201113387 六、發明說明： 【發明所屬之技術領域】 [0001]本發明涉及鍍膜技術’尤其涉及一種能夠用於同一鑛膜 室内進行蒸鍍與濺鍍之鍍膜裝置。 [先前技術] [〇〇〇2]當前，許多工業產品表面都錢有功能薄膜以改善產品表 面之各種性能。如於光學鏡片之表面鍍上一層抗反射膜 ，以降低鏡片表面之反射率、降低入射光通過鏡片之能 0 量損耗。又如於某些濾光元件表面鍍上一層濾光膜，可 濾掉某一預定波段之光，製成各種各樣之濾光片。一般 地，鍍膜方法主要包括蒸鍍與濺鑛等，採用濺鍍形成鍍 . 膜之方法請參見文獻可參閱I· Safi,於2000年於sur face & Coating Technology 上發表之論文 Recent Aspects Concerning DC Reactive Magnetron Sputtering of Thin Film: a Review。 ,4》 '· -: ·· ： ：S .. -., Λ "I ' [〇〇〇3] 於許多半導體元件或者淇他光電元件之同一表面需要分 〇 別採用蒸鍍與濺鍍费成鍍膜。先前技術中，蒸鍍機台與 濺鍵機台係兩分開獨立之機台。於生產中，則需要將經 過蒸鍍或者濺鍍之鍍膜基板轉移安裝到濺鍍或者蒸鍍機 台中。於進行基板之轉移與安裝之過程中，浪費大量之 時間，還會於此過程中造成鍍膜基板待鍍膜之表面吸附 其他粒子而被污染，造成鑛膜後產品不良。 【發明内容】 [0004]因此，有必要提供一種能夠於同一鍍膜室内進行蒸鍍與 濺鍍之鍍膜裝置。 098134863 表單編號Α0101 第5頁/共24頁 0982059727-0 201113387 [〇〇〇5] 以下將以實施例說明一種鑛膜裝置。 [0006] 一種鍍膜裝置，其包括鍍膜室、承載裝置、濺鍍裝置及 蒸鍍裝置。所述承載裝置包括固定板及用於承載鍍膜工 件之第一承載盤。所述固定板將鑛膜室分隔成蒸鍍腔與 滅;鍍腔。所述j賤鍍裝置設置於漱鍍腔内。所述蒸鍍裝置 與所述蒸鍵腔對應連通。所述固定板開設有連通蒸錢腔 與濺鍍腔之鍍膜通孔。所述第一承載盤可轉動地安裝於 鍍膜室内並位於鍍膜通孔附近，以使第一承載盤藉由轉 動可選擇性地遮蔽或者暴露所述锻膜通孔。從而當所述 第一承載盤暴露所述鍍膜通孔時，使得第一承載盤承載 之鍍膜工件暴露於蒸鍍腔與濺鍍腔中之一個。並且當根 據第一承載盤之轉動使得第一承載盤遮蔽所述鍍膜通孔 時’所述第一承載盤承載之鍍膜工件藉由鍍膜通孔暴露 於蒸鍍腔與濺鍍腔中之另一個。 [0007] 本技術方案提供之鍍膜裝置，其設置有承率盤與固定板 ，固定板將鍍膜室分隔成蒸鍍腔與濺錄腔，並且固定板 開設有鍍膜通孔’藉由將承栽盤彳轉動地安裝於鍍膜室 内’藉由轉動承載盤可使得承載盤遮蔽或者暴露鍍膜通 孔，從而可實現於同一鍍膜室内對鍍膜元件選擇性進行 蒸鍍製程或者濺鍍製程，從而可避免形成不同鍍膜轉換 鍍膜室而造成之鍍膜污染，並且由於不需要轉換鍍膜室 ，提高了鍵膜之效率。 【實施方式】 [0008] 下面結合附圖及實施例對本技術方案提供之鍍骐裝置作 進一步說明。 098134863 表單編號A0101 第6頁/共24頁 0982059727-0 201113387 [0009] [0010] Ο ο [0011] 明一併參閱圖1至圖3，本實施例提供之鑛膜裝置ιοο包括 鍍膜室11〇、承載裝置12〇、濺鍍裝置130及蒸鍍裝置140 〇 鑛膜室110用於固定承載裝置120、濺鍍裝置130及蒸鍍 裝置140，並具有收容空間11〇1，以於該空間内11〇1進 行鍍膜》鍍膜室110可為具有長方體形、圓柱形或者多棱 柱形空腔之殼體《本實施例中，鍍膜室11〇為長方體形殼 體》鍍膜室110包括頂板111、與頂板1丨丨相對之底板112 、第一側板113、第二侧板114、第三侧板115及第四側 板11 6 ’頂板111、底板112、第一側板113、第二側板 114、第三側板115及第四侧板116圍成一收容腔11〇1。 底板112、第一側板113、第二側板114、第三側板115及 第四側板116 —體成型。第一側板113與第三側板115相 對設置。於第一側板113開設有兩第一安燊孔in，兩第 一安裝孔117與底板112之間距相尊。於第三側板115内 開設有兩第二安裝孔11名，兩第二安裝孔118與底板112 之距離相等。兩第一安裝孔117與兩第二安裝孔118一一 對應，每一第一安裝孔117之中心轴線與其對應之第二安 裝孔118之中心軸線於同一平行於底板112且垂直於第一 側板113之直線上。於底板112之中心位置，開設有固定 孔119，用於固定蒸鍍裝置140。 承載裝置120安裝於鍍膜室11〇内將鍍膜室11〇之收容腔 1101分隔為蒸鍍腔1102與濺鍍腔1103，並用於承載鍍膜 工件。本實施例中，承載裝置120包括固定板121、第一 承載盤122、第二承載盤123、第一轉軸124及第二轉軸 098134863 表單編號Α0101 第7頁/共24頁 0982059727-0 201113387 125。固定板121固定於鍍膜室110内並平行於底板112。 固定板121之形狀與收容空間1101之橫裁面之形狀相互配 合，其與第一側板113、第二側板114、第三側板11 5及 第四側板116均緊密接觸。本實施例中，固定板121與鍍 膜室110 —體成型。第一安裝孔117與第二安裝孔118均 位於濺鍍腔1103—側。固定板121具有相對之第一表面 1211與第二表面1212,第一表面1211與頂板111相對， 第二表面1212與底板112相對。於固定板121之中心自第 一表面1211向第二表面1212開設有鍍膜通孔1213。鍍膜 通孔1213之橫裁面之形狀與待鍍臈ji件之形狀相對應。 本實施例中，鍍膜通孔1213之橫截面之形狀為長方形。 於第一表面1211環繞鍍膜通孔121.3設置有支撐部1215， 以用於支撐鍍膜工件。本實施例中，固定板121上設置有 兩定位塊1214，兩定位塊1214位於鍍膜通孔1213之相對 兩侧。支撐部1215凸出於固定板121第一表面1211之高 度小於定位塊1214凸出於固定板121滅第^表面1211之 高度。 [0012]第一承載盤122與第二承載盤123均用於承載鍍膜工件。 本實施例中，第一承載盤122包括相互固定連接之第一承 載部1221及第一固定部1222。第一承載部1221大致為長 方體，其具有相對之第一承載面1223與第一底面1224。 於第一承載面1 223上開設有第一收容槽1225用於收容固 定鍍膜工件。第一收容槽1225為盲槽。於第一收容槽 1225之相對兩側’開設有兩第一定位通孔1226，兩第一 定位通孔1226之橫截面之形狀與定位凸塊丨214之形狀相 098134863 表單編號A0101 第8頁/共24頁 0982059727-0 201113387 轉 [0013] Ο [0014] Ο [0015] 098134863 對應，兩第一定位通孔1226之間距與兩定位凸塊121 間距相等，使得兩定位凸塊1214恰好可配合於兩第 位通孔1226中。第一固定部1222用於與第一轉袖124固 定。本實施例中，苐一固定部1 222套設並固定於第 軸124。第二承載盤123之結構與形狀與第/承載盤 之形狀與結構相同。 第一轉軸123呈圓柱形，其長度大於第一側板113與第一 側板115之間距。第-承載盤122之第-固定部1222連接 於第一轉轴124之中心。本實施例中，第一承載盤122固 定於第一轉軸124。第一轉轴124之兩端分別穿入一個第 一安裝孔117與該第一安裝孔117於同一直線之第二安裝 孔118中，優選地，第一轉軸124之一端或者兩端超出鍍 膜室110，以便於鍍膜室11〇外控制第一轉轴124使第一 轉軸124及固定於第一轉軸124之第一承載盤121轉動° 第二轉軸125之形狀與結構:與第一轉轴124之結構與形狀 相同。第二承載盤123連搔於第二轉轴125之中心位置。 本實施例中，第二承裁盤123固定於第二轉軸125。第一 轉軸125之兩端分別穿入另一第一安裝孔117與該第一女 裝孔117位於同一直線之第二安裝孔118中。使得第一轉 軸124與第二轉轴125相立平行。優選地，第二轉轴125 之一端或者兩端超出鍍膜室，以便於鍍膜室110外控 制第二轉轴125使第二轉軸125及固定於第二轉軸125之 第二承載盤123轉動。 請參閱圖4及圖5，本實施例中，為了使得能夠同時對第 一承載盤122與第二承載盤123内之工件進行鍍膜 表單編號A0101 第9頁/共24頁 藉由 0982059727-0 201113387 旋轉第-轉轴124與第二轉袖125，第一承載盤122與第 二承載盤123平行設置ϋ均平行於肢板121時’當第一 承載盤122之第一承載面1223與固定板121之第一表面 1211相對，承載於第4载盤122之韻工件遮蔽鑛膜通 孔1213並暴露於蒸鍍腔1102。而第二承載盤123之底面 與第一表面1211相對，使得承載於第二承載盤123之鍍膜 工件表面暴露於濺鍍腔1103中。分別旋轉第一轉軸124與 第二轉軸125，當第二承載盤123之承載面與固定板121 之第一表面1211相對時，承載於第二承載盤123之鍍膜工 件遮蔽鍍膜通孔1213並暴露於蒸鍍腔1102。而第一承載 盤122之第一底面1224與第一表面12〗i相對，使得承載 於第一承載盤122之鍍膜工件表面暴露於濺鍍腔11〇3中。 [0016]第一轉轴丨24與第二轉轴125可均設於蒸鍍腔11〇2内，或 者第一轉軸124與第二轉軸125均設於濺鍍腔11〇3内，或 者第一轉轴124與第二轉軸125中之一個設置於蒸鍍腔 1102，第一轉軸124與第二·轉軸125中之另一個設置於濺 鍍腔1103。另外’第一轉轴124與第二轉軸125亦可固定 女裝於固疋板121或者鍵骐室iiq，而第一承載盤M2可 轉動地安裝於第一轉轴124，第二承載盤123可轉動地安 裝於第二轉轴125 ’使得第-承栽盤122與第二承載盤 123可相狀固定板121_ 1«或者«锻膜通孔 1213。 [_舰裝置130安裝於頂板U1與固定板121相對之表面上 。本實施例中’濺鍵裝置13G包括_把。當於舰乾與 固定板121或兩承載盤之間施加高壓電場時’於濺鍍腔中 098134863 表單編號A0101 第10頁/共24頁 0982059727-0 201113387 充入所需要之惰性氣體（通常為氬氣），於該電場之作 用下，氬氣電離成氬離手（帶正電荷）與電子，氬離子 於電場之作用下加速轟擊靶材，濺射出大量之靶材原子 ，呈中性之靶原子（或分子）沈積於鍍膜工件上成膜。 當然，濺鍍裝置130還可進一步包括磁控裝置，以控制惰 性氣體離子於電場中運行之軌跡，從而使得複數區域之 靶材被轟擊，提高靶材之利用率。 [0018] Ο ❹ 蒸鍍裝置140固定於底板112。蒸鍍裝置140包括蒸鍍坩 堝141、第一固定件142、第二固定件143及噴頭144。蒸 鍍坩堝141用於收容鍍膜原料。第一固定件141用於固定 蒸鍍坩堝141。本實施例中，第一固定件142大致呈圓柱 形，其具有相對之第一端部1421與第二端部1422，蒸鍍 坩堝141固定於第一端部1421。第一固定件142之外表面 設置有外螺紋。第二固定件143包括一體成型並同軸設置 之安裝部1431與固定部1432。第二固定件；143開設有貫 穿安裝部1431及固定部1432之收容孔1433，收容孔 1433之内壁設置有第一固定件141之外螺紋相配合之内螺 紋，用於與第一固定件141相配合使得第一固定件141可 相對於第二固定件142進行調節。固定部1432為圓柱形， 其橫截面之直徑之大小與底板112之固定孔119之孔徑相 配合，固定部1432插於並固定於固定孔119，使得安裝部 1431位於鍍膜室110外，收容孔1433與固定孔119同軸。 第一固定件142之第一端部1421位於固定部1432之一侧 ，第二端部1422位於安裝部1431 —側並從安裝部1431— 側露出。 098134863 表單編號Α0101 第11頁/共24頁 0982059727-0 201113387 [001¾貝頭144固疋於第二固定件143之固定部1432並與第二固 定件143同軸。喷頭144大致為圓台形腔體。喷頭144具 有相對之第一端1441與第二端1442，自第一端1441向第 二端1442其直徑逐漸變小，第一端1441固定於固定部 1432，第二端1442開有開口 1443，喷頭144與第二固定 件134形成一收容腔145。優選地，開口 1443與鍍膜通孔 1213同轴。當加熱蒸鍍坩堝141中之鍍膜原料揮發時，其 於收容腔145内達到一定濃度後喷發到鍍膜工件，提高鍍 膜之品質。 [0020] 本技術方案提供之鍍膜裝置1〇 〇，可於第一承載盤丨2 2與 第二承載盤123中分別承載鍍膜工件，然後藉由旋轉第一 轉轴124與第二轉軸125，使将當第一承載盤122之鍍膜 工件進行蒸鍍時，第二承載盤123内承載之鍍膜工件進行 濺鍍’並且可藉由轉動第一轉軸124與第二轉軸125，使 得第一承載盤122内蒸鍍完成之鍍膜工件進行濺鍍，而使 得完成濺鍍之第二承載盤123内之鍍膜工件進行蒸鑛，如 此，可於鍍膜工件之表面形成相互堆疊之鍍膜結構而於 同一鍍膜裝置中完成。 [0021] 另外，承載盤與轉軸之個數亦可為一個，即按照鍍膜之 需要，藉由旋轉轉軸轉動，使得承載盤内之鍍膜工件之 表面選擇性之朝向蒸鍍腔或者濺鍍腔’以可交替形成賤 鍍膜與蒸鍍膜，另外於鍍膜室内設置遮蔽板，於承載盤 沒有遮蔽鍍膜通孔時，採用遮蔽板將鍍膜通孔遮蔽。為 了能夠同時實現複數鍍膜元件進行鍵膜’亦可設置更複 數之鍍膜承載盤、旋轉軸與鍍膜通孔’使得每兩鍍膜承 098134863 表單編號A0101 第12頁/共24頁 0982059727- 201113387 載盤與一鍍臈通孔相對應，從而可更大程度提高鍍膜之 效率。 Ο [0022] 本技術方案提供之鍍獏裝置，其設置有承載盤與固定板 ’固定板將鍍膜室分隔成蒸鍍腔與濺鍍腔，並且固定板 開設有鍍膜通孔’藉由將承載盤可轉動地安裝於鍍膜室 内’藉由轉動承載盤可使得承載盤遮蔽或者暴露鍍膜通 孔，從而可實現於同一鍍膜室内對鍍膜元件選擇性進行 蒸鍍製程或者濺鍍製程，從而可避免形成不同鍍膜轉換 鍍膜室而造成之鍍臈污染，並且由於不需要轉換鍍膜室 ’提高了鍍膜之效率、 [0〇23] 综上所述’本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發_日月之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。201113387 VI. Description of the Invention: [Technical Field] The present invention relates to a coating technique, and particularly relates to a coating apparatus which can be used for vapor deposition and sputtering in the same mineral film chamber. [Prior Art] [〇〇〇2] At present, many industrial products have a functional film on the surface to improve various properties of the product surface. For example, an anti-reflection film is coated on the surface of the optical lens to reduce the reflectivity of the lens surface and reduce the energy loss of the incident light passing through the lens. Another example is that a filter film is coated on the surface of some filter elements to filter out a predetermined wavelength of light to make a variety of filters. In general, the coating method mainly includes evaporation and sputtering, etc., and plating is formed by sputtering. For the method of the film, please refer to I. Safi, paper published on sur face & Coating Technology in 2000. Recent Aspects Concerning DC Reactive Magnetron Sputtering of Thin Film: a Review. ,4》 '· -: ·· : :S .. -., Λ "I ' [〇〇〇3] On the same surface of many semiconductor components or Qi photoelectric components, it is necessary to use evaporation and sputtering. Fei Cheng coating. In the prior art, the vapor deposition machine and the splash screen machine are separated from each other. In production, the vapor deposited or sputter coated substrate needs to be transferred to a sputtering or evaporation machine. In the process of transferring and mounting the substrate, a large amount of time is wasted, and in the process, the surface of the coated substrate to be coated is adsorbed by other particles and contaminated, resulting in poor post-mineral product. SUMMARY OF THE INVENTION [0004] Therefore, it is necessary to provide a coating apparatus capable of performing vapor deposition and sputtering in the same coating chamber. 098134863 Form No. Α0101 Page 5 of 24 0982059727-0 201113387 [〇〇〇5] A mineral film device will be described below by way of example. [0006] A coating apparatus comprising a coating chamber, a carrying device, a sputtering device, and an evaporation device. The carrying device comprises a fixing plate and a first carrier plate for carrying the coating workpiece. The fixing plate divides the ore chamber into an evaporation chamber and a cathode; a plating chamber. The j 贱 plating device is disposed in the ruthenium plating chamber. The vapor deposition device is in communication with the steaming key chamber. The fixing plate is provided with a coating through hole connecting the steaming chamber and the sputtering chamber. The first carrier disk is rotatably mounted in the coating chamber and adjacent to the coating through hole, so that the first carrier disk can selectively shield or expose the forged film through hole by rotation. Thereby, when the first carrier disk exposes the plated through hole, the coated workpiece carried by the first carrier plate is exposed to one of the evaporation chamber and the sputtering chamber. And when the first carrier is shielded from the coated through hole according to the rotation of the first carrier, the coated workpiece carried by the first carrier is exposed to the other of the evaporation chamber and the sputtering chamber through the through hole of the coating. . [0007] The coating device provided by the technical solution is provided with a bearing plate and a fixing plate, the fixing plate separates the coating chamber into an evaporation chamber and a splashing chamber, and the fixing plate is provided with a coating through hole 'by The disk is rotatably mounted in the coating chamber. By rotating the carrier plate, the carrier disk can be shielded or exposed through the coating film, so that the coating device can be selectively vaporized or sputtered in the same coating chamber, thereby avoiding formation. The coating is contaminated by different coating conversion chambers, and the efficiency of the bonding film is improved because there is no need to convert the coating chamber. [Embodiment] [0008] The rhodium plating apparatus provided by the present technical solution will be further described below with reference to the accompanying drawings and embodiments. 098134863 Form No. A0101 Page 6 / Total 24 Page 0992059727-0 201113387 [0009] [0010] As shown in FIG. 1 to FIG. 3, the mineral film device ιοο provided in this embodiment includes a coating chamber 11〇 The load bearing device 12, the sputtering device 130, and the vapor deposition device 140 are used to fix the carrier device 120, the sputtering device 130, and the vapor deposition device 140, and have a receiving space 11〇1 in the space. The coating chamber 110 may be a casing having a rectangular parallelepiped shape, a cylindrical shape or a polygonal prismatic cavity. In the present embodiment, the coating chamber 11 is a rectangular parallelepiped housing. The coating chamber 110 includes a top plate 111, and The top plate 1 is opposite to the bottom plate 112, the first side plate 113, the second side plate 114, the third side plate 115, and the fourth side plate 11 6 'the top plate 111, the bottom plate 112, the first side plate 113, the second side plate 114, and the third The side plate 115 and the fourth side plate 116 enclose a receiving cavity 11〇1. The bottom plate 112, the first side plate 113, the second side plate 114, the third side plate 115, and the fourth side plate 116 are integrally formed. The first side plate 113 is disposed opposite to the third side plate 115. Two first ampoules are opened in the first side plate 113, and the distance between the two first mounting holes 117 and the bottom plate 112 is respected. Two second mounting holes 11 are defined in the third side plate 115, and the distance between the two second mounting holes 118 and the bottom plate 112 is equal. The two first mounting holes 117 are in one-to-one correspondence with the two second mounting holes 118. The central axis of each of the first mounting holes 117 is parallel to the bottom plate 112 and perpendicular to the first axis of the corresponding second mounting hole 118. The side plates 113 are in a straight line. At a central position of the bottom plate 112, a fixing hole 119 is opened for fixing the vapor deposition device 140. The carrying device 120 is installed in the coating chamber 11 to divide the receiving chamber 1101 of the coating chamber 11 into the vapor deposition chamber 1102 and the sputtering chamber 1103, and is used for carrying the coated workpiece. In this embodiment, the carrying device 120 includes a fixing plate 121, a first carrying tray 122, a second carrying tray 123, a first rotating shaft 124, and a second rotating shaft 098134863. Form number Α0101 Page 7/24 pages 0982059727-0 201113387 125. The fixing plate 121 is fixed in the coating chamber 110 and parallel to the bottom plate 112. The shape of the fixing plate 121 and the shape of the transverse surface of the accommodating space 1101 are matched with each other, and are in close contact with the first side plate 113, the second side plate 114, the third side plate 175, and the fourth side plate 116. In this embodiment, the fixing plate 121 is integrally formed with the coating chamber 110. The first mounting hole 117 and the second mounting hole 118 are both located on the side of the sputtering chamber 1103. The fixing plate 121 has a first surface 1211 opposite to the top surface 111, and a second surface 1212 opposite to the bottom plate 112. A plated through hole 1213 is formed in the center of the fixing plate 121 from the first surface 1211 to the second surface 1212. The shape of the cross-section of the through-hole 1213 corresponds to the shape of the member to be plated. In this embodiment, the shape of the cross section of the plated through hole 1213 is a rectangle. A support portion 1215 is disposed around the coated through hole 121.3 on the first surface 1211 for supporting the coated workpiece. In this embodiment, the fixing plate 121 is provided with two positioning blocks 1214, and the two positioning blocks 1214 are located on opposite sides of the coating through hole 1213. The height of the support portion 1215 protruding from the first surface 1211 of the fixing plate 121 is smaller than the height at which the positioning block 1214 protrudes from the fixing surface 121 to the second surface 1211. [0012] Both the first carrier tray 122 and the second carrier tray 123 are used to carry a coated workpiece. In this embodiment, the first carrier 122 includes a first carrier portion 1221 and a first fixing portion 1222 that are fixedly connected to each other. The first carrier portion 1221 is substantially a rectangular parallelepiped having opposite first bearing surfaces 1223 and first bottom surface 1224. A first receiving groove 1225 is defined in the first bearing surface 1 223 for receiving the fixed coated workpiece. The first receiving groove 1225 is a blind groove. Two first positioning through holes 1226 are formed on opposite sides of the first receiving groove 1225. The shape of the cross section of the first positioning through holes 1226 and the shape of the positioning protrusions 214 are 098134863. Form No. A0101 Page 8 / 24 pages 0992059727-0 201113387 Turn [0013] Ο [0015] 098 098134863 Correspondingly, the distance between the two first positioning through holes 1226 is equal to the distance between the two positioning protrusions 121, so that the two positioning protrusions 1214 can be matched with Two position through holes 1226. The first fixing portion 1222 is for fixing with the first sleeves 124. In this embodiment, the first fixing portion 1 222 is sleeved and fixed to the first shaft 124. The structure and shape of the second carrier tray 123 are the same as those of the carrier/carrier tray. The first rotating shaft 123 has a cylindrical shape with a length greater than a distance between the first side plate 113 and the first side plate 115. The first fixing portion 1222 of the first carrier disk 122 is coupled to the center of the first rotating shaft 124. In this embodiment, the first carrier 122 is fixed to the first rotating shaft 124. The two ends of the first rotating shaft 124 are respectively inserted into the second mounting holes 118 of the first mounting hole 117 and the first mounting hole 117. Preferably, one end or both ends of the first rotating shaft 124 exceed the coating chamber. 110. The first rotating shaft 124 is controlled by the coating chamber 11 to rotate the first rotating shaft 124 and the first supporting plate 121 fixed to the first rotating shaft 124. The shape and structure of the second rotating shaft 125: and the first rotating shaft 124 The structure and shape are the same. The second carrier tray 123 is connected to the center of the second rotating shaft 125. In this embodiment, the second receiving tray 123 is fixed to the second rotating shaft 125. Both ends of the first rotating shaft 125 are respectively inserted into the second mounting holes 118 in which the other first mounting holes 117 are in the same straight line as the first female fitting holes 117. The first rotating shaft 124 is made to be parallel to the second rotating shaft 125. Preferably, one end or both ends of the second rotating shaft 125 are beyond the coating chamber, so that the second rotating shaft 125 is controlled outside the coating chamber 110 to rotate the second rotating shaft 125 and the second carrier 123 fixed to the second rotating shaft 125. Referring to FIG. 4 and FIG. 5, in this embodiment, in order to enable simultaneous coating of the workpieces in the first carrier tray 122 and the second carrier tray 123, the form number A0101 is 9 pages/total 24 pages by 0982059727-0 201113387 Rotating the first rotating shaft 124 and the second rotating sleeve 125, the first carrying tray 122 and the second carrying tray 123 are disposed in parallel with each other when the parallel to the limb plate 121 is 'when the first carrying surface 122 of the first carrying tray 122 is fixed to the fixed plate The first surface 1211 of the 121 is opposed to the rhombic workpiece of the fourth carrier 122 to shield the ore film through hole 1213 and exposed to the vapor deposition chamber 1102. The bottom surface of the second carrier tray 123 is opposite to the first surface 1211, so that the surface of the coated workpiece carried on the second carrier tray 123 is exposed to the sputtering chamber 1103. The first rotating shaft 124 and the second rotating shaft 125 are respectively rotated. When the bearing surface of the second carrier 123 is opposite to the first surface 1211 of the fixing plate 121, the coated workpiece carried on the second carrier 123 is shielded by the coating through hole 1213 and exposed. The chamber 1102 is vapor-deposited. The first bottom surface 1224 of the first carrier 122 is opposite to the first surface 12i, such that the surface of the coated workpiece carried on the first carrier 122 is exposed to the sputtering chamber 11〇3. [0016] The first rotating shaft 24 and the second rotating shaft 125 may be disposed in the vapor deposition chamber 11〇2, or the first rotating shaft 124 and the second rotating shaft 125 are both disposed in the sputtering chamber 11〇3, or One of the rotating shaft 124 and the second rotating shaft 125 is disposed in the vapor deposition chamber 1102, and the other of the first rotating shaft 124 and the second rotating shaft 125 is disposed in the sputtering chamber 1103. In addition, the first rotating shaft 124 and the second rotating shaft 125 can also be fixed on the solid plate 121 or the key chamber iiq, and the first carrier M2 is rotatably mounted on the first rotating shaft 124, and the second supporting plate 123 The second rotating shaft 125 ′ is rotatably mounted such that the first bearing tray 122 and the second supporting tray 123 can fix the plate 121_ 1« or the forged film through hole 1213. [_The ship device 130 is mounted on the surface of the top plate U1 opposite to the fixed plate 121. In the present embodiment, the 'splash key device 13G' includes a handle. When a high-voltage electric field is applied between the ship's stem and the fixed plate 121 or between the two carriers, '098134863 in the sputtering chamber. Form No. A0101 Page 10/24 pages 0992059727-0 201113387 Fill the required inert gas (usually argon) Under the action of the electric field, argon ionizes into argon to leave the hand (with positive charge) and electrons, and argon ions accelerate the bombardment of the target under the action of the electric field, and sputter a large number of target atoms, which are neutral target atoms. (or molecules) deposited on the coated workpiece to form a film. Of course, the sputtering apparatus 130 may further include a magnetron to control the trajectory of the inert gas ions operating in the electric field, thereby causing the targets of the plurality of regions to be bombarded, thereby improving the utilization of the target. [0018] The vapor deposition device 140 is fixed to the bottom plate 112. The vapor deposition device 140 includes an evaporation crucible 141, a first fixing member 142, a second fixing member 143, and a shower head 144. The ruthenium plated 141 is used to store the coating material. The first fixing member 141 is for fixing the vapor deposition crucible 141. In this embodiment, the first fixing member 142 has a substantially cylindrical shape, and has a first end portion 1421 and a second end portion 1422 opposite to each other, and the vapor deposition crucible 141 is fixed to the first end portion 1421. The outer surface of the first fixing member 142 is provided with an external thread. The second fixing member 143 includes a mounting portion 1431 and a fixing portion 1432 which are integrally formed and coaxially disposed. The second fixing member 143 defines a receiving hole 1433 extending through the mounting portion 1431 and the fixing portion 1432. The inner wall of the receiving hole 1433 is provided with a threaded internal thread of the first fixing member 141 for the first fixing member 141. The mating makes the first fixing member 141 adjustable relative to the second fixing member 142. The fixing portion 1432 has a cylindrical shape, and the diameter of the cross section is matched with the diameter of the fixing hole 119 of the bottom plate 112. The fixing portion 1432 is inserted into and fixed to the fixing hole 119, so that the mounting portion 1431 is located outside the coating chamber 110, and the receiving hole is received. 1433 is coaxial with the fixing hole 119. The first end portion 1421 of the first fixing member 142 is located on one side of the fixing portion 1432, and the second end portion 1422 is located at the side of the mounting portion 1431 and is exposed from the side of the mounting portion 1431. 098134863 Form No. Α0101 Page 11 of 24 0982059727-0 201113387 [0013⁄4 The head 144 is fixed to the fixing portion 1432 of the second fixing member 143 and coaxial with the second fixing member 143. The showerhead 144 is generally a truncated cone shaped cavity. The nozzle 144 has a first end 1441 and a second end 1442. The first end 1441 is gradually smaller in diameter from the first end 1441 to the second end 1442. The first end 1441 is fixed to the fixing portion 1432, and the second end 1442 is opened with an opening 1443. The nozzle 144 and the second fixing member 134 form a receiving cavity 145. Preferably, the opening 1443 is coaxial with the coated through hole 1213. When the coating material in the heated vapor deposition crucible 141 is volatilized, it is ejected to the coated workpiece in a certain concentration in the receiving chamber 145 to improve the quality of the plating film. [0020] The coating device 1〇〇 provided by the present technical solution can respectively carry a coated workpiece in the first carrier tray 22 and the second carrier tray 123, and then rotate the first rotating shaft 124 and the second rotating shaft 125, When the coated workpiece of the first carrier 122 is vapor-deposited, the coated workpiece carried in the second carrier 123 is sputtered and the first carrier can be rotated by rotating the first shaft 124 and the second shaft 125. The coated workpiece in the vapor deposition in 122 is sputtered, so that the coated workpiece in the second carrying tray 123 that has been sputtered is subjected to steaming, so that a coating structure stacked on each other on the surface of the coated workpiece can be formed on the same coating device. Completed in the middle. [0021] In addition, the number of the carrier disk and the rotating shaft may also be one, that is, according to the needs of the coating, the surface of the coated workpiece in the carrier disk is selectively oriented toward the vapor deposition chamber or the sputtering chamber by rotating the rotating shaft. The ruthenium plating film and the vapor deposition film may be alternately formed, and a shielding plate may be disposed in the coating chamber. When the carrier disk does not have a coating through hole, the shielding plate is shielded by the shielding plate. In order to be able to simultaneously implement a plurality of coating elements for the bonding film, it is also possible to provide a plurality of coating carrier plates, rotating shafts and coated through holes, so that each of the two coatings is 098,134,863, Form No. A0101, Page 12 of 24, 0982059727-201113387. A plated through hole corresponds to each other, thereby increasing the efficiency of the coating to a greater extent. [0022] The present invention provides a rhodium plating device provided with a carrier plate and a fixed plate 'fixing plate to separate the coating chamber into an evaporation chamber and a sputtering chamber, and the fixing plate is provided with a coated through hole' The disc is rotatably mounted in the coating chamber. By rotating the carrier tray, the carrier tray can be shielded or exposed through the coating film, so that the vapor deposition process or the sputtering process can be selectively performed on the coating component in the same coating chamber, thereby avoiding formation. Different coatings convert the coating chamber to cause ruthenium contamination, and because there is no need to convert the coating chamber', the efficiency of the coating is improved, [0〇23] In summary, the invention has indeed met the requirements of the invention patent, and patented according to law. Application. However, the above is only the preferred implementation method of this issue, and it is not possible to limit the scope of patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
【圖式簡單說明】 [0024] 圖1係本技術方案實施例提供之鍵旗:裝置之立體示意圖。 [0025] 圖2係本技術方案第—實施例提供之鑛膜裝置之分解示意 圖。 [0026] 圖3係圖1沿111 -111線之剖面示意圖。 [0027] 圖4係本技術方案實施例提供之鑛膜裝置之使用狀態之示 意圖。 [0028] 098134863 圖5係本技術方案實施例提供之鍍膜裝置之另一使用狀遙 之示意圖。 0982059727-0 表單编號A0101 第13頁/共24頁 201113387 【主要元件符號說明】 [0029] 鍍膜裝置：100 [0030] 鍍膜室：110 [0031] 收容空間：1101 [0032] 蒸鍍腔：1102 [0033] 濺鍍腔：1103 [0034] 頂板：111 [0035] 底板：112 [0036] 第一側板·· 113 [0037] 第二侧板：114 [0038] 第三侧板：115 [0039] 第四側板：116 [0040] 第一安裝孔：117 [0041] 第二安裝孔：118 [0042] 固定孔：119 [0043] 承載裝置：120 [0044] 固定板：121 [0045] 第一表面：1211 [0046] 第二表面：1212 [0047] 鍍膜通孔：1213 098134863 表單編號A0101 第14頁/共24頁 0982059727-0 201113387 [0048] 支撐部：1215 [0049] 定位凸塊：1214 [0050] 第一承載盤：122 [0051] 第一承載部：1221 [0052] 第一固定部：1222 [0053] 第一承載面：1223 [0054] Ο 第一底面：1224 [0055] 第一收容槽：1225 [0056] 第一定位通孔：1226 [0057] 第二承載盤：123 [0058] 第一轉軸：124 [0059] 第二轉軸：125 [0060] Ο 濺鍍裝置：130 [0061] 蒸鍍裝置：140 [0062] 蒸鍍坩堝：141 [0063] 固定件：142 [0064] 第一端部：1421 [0065] 第二端部：1422 [0066] 第二固定件：143 098134863 表單編號Α0101 第15頁/共24頁 0982059727-0 201113387 [0067] 安裝部：1431 [0068] 固定部：1 4 3 2 [0069] 收容孔：1433 [0070] 喷頭：144 [0071] 第一端：1441 [0072] 第二端：1442 [0073] 開口 ： 1443 [0074] 收容腔：145 0982059727-0 098134863 表單編號A0101 第16頁/共24頁BRIEF DESCRIPTION OF THE DRAWINGS [0024] FIG. 1 is a perspective view of a key flag provided by an embodiment of the present technical solution. 2 is an exploded schematic view of a mineral film device according to a first embodiment of the present technical solution. [0025] FIG. 3 is a schematic cross-sectional view taken along line 111-111 of FIG. 1. [0027] FIG. 4 is a schematic diagram showing the state of use of the mineral film device provided by the embodiment of the present technical solution. [0028] FIG. 5 is a schematic diagram of another use mode of the coating device provided by the embodiment of the present technical solution. 0982059727-0 Form No. A0101 Page 13 of 24 201113387 [Main component symbol description] [0029] Coating device: 100 [0030] Coating chamber: 110 [0031] Containing space: 1101 [0032] Evaporating chamber: 1102 Sputtering cavity: 1103 [0034] Top plate: 111 [0035] Base plate: 112 [0036] First side plate · 113 [0037] Second side plate: 114 [0038] Third side plate: 115 [0039] Fourth side panel: 116 [0040] First mounting hole: 117 [0041] Second mounting hole: 118 [0042] Fixing hole: 119 [0043] Carrier: 120 [0044] Fixing plate: 121 [0045] First surface :1211 [0046] Second surface: 1212 [0047] Coated through hole: 1213 098134863 Form number A0101 Page 14 / Total 24 page 0992059727-0 201113387 [0048] Support: 1215 [0049] Positioning bump: 1214 [0050] First carrying tray: 122 [0051] First carrying portion: 1221 [0052] First fixing portion: 1222 [0053] First bearing surface: 1223 [0054] Ο First bottom surface: 1224 [0055] First receiving groove : 1225 [0056] First positioning through hole: 1226 [0057] Second carrier: 123 [0058] First shaft: 124 [0059] Rotary shaft: 125 [0060] 溅 Sputtering device: 130 [0061] Evaporating device: 140 [0062] Evaporating 坩埚: 141 [0063] Fixing member: 142 [0064] First end: 1421 [0065] Second end Part: 1422 [0066] Second Fixing Member: 143 098134863 Form No. Α 0101 Page 15 / Total 24 Page 0992059727-0 201113387 [0067] Mounting Section: 1431 [0068] Fixing Section: 1 4 3 2 [0069] Housing Hole: 1433 [0070] Nozzle: 144 [0071] First end: 1441 [0072] Second end: 1442 [0073] Opening: 1443 [0074] Containment cavity: 145 0982059727-0 098134863 Form number A0101 Page 16 of 24 page