HK1217008A1 - 層叠體及電路基板 - Google Patents

層叠體及電路基板

Info

Publication number
HK1217008A1
HK1217008A1 HK16104900.3A HK16104900A HK1217008A1 HK 1217008 A1 HK1217008 A1 HK 1217008A1 HK 16104900 A HK16104900 A HK 16104900A HK 1217008 A1 HK1217008 A1 HK 1217008A1
Authority
HK
Hong Kong
Prior art keywords
laminate
circuit board
board
circuit
Prior art date
Application number
HK16104900.3A
Other languages
English (en)
Inventor
Akihito Mori
Original Assignee
Toppan Forms Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Forms Co Ltd filed Critical Toppan Forms Co Ltd
Publication of HK1217008A1 publication Critical patent/HK1217008A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
HK16104900.3A 2013-03-29 2016-04-28 層叠體及電路基板 HK1217008A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013072363 2013-03-29
JP2014059150 2014-03-20
PCT/JP2014/059028 WO2014157581A1 (ja) 2013-03-29 2014-03-27 積層体及び回路基板

Publications (1)

Publication Number Publication Date
HK1217008A1 true HK1217008A1 (zh) 2016-12-16

Family

ID=51624537

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16104900.3A HK1217008A1 (zh) 2013-03-29 2016-04-28 層叠體及電路基板

Country Status (5)

Country Link
US (1) US10849231B2 (zh)
JP (2) JP5986679B2 (zh)
CN (1) CN105073407B (zh)
HK (1) HK1217008A1 (zh)
WO (1) WO2014157581A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI655892B (zh) * 2016-05-31 2019-04-01 日商Ｊｘ金屬股份有限公司 附散熱用金屬材之結構物、印刷電路板及電子機器、散熱用金屬材
TWI659828B (zh) * 2016-07-27 2019-05-21 日商Ｊｘ金屬股份有限公司 附散熱用金屬材之結構物、印刷電路板、電子機器及散熱用金屬材
CN109952356A (zh) * 2016-11-10 2019-06-28 京瓷株式会社 半导体粘接用树脂组合物、半导体粘接用片以及使用其的半导体装置
JP7418731B2 (ja) 2018-10-04 2024-01-22 Ｔｏｐｐａｎエッジ株式会社 金属製部材の接合方法
US11268809B2 (en) * 2018-11-07 2022-03-08 International Business Machines Corporation Detecting and correcting deficiencies in surface conditions for bonding applications
KR102184587B1 (ko) * 2019-02-28 2020-12-01 주식회사 케이씨씨 접착제 조성물

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4820745A (en) * 1985-05-07 1989-04-11 Huels Troisdorf Aktiengesellschaft Pressure-sensitive adhesives based on radiation-curable polyesters containing (meth)acrylic groups
JPH10338860A (ja) * 1997-06-06 1998-12-22 Bridgestone Corp 異方性導電フィルム
JP2000022294A (ja) * 1998-06-30 2000-01-21 Kyocera Corp 電子部品回路基板
JP2000114691A (ja) * 1998-10-07 2000-04-21 Matsushita Electric Ind Co Ltd 配線回路基板の製造方法
US6164520A (en) 1999-11-11 2000-12-26 Visteon Global Technologies, Inc. Robust thick film conductors
JP2002076565A (ja) 2000-08-29 2002-03-15 Matsushita Electric Ind Co Ltd 電子部品およびその実装体
JP2005203722A (ja) * 2003-12-16 2005-07-28 Kyocera Corp 配線基板
JP2006066838A (ja) * 2004-08-30 2006-03-09 Teikoku Tsushin Kogyo Co Ltd 回路基板
US20060130700A1 (en) * 2004-12-16 2006-06-22 Reinartz Nicole M Silver-containing inkjet ink
CN101390210B (zh) * 2005-12-28 2010-07-28 联合材料公司 半导体元件安装用基板及其制造方法以及半导体装置
JP5042729B2 (ja) * 2006-07-04 2012-10-03 新日鐵化学株式会社 ポリイミド樹脂層の表面改質方法及び金属張積層板の製造方法
TW200811717A (en) * 2006-08-25 2008-03-01 Advanced Connectek Inc Method for fabricating antenna units in continuous manner
WO2009084386A1 (ja) * 2007-12-27 2009-07-09 Bridgestone Corporation 接着性樹脂組成物
JP2010225572A (ja) 2008-11-10 2010-10-07 Kobe Steel Ltd 有機ｅｌディスプレイ用の反射アノード電極および配線膜
JP5323668B2 (ja) * 2009-12-24 2013-10-23 日本メクトロン株式会社 照明装置及びその製造方法
WO2011086680A1 (ja) * 2010-01-15 2011-07-21 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤
JP5906027B2 (ja) * 2010-07-30 2016-04-20 トッパン・フォームズ株式会社 装飾用又は鏡面用インク組成物、基材及び金属銀層を表面に供えた基材の製造方法
DE112013001780B4 (de) * 2012-03-30 2024-08-08 Dic Corporation Schichtpressstoff, Leiterbild, Stromkreis und Verfahren zur Schichtpressstoffherstellung
WO2014013557A1 (ja) * 2012-07-17 2014-01-23 日油株式会社 銀含有組成物及び銀要素形成基材

Also Published As

Publication number Publication date
US10849231B2 (en) 2020-11-24
CN105073407A (zh) 2015-11-18
JP5986679B2 (ja) 2016-09-06
JP6270913B2 (ja) 2018-01-31
JP2016157987A (ja) 2016-09-01
US20160286653A1 (en) 2016-09-29
WO2014157581A1 (ja) 2014-10-02
JPWO2014157581A1 (ja) 2017-02-16
CN105073407B (zh) 2017-01-11

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