CN105118912A - Packaging-free LED structure with uniform heat radiation and LED lamp - Google Patents
Packaging-free LED structure with uniform heat radiation and LED lamp Download PDFInfo
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- CN105118912A CN105118912A CN201510584263.6A CN201510584263A CN105118912A CN 105118912 A CN105118912 A CN 105118912A CN 201510584263 A CN201510584263 A CN 201510584263A CN 105118912 A CN105118912 A CN 105118912A
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- polyhedral
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The present invention discloses a packaging-free LED structure with uniform heat radiation and a LED lamp. The LED structure comprises a substrate, a chip inversely installed in the substrate, and a support arranged at the periphery of the substrate, wherein more than two layers of polyhedral structures for heat radiation of the chip are arranged on the substrate. According to the invention, the polyhedral structures are staggered on the substrate in a step-shaped manner to allow heat generated by the LED chip to be uniformly and quickly conducted in such a manner to avoid heat accumulation of the chip, reduce the temperature of the chip and prevent the chip from burning out, thereby ensuring the reliability of the LED product.
Description
Technical field
The present invention relates to technical field of LED illumination, packaged LED structure and LED are exempted from particular a kind of heat radiation uniformly.
Background technology
Current, along with the lifting of LED power and luminous efficiency, the LED product of the features such as energy-conserving and environment-protective, response is fast, volume is little, light efficiency is high is widely used in showing the fields such as the backlight of product and general illumination, and occupy the increasing market space, be considered to the best light source of new green energy conservation from generation to generation illumination.
But at present because the electricity conversion of LED is still not high, especially for high power LED device, only have the electric energy of 15%-20% to convert luminous energy to, all the other 80%-85% are converted to heat energy.If can not in time chip heating be derived and be dissipated, amount of heat will be gathered in LED inside, junction temperature of chip will progressively raise, LED performance is made to reduce (as operating voltage reduces on the one hand, luminous efficiency reduction, red shift of wavelength etc.), thermal stress will be produced in LED body on the other hand, cause a series of integrity problem (as life-span, colour temperature change etc.).
So, along with LED power is more and more higher, the heat dissipation problem of LED and the shortcoming of method for packing also become increasingly conspicuous, such as solving heat dissipation problem, current appearance utilizes the CSP of flip-chip to exempt from packaged type LED, as shown in Figure 1, flip-chip 1B does not need routing, directly connects the electrode 1D of chip and the circuit of substrate 1A by tin sweat(ing) 1C.So the heat that chip sheds directly can be transmitted to (shown in the arrow in Fig. 1) on substrate by the tin sweat(ing) of below, then spread out of by substrate.
But because the power of this LED is all larger, the heat of chip bottom is higher, if so there is impurity in scolding tin or substrate heat conductivility is uneven, easily hot stack will be produced in the part of tin sweat(ing) connecting electrode and substrate, hot stack can cause the heat of tin sweat(ing) part to shed, thus cause the temperature of LED chip to exceed its rated value, thus burn chip.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the invention provides a kind of heat radiation and exempt from packaged LED structure uniformly, be intended to solve existing packaged LED structure of exempting from and easily produce hot stack in the part of tin sweat(ing) connecting electrode and substrate, cause the heat of tin sweat(ing) part evenly, fast to shed, easily cause the problem that chip burns.
Technical scheme of the present invention is as follows:
A kind of heat radiation exempts from packaged LED structure uniformly, comprise substrate, upside-down mounting in described substrate chip and be arranged on the support of substrate periphery, wherein, described substrate is provided with for more than two layers staggered polyhedral structures of described chip cooling.
Described heat radiation exempts from packaged LED structure uniformly, wherein,
The cross section of described more than two layers staggered polyhedral structures becomes longer spread from top to bottom successively.
Described heat radiation exempts from packaged LED structure uniformly, wherein,
In described staggered adjacent two layers polyhedral structure, the angular position lower surface of described last layer polyhedral structure is arranged at described lower one deck polyhedral edge position upper surface.
Described heat radiation exempts from packaged LED structure uniformly, and wherein, described chip is arranged in the cavity of described the superiors polyhedral structure end face.
Described heat radiation exempts from packaged LED structure uniformly, and wherein, described substrate is disposed with the first polyhedral structure, the second polyhedral structure and the 3rd polyhedral structure from top to bottom;
The angular position lower surface of described first polyhedral structure contacts with the edge position upper surface of the second multi-plane structure, and the angular position lower surface of described second polyhedral structure contacts with the edge position upper surface of the 3rd multi-plane structure.
Described heat radiation exempts from packaged LED structure uniformly, and wherein, the support outside described substrate and described substrate is injection molded into integrative-structure.
Described heat radiation exempts from packaged LED structure uniformly, wherein, described in be injection molded into integrative-structure bracket bottom show out the bottom surface of described orlop polyhedral structure.
Described heat radiation exempts from packaged LED structure uniformly, and wherein, described polyhedral structure is hexahedron structure or octahedral structure.
A kind of LED, wherein, the heat radiation that described LED comprises described in any one exempts from packaged LED structure uniformly.
One heat radiation provided by the invention exempts from packaged LED structure uniformly, by intersecting the polyhedral structure of setting table scalariform on substrate, the heat that LED chip is produced can conduct evenly and rapidly, avoid the hot stack of chip, reduce the temperature of chip, prevent chip from burning, thus ensure that the reliability of LED product.
Accompanying drawing explanation
Fig. 1 existingly exempts from packaged LED structure schematic diagram.
Fig. 2 is that the present invention is dispelled the heat and exempted from the schematic diagram of packaged LED structure (not containing support) uniformly.
Fig. 3 is that the present invention is dispelled the heat and exempted from the schematic diagram of packaged LED structure uniformly.
Fig. 4 is that the present invention is dispelled the heat and exempted from the heat conduction schematic diagram of packaged LED structure uniformly.
Fig. 5 is that the present invention is dispelled the heat and exempted from packaged LED structure bottom schematic view uniformly.
Embodiment
Below with reference to accompanying drawing, described in detail embodiment of the present utility model and embodiment, described specific embodiment, only in order to explain the utility model, is not intended to limit embodiment of the present utility model.
As shown in Figures 2 and 3, heat radiation provided by the invention exempts from packaged LED structure uniformly, comprise substrate 1, upside-down mounting in described substrate 1 chip 2 and be arranged on the support 3 of substrate 1 periphery, wherein, described substrate 1 is provided with more than the two layers staggered polyhedral structures 10 for dispelling the heat to described chip 2.The structure that polyhedral structure in the embodiment of the present invention can be hexahedron structure, is appreciated that in other embodiments of the invention, and polyhedral structure can be pentahedron, octahedra grade for corner angle are more.
Below for described polyhedral structure for hexahedron structure is described in further details the present invention.
Due to the heat-conduction principle that heat trend in solid is assembled in solid seamed edge edge junction, with staggered stepped more than two layers hexahedron solid structures in the embodiment of the present invention, angular position structure conduction in the downward one deck hexahedron structure of heat that every layer of hexahedral angular position structure can make chip produce, formative dynamics heat flow, take away the heat that chip produces in time, prevent burning of chip.
The mode that LED flip chip in the embodiment of the present invention is connected by tin sweat(ing), be arranged on the printed circuit board of the inner chamber of substrate, substrate surface carries out the deposition of circuit layer, comprise the techniques such as insulating barrier coating, copper facing, etched circuit, surface treatment, the substrate intracavity bottom finally made is exposed positive and negative electrode, conventional backflow is adopted to weld with LED flip chip again or the equipment such as eutectic is welded and fixed, even if in welding process, tin sweat(ing) has impurity like this, the heat that impurity produces also can conduct by structure of the present invention fast, uniformly.
In the invention process, the cross section of staggered multilayer hexahedron structure becomes longer spread from top to bottom successively, and the heat transfer area of such heat successively becomes large, conducts the heat larger.Described more than two layers polyhedron solid structures are adopted to be employing three layers of hexahedron structure in this preferred embodiment, as shown in Figure 2.
Concrete, in staggered adjacent two layers hexahedron structure, the angular position lower surface of last layer hexahedron structure is arranged at lower one deck hexahedral edge position upper surface.As shown in Figure 2, polyhedral structure 10 described in the present embodiment comprises three layers of hexahedron structure, be respectively the first hexahedron structure 12, second hexahedron structure 13,3rd hexahedron structure 14, three layers hexahedron structure is staggered, wherein, the lower surface of the angular position of the first hexahedron structure 12 contacts with the upper surface of the edge position of the second six sided structures 13, and the lower surface of the angular position of the second hexahedron structure 13 contacts with the upper surface of the edge position of the 3rd six sided structures 14.Like this, heat can be assembled at the angular position place of every one deck hexahedron structure, and flow in the angular position of one deck downwards, the conduction of the heat that chip produces horizontal homogeneous between every layer of hexahedron, stable heat flow fast on substrate, reduce the heat that chip produces timely and effectively, prevent burning of chip.
In embodiments of the present invention, as shown in Figure 2, the chip 2 of upside-down mounting is arranged in the cavity 121 in the first hexahedron structure 12 end face centre position, the most of heat that the chip of upside-down mounting can be produced that arranges of cavity is all conducted by the first hexahedron structure, be appreciated that the degree of depth and the size of cavity can carry out adaptability design with the concrete size of chip.
The concrete flowing of the heat that the chip 2 of upside-down mounting produces as shown in Figure 4, first the heat that fixing flip-chip 2 on substrate 1 produces conducts to the first hexahedron structure 12 by the cavity 121 of the first hexahedron structure 12, due to the junction, corner that fixing middle heat trend is fixing, heat is to six angular position conduction of the first hexahedron structure 12, simultaneously because the first hexahedron structure 12 and the second hexahedron access node structure 13 are staggeredly placed, and the sectional area of the second hexahedron structure 13 is greater than the sectional area of the first hexahedron structure 12, then six angular positions of the first hexahedron structure 12 just with six limit location contacts of the second hexahedron structure 13, heat edge position from six angular positions of the first hexahedron structure 12 to the second hexahedron structure 13 conduction after, continue to conduct to the angular position of the second hexahedron structure 13, in like manner, the heat of the angular position of the second hexahedron structure 13 continues conduction, until conduct to the angular position of the 3rd hexahedron structure 14, then distribute in air or other medium, such heat produces dynamically in three layers of hexahedron structure, stable heat flow, uniformly the heat conduction of chip can be gone out, prevent burning of chip.In the embodiment of the present invention, every layer of hexahedron structure is by being welded to connect.Be appreciated that hexahedron structure on substrate can according to actual production need arrange more than two layers, as 5 layers, 6 layers etc., to obtain better radiating effect.
As one embodiment of the present of invention, the conductive coefficient of described polyhedral structure every layer diminishes from top to bottom successively.The material of suitable substrate can be chosen, can be metal, silicon, pottery etc., the material of every layer of hexahedron structure is respectively different materials, and conductive coefficient diminishes from top to bottom successively, conducts fast in the hexahedron structure of the heat that chip is produced different conductive coefficient more than two layers.
As shown in Figures 2 and 3, three layers of hexahedron structure chooses three kinds of different materials, conductive coefficient is followed successively by W1, W2, W3 from the first hexahedron structure 12 to the three hexahedron structure 14, and W1>W2>W3, conductive coefficient is larger, and heat-transfer capability is stronger, like this, the heat that chip produces can produce level flowing fast in three layers of hexahedron structure, is conducive to the quick heat radiating of chip.
In embodiments of the present invention, support outside described substrate and described substrate is injection molded into integrative-structure, for wrapping up the board structure with fixing internal, the material that this outside support uses comprises the materials such as phenylpropanolamine HC1 PPA, polyester material PCT and epoxy molding plastic EMC.
As a preferred embodiment of the present invention, as shown in Figure 5, described in be injection molded into integrative-structure support 3 bottom surface expose the bottom surface of described undermost 3rd hexahedron structure 14, meanwhile, also expose the electrode 11 on substrate, so that electrical connection.Because the heat-transfer capability of plastics is less, the bottom surface of undermost hexahedron structure is exposed to the bottom surface of support in injection moulding process, is conducive to the heat radiation of chip.
The embodiment of the present invention also provides a kind of LED (overall structure is not shown in the drawings), comprise above-mentioned heat radiation and exempt from packaged LED structure uniformly, wherein as shown in Figure 3, the surface of the chip 2 of upside-down mounting is also covered with fluorescent material 21, described coating fluorescent material method can be undertaken by spraying method or the mode pasting fluorescent powder membrane, selects different fluorescent material can obtain the light of different colours.By structural design of the present invention, the heat that LED flip-chip produces passes through staggered polyhedral structure substantially and evenly, fast distributes, and prevents burning of chip, ensures the serviceability of LED.
Heat radiation provided by the invention exempts from packaged LED structure uniformly, solid heat transfer is utilized to be tending towards the principle of solid corner intersection gathering, at substrate alternate, more than two layers polyhedral structures are set, make the sectional area of polyhedral structure successively increase from top to bottom simultaneously, and derive coefficient and successively reduce, the heat flow that the heat that chip is produced formative dynamics in polyhedral structure is stable, the temperature of chip is controlled effectively, prevent burning of chip, ensure that the reliability exempting from packaged LED structure, packaged LED structure of exempting from of the present invention is similar to traditional LED surface structure simultaneously, LED industry can be widely used in.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (9)
1. a heat radiation exempts from packaged LED structure uniformly, comprise substrate, upside-down mounting in described substrate chip and be arranged on the support of substrate periphery, it is characterized in that, described substrate is provided with for more than two layers staggered polyhedral structures of described chip cooling.
2. heat radiation according to claim 1 exempts from packaged LED structure uniformly, it is characterized in that,
The cross section of described more than two layers staggered polyhedral structures becomes longer spread from top to bottom successively.
3. heat radiation according to claim 1 exempts from packaged LED structure uniformly, it is characterized in that,
In described staggered adjacent two layers polyhedral structure, the angular position lower surface of described last layer polyhedral structure is arranged at described lower one deck polyhedral edge position upper surface.
4. heat radiation according to claim 1 exempts from packaged LED structure uniformly, it is characterized in that, described chip is arranged in the cavity of described the superiors polyhedral structure end face.
5. heat radiation according to claim 4 exempts from packaged LED structure uniformly, it is characterized in that, described substrate is disposed with the first polyhedral structure, the second polyhedral structure and the 3rd polyhedral structure from top to bottom;
The angular position lower surface of described first polyhedral structure contacts with the edge position upper surface of the second multi-plane structure, and the angular position lower surface of described second polyhedral structure contacts with the edge position upper surface of the 3rd multi-plane structure.
6. heat radiation according to claim 1 exempts from packaged LED structure uniformly, it is characterized in that, the support outside described substrate and described substrate is injection molded into integrative-structure.
7. heat radiation according to claim 6 exempts from packaged LED structure uniformly, it is characterized in that, described in be injection molded into integrative-structure bracket bottom show out the bottom surface of described orlop polyhedral structure.
8. heat radiation according to claim 1 exempts from packaged LED structure uniformly, it is characterized in that, described polyhedral structure is hexahedron structure or octahedral structure.
9. a LED, is characterized in that, the heat radiation that described LED comprises described in any one of claim 1 to 8 exempts from packaged LED structure uniformly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510584263.6A CN105118912B (en) | 2015-09-15 | 2015-09-15 | A kind of heat dissipation uniformly exempts from packaged LED structure and LED light |
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| CN201510584263.6A CN105118912B (en) | 2015-09-15 | 2015-09-15 | A kind of heat dissipation uniformly exempts from packaged LED structure and LED light |
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| CN105118912A true CN105118912A (en) | 2015-12-02 |
| CN105118912B CN105118912B (en) | 2018-09-25 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101814569A (en) * | 2009-02-23 | 2010-08-25 | Lg伊诺特有限公司 | Light emitting device package |
| CN201607152U (en) * | 2009-10-15 | 2010-10-13 | 苏州中泽光电科技有限公司 | Perforated multi-facet radiator |
| CN102661589A (en) * | 2012-04-13 | 2012-09-12 | 安徽瑞煌光电科技有限公司 | Laminated radiator for LED light source |
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2015
- 2015-09-15 CN CN201510584263.6A patent/CN105118912B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101814569A (en) * | 2009-02-23 | 2010-08-25 | Lg伊诺特有限公司 | Light emitting device package |
| CN201607152U (en) * | 2009-10-15 | 2010-10-13 | 苏州中泽光电科技有限公司 | Perforated multi-facet radiator |
| CN102661589A (en) * | 2012-04-13 | 2012-09-12 | 安徽瑞煌光电科技有限公司 | Laminated radiator for LED light source |
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| CN105118912B (en) | 2018-09-25 |
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Effective date of registration: 20180815 Address after: 518000 A, sixth industrial area, Tian Liao community, Gongming street, Guangming New District, Shenzhen, Guangdong. Applicant after: Shenzhen SKYWORTH Optical Technology Co., Ltd. Address before: 518108 the two or three, four and the first floor of the R & D building of SKYWORTH science and Technology Industrial Park, Baoan District Road, Shiyan Road, Baoan District, Shenzhen. Applicant before: Skyworth LCD Modules (Shenzhen) Co., Ltd. |
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