CN104969125B - 辐射敏感树脂组合物及电子部件 - Google Patents

辐射敏感树脂组合物及电子部件 Download PDF

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Publication number
CN104969125B
CN104969125B CN201480007070.8A CN201480007070A CN104969125B CN 104969125 B CN104969125 B CN 104969125B CN 201480007070 A CN201480007070 A CN 201480007070A CN 104969125 B CN104969125 B CN 104969125B
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methyl
alkene
group
hept
radiation
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Chinese (zh)
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CN104969125A (zh
Inventor
阿部聪
堤隆志
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Zeon Corp
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Nippon Zeon Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/22Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • C08K5/28Azides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/375Thiols containing six-membered aromatic rings

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
CN201480007070.8A 2013-02-04 2014-02-03 辐射敏感树脂组合物及电子部件 Active CN104969125B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-019167 2013-02-04
JP2013019167 2013-02-04
PCT/JP2014/052408 WO2014119777A1 (ja) 2013-02-04 2014-02-03 感放射線樹脂組成物および電子部品

Publications (2)

Publication Number Publication Date
CN104969125A CN104969125A (zh) 2015-10-07
CN104969125B true CN104969125B (zh) 2019-06-04

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CN201480007070.8A Active CN104969125B (zh) 2013-02-04 2014-02-03 辐射敏感树脂组合物及电子部件

Country Status (5)

Country Link
JP (1) JP6304044B2 (ja)
KR (1) KR102217197B1 (ja)
CN (1) CN104969125B (ja)
TW (1) TWI632163B (ja)
WO (1) WO2014119777A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6702194B2 (ja) * 2014-10-24 2020-05-27 住友ベークライト株式会社 感光性接着剤組成物および半導体装置
EP3345971A4 (en) * 2015-08-31 2019-04-17 Zeon Corporation RESIN COMPOSITION
US11467494B2 (en) * 2019-03-15 2022-10-11 Merck Patent Gmbh Positive type photosensitive polysiloxane composition
TWI833992B (zh) 2019-10-15 2024-03-01 美商羅門哈斯電子材料有限公司 光致抗蝕劑組成物及圖案形成方法
WO2023176680A1 (ja) * 2022-03-14 2023-09-21 株式会社Adeka 組成物及び硬化物

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1656428A (zh) * 2002-09-30 2005-08-17 日本瑞翁株式会社 放射线敏感性树脂组合物、树脂图案膜及其形成方法以及树脂图案膜的应用
JP2005272495A (ja) * 2004-03-23 2005-10-06 Jsr Corp 接着剤用液状硬化性樹脂組成物
JP2005292278A (ja) * 2004-03-31 2005-10-20 Nippon Zeon Co Ltd 感放射線組成物、積層体及びその製造方法並びに電子部品
KR20090132194A (ko) * 2008-06-20 2009-12-30 동우 화인켐 주식회사 청색 감광성 수지 조성물, 이를 이용한 컬러필터 및액정표시장치
CN101620376A (zh) * 2008-07-02 2010-01-06 富士胶片株式会社 压印用固化性组合物、使用了该组合物的固化物及其制造方法、以及液晶显示装置用部件
JP2010224067A (ja) * 2009-03-19 2010-10-07 Jsr Corp 感放射線性樹脂組成物、液晶表示素子の層間絶縁膜、保護膜及びスペーサーとその形成方法
CN102549496A (zh) * 2009-10-16 2012-07-04 夏普株式会社 放射线敏感性树脂组合物以及层间绝缘膜的形成方法
CN102762621A (zh) * 2009-11-30 2012-10-31 日立化成工业株式会社 感光性树脂组合物、感光性树脂清漆、感光性树脂膜和感光性树脂固化物
JP2012212039A (ja) * 2011-03-31 2012-11-01 Sekisui Chem Co Ltd 感光性組成物及びプリント配線板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5589270B2 (ja) * 2007-10-23 2014-09-17 Jsr株式会社 青色カラーフィルタ用感放射線性組成物、カラーフィルタ及び液晶表示素子
TWI507819B (zh) * 2011-03-31 2015-11-11 Toyo Ink Sc Holdings Co Ltd 著色組成物及用此之彩色濾光片
JP6010322B2 (ja) * 2012-04-09 2016-10-19 株式会社カネカ 硬化性組成物およびその用途

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1656428A (zh) * 2002-09-30 2005-08-17 日本瑞翁株式会社 放射线敏感性树脂组合物、树脂图案膜及其形成方法以及树脂图案膜的应用
JP2005272495A (ja) * 2004-03-23 2005-10-06 Jsr Corp 接着剤用液状硬化性樹脂組成物
JP2005292278A (ja) * 2004-03-31 2005-10-20 Nippon Zeon Co Ltd 感放射線組成物、積層体及びその製造方法並びに電子部品
KR20090132194A (ko) * 2008-06-20 2009-12-30 동우 화인켐 주식회사 청색 감광성 수지 조성물, 이를 이용한 컬러필터 및액정표시장치
CN101620376A (zh) * 2008-07-02 2010-01-06 富士胶片株式会社 压印用固化性组合物、使用了该组合物的固化物及其制造方法、以及液晶显示装置用部件
JP2010224067A (ja) * 2009-03-19 2010-10-07 Jsr Corp 感放射線性樹脂組成物、液晶表示素子の層間絶縁膜、保護膜及びスペーサーとその形成方法
CN102549496A (zh) * 2009-10-16 2012-07-04 夏普株式会社 放射线敏感性树脂组合物以及层间绝缘膜的形成方法
CN102762621A (zh) * 2009-11-30 2012-10-31 日立化成工业株式会社 感光性树脂组合物、感光性树脂清漆、感光性树脂膜和感光性树脂固化物
JP2012212039A (ja) * 2011-03-31 2012-11-01 Sekisui Chem Co Ltd 感光性組成物及びプリント配線板

Also Published As

Publication number Publication date
KR20150115832A (ko) 2015-10-14
TWI632163B (zh) 2018-08-11
JP6304044B2 (ja) 2018-04-04
TW201439127A (zh) 2014-10-16
CN104969125A (zh) 2015-10-07
JPWO2014119777A1 (ja) 2017-01-26
KR102217197B1 (ko) 2021-02-17
WO2014119777A1 (ja) 2014-08-07

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