TWI583480B - Three - dimensional laser processing machine - Google Patents

Three - dimensional laser processing machine Download PDF

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Publication number
TWI583480B
TWI583480B TW102143321A TW102143321A TWI583480B TW I583480 B TWI583480 B TW I583480B TW 102143321 A TW102143321 A TW 102143321A TW 102143321 A TW102143321 A TW 102143321A TW I583480 B TWI583480 B TW I583480B
Authority
TW
Taiwan
Prior art keywords
workpiece
laser processing
processing
dimensional shape
laser
Prior art date
Application number
TW102143321A
Other languages
English (en)
Chinese (zh)
Other versions
TW201429598A (zh
Inventor
Tsugumaru Yamashita
Yoshihito Fujita
Saneyuki Goya
Ryota Shibata
Ryu Suzuki
Makoto Yamasaki
Original Assignee
Mitsubishi Heavy Industries Machine Tool Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Machine Tool Co Ltd filed Critical Mitsubishi Heavy Industries Machine Tool Co Ltd
Publication of TW201429598A publication Critical patent/TW201429598A/zh
Application granted granted Critical
Publication of TWI583480B publication Critical patent/TWI583480B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. by grinding, polishing or smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
    • G01B5/0004—Supports

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
TW102143321A 2013-01-10 2013-11-27 Three - dimensional laser processing machine TWI583480B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013002328A JP2014133248A (ja) 2013-01-10 2013-01-10 三次元レーザ加工機

Publications (2)

Publication Number Publication Date
TW201429598A TW201429598A (zh) 2014-08-01
TWI583480B true TWI583480B (zh) 2017-05-21

Family

ID=51166785

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102143321A TWI583480B (zh) 2013-01-10 2013-11-27 Three - dimensional laser processing machine

Country Status (8)

Country Link
US (1) US20150336209A1 (enExample)
EP (1) EP2944414A4 (enExample)
JP (1) JP2014133248A (enExample)
KR (1) KR20150092320A (enExample)
CN (1) CN104918744B (enExample)
CA (1) CA2897472A1 (enExample)
TW (1) TWI583480B (enExample)
WO (1) WO2014109120A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI916712B (zh) 2023-11-21 2026-03-01 明志科技大學 高功率雷射提升人孔蓋表面抗滑係數的方法

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GB2536434A (en) * 2015-03-16 2016-09-21 Sony Corp A cutting device, cutting equipment and method
US20160311062A1 (en) * 2015-04-21 2016-10-27 Rohr, Inc. Machining a freely arranged or partially constrained composite part using a laser system
CN105215545A (zh) * 2015-11-11 2016-01-06 苏州天弘激光股份有限公司 晶圆直切机
KR101811696B1 (ko) * 2016-01-25 2017-12-27 주식회사 쓰리디시스템즈코리아 3차원 스캐닝 장치 및 3차원 스캐닝 방법
USD870166S1 (en) * 2016-08-31 2019-12-17 Trumpf Gmbh + Co. Kg Laser processing machine
WO2018203362A1 (ja) * 2017-05-01 2018-11-08 株式会社ニコン 加工装置及び加工方法
TWI677393B (zh) * 2017-05-10 2019-11-21 崔秉燦 夾具組件、包括此夾具組件的雷射加工方法及雷射加工裝置
JP7056425B2 (ja) * 2018-07-17 2022-04-19 株式会社デンソー レーザ加工装置
WO2020031948A1 (ja) * 2018-08-06 2020-02-13 国立大学法人東京大学 レーザ加工システムに用いられる機械学習方法、シミュレーション装置、レーザ加工システム並びにプログラム
KR102587522B1 (ko) * 2018-09-26 2023-10-11 헤이신 엘티디. 액체 도포 장치
KR102186303B1 (ko) * 2018-10-11 2020-12-04 주식회사 인스텍 영상처리를 이용한 실시간 자동 높이 추적 제어 시스템 및 그 방법
CN110147073A (zh) * 2019-06-21 2019-08-20 东莞市力星激光科技有限公司 一种激光切管机的控制系统
CN112077450A (zh) * 2020-08-17 2020-12-15 黑龙江职业学院(黑龙江省经济管理干部学院) 一种高效激光雕刻模组
IT202100030350A1 (it) * 2021-11-30 2023-05-30 Luca Zanotto Apparato e procedimento per la lavorazione superficiale di elementi lastriformi
JP2024032310A (ja) * 2022-08-29 2024-03-12 株式会社東京精密 測定装置及び加工装置

Citations (8)

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US6563130B2 (en) * 1998-10-21 2003-05-13 Canadian Space Agency Distance tracking control system for single pass topographical mapping
CN1421293A (zh) * 2001-11-26 2003-06-04 三菱重工业株式会社 三维形状物焊接方法及其装置
WO2004024384A1 (en) * 2002-09-13 2004-03-25 Tamicare Ltd. Laser modification of complex objects
TW200730285A (en) * 2005-10-18 2007-08-16 Electro Scient Ind Inc Real time target topography tracking during laser processing
CN101138926A (zh) * 2007-02-28 2008-03-12 浙江省林业科学研究院 一种仿形激光雕刻加工方法及其激光雕刻机
CN101372070A (zh) * 2008-08-15 2009-02-25 东莞华中科技大学制造工程研究院 一种连杆式激光焊接测量一体化装置
CN101376194A (zh) * 2008-08-19 2009-03-04 东莞华中科技大学制造工程研究院 一种激光焊接在线测量补偿装置
CN101786200A (zh) * 2010-02-26 2010-07-28 华中科技大学 一种自由曲面上的投影式激光刻蚀方法

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JP2009082932A (ja) * 2007-09-28 2009-04-23 Pulstec Industrial Co Ltd レーザ加工装置及びレーザ加工方法
JP2010017745A (ja) 2008-07-11 2010-01-28 Mitsui Seiki Kogyo Co Ltd ５軸レーザ加工装置
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JP4891445B1 (ja) * 2011-03-17 2012-03-07 パナソニック電工株式会社 超精密複合加工装置および超精密複合加工方法

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US6563130B2 (en) * 1998-10-21 2003-05-13 Canadian Space Agency Distance tracking control system for single pass topographical mapping
CN1421293A (zh) * 2001-11-26 2003-06-04 三菱重工业株式会社 三维形状物焊接方法及其装置
WO2004024384A1 (en) * 2002-09-13 2004-03-25 Tamicare Ltd. Laser modification of complex objects
TW200730285A (en) * 2005-10-18 2007-08-16 Electro Scient Ind Inc Real time target topography tracking during laser processing
CN101138926A (zh) * 2007-02-28 2008-03-12 浙江省林业科学研究院 一种仿形激光雕刻加工方法及其激光雕刻机
CN101372070A (zh) * 2008-08-15 2009-02-25 东莞华中科技大学制造工程研究院 一种连杆式激光焊接测量一体化装置
CN101376194A (zh) * 2008-08-19 2009-03-04 东莞华中科技大学制造工程研究院 一种激光焊接在线测量补偿装置
CN101786200A (zh) * 2010-02-26 2010-07-28 华中科技大学 一种自由曲面上的投影式激光刻蚀方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI916712B (zh) 2023-11-21 2026-03-01 明志科技大學 高功率雷射提升人孔蓋表面抗滑係數的方法

Also Published As

Publication number Publication date
EP2944414A1 (en) 2015-11-18
WO2014109120A1 (ja) 2014-07-17
TW201429598A (zh) 2014-08-01
KR20150092320A (ko) 2015-08-12
US20150336209A1 (en) 2015-11-26
EP2944414A4 (en) 2016-02-17
CN104918744B (zh) 2016-11-23
CN104918744A (zh) 2015-09-16
JP2014133248A (ja) 2014-07-24
CA2897472A1 (en) 2014-07-17

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