CN104926314B8 - 一种led用陶瓷基板 - Google Patents

一种led用陶瓷基板 Download PDF

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Publication number
CN104926314B8
CN104926314B8 CN201510334118.2A CN201510334118A CN104926314B8 CN 104926314 B8 CN104926314 B8 CN 104926314B8 CN 201510334118 A CN201510334118 A CN 201510334118A CN 104926314 B8 CN104926314 B8 CN 104926314B8
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ceramic substrate
raw materials
additives
leds
meanwhile
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CN104926314A (zh
CN104926314B (zh
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张宝
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Gansu Rongbao Technology Co ltd
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Gansu Rongbao Technology Co ltd
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Abstract

本发明公开了一种LED用陶瓷基板，优化LTCC制备工艺中的各种原料，以氮化铝、氮化硼、氧化铝和氧化铍作为主要原料，同时，添加了玻璃烧结助剂、铜铝合金纳米颗粒、稀土氧化物、溶剂、增塑剂、分散剂和粘结剂等添加剂，进一步优化了陶瓷基板的物化性能，本申请的陶瓷基板导热率大于400W/(m·k)，抗弯强度大于300Mpa，介电常数小于2。同时，通过常规的LTCC制备方法，即可将主要原料和添加剂制备成具有高导率的陶瓷基板，制备工艺简单，利于产业化。
CN201510334118.2A 2015-06-17 2015-06-17 一种led用陶瓷基板 Expired - Fee Related CN104926314B8 (zh)

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CN104926314A CN104926314A (zh) 2015-09-23
CN104926314B CN104926314B (zh) 2016-12-07
CN104926314B8 true CN104926314B8 (zh) 2017-02-22

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105304795A (zh) * 2015-11-04 2016-02-03 苏州知瑞光电材料科技有限公司 一种led用陶瓷散热基板
CN106187204A (zh) * 2016-07-20 2016-12-07 合肥毅创钣金科技有限公司 一种氟羟基磷灰石改性的高致密度大功率led散热陶瓷基板
CN106187250A (zh) * 2016-07-20 2016-12-07 合肥毅创钣金科技有限公司 一种纳米氧化锆‑纳米铜增韧的大功率led散热氮化铝陶瓷基板
CN106340669A (zh) * 2016-09-18 2017-01-18 中南大学 一种用于固体电解质的氧化镧掺杂氧氮玻璃及其制备方法
CN107311666A (zh) * 2017-05-23 2017-11-03 福建华清电子材料科技有限公司 低温共烧陶瓷基板的成型与烧结方法
KR101797232B1 (ko) * 2017-07-10 2017-11-13 주식회사 케이에스엠컴포넌트 정전척
CN109285786A (zh) * 2018-09-17 2019-01-29 郭鸿洲 一种芯片封装基板及制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1938221A (zh) * 2004-03-29 2007-03-28 电气化学工业株式会社 氮化铝粉末及氮化铝烧结体
CN1972883A (zh) * 2004-06-21 2007-05-30 株式会社德山 氮化物烧结体及其制造方法
CN103803984A (zh) * 2013-12-30 2014-05-21 莱鼎电子材料科技有限公司 采用复合粉末粒型制备氮化铝陶瓷基片的方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1938221A (zh) * 2004-03-29 2007-03-28 电气化学工业株式会社 氮化铝粉末及氮化铝烧结体
CN1972883A (zh) * 2004-06-21 2007-05-30 株式会社德山 氮化物烧结体及其制造方法
CN103803984A (zh) * 2013-12-30 2014-05-21 莱鼎电子材料科技有限公司 采用复合粉末粒型制备氮化铝陶瓷基片的方法

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CN104926314B (zh) 2016-12-07

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Effective date of registration: 20160929

Address after: 266000 Licang, Qingdao, No. nine East water road, No. 320, No.

Applicant after: Gu Yukui

Address before: 410205 A543, Changsha, China, the headquarters of the software park, No. 39, sharp mountain road, high tech Development Zone, Hunan, China

Applicant before: CHANGSHA DINGCHENG NEW MATERIAL TECHNOLOGY Co.,Ltd.

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Effective date of registration: 20161201

Address after: 733017 Yongchang Town, Gansu, Wuwei

Patentee after: Gansu Rongbao Technology Co.,Ltd.

Address before: 266000 Licang, Qingdao, No. nine East water road, No. 320, No.

Patentee before: Gu Yukui

C53 Correction of patent of invention or patent application
CI01 Publication of corrected invention patent application

Correction item: Patentee|Address|Inventor

Correct: Gansu Rongbao Technology Co.,Ltd.|733017 Yongchang Town, Gansu, Wuwei|Zhang Bao

False: Gu Yukui|266000 Licang, Qingdao, No. nine East water road, No. 320, No.|Liu Zhentian

Number: 49

Volume: 32

CI03 Correction of invention patent

Correction item: Patentee|Address|Inventor

Correct: Gansu Rongbao Technology Co.,Ltd.|733017 Yongchang Town, Gansu, Wuwei|Zhang Bao

False: Gu Yukui|266000 Licang, Qingdao, No. nine East water road, No. 320, No.|Liu Zhentian

Number: 49

Page: The title page

Volume: 32

ERR Gazette correction
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161207

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CF01 Termination of patent right due to non-payment of annual fee