CN105074912B - 绝热片及其制造方法 - Google Patents

绝热片及其制造方法 Download PDF

Info

Publication number
CN105074912B
CN105074912B CN201480017491.9A CN201480017491A CN105074912B CN 105074912 B CN105074912 B CN 105074912B CN 201480017491 A CN201480017491 A CN 201480017491A CN 105074912 B CN105074912 B CN 105074912B
Authority
CN
China
Prior art keywords
heat
heat storage
face
storage plate
insulating trip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480017491.9A
Other languages
English (en)
Other versions
CN105074912A (zh
Inventor
中山雅文
坂口佳也
山田浩文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN105074912A publication Critical patent/CN105074912A/zh
Application granted granted Critical
Publication of CN105074912B publication Critical patent/CN105074912B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L59/00—Thermal insulation in general
    • F16L59/02—Shape or form of insulating materials, with or without coverings integral with the insulating materials
    • F16L59/026—Mattresses, mats, blankets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/025—Particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/142—Laminating of sheets, panels or inserts, e.g. stiffeners, by wrapping in at least one outer layer, or inserting into a preformed pocket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

绝热片具有蓄热片、第1绝缘片和热传导片。蓄热片包含第1树脂、和以凝聚的状态混入该第1树脂中且内包有潜热蓄热剂的多个微胶襄。第1绝缘片具有与蓄热片粘合的第1面、和该第1面的相反侧的第2面。热传导片与第1绝缘片的第2面粘合。蓄热片中的微胶襄的比例为40wt％以上且90wt％以下，蓄热片在与第1绝缘片相接的部分具有不存在微胶襄的层。

Description

绝热片及其制造方法
技术领域
本发明涉及抑制或延迟从发热部件产生的热被传递到外部，并且抑制发热部件的温度急剧上升的绝热片及其制造方法。
背景技术
近年来，伴随各种电子设备的高性能化，IC等发热部件的发热量变大，引起框体变热或者由于IC的温度过度上升因而IC的动作速度变慢的情况。因此采取了通过使像石墨片那样热传导性优异的构件与IC接触，来使所产生的热扩散这样的对策。
在上述方法中，虽然能够应对某种程度的发热，但若瞬间的发热进一步变大，则难以应对。特别是下载大量数据的电子设备，在下载时突发性地发热。通常，由于下载的时间不那么长，因此暂时性地抑制该热所引起的温度上升是非常重要的。
另外，作为与本申请的发明关联的在先技术文献信息，例如，已知专利文献1。
在先技术文献
专利文献
专利文献1：JP特表2008-516413号公报
发明内容
本发明的目的在于，提供一种抑制或延迟从发热部件产生的热被传递到外部，并且抑制发热部件的温度急剧上升的绝热片。
为了解决上述课题，本发明的绝热片具有蓄热片、第1绝缘片和热传导片。蓄热片包含第1树脂、和以凝聚的状态混入该第1树脂中且内包有潜热蓄热剂的多个微胶囊。第1绝缘片具有与蓄热片粘合的第1面、和该第1面的相反侧的第2面。热传导片与第1绝缘片的第2面粘合。蓄热片中的微胶囊的比例为40wt％以上且90wt％以下，蓄热片在与第1绝缘片相接的部分具有不存在微胶囊的层。通过上述构成，能够抑制或延迟从发热部件产生的热传递到外部，并且抑制发热部件的温度急剧上升。此外，能够将蓄热片和热传导片稳定地连接，能够将在热传导片扩散的热高效地传递到蓄热片。其结果，使由发热部件产生的热通过热传导片而扩散，并且从热传导片传递到蓄热片的热若成为给定的温度则作为用于使潜热蓄热剂熔解的热而被消耗。因此，能够使发热部件的温度上升延迟。
附图说明
图1是本发明的实施方式中的绝热片的剖面图。
图2是表示本发明的实施方式中的绝热片的使用例的图。
图3A是对本发明的实施方式中的绝热片的制造方法中的片成型进行说明的图。
图3B是表示图3A所示的步骤之后的切断为给定的形状的状态的立体图。
图3C是通过本发明的实施方式中的绝热片的制造方法而得到的绝热片的立体图。
具体实施方式
图1是本发明的实施方式中的绝热片的剖面图。
该绝热片具有蓄热片13、第1绝缘片14、和热传导片15。蓄热片13是对内包有潜热蓄热剂的微胶囊11和第1树脂12进行混合，并成型为片状。在此微胶囊11是在由甲醛树脂(formalin resin)形成的胶囊中，作为潜热蓄热剂而封入了熔点为约39℃的石蜡的粒子，胶囊的直径为1～3μm程度。胶囊的球体凝聚而形成大小为50μm程度的块，微胶囊11形成了粉状体。通过将微胶囊11与第1树脂12混合并成型为片状而构成了厚度约0.6mm的蓄热片13。作为第1树脂12，例如使用了聚氨酯树脂。像这样通过使用聚氨酯树脂，从而即使增大微胶囊11的量，也能够不毁坏微胶囊11地进行混合，并且蓄热片13还具有柔软性。
蓄热片13中的微胶囊11的比例，例如设为重量比约70％。作为蓄热片13的性能，越增大微胶囊11的比例则越提高，但若该比例超过重量比90％则混炼变得困难，此外难以保持作为片的强度、形状。另一方面，若微胶囊11的比例不足重量比40％，则成为微胶囊11的块彼此零乱地浮在第1树脂12中的状态。因此热传导性下降，难以发挥蓄热片13的性能。通过将微胶囊11的比例设为40％以上，从而成为微胶囊11的块彼此相互接触的状态。因此，能够快速地向蓄热片13整体传热。由此，将蓄热片13中的微胶囊11的比例设为重量比40％以上、90％以下较为理想。更优选为50％以上、90％以下。
在蓄热片13的一个面上，例如粘合有由厚度约10μm的聚对苯二甲酸乙二醇酯(以下，记作PET)形成的第1绝缘片14的第1面。在第1绝缘片14的第1面的相反侧的第2面，经由由丙烯酸类树脂形成的粘着材料，粘合有热传导片15。作为热传导片15，例如使用厚度约25μm的热分解石墨片。另外，作为热传导片15，除了热分解石墨片以外，可以使用铜膜、铝膜等。像这样，通过使用至少在面方向上具有100W/m·K以上的热传导率的片，能够进一步发挥本发明效果。但是若上述热分解石墨片的面方向的热传导率为约1600W/m·K，则在面方向上热传导率远远高于这些金属膜。而且石墨片在柔软性方面也优异因而较为理想。
在此在蓄热片13的与第1绝缘片14相接的部分，以厚度5～10μm设置有不存在微胶囊11的层13A。即层13A仅由聚氨酯树脂形成，容易与第1绝缘片14粘接。进而将第1绝缘片14的与蓄热片13相接的第1面极化来使用较为理想。这样一来，能够进一步提高第1绝缘片14与蓄热片13的接合强度。为了像以上那样将第1绝缘片14极化，可以采用通过对第1绝缘片14实施电晕处理，来形成氢氧基或者羧基等极性基的方法。
进而在热传导片15的、与蓄热片13粘合的第1面的相反侧的第2面还粘合有第2绝缘片16较为理想。这样一来，在处理时能够保护热传导片15。此外也可以使第2绝缘片16为双面胶带。这样一来，能够使发热部件与热传导片15密接，能够使热传导片15的性能进一步得到发挥。进而，也可以在蓄热片13的与第1绝缘片14粘合的面的相反侧的面还粘合第3绝缘片18。通过第3绝缘片18能够保护蓄热片13。
另外，使蓄热片13与第1绝缘片14粘合意味着作为结果是被粘合的状态，也可以通过在形成了蓄热片13之后，粘合第1绝缘片14的方法，或者在第1绝缘片14上对蓄热片13进行成型等方法来形成。
图2是对本实施方式中的绝热片的使用例进行说明的剖面图，绝热片的热传导片15侧经由第2绝缘片16与安装于基板20的IC等发热部件19或者对其进行收纳的框体抵接。即使在发热部件19上粘合蓄热片13，也由于蓄热片13本身热传导性不佳，因而热仅传递到接近发热部件19的部分。相对于此，通过像本实施方式这样构成，从而在发热部件19产生的热传递到热传导片15，并在面方向上扩散。由于热传导片15整体与蓄热片13可靠地粘合，因此热顺利地传递到蓄热片13整体。传递到蓄热片13的热，若成为给定温度则作为用于使潜热蓄热剂熔解的热而被消耗，因此能够使温度上升延迟。由此，特别能够对下载时的急剧的发热进行吸收、扩散。
另外，在本实施方式中，潜热蓄热剂的熔点为约39℃，但也可以不像这样使用一种微胶囊11，而是对例如封入了熔点为约39℃的潜热蓄热剂的微胶囊、封入了约60℃的潜热蓄热剂的微胶囊、和第1树脂12进行混合来制作蓄热片13。这样一来，能够进一步抑制发热部件19的温度急剧上升。
接着，参照图3A～图3C对本发明的实施方式中的绝热片的制造方法进行说明。
首先对微胶囊11和固化前的第1树脂12进行混合，并对图3A所示的蓄热片用膏剂17进行调整。在此微胶囊11是在由甲醛树脂形成的胶囊中作为潜热蓄热剂而封入了熔点为约39℃的石蜡而成的粒子。胶囊的大小为直径1～3μm程度。胶囊的球体凝聚而形成了大小50μm程度的块。
此外作为第1树脂12使用了聚氨酯树脂。固化前的聚氨酯树脂包含主剂和固化剂，固化后的穿透深度(depth of penetration)为50以上且250以下，更优选为80以上且180以下。在此穿透深度可以使用通过ASTM D5或JIS K2207规定的方法，具体来说例如可以使用离合公司制自动穿透深度试验器RPM-2011来进行测定。通常的聚氨酯树脂的穿透深度为20以下程度，但这种在树脂中混合大量的微胶囊11并进行了固化的情况下，变脆而难以保持作为片的形状。此外在穿透深度过大的情况下，也没有强度，难以维持片形状。相对于此，在本实施方式中，由于使用了穿透深度为50以上且250以下那样的树脂，因此即使将微胶囊11的比例设为重量比40％以上也能够成型为片状。
在本实施方式中将蓄热片用膏剂17内的微胶囊11的比例调整为重量比约70％，将第1树脂12的比例调整为重量比约30％。
使用辊轧成型机使蓄热片用膏剂17如图3A那样夹在第1绝缘片14与第3绝缘片18之间并通过辊31之间，成型为厚度约0.6mm的片。
作为第1绝缘片14使用厚度约10μm的PET膜，对蓄热片13进行成型的面(第1面)，通过实施电晕处理而形成氢氧基或者羧基等极性基从而被极化，进而形成了凹凸。这样一来，对蓄热片13进行成型的面的润湿性变好，在对蓄热片13进行了成型时其中的第1树脂12与第1绝缘片14很好地润湿。因此，在蓄热片13的与第1绝缘片14相接的面，以5～10μm的厚度形成了不存在微胶囊的层13A。因此通过使第1树脂12固化，从而蓄热片13与第1绝缘片14的结合变得牢固，而且其间的热传导性也提高。
另外，在图3A中在第1绝缘片14与第3绝缘片18之间形成了蓄热片13，但也可以不使用第3绝缘片18而在第1绝缘片14的第1面形成蓄热片13。
此外作为第3绝缘片18，与第1绝缘片14同样地使用厚度约10μm的PET膜，由此最终能够作为保护膜。或者，通过将第3绝缘片18设为具有脱模性的膜，从而通过在作为绝热片进行安装后进行剥离，能够使蓄热片13露出。通过使蓄热片13露出，能够使绝热片的散热性提高。
接着，将蓄热片13和第1绝缘片14的层叠体放入约90℃的干燥机中约20小时，使蓄热片13中的固化前的第1树脂12固化。通过模具将其切断为给定的形状，能够得到图3B所示的固化体。
接着通过在第1绝缘片14的形成了蓄热片13的第1面的相反侧的第2面粘合热传导片15，能够得到图3C那样的绝热片。在此，作为热传导片15使用厚度约25μm的热分解石墨片，通过在热传导片15的一面设置的双面胶带来与第1绝缘片14粘合。
进而在热传导片15的与蓄热片13粘合的面的相反侧的面还粘合第2绝缘片16较为理想。在此情况下通过使用预先在热传导片15的与蓄热片13粘合的面的相反侧的面粘合了第2绝缘片16的物件，从而能够容易地形成。这样一来，在处理时能够保护热传导片15。此外也可以使第2绝缘片16为双面胶带。这样一来，能够使发热部件19与热传导片15密接，能够使热传导片15的性能进一步得到发挥。
工业实用性
本发明所涉及的绝热片能够抑制或延迟从发热部件产生的热传递到外部，并且抑制发热部件的温度急剧上升，在工业上有用。
标号说明
11 微胶囊
12 第1树脂
13 蓄热片
13A 不存在微胶囊的层
14 第1绝缘片
15 热传导片
16 第2绝缘片
17 蓄热片用膏剂
18 第3绝缘片
19 发热部件
20 基板
31 辊

Claims (7)

1.一种绝热片，具备：
蓄热片，其包含第1树脂、和以凝聚的状态混入所述第1树脂中且内包有潜热蓄热剂的多个微胶囊；
第1绝缘片，其具有与所述蓄热片粘合的第1面、和所述第1面的相反侧的第2面；和
热传导片，其与所述第1绝缘片的所述第2面粘合，
所述蓄热片中的所述微胶囊的比例为40wt％以上且90wt％以下，
所述蓄热片在与所述第1绝缘片相接的部分具有不存在所述微胶囊的层，所述层仅由聚氨酯树脂形成。
2.根据权利要求1所述的绝热片，其中，
所述第1绝缘片的所述第1面被极化。
3.根据权利要求1所述的绝热片，其中，
所述热传导片是面方向的热传导率为100W/m·K以上的片。
4.一种绝热片的制造方法，具备如下步骤：
对内包有潜热蓄热剂且凝聚的多个微胶囊与固化前的第1树脂进行混合，使得所述微胶囊的比例为40wt％以上且90wt％以下，来调整蓄热片用膏剂的步骤；
将所述蓄热片用膏剂成型在第1绝缘片的第1面上来形成蓄热片的步骤；
对所述蓄热片进行加热来对所述固化前的第1树脂进行固化的步骤；和
在所述第1绝缘片的所述第1面的相反侧的第2面粘合热传导片的步骤，
所述第1绝缘片的所述第1面与所述第1绝缘片的内部相比，对所述固化前的第1树脂的润湿性高，
在所述蓄热片的与所述第1绝缘片相接的部分形成不存在所述微胶囊的层，所述层仅由聚氨酯树脂形成。
5.根据权利要求4所述的绝热片的制造方法，其中，
所述第1绝缘片的所述第1面通过电晕处理而被极化。
6.根据权利要求4所述的绝热片的制造方法，其中，
在基于ASTM D5的硬度评价中，固化后的所述第1树脂的穿透深度为50以上且250以下。
7.根据权利要求4所述的绝热片的制造方法，其中，
所述热传导片的面方向的热传导率为100W/m·K以上。
CN201480017491.9A 2013-03-25 2014-01-08 绝热片及其制造方法 Expired - Fee Related CN105074912B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-061412 2013-03-25
JP2013061412 2013-03-25
PCT/JP2014/000023 WO2014155898A1 (ja) 2013-03-25 2014-01-08 断熱シートおよびその製造方法

Publications (2)

Publication Number Publication Date
CN105074912A CN105074912A (zh) 2015-11-18
CN105074912B true CN105074912B (zh) 2018-03-16

Family

ID=51622927

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480017491.9A Expired - Fee Related CN105074912B (zh) 2013-03-25 2014-01-08 绝热片及其制造方法

Country Status (4)

Country Link
US (1) US10438866B2 (zh)
JP (1) JP6379357B2 (zh)
CN (1) CN105074912B (zh)
WO (1) WO2014155898A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104733479B (zh) * 2015-04-13 2018-07-17 京东方科技集团股份有限公司 柔性衬底基板及其制备方法、显示基板、显示装置
WO2017006726A1 (ja) * 2015-07-07 2017-01-12 株式会社村田製作所 冷却デバイス
JP7395820B2 (ja) * 2018-11-14 2023-12-12 株式会社レゾナック 蓄熱材の形成方法
WO2020110662A1 (ja) * 2018-11-26 2020-06-04 富士フイルム株式会社 蓄熱シート、蓄熱部材及び電子デバイス
JPWO2020195956A1 (zh) * 2019-03-27 2020-10-01

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319239A (zh) * 1999-07-28 2001-10-24 松下电器产业株式会社 制造陶瓷电子元件的方法
CN1322367A (zh) * 1999-09-22 2001-11-14 松下电器产业株式会社 陶瓷电子零件的制造方法
CN1327602A (zh) * 1999-10-18 2001-12-19 松下电器产业株式会社 层合体的制造方法及层合体加压装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804297A (en) * 1995-07-05 1998-09-08 Colvin; David P. Thermal insulating coating employing microencapsulated phase change material and method
WO2001019611A1 (fr) * 1999-09-16 2001-03-22 Tetra Laval Holdings & Finance S.A. Materiau lamine pour emballage et son procede de fabrication
JP2001248987A (ja) * 2000-03-06 2001-09-14 Sekisui Chem Co Ltd 蓄熱構造体
CA2424630A1 (en) * 2003-04-07 2004-10-07 Marko I.R.D.C. Inc. Reflective film
HUE040521T2 (hu) 2003-11-04 2019-03-28 Neograf Solutions Llc Réteges hõszigetelés
JP4555300B2 (ja) 2004-10-06 2010-09-29 グラフテック インターナショナル ホールディングス インコーポレーテッド サンドイッチ構造を有するサーマルソリューション
EP1815064A1 (de) * 2004-11-17 2007-08-08 Basf Aktiengesellschaft Verpackungsmaterial enthaltend eine beschichtung mit mikrokapseln
US20100316816A1 (en) * 2005-12-02 2010-12-16 Tesa Se Double-sided pressure-sensitive adhesive tapes for producing lc-displays having light-reflecting and absorbing properties
JP2008291083A (ja) 2007-05-23 2008-12-04 Yokohama Rubber Co Ltd:The 放熱材用熱可塑性エラストマー組成物
JP4947428B2 (ja) * 2007-11-12 2012-06-06 北川工業株式会社 断熱シート及び筐体
US8221910B2 (en) * 2008-07-16 2012-07-17 Outlast Technologies, LLC Thermal regulating building materials and other construction components containing polymeric phase change materials
BRPI0922910A2 (pt) * 2008-12-17 2016-01-26 Basf Se "elemento de construção de forma plana feito de material compósito, processo para produzir um elemento de construção de forma plana,e, uso de um elemento de construção de forma plana".
JP2010251463A (ja) * 2009-04-14 2010-11-04 Asahi Kasei E-Materials Corp 新規吸熱シート
US20100316821A1 (en) * 2009-06-12 2010-12-16 Sunny General International Co., Ltd. Multi-layer films, sheets, and hollow articles with thermal management function for uses as casings of secondary batteries and supercapacitors, and sleeves of secondary battery and supercapacitor packs
JP2012087182A (ja) * 2010-10-18 2012-05-10 Hitachi Maxell Ltd 遮熱用粘着テープ
KR101397686B1 (ko) * 2010-12-06 2014-05-22 제일모직주식회사 기재필름 및 이를 이용한 반도체용 접착필름

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319239A (zh) * 1999-07-28 2001-10-24 松下电器产业株式会社 制造陶瓷电子元件的方法
CN1322367A (zh) * 1999-09-22 2001-11-14 松下电器产业株式会社 陶瓷电子零件的制造方法
CN1327602A (zh) * 1999-10-18 2001-12-19 松下电器产业株式会社 层合体的制造方法及层合体加压装置

Also Published As

Publication number Publication date
JP6379357B2 (ja) 2018-08-29
WO2014155898A1 (ja) 2014-10-02
CN105074912A (zh) 2015-11-18
US10438866B2 (en) 2019-10-08
JPWO2014155898A1 (ja) 2017-02-16
US20160172270A1 (en) 2016-06-16

Similar Documents

Publication Publication Date Title
CN105074912B (zh) 绝热片及其制造方法
CN206250180U (zh) 热界面材料组件和设备
JP6289831B2 (ja) 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
TWI507120B (zh) 用於板層電磁干擾（ｅｍｉ）屏蔽之複合膜
WO2015141830A1 (ja) 異方性導電フィルム及びその製造方法
CN105659378B (zh) 绝热片及其制造方法
CN1893803A (zh) 散热部件及其制造方法
CN101669258A (zh) 导电体的连接方法、导电体连接用部件、连接结构及太阳能电池模块
KR101991189B1 (ko) 적층 가공
JP2009024126A (ja) ポリマー組成物、熱伝導性シート、金属箔付高熱伝導接着シート、金属板付高熱伝導接着シート、金属ベース回路基板ならびにパワーモジュール
JP6303597B2 (ja) 電子部品モジュールの製造方法
CN106537581B (zh) 散热片材以及使用该散热片材的散热结构体
JP2019145639A (ja) 電磁波シールドフィルム
SG162785A1 (en) Microwave process for forming a coating
TWI642711B (zh) 熱硬化性樹脂組成物及導熱性薄片
JP5424984B2 (ja) 半導体モジュールの製造方法
CN105916350B (zh) 一种终端设备以及相关方法
JP2019145769A (ja) 電磁波シールドフィルム
JP5942641B2 (ja) 樹脂シート及びその製造方法、樹脂シート硬化物、並びに放熱用部材
JP2008088405A (ja) 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
TW201713179A (zh) 印刷電路板的製造方法及該方法所使用之印刷電路板保護薄膜、以及片狀積層體
KR20180015337A (ko) 절연용 필러가 배치된 복합시트 및 그 제조방법
CN107343375A (zh) 一种后壳和移动终端
JP5559219B2 (ja) 金属箔付高熱伝導接着シート、又は、金属板付高熱伝導接着シートの接着された半導体モジュールの製造方法
CN209652216U (zh) 热解失粘导电胶带

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180316

CF01 Termination of patent right due to non-payment of annual fee