CN104918744B - 三维激光加工机 - Google Patents

三维激光加工机 Download PDF

Info

Publication number
CN104918744B
CN104918744B CN201380070104.3A CN201380070104A CN104918744B CN 104918744 B CN104918744 B CN 104918744B CN 201380070104 A CN201380070104 A CN 201380070104A CN 104918744 B CN104918744 B CN 104918744B
Authority
CN
China
Prior art keywords
workpiece
laser processing
dimensional shape
processing
dimensional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380070104.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN104918744A (zh
Inventor
山下贡丸
藤田善仁
吴屋真之
柴田亮太
铃木龙
山崎真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Publication of CN104918744A publication Critical patent/CN104918744A/zh
Application granted granted Critical
Publication of CN104918744B publication Critical patent/CN104918744B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568Modifying rugosity
    • B23K26/3576Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
    • G01B5/0004Supports

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
CN201380070104.3A 2013-01-10 2013-11-08 三维激光加工机 Expired - Fee Related CN104918744B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-002328 2013-01-10
JP2013002328A JP2014133248A (ja) 2013-01-10 2013-01-10 三次元レーザ加工機
PCT/JP2013/080208 WO2014109120A1 (ja) 2013-01-10 2013-11-08 三次元レーザ加工機

Publications (2)

Publication Number Publication Date
CN104918744A CN104918744A (zh) 2015-09-16
CN104918744B true CN104918744B (zh) 2016-11-23

Family

ID=51166785

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380070104.3A Expired - Fee Related CN104918744B (zh) 2013-01-10 2013-11-08 三维激光加工机

Country Status (8)

Country Link
US (1) US20150336209A1 (enExample)
EP (1) EP2944414A4 (enExample)
JP (1) JP2014133248A (enExample)
KR (1) KR20150092320A (enExample)
CN (1) CN104918744B (enExample)
CA (1) CA2897472A1 (enExample)
TW (1) TWI583480B (enExample)
WO (1) WO2014109120A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2536434A (en) * 2015-03-16 2016-09-21 Sony Corp A cutting device, cutting equipment and method
US20160311062A1 (en) * 2015-04-21 2016-10-27 Rohr, Inc. Machining a freely arranged or partially constrained composite part using a laser system
CN105215545A (zh) * 2015-11-11 2016-01-06 苏州天弘激光股份有限公司 晶圆直切机
KR101811696B1 (ko) * 2016-01-25 2017-12-27 주식회사 쓰리디시스템즈코리아 3차원 스캐닝 장치 및 3차원 스캐닝 방법
USD870166S1 (en) * 2016-08-31 2019-12-17 Trumpf Gmbh + Co. Kg Laser processing machine
WO2018203362A1 (ja) * 2017-05-01 2018-11-08 株式会社ニコン 加工装置及び加工方法
KR102110763B1 (ko) * 2017-05-10 2020-06-08 최병찬 솔더링 장치, 레이저 가공 장치 및 가공 방법
JP7056425B2 (ja) * 2018-07-17 2022-04-19 株式会社デンソー レーザ加工装置
EP3834979A4 (en) * 2018-08-06 2022-04-27 The University of Tokyo Machine learning method used for laser processing system, simulation device, laser processing system, and program
DE112019004824T5 (de) * 2018-09-26 2021-06-10 Nidec Machinery Corporation Flüssigkeitsbeschichtungsvorrichtung
KR102186303B1 (ko) * 2018-10-11 2020-12-04 주식회사 인스텍 영상처리를 이용한 실시간 자동 높이 추적 제어 시스템 및 그 방법
CN110147073A (zh) * 2019-06-21 2019-08-20 东莞市力星激光科技有限公司 一种激光切管机的控制系统
CN112077450A (zh) * 2020-08-17 2020-12-15 黑龙江职业学院(黑龙江省经济管理干部学院) 一种高效激光雕刻模组
IT202100030350A1 (it) * 2021-11-30 2023-05-30 Luca Zanotto Apparato e procedimento per la lavorazione superficiale di elementi lastriformi
JP2024032310A (ja) * 2022-08-29 2024-03-12 株式会社東京精密 測定装置及び加工装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6127192A (ja) 1984-07-17 1986-02-06 Mitsubishi Heavy Ind Ltd レ−ザ−加工機
JPH10156677A (ja) * 1996-12-04 1998-06-16 Amada Washino Co Ltd 研削加工方法及び研削盤
CA2251243C (en) * 1998-10-21 2006-12-19 Robert Dworkowski Distance tracking control system for single pass topographical mapping
JP3806342B2 (ja) * 2001-11-26 2006-08-09 三菱重工業株式会社 3次元形状物溶接方法及びその装置
AU2003267781A1 (en) * 2002-09-13 2004-04-30 Tamicare Ltd. Laser modification of complex objects
JP3796207B2 (ja) * 2002-09-20 2006-07-12 新潟県 三次元レーザ加工機による加工方法並びに三次元レーザ加工用のncプログラムの作成方法
JP2005021937A (ja) * 2003-07-01 2005-01-27 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
JP2006098065A (ja) * 2004-09-28 2006-04-13 Sanyo Electric Co Ltd キャリブレーション装置および方法、ならびにそれらを利用可能な3次元モデリング装置および3次元モデリングシステム
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
JP5300185B2 (ja) * 2006-08-14 2013-09-25 日産自動車株式会社 レーザ加工装置およびそのレーザ加工方法
CN101138926A (zh) * 2007-02-28 2008-03-12 浙江省林业科学研究院 一种仿形激光雕刻加工方法及其激光雕刻机
JP2009082932A (ja) * 2007-09-28 2009-04-23 Pulstec Industrial Co Ltd レーザ加工装置及びレーザ加工方法
JP2010017745A (ja) 2008-07-11 2010-01-28 Mitsui Seiki Kogyo Co Ltd 5軸レーザ加工装置
CN101372070B (zh) * 2008-08-15 2011-06-22 东莞华中科技大学制造工程研究院 一种连杆式激光焊接测量一体化装置
CN101376194B (zh) * 2008-08-19 2011-02-16 东莞华中科技大学制造工程研究院 一种激光焊接在线测量补偿装置
JP5318544B2 (ja) * 2008-12-01 2013-10-16 株式会社ディスコ レーザ加工装置
CN101786200B (zh) * 2010-02-26 2012-01-25 华中科技大学 一种自由曲面上的投影式激光刻蚀方法
JP4891445B1 (ja) * 2011-03-17 2012-03-07 パナソニック電工株式会社 超精密複合加工装置および超精密複合加工方法

Also Published As

Publication number Publication date
TWI583480B (zh) 2017-05-21
CN104918744A (zh) 2015-09-16
EP2944414A1 (en) 2015-11-18
WO2014109120A1 (ja) 2014-07-17
KR20150092320A (ko) 2015-08-12
CA2897472A1 (en) 2014-07-17
EP2944414A4 (en) 2016-02-17
TW201429598A (zh) 2014-08-01
JP2014133248A (ja) 2014-07-24
US20150336209A1 (en) 2015-11-26

Similar Documents

Publication Publication Date Title
CN104918744B (zh) 三维激光加工机
US10474123B2 (en) Method and apparatus for detecting and correcting a spatial position of a workpiece held in a positioning device
CN104870143B (zh) 工具形状测定方法以及工具形状测定装置
JP6917409B2 (ja) 複数ワークの溶接方法及びその方法の使用
CN102216724B (zh) 车床中的直径测量
KR101527311B1 (ko) 공작 기계
US20210129271A1 (en) Apparatus and method for processing a workpiece by laser radiation
CN114450584A (zh) 层叠造形系统
JP2014013547A (ja) 加工システムにおける誤差補正装置および方法
KR20180132538A (ko) 레이저 가공 장치의 광축 확인 방법
JP2000074644A (ja) 棒状切削工具の測定装置並びに該測定装置を使用したドリルの測定方法
JP2004249305A (ja) レーザ溶接方法とそのレーザ溶接システム
JP7713645B2 (ja) レーザ溶接装置及びレーザ光の照射位置ずれの補正方法
JP2015131303A (ja) レーザー加工装置における加工送り機構の作動特性検出方法およびレーザー加工装置
JP2025018060A (ja) レーザ加工方法およびレーザ加工装置
CN109978853A (zh) 一种直线焊缝激光拼焊中焊接位置与焊缝偏差计算方法
JP2025096541A (ja) ロボット装置
JP7386282B2 (ja) 切断部材処理装置及び切断システム
TW202106433A (zh) 雷射加工裝置的加工性能之確認方法
JP4242229B2 (ja) 工作機械の熱変位補正方法およびその装置
JP6278611B2 (ja) 画像処理システム及びその方法
JP2003211274A (ja) レーザ溶接装置および溶接方法
JPH10337637A (ja) 基準孔加工方法及び基準孔加工装置
Jezeršek et al. Real time surface deformations monitoring during laser processing
JP2006202890A (ja) 切削装置

Legal Events

Date Code Title Description
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160524

Address after: Shiga

Applicant after: MITSUBISHI HEAVY IND LTD

Address before: Tokyo, Japan, Japan

Applicant before: Mit-subishi Heavy Industries Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161123

Termination date: 20171108