CN111455343A - Film coating machine and film coating control method - Google Patents
Film coating machine and film coating control method Download PDFInfo
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- CN111455343A CN111455343A CN201910048962.7A CN201910048962A CN111455343A CN 111455343 A CN111455343 A CN 111455343A CN 201910048962 A CN201910048962 A CN 201910048962A CN 111455343 A CN111455343 A CN 111455343A
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000007888 film coating Substances 0.000 title abstract description 16
- 238000009501 film coating Methods 0.000 title abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 80
- 239000011248 coating agent Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000013077 target material Substances 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 13
- 230000033001 locomotion Effects 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 12
- 238000000429 assembly Methods 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims 5
- 239000011247 coating layer Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 18
- 238000004544 sputter deposition Methods 0.000 abstract description 16
- 239000007789 gas Substances 0.000 description 17
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a film coating machine and a film coating control method. The coating machine includes: coating a film cavity; the target material assembly is arranged in the coating cavity; the substrate fixing assembly is arranged in the coating cavity and is opposite to the target assembly; and the baffle is used for changing the movement direction of the particles emitted from the target assembly to the substrate fixing assembly. The film plating machine provided by the invention changes the movement direction of the particles emitted by the target component to the substrate fixing component by arranging the baffle plate, so that the film plating speed can be adjusted under the condition of avoiding changing relevant parameters such as sputtering power, sputtering atmosphere and the like, the control process is facilitated to be simplified, the continuity of the film plating process is kept, and the convenience degree of the film plating process is improved.
Description
Technical Field
The invention relates to the technical field of solar power generation, in particular to a film coating machine and a film coating control method.
Background
The continuous coating equipment has the advantages of high automation and continuous operation of the production process, and is suitable for large-area continuous production. The same equipment can be designed to continuously plate a plurality of film layers, for example, a Mo (molybdenum) line equipment can be continuously plated with two film layers of SiN (silicon nitride) and Mo, and a TCO (transparent conductive oxide) equipment can also be continuously plated with two film layers of IZO (indium zinc oxide) and AZO (aluminum-doped zinc oxide). In the process of optimizing the process, the thickness of the film layer needs to be re-integrated sometimes, and the existing method for adjusting the film thickness is generally realized by adjusting the power of a sputtering power supply or adjusting the traveling speed of a product in a cavity, namely the film coating speed. However, the sputtering power supply power is adjusted, the atmosphere of the cavity is changed, and the reaction gas needs to be compensated; the film coating speed is adjusted, and the film coating speed of various film layers is changed simultaneously. Therefore, the prior coating is inconvenient to adjust.
Disclosure of Invention
The embodiment of the invention provides a film coating machine and a film coating control method, which aim to solve the problem that the conventional film coating adjusting mode is inconvenient.
In a first aspect, an embodiment of the present invention provides a film plating machine, including:
coating a film cavity;
the target material assembly is arranged in the coating cavity;
the substrate fixing assembly is arranged in the coating cavity and is opposite to the target assembly;
and the baffle is used for changing the movement direction of the particles emitted from the target assembly to the substrate fixing assembly.
Optionally, the baffle plate further comprises a through hole penetrating through the baffle plate, and particles emitted from the target assembly move towards the substrate fixing assembly through the through hole. 9
Optionally, the baffle includes a plurality of sub-baffles, at least one sub-baffle is disposed on each of two opposite sides of the coating chamber, and the sub-baffles move between the target assembly and the substrate fixing assembly to form the through hole.
Optionally, the plurality of sub-baffles are symmetrically distributed on two sides of the coating cavity, the baffles on the two sides of the coating cavity are in transmission connection, and can synchronously move towards or away from each other.
Optionally, the coating machine further comprises a driving assembly, and the driving assembly drives the baffle to move between the target assembly and the substrate fixing assembly.
Optionally, the coating device further comprises a control assembly, the control assembly comprises a signal receiving unit and a signal feedback unit connected with the signal receiving unit, the signal receiving unit is used for acquiring the position of the baffle, the signal feedback unit is connected with the driving device, and the signal feedback unit is used for driving the baffle to move through the driving device according to the position of the baffle and the coating process.
Optionally, the number of the target assemblies is at least two, and the at least two target assemblies are respectively used for providing different coating target materials.
In a second aspect, an embodiment of the present invention provides a coating control method, which is applied to any one of the coating machines described above, and the coating control method includes:
arranging a substrate base plate to be coated on the base plate fixing component;
moving the baffle for the first time to provide a first shielding area, and forming a first film layer on the substrate to be coated;
moving the baffle for the second time to provide a second shielding area and forming a second film layer on the first film layer;
the first film layer and the second film layer comprise different materials, and the first shielding area and the second shielding area are shielding areas with different sizes.
Optionally, in a case that the film plating machine includes a baffle and a driving assembly, the first moving of the baffle provides a first shielding area, including:
the driving assembly drives the baffle to move to a first position, and when the baffle is located at the first position, the area of the substrate base plate to be coated, which is sheltered by the baffle, is equal to the first sheltered area; and/or
The second moving the shutter to provide a second occlusion area, comprising:
the driving assembly drives the baffle to move to a second position, and when the baffle is located at the second position, the area of the substrate base plate to be coated, which is sheltered by the baffle, is equal to the second sheltered area.
Optionally, in a case that the film plating machine includes a control assembly, the first moving of the baffle provides a first shielding area, and before forming a first film layer on the article to be plated, the method further includes:
acquiring the current position of the baffle through a signal receiving unit;
and controlling a driving assembly to drive the baffle to move to an initial position through a signal feedback unit according to the current position of the baffle, wherein the shielding area of the baffle is 0 at the initial position.
The film plating machine provided by the invention changes the movement direction of the particles emitted by the target component to the substrate fixing component by arranging the baffle plate, so that the film plating speed can be adjusted under the condition of avoiding changing relevant parameters such as sputtering power, sputtering atmosphere and the like, the control process is facilitated to be simplified, the continuity of the film plating process is kept, and the convenience degree of the film plating process is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a diagram illustrating a state of use of a coater according to an embodiment of the present invention;
FIG. 2 is another usage diagram of a coater according to an embodiment of the present invention
Fig. 3 is a flowchart of a plating control method according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a film coating machine.
In one embodiment, as shown in fig. 1 and 2, the coater includes a coating chamber 110, a target assembly 120, a baffle 130, and a substrate holding assembly for holding a substrate 200.
The coating chamber 110 is used for providing a reaction space, the target assembly 120 is disposed in the coating chamber 110 and is used for accommodating a target material used for coating, and the substrate fixing assembly is generally a fixture or the like and can clamp and fix the substrate 200 to be coated.
As shown in fig. 1 and 2, the target material contained in the target assembly 120 is separated from the target assembly 120 under the bombardment action of the charged particle beam or is separated from the target assembly 120 after being heated and vaporized, and the target material separated from the target assembly 120 forms a target gas.
The baffle 130 is used to change the direction of movement of particles (or target gas) emitted from the target assembly 120 toward the substrate holding assembly. As shown by the range of the dotted line in fig. 1 and 2, the target gas is sputtered in a specific direction by the electric field. When the substrate base plate 200 to be coated is positioned in this direction, the target gas can deposit on the substrate base plate 200 and form a film layer of the target material. Changing the direction of motion of the particles emitted from the target assembly 120 can be achieved by providing baffles in the original direction of the target gas.
It should be appreciated that sputtering the target assembly 120 during the coating process corresponds to providing a target gas atmosphere having a concentration within the sputtering region. While the shield 130 provides a certain shielding area, it only affects the concentration of the target assembly material, but not the sputtering range of the target assembly material.
When the baffle 130 is positioned between the target and the substrate base plate 200, a portion of the target gas will be deposited or deflected on the baffle 130, thereby changing the direction of movement that would otherwise be toward the substrate holding assembly, so that the concentration of the target gas will decrease at the side of the baffle 130 away from the target assembly 120, and the deposition rate of the target material on the substrate base plate 200 will decrease accordingly.
When the shielding areas are different, the proportion of the target gas in the movement direction of the original substrate fixing assembly is changed, and the coating speed is different, so that the coating speed can be adjusted by adjusting the position of the baffle 130.
According to the film plating machine, the baffle 130 is arranged, the baffle 130 can change the movement direction of particles emitted from the target assembly to the substrate fixing assembly, and the proportion of a film plating target material deposited on the baffle 130 can be adjusted by adjusting the position of the baffle 130 in the use process, so that the concentration of the target gas at the substrate fixing assembly can be adjusted.
Therefore, the regulation of the coating speed can be realized under the condition of avoiding changing relevant parameters such as sputtering power, sputtering atmosphere and the like, the control process is facilitated to be simplified, the continuity of the coating process is kept, and the convenience degree of the coating process is improved.
Further, the blocking plate 130 further includes a through hole 131 penetrating the blocking plate 130, and the particles emitted from the target assembly move toward the substrate fixing assembly through the through hole 131.
When the size of the through hole 131 changes, the number of particles moving toward the substrate fixing member through the through hole 131 also changes, and the concentration of the target gas at the substrate 200 to be coated is also changed, so that the coating speed is adjusted.
Further, the baffle 130 includes a plurality of sub-baffles, at least one sub-baffle is disposed on each of two opposite sides of the coating chamber 110, and through holes 131 are formed at intervals between the sub-baffles. In a preferred embodiment, the plurality of sub-baffles are symmetrically distributed on two sides of the coating cavity 110, and the sub-baffles located on the two sides of the coating cavity 110 are in transmission connection and can synchronously move towards or away from each other.
It should be understood that, in order to make the coating thickness uniform, the concentration of the target assembly material should be controlled to be relatively uniform, and therefore, in the present embodiment, the sub-baffles are disposed on two opposite sides of the coating chamber 110, so that the through holes 131 formed between the sub-baffles are substantially located in the central region of the target gas moving direction, which can improve the uniformity of the target gas distribution.
When the sub-baffles are symmetrically arranged and move synchronously, the uniformity of the target gas in the coating cavity 110 can be further improved, so that the uniformity of coating is improved.
The coater also includes a driving assembly connected to the baffle 130 for driving the baffle 130 to move to different positions to provide different shading areas.
The driving device may be a motor, etc., as long as it can drive the baffle 130 to move, and it may be connected to the baffle 130 through a transmission manner including, but not limited to, a rack and pinion, a worm gear, etc., so as to drive the baffle 130 to provide different shielding areas.
In a preferred embodiment, the baffle 130 is disposed in a direction substantially perpendicular to the sputtering direction of the target assembly 120, such that the same area of the baffle 130 provides a larger shadow area.
In another preferred embodiment, the baffle 130 is made of a material that is not reactive with the target material, so that the target material deposited on the baffle 130 can be recovered after the reaction, thereby saving resources.
Further, the coating machine further comprises a control assembly, the control assembly comprises a signal receiving unit and a signal feedback unit connected with the signal receiving unit, the signal receiving unit is used for acquiring the position of the baffle 130, the signal feedback unit is connected with the driving device, and the signal feedback unit is used for controlling the driving device according to the position of the baffle 130 and the coating process and driving each baffle 130 to move through the driving device.
The signal receiving unit may include a sensor for detecting the position of the barrier 130, and the position of the barrier 130 may be detected by a photoelectric sensor, an electromagnetic sensor, or the like, for example.
The coater generates a corresponding coating control signal as the coating process proceeds. For example, in the process of continuously plating two or more film layers, when one film plating operation is completed and another film plating operation is performed, a corresponding control process is necessarily involved, and the process can be performed manually by an operator or automatically controlled by an upper computer or a controller such as a single chip microcomputer or a computer. These control processes generate corresponding coating control signals.
When the signal receiving unit obtains the coating control signal corresponding to the coating process switching, the signal feedback unit can control the driving device to start, and the baffle 130 is driven to move to the position corresponding to the next coating process according to the current position of the baffle 130 obtained by the signal receiving unit, so that the coating process can be conveniently and quickly controlled.
Further, the number of the target assemblies 120 is at least two, and at least two target assemblies 120 are respectively used for providing different coating materials.
In this embodiment, at least two target assemblies 120 provide different coating materials, and in the coating process, switching of the coating materials can be realized by switching the target assemblies 120, so that the coating process can be more continuous, and the coating efficiency can be improved.
The invention also provides a coating control method applied to any coating machine.
In one embodiment, as shown in fig. 3, the plating control method includes:
301, arranging a substrate base plate 200 to be coated on a base plate fixing component;
In this embodiment, the substrate base plate 200 may be disposed in the film coating cavity 110 by clamping with a clamp, and during the process of continuously forming the first film layer and the second film layer on the substrate base plate 200, the target assembly 120 corresponding to the first film layer is firstly utilized to perform sputtering, and at this time, the baffle 130 provides a first shielding area on the sputtering region of the target assembly 120.
The first layer and the second layer comprise different materials, so after the first layer is formed, the target material provided by the target assembly 120 needs to be switched to the material corresponding to the second layer, and meanwhile, before the second layer is plated, the control baffle 130 provides a second shielding area.
Because the first shielding area and the second shielding area are areas with different sizes, the concentration of the target gas is different and the corresponding coating rate is different in the process of forming the first film layer and the second film layer under the condition of keeping the same other conditions, so that the current coating rate can be adjusted on the premise of not adjusting the sputtering power, not adjusting the sputtering atmosphere and not influencing the coating rates of other cathodes.
Further, in the case that the coater includes the baffle 130 and the driving assembly, the step 302 includes:
the driving assembly drives the baffle 130 to move to a first position, and when the baffle 130 is located at the first position, the area of the substrate base plate 200 to be coated, which is sheltered by the baffle 130, is equal to the first sheltered area; and/or
The above step 303 includes:
the driving assembly drives the baffle 130 to move to the second position, and when the baffle 130 is located at the second position, the area of the substrate base plate 200 to be coated, which is sheltered by the baffle 130, is equal to the second sheltered area.
In the case of a coating machine comprising a baffle 130 and a driving assembly, the adjustment of the shielding area is realized by changing the position of the driving assembly driving the baffle 130.
In practice, the coating rates of the baffle 130 at different positions can be tested in advance, and then in the actual production process, according to the result of the pre-testing, when the coating rate needs to be controlled, the coating rate can be adjusted to the target value only by controlling the baffle 130 to move to the position determined in the testing process.
Further, in the case that the coater includes the above control assembly, before step 302, the method further includes:
acquiring the current position of the baffle 130 through the signal receiving unit;
according to the current position of the baffle 130, the driving assembly is controlled by the signal feedback unit to drive the baffle 130 to move to the initial position, wherein the shielding area of the baffle 130 is 0 at the initial position. Further, one of the first and second shielding areas is 0.
It should be appreciated that in the case where the shielding area is not 0, since a part of the target gas is deposited on the shutter 130, a certain waste is caused. Therefore, for the continuously performed coating processes, the shielding area corresponding to one of the processes is controlled to be 0, and is usually 0 in the coating process with the faster coating rate, so that the deposition of the target gas on the baffle 130 can be reduced, and the material of the target assembly used can be saved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A coating machine is characterized by comprising:
coating a film cavity;
the target material assembly is arranged in the coating cavity;
the substrate fixing assembly is arranged in the coating cavity and is opposite to the target assembly;
and the baffle is used for changing the movement direction of the particles emitted from the target assembly to the substrate fixing assembly.
2. The coater of claim 1 wherein the baffle further comprises a through-hole extending through the baffle through which particles emitted from the target assembly move toward the substrate holding assembly.
3. The coater of claim 2 wherein the baffle comprises a plurality of sub-baffles, and wherein at least one of the sub-baffles is disposed on each of opposite sides of the coating chamber, the sub-baffles moving between the target assembly and the substrate holding assembly to form the through-holes.
4. The coater according to claim 3 wherein a plurality of sub-baffles are symmetrically distributed on both sides of the coating chamber, the sub-baffles located on both sides of the coating chamber are in driving connection and can move synchronously towards or away from each other.
5. The coater of any one of claims 1 to 4 further comprising a drive assembly that drives the shutter to move between the target assembly and the substrate holding assembly.
6. The coating machine as claimed in claim 5, further comprising a control assembly, wherein the control assembly comprises a signal receiving unit and a signal feedback unit connected with the signal receiving unit, the signal receiving unit is used for acquiring the position of the baffle, the signal feedback unit is connected with the driving device, and the signal feedback unit is used for driving the baffle to move through the driving device according to the position of the baffle and the coating process.
7. The coater of claim 1 wherein the number of target assemblies is at least two and at least two of the target assemblies are each adapted to provide a different coating target material.
8. A coating control method applied to the coating machine according to any one of claims 1 to 7, comprising:
arranging a substrate base plate to be coated on the base plate fixing component;
moving the baffle for the first time to provide a first shielding area, and forming a first film layer on the substrate to be coated;
moving the baffle for the second time to provide a second shielding area and forming a second film layer on the first film layer;
the first film layer and the second film layer comprise different materials, and the first shielding area and the second shielding area are shielding areas with different sizes.
9. The coating control method of claim 8, wherein, in the case where the coating machine includes a shutter and a drive assembly, the first moving the shutter to provide a first blocked area comprises:
the driving assembly drives the baffle to move to a first position, and when the baffle is located at the first position, the area of the substrate base plate to be coated, which is sheltered by the baffle, is equal to the first sheltered area; and/or
The second moving the shutter to provide a second occlusion area, comprising:
the driving assembly drives the baffle to move to a second position, and when the baffle is located at the second position, the area of the substrate base plate to be coated, which is sheltered by the baffle, is equal to the second sheltered area.
10. The coating control method according to claim 8 or 9, wherein in a case where the coating machine includes a control unit, the first moving of the shutter provides a first blocked area and before forming a first coating layer on the article to be coated, the method further comprises:
acquiring the current position of the baffle through a signal receiving unit;
and controlling a driving assembly to drive the baffle to move to an initial position through a signal feedback unit according to the current position of the baffle, wherein the shielding area of the baffle is 0 at the initial position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910048962.7A CN111455343A (en) | 2019-01-18 | 2019-01-18 | Film coating machine and film coating control method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910048962.7A CN111455343A (en) | 2019-01-18 | 2019-01-18 | Film coating machine and film coating control method |
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| CN111455343A true CN111455343A (en) | 2020-07-28 |
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| CN201910048962.7A Pending CN111455343A (en) | 2019-01-18 | 2019-01-18 | Film coating machine and film coating control method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113265630A (en) * | 2021-06-30 | 2021-08-17 | 纳峰真空镀膜（上海）有限公司 | Coating film baffle |
| CN113684451A (en) * | 2021-08-16 | 2021-11-23 | 上海济物光电技术有限公司 | Additive surface shape correcting device of silicon carbide optical lens |
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| CN103132016A (en) * | 2013-02-22 | 2013-06-05 | 京东方科技集团股份有限公司 | Membrane edge adjusting device |
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