CN104862656B - Two-way deposition plating apparatus and film plating process - Google Patents
Two-way deposition plating apparatus and film plating process Download PDFInfo
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- CN104862656B CN104862656B CN201510314281.2A CN201510314281A CN104862656B CN 104862656 B CN104862656 B CN 104862656B CN 201510314281 A CN201510314281 A CN 201510314281A CN 104862656 B CN104862656 B CN 104862656B
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- umbrella stand
- substrate
- plated film
- sputtering target
- target material
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Abstract
The present invention relates to technical field of film preparation, especially two-way deposition plating apparatus and film plating process, it is characterised in that：Sputtering target material and evaporation source are fixedly installed respectively above and below the workpiece umbrella stand, the plated film that the evaporation source below the workpiece umbrella stand is carried out by corresponding ion gun booster action to a side surface of the substrate, the sputtering target material above the workpiece umbrella stand carry out plated film by corresponding radio frequency source excitation and to another side surface of the substrate.It is an advantage of the invention that：Two-sided while plated film two-way deposition vacuum coating apparatus can be realized, to reach two coating materials sources of synchronization while deposit；The plated film link for the substrate for making to need double-sided coating is reduced, and helps to plate the raising of membrane efficiency and quality.
Description
Technical field
The present invention relates to technical field of film preparation, especially two-way deposition plating apparatus and film plating process.
Background technology
With the development of coating technique, higher requirement is proposed to film quality and plating membrane efficiency.Many coated products,
Such as optical lens, optical mirror slip etc., need to carry out double-sided coating to its substrate under normal conditions.It is two-sided for these needs
The product of plated film, current common process are successively coated with the film on two surfaces of substrate generally by plated film twice；Namely
Carry out following tetra- steps of A, B, C, D：The first plated film on a surface of substrate（A）, after the completion of plated film by substrate from fixture
Take out（B）, reverse side and again clamps are carried out to substrate（C）, then the plated film on another surface of substrate（D）.Above flow is deposited
In following area for improvement：1）Plated film adds work time cost at twice on substrate two surfaces, and is unfavorable for production effect
The raising of rate.2）In manufacturing enterprise, by generally requiring to increase by one of cleaning step B to step C, opened with reducing
Door for vacuum chamber and take the pollution during sample.3）During step B and step C is carried out, some substrate tables are often produced
Face, which forms scuffing etc., influences the factor of product yield.
For the technological process of above-mentioned double-sided coating, there is technical staff by changing to mechanism in vacuum coating equipment
Make to seek solution route.Wherein, more successful reforming mode is the method using upset workpiece umbrella stand.Here, workpiece umbrella
The device of film plating substrate is placed when frame is plated film；Upset workpiece umbrella stand refers to the workpiece umbrella stand that can be overturn.This method
The main distinction with above-mentioned A-B-C-D four steps conventional method is：After the step A of coating single side is completed, without opening
Door for vacuum chamber, substrate also avoid the need for taking out from the fixture of workpiece umbrella stand, but by mechanical mechanism directly by workpiece umbrella stand
Upset so that also uncoated one side carries out plated film, so as to complete double-sided coating to this face again thereafter towards evaporation source.It is above-mentioned
Flow may be summarized to be A, B/, tri- steps of D：The first plated film on a surface of substrate（A）, workpiece umbrella is overturn after the completion of plated film
Frame（B/）, then the plated film on another surface of substrate（D）.This upset workpiece umbrella stand method is mainly characterized by coated product
After the step A of coating single side is completed, coating machine, which does not have to deflate, to open the door, but in the case where keeping existing vacuum state, pass through workpiece
The upset of umbrella stand, and enter the plated film for another surface of substrate（That is step D）.The method of upset workpiece umbrella stand no doubt has it
Intrinsic advantage, but be not difficult to find out, this method actually or is successively carried out at twice for the plated film on two surfaces of substrate；Separately
Outside, in plated film cavity on the one hand the presence of switching mechanism adds design and manufacture cost, while the fault rate of switching mechanism is also
It can not be ignored.
The content of the invention
The purpose of the present invention is according to above-mentioned the deficiencies in the prior art, there is provided two-way deposition plating apparatus and plated film side
Method, by setting two sets of independent sputtering target materials and evaporation source, plated film is carried out simultaneously to substrate two sides, improves plating membrane efficiency and plating
Film quality.
The object of the invention is realized and completed by following technical scheme：
A kind of two-way deposition plating apparatus, including plated film cavity, workpiece umbrella stand, the work are provided with the plated film cavity
Substrate is carried on part umbrella stand, it is characterised in that：Sputtering target material is fixedly installed respectively above and below the workpiece umbrella stand
And evaporation source, the evaporation source below the workpiece umbrella stand is by corresponding ion gun booster action to the substrate
A side surface carry out plated film, the sputtering target material above the workpiece umbrella stand is by corresponding radio frequency source excitation
And plated film is carried out to another side surface of the substrate.
The sputtering target material above the workpiece umbrella stand is towards the substrate, above the workpiece umbrella stand
The radio frequency source is arranged towards the sputtering target material between the sputtering target material and the radio frequency source in angle, is ensured through institute
When stating sputtering target material described in radio frequency source excitation, the sputtered atom sputtering sedimentation of the sputtering target material is in the side table of the substrate
Face.
Amending plates are provided between the substrate and the sputtering target material, one end of the amending plates is fixedly installed on plated film
In the side wall of cavity, to be arranged between the side wall of the amending plates and plated film cavity in angle, angle angle between the two is satisfied with,
The sputtered atom of the sputtering target material passes through the amending plates.
The side wall of the plated film cavity is fixedly installed backplate, and the backplate is used to separate above the workpiece umbrella stand with
The plated film cavity of side, the setting height of the backplate is coincide with the height and position of the workpiece umbrella stand minimum point to be adapted to.
A kind of film plating process for being related to above-mentioned two-way deposition plating apparatus, it is characterised in that：Methods described comprises at least
Following steps：
The position of the sputtering target material of the adjustment above the workpiece umbrella stand and its with its form it is corresponding described in penetrate
Angle between frequency source, its angle of divergence and radiation areas are made to correspond to the upper of the substrate that covering is carried on the workpiece umbrella stand
Surface；The position of the evaporation source of the adjustment below the workpiece umbrella stand and its with its form the corresponding ion gun it
Between angle, the corresponding covering in its angle of divergence and radiation areas is carried on the lower surface of the substrate on the workpiece umbrella stand；
Deposition plating is carried out to the both side surface of the substrate, and avoids upper and lower radiation areas overlapping.
It is an advantage of the invention that：Two-sided while plated film two-way deposition vacuum coating apparatus can be realized, to reach same
Moment, two coating materials sources deposited simultaneously；The plated film link for the substrate for making to need double-sided coating is reduced, and helps to plate membrane efficiency and matter
The raising of amount；The material that a variety of double-faced sputter devices can not or be difficult to deposit can be plated easily, for subsequent thin film technique
Exploitation also provides certain hardware superiority；Machine cost is relatively low；Place while product can be more convenient, lens dimension shape is allowed
Greatly, and without being confined to planar substrates again.
Brief description of the drawings
Fig. 1 is the structural representation of coating apparatus in the present invention；
Fig. 2 be in Fig. 1 A-A ' to sectional view；
Fig. 3 be in Fig. 1 B-B ' to sectional view.
Embodiment
Feature of present invention and other correlated characteristics are described in further detail by embodiment below in conjunction with accompanying drawing, so as to
In the understanding of technical staff of the same trade：
As Figure 1-3,1-11 is marked to be expressed as in figure：Plated film cavity 1, substrate 2, workpiece umbrella stand 3, sputtering target material
4th, evaporation source 5, radio frequency source 6, ion gun 7, rotating mechanism 8, amending plates 9, amending plates 10, backplate 11.
Embodiment：As shown in figure 1, the two-way deposition plating apparatus in the present embodiment includes plated film cavity 1.Plated film cavity 1
It is internally provided with the workpiece umbrella stand 3 for carrying substrates 2.The center position of workpiece umbrella stand 3 is provided with rotating mechanism 8, whirler
Structure 8 is rotated by external drive device, and workpiece umbrella stand 3 can be with the together uniform rotation of rotating mechanism 8.The lower section of workpiece umbrella stand 3
Evaporation source 5 and ion gun 7 are provided with, wherein ion gun 7 is used for the side that auxiliary evaporation source 5 makes evaporation coating materials be deposited on substrate 2
Surface（The lower surface of substrate 2 is expressed as in Fig. 1）.
The top of workpiece umbrella stand 3 is provided with sputtering target material 4 and radio frequency source 6, and sputtering target material 4 is arranged on the top of plated film cavity 1
Portion, radio frequency source 6 are arranged on the side wall of plated film cavity 1, and radio frequency source 6 is used to excite sputtering target material 4.Radio frequency source 6 and positioned at workpiece umbrella
Angle is formed between the sputtering target material 4 of the top of frame 3 to set, when making it excite sputtering target material 4, the sputtered atom of sputtering target material 4 sinks
Product is in another side surface of substrate 2（The upper surface of substrate 2 is expressed as in Fig. 1）.Splashing above and below workpiece umbrella stand 3
Shoot at the target and material 4 and evaporation source 5, sputtering target material 4 and radio frequency source 6 while work, plated with realizing while two surfaces of substrate 2
Film.In addition, placing the position of evaporation source 5 can also be replaced with the sputtering source being made up of sputtering target material 4 and its radio frequency source 6.
Sputtering target material 4 is placed on the top of plated film cavity 1, and direction is carried on the substrate 2 on workpiece umbrella stand 3.Sputtering target material 4
On atom by being launched energetic ion by radio frequency source 6（Dashed arrows shown in figure）Excitation and from target material surface overflow
As sputtered atom（Dotted arrows）.Sputtered atom is eventually deposited at a side surface of substrate 2, forms film.Radio frequency source 6 can be with
Triggered by direct current or alternating current.For sputtering target material 4, mechanism can be rotated or turned over to realize multiple film by installation
The plated film of material, that is, realize a variety of films for plating different materials, different-thickness successively on a side surface of substrate 2.
Evaporation source 5 is placed on center or the other positions of the bottom of plated film cavity 1.Evaporation source 5 work when can utilize from
The assistant depositing of component 7.Evaporation source 5 can use the evaporation pattern such as electron beam evaporation plating or resistance steaming.The quantity of evaporation source 5 is not limited to one
It is individual, i.e., when in face of the workpiece umbrella stand 3 of large area, evaporation source 5 can be increased so as to ensure the efficiency of plated film and coating quality.
As shown in Figures 2 and 3, in order that the surface energy of the substrate 2 corresponding to each evaporation source forms the film of uniform thickness,
The amending plates 9 and amending plates 10 of film caliper uniformity can be provided for improving among plated film cavity 1.Amending plates 10 are arranged on
Between the lower surface of evaporation source 5 and workpiece umbrella stand 3, amending plates 9 are arranged between the upper surface of sputtering target material 4 and workpiece umbrella stand 4.
One end of amending plates 9 and amending plates 10 is respectively fixedly disposed in the side wall of plated film cavity 1, wherein amending plates 9 and plated film cavity 1
Side wall between in angle arrange that angle angle between the two is satisfied with, the sputtered atom of the sputtering target material passes through amending plates
9, so that amending plates 9 work.Amending plates 9 and amending plates 10 do not contact when placing with film plating substrate, otherwise cause workpiece umbrella stand
It is unable to normal rotation.Amending plates 9 and amending plates 10 are a tablet, evaporate angle by the part for optionally blocking evaporation source
Realize that the substrate 2 of diverse location there can be uniform coating film thickness on workpiece umbrella stand 3.Amending plates 9 are for correcting workpiece
The film thickness uniformity that the upper surface of substrate is respectively enclosed from inside to outside on umbrella stand 3；Amending plates 10 are for correcting substrate on workpiece umbrella stand 3
The film thickness uniformity respectively enclosed from inside to outside of lower surface.
The present embodiment is in the specific implementation：It is to reduce two evaporation sources in same plated film cavity and existing coating materials is dirty
Dye, can take following measure：
1）During plated film after workpiece umbrella stand 3 upper piece, ensure on workpiece umbrella stand 3 without small opening and it is weak block, ensure on workpiece umbrella stand 3
Fixture is firm seamless.This respect can be realized by the design of substrate fixture.For example jaw thickness does the thicker reduction later stage
The deformation that uses and cause Lou film, gap tolerance is as far as possible small for being bonded between fixture and product, to prevent oozing mutually for upper and lower coating materials
Pollution thoroughly.
2）The angle of divergence and the radiation areas of two kinds of evaporation sources are adjusted, avoid coating materials radiation up and down overlapping as far as possible.
3）As shown in figure 1, backplate 11 is installed on plated film cavity wall.Backplate be used to separating the top of workpiece umbrella stand 3 and
The plated film cavity 1 of lower section, the setting height of backplate 11 is coincide with the height and position of the minimum point of workpiece umbrella stand 3 to be adapted to, so that position
Evaporation source above workpiece umbrella stand 3 will not be from the upper surface of workpiece umbrella stand 3 between workpiece umbrella stand 3 and plated film cavity 1
Space flow to the lower surface of workpiece umbrella stand 3, avoids the pollution of interpenetrating of coating materials.
Due to being provided with two evaporation sources in a plated film cavity 1, it is thus possible to be related to high voltage, highfield it is dry
Disturb, so need to carry out shielding jamming countermeasure in terms of electrical control, avoid failure caused by high voltage, highfield interference,
Accident.
Evaporation source 5 uses electron beam evaporation plating pattern.That is, there are an electron gun, electron in the floor installation of plated film cavity
After rifle adds high pressure, after caused camber electron beam gets to the coating materials in evaporation source 5, the film atom evaporated to surrounding is produced, from
And start to deposit on the eyeglass of umbrella stand.One ion gun 7 is set beside evaporation source simultaneously, and it can produce the ion of high-energy
Beam bombards eyeglass, improves the compactness of depositional coating.
The present embodiment is related to following plating steps when specifically used
1）Mechanically and electrically software control for coating apparatus is designed and debugged, and ensures smoothly entering for coating process
OK.
2）The realization of coating film thickness control：For evaporation source can use brilliant control or light-operated side into the thickness monitoring of film
Method；For sputtering source into film thickness monitoring can use speed monitoring or light control method.
3）The debugging of coating film thickness homogeneity：By adjusting the shape of amendment amending plates 9 and amending plates 10 so that substrate 2
Two surfaces can realize uniform coated.
4）In terms of filming control, different plating runs are run to film plating substrate upper and lower surface, and realize that two-way simultaneous plates
The monitoring of membrane process parameters and state.
5）Due to being related to high voltage, highfield may interfere with, and need to carry out shielding jamming countermeasure in terms of electrical control.
6）Adjustment is located at the position of the sputtering target material above the workpiece umbrella stand and its formed with it corresponding described
Angle between radio frequency source, its angle of divergence and radiation areas are made to correspond to the substrate that covering is carried on the workpiece umbrella stand
Upper surface；Adjustment is located at the position of the evaporation source below the workpiece umbrella stand and its forms the corresponding ion gun with it
Between angle, the corresponding covering in its angle of divergence and radiation areas is carried on the following table of the substrate on the workpiece umbrella stand
Face；Above-mentioned steps are realized carries out deposition plating to the both side surface of the substrate, and avoids upper and lower radiation areas overlapping.
7）Driving rotating mechanism 8 drives workpiece umbrella stand 3 to be rotated, while excites the sputtering target material 4 and evaporation source 5,
The both side surface for the substrate 2 being pointed on workpiece umbrella stand 3 carries out deposition plating.
Although the design to the object of the invention and embodiment elaborate above example referring to the drawings, this
Field those of ordinary skill will recognize, still can be right in the case where limiting the precondition of scope without departing from claim
The present invention makes various modifications and variations, such as：Replace the species of evaporation source, position, the shape of workpiece umbrella stand 3, size etc., therefore
This is not repeated one by one.
Claims (5)
1. a kind of two-way deposition plating apparatus, including plated film cavity, workpiece umbrella stand, the workpiece are provided with the plated film cavity
Substrate is carried on umbrella stand, it is characterised in that：Be fixedly installed respectively above and below the workpiece umbrella stand sputtering target material and
Evaporation source, the evaporation source below the workpiece umbrella stand is by corresponding ion gun booster action to the substrate
One side surface carry out plated film, the sputtering target material above the workpiece umbrella stand by corresponding radio frequency source excitation simultaneously
Plated film is carried out to another side surface of the substrate.
A kind of 2. two-way deposition plating apparatus according to claim 1, it is characterised in that：Above the workpiece umbrella stand
The sputtering target material towards the substrate, the radio frequency source above the workpiece umbrella stand towards the sputtering target material,
And arranged between the sputtering target material and the radio frequency source in angle, ensure through described in the radio frequency source excitation during sputtering target material,
The sputtered atom sputtering sedimentation of the sputtering target material is in a side surface of the substrate.
A kind of 3. two-way deposition plating apparatus according to claim 2, it is characterised in that：The substrate and the sputtering target
Amending plates are provided between material, one end of the amending plates is fixedly installed in the side wall of plated film cavity, the amending plates and plating
Arranged between the side wall of membrane cavity body in angle, angle angle between the two is satisfied with, and the sputtered atom of the sputtering target material passes through
The amending plates.
A kind of 4. two-way deposition plating apparatus according to claim 1, it is characterised in that：The side wall of the plated film cavity is consolidated
Surely backplate is provided with, the backplate is used to separate the plated film cavity above and below the workpiece umbrella stand, the backplate
Set height to coincide with the height and position of the workpiece umbrella stand minimum point to be adapted to.
A kind of 5. film plating process for being related to the two-way deposition plating apparatus described in claim 1-4, it is characterised in that：Methods described
Including at least following steps：
Adjustment is located at the position of the sputtering target material above the workpiece umbrella stand and its forms the corresponding radio frequency source with it
Between angle, the corresponding covering in its angle of divergence and radiation areas is carried on the upper table of the substrate on the workpiece umbrella stand
Face；The position of the evaporation source of the adjustment below the workpiece umbrella stand and its between forming the corresponding ion gun with it
Angle, the corresponding covering in its angle of divergence and radiation areas is carried on the lower surface of the substrate on the workpiece umbrella stand；
Deposition plating is carried out to the both side surface of the substrate, and avoids upper and lower radiation areas overlapping.
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| CN201510314281.2A CN104862656B (en) | 2015-06-10 | 2015-06-10 | Two-way deposition plating apparatus and film plating process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510314281.2A CN104862656B (en) | 2015-06-10 | 2015-06-10 | Two-way deposition plating apparatus and film plating process |
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| CN104862656A CN104862656A (en) | 2015-08-26 |
| CN104862656B true CN104862656B (en) | 2017-12-08 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105220115B (en) * | 2015-10-31 | 2018-06-26 | 华有光电（东莞）有限公司 | A kind of clean ion cleaning system secondary to coated product and its purification method |
| CN105887020B (en) * | 2016-06-30 | 2019-04-02 | 光驰科技(上海)有限公司 | Multi-vaporizing-source coating apparatus and its film plating process |
| CN106399950B (en) * | 2016-12-27 | 2019-02-26 | 光驰科技(上海)有限公司 | A kind of film plating process for realizing ion source uniform irradiation film plating substrate |
| CN107254668A (en) * | 2017-07-28 | 2017-10-17 | 佛山市联仪光学有限公司 | Automate coating machine |
| CN108107610B (en) * | 2017-12-27 | 2021-04-13 | 中国电子科技集团公司第二十六研究所 | Large aperture acousto-optic tunable filter |
| CN110724913A (en) * | 2019-11-07 | 2020-01-24 | 西安工业大学 | Resistance thermal evaporation coating device for large-diameter reflector |
| CN111580193A (en) * | 2020-06-08 | 2020-08-25 | 华天慧创科技（西安）有限公司 | Ultrathin film-coated optical wafer and preparation method thereof |
| CN113981377B (en) * | 2021-10-15 | 2024-04-16 | 信阳市图丽光电有限公司 | Optical lens coating method |
| CN218842311U (en) * | 2022-08-31 | 2023-04-11 | 安徽其芒光电科技有限公司 | Thin film deposition apparatus |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2644433Y (en) * | 2003-07-15 | 2004-09-29 | 精碟科技股份有限公司 | Deposition equipment and screening unit thereof |
| TWI265202B (en) * | 2005-03-02 | 2006-11-01 | Asia Optical Co Inc | Tool and device for dedicate coating a photochemical film on a substrate |
| CN1891848A (en) * | 2005-07-01 | 2007-01-10 | 鸿富锦精密工业（深圳）有限公司 | Optical coating device |
| CN101363117B (en) * | 2007-08-08 | 2011-08-24 | 鸿富锦精密工业（深圳）有限公司 | Film coating bracket and film-plating machine |
| CN102031493B (en) * | 2009-09-30 | 2013-08-21 | 鸿富锦精密工业（深圳）有限公司 | Film coating device |
| CN202968673U (en) * | 2012-12-14 | 2013-06-05 | 福建福光光电科技有限公司 | Lens coating device |
| CN204162775U (en) * | 2014-11-04 | 2015-02-18 | 肇庆市振华真空机械有限公司 | A kind of electronic component double-sided coating device |
| CN204714886U (en) * | 2015-06-10 | 2015-10-21 | 光驰科技(上海)有限公司 | Two-way deposition plating apparatus |
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