CN105073407A - 层叠体及电路基板 - Google Patents
层叠体及电路基板 Download PDFInfo
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- CN105073407A CN105073407A CN201480018612.1A CN201480018612A CN105073407A CN 105073407 A CN105073407 A CN 105073407A CN 201480018612 A CN201480018612 A CN 201480018612A CN 105073407 A CN105073407 A CN 105073407A
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- Prior art keywords
- silver
- mentioned
- silver layer
- duplexer
- kurtosis
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- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000005440 p-toluyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C(*)=O)C([H])([H])[H] 0.000 description 1
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- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 125000004193 piperazinyl group Chemical group 0.000 description 1
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- 230000001737 promoting effect Effects 0.000 description 1
- PYNUOAIJIQGACY-UHFFFAOYSA-N propylazanium;chloride Chemical compound Cl.CCCN PYNUOAIJIQGACY-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- JIKVETCBELSHNU-UHFFFAOYSA-M silver;3-oxobutanoate Chemical compound [Ag+].CC(=O)CC([O-])=O JIKVETCBELSHNU-UHFFFAOYSA-M 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
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Abstract
Description
Claims (11)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JP2013072363 | 2013-03-29 | ||
JP2013-072363 | 2013-03-29 | ||
JP2014059150 | 2014-03-20 | ||
JP2014-059150 | 2014-03-20 | ||
PCT/JP2014/059028 WO2014157581A1 (ja) | 2013-03-29 | 2014-03-27 | 積層体及び回路基板 |
Publications (2)
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CN105073407A true CN105073407A (zh) | 2015-11-18 |
CN105073407B CN105073407B (zh) | 2017-01-11 |
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CN201480018612.1A Active CN105073407B (zh) | 2013-03-29 | 2014-03-27 | 层叠体及电路基板 |
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US (1) | US10849231B2 (zh) |
JP (2) | JP5986679B2 (zh) |
CN (1) | CN105073407B (zh) |
HK (1) | HK1217008A1 (zh) |
WO (1) | WO2014157581A1 (zh) |
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TWI655892B (zh) * | 2016-05-31 | 2019-04-01 | 日商Jx金屬股份有限公司 | 附散熱用金屬材之結構物、印刷電路板及電子機器、散熱用金屬材 |
TWI659828B (zh) * | 2016-07-27 | 2019-05-21 | 日商Jx金屬股份有限公司 | 附散熱用金屬材之結構物、印刷電路板、電子機器及散熱用金屬材 |
WO2018087858A1 (ja) * | 2016-11-10 | 2018-05-17 | 京セラ株式会社 | 半導体接着用樹脂組成物、半導体接着用シート及びそれを用いた半導体装置 |
JP7418731B2 (ja) | 2018-10-04 | 2024-01-22 | Toppanエッジ株式会社 | 金属製部材の接合方法 |
US11268809B2 (en) * | 2018-11-07 | 2022-03-08 | International Business Machines Corporation | Detecting and correcting deficiencies in surface conditions for bonding applications |
KR102184587B1 (ko) * | 2019-02-28 | 2020-12-01 | 주식회사 케이씨씨 | 접착제 조성물 |
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JP2000022294A (ja) * | 1998-06-30 | 2000-01-21 | Kyocera Corp | 電子部品回路基板 |
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JP2005203722A (ja) * | 2003-12-16 | 2005-07-28 | Kyocera Corp | 配線基板 |
JP2006066838A (ja) * | 2004-08-30 | 2006-03-09 | Teikoku Tsushin Kogyo Co Ltd | 回路基板 |
CN101390210A (zh) * | 2005-12-28 | 2009-03-18 | 联合材料公司 | 半导体元件安装用基板和使用其的半导体装置及半导体元件安装用基板的制造方法 |
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JPH10338860A (ja) * | 1997-06-06 | 1998-12-22 | Bridgestone Corp | 異方性導電フィルム |
US6164520A (en) | 1999-11-11 | 2000-12-26 | Visteon Global Technologies, Inc. | Robust thick film conductors |
JP2002076565A (ja) | 2000-08-29 | 2002-03-15 | Matsushita Electric Ind Co Ltd | 電子部品およびその実装体 |
US20060130700A1 (en) * | 2004-12-16 | 2006-06-22 | Reinartz Nicole M | Silver-containing inkjet ink |
JP5042729B2 (ja) * | 2006-07-04 | 2012-10-03 | 新日鐵化学株式会社 | ポリイミド樹脂層の表面改質方法及び金属張積層板の製造方法 |
TW200811717A (en) * | 2006-08-25 | 2008-03-01 | Advanced Connectek Inc | Method for fabricating antenna units in continuous manner |
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US20150068907A1 (en) * | 2012-03-30 | 2015-03-12 | Dic Corporation | Laminate, conductive pattern, electric circuit, and method for producing laminate |
CN104471652B (zh) * | 2012-07-17 | 2016-10-26 | 日油株式会社 | 含银组合物及银成分形成基材 |
-
2014
- 2014-03-27 JP JP2015508735A patent/JP5986679B2/ja active Active
- 2014-03-27 WO PCT/JP2014/059028 patent/WO2014157581A1/ja active Application Filing
- 2014-03-27 CN CN201480018612.1A patent/CN105073407B/zh active Active
- 2014-03-27 US US14/778,162 patent/US10849231B2/en active Active
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2016
- 2016-04-28 HK HK16104900.3A patent/HK1217008A1/zh unknown
- 2016-05-27 JP JP2016106808A patent/JP6270913B2/ja active Active
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JP2000022294A (ja) * | 1998-06-30 | 2000-01-21 | Kyocera Corp | 電子部品回路基板 |
CN1287771A (zh) * | 1998-10-07 | 2001-03-14 | 松下电器产业株式会社 | 布线电路板的制造方法和布线电路板 |
JP2005203722A (ja) * | 2003-12-16 | 2005-07-28 | Kyocera Corp | 配線基板 |
JP2006066838A (ja) * | 2004-08-30 | 2006-03-09 | Teikoku Tsushin Kogyo Co Ltd | 回路基板 |
CN101390210A (zh) * | 2005-12-28 | 2009-03-18 | 联合材料公司 | 半导体元件安装用基板和使用其的半导体装置及半导体元件安装用基板的制造方法 |
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US10849231B2 (en) | 2020-11-24 |
WO2014157581A1 (ja) | 2014-10-02 |
JP5986679B2 (ja) | 2016-09-06 |
US20160286653A1 (en) | 2016-09-29 |
JP6270913B2 (ja) | 2018-01-31 |
HK1217008A1 (zh) | 2016-12-16 |
CN105073407B (zh) | 2017-01-11 |
JP2016157987A (ja) | 2016-09-01 |
JPWO2014157581A1 (ja) | 2017-02-16 |
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