CN107313020B - A kind of magnetic control sputtering film plating device - Google Patents
A kind of magnetic control sputtering film plating device Download PDFInfo
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- CN107313020B CN107313020B CN201710709875.2A CN201710709875A CN107313020B CN 107313020 B CN107313020 B CN 107313020B CN 201710709875 A CN201710709875 A CN 201710709875A CN 107313020 B CN107313020 B CN 107313020B
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- plating device
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
Abstract
The present invention provides a kind of magnetic control sputtering film plating device, and the magnetic control sputtering film plating device includes vacuum chamber；A sputter coating area is arranged in the vacuum chamber；Magnetic control target is set in the sputter coating area；Carrying platform is located in the sputter coating area to bearing substrate relative to the mobile setting of the magnetic control target；And regulating mechanism, the regulating mechanism include the controllable register to adjust thicknesses of layers；Film thickness automatic tester；Wherein, the film thickness automatic tester detects the thicknesses of layers of the substrate, adjusts the controllable register by the regulating mechanism and moves horizontally, to correct the thicknesses of layers of the substrate.When magnetic control sputtering film plating device plated film to solve the prior art, it is easy to appear the bad phenomenon of film layer longitudinal uniformity.
Description
Technical field
The present invention relates to sputter coating field more particularly to a kind of magnetic control sputtering film plating devices.
Background technique
Produce in the components such as LCD, OLED, TP material currently on the market much for example: SiO2, SIN, TiO2, ITO,
The common film material such as IZO, metal can all use vacuum magnetron sputtering film plating machine (PVD)；Vacuum sputtering equipment is generally by cathode
System, the part such as vacuum system, conveyer system form；The core of vacuum coating is to prepare in the vacuum cavity of continuous-stable equal
Even required film layer, current equipment and substrate all develop toward large scale direction, it is necessary to and less vacuum cavity is begun to speak frequency,
Even film layer row more evenly guarantees the stable operation of equipment high efficiency.
The plated film mode of current magnetron sputter is generally wire type coating machine, and cathode assembly is fixed, a kind of: substrate side is moved
Dynamic side sputter coating, a kind of: substrate forbids motionless beginning plated film before being transferred to cathode；Both of which will appear longitudinal uniformity
Bad phenomenon, current adjustment mode are mainly the following mode and adjust: adjustment field homogeneity adjusts anode cap or adjusting
The shape of baffle, process gas pass through segmentation gas supply.
It adjusts magnetic field homogeneity and adjusts the mode of anode hood shape, requiring vacuum breaker every time could be handled, broken every time
Vacuum will affect the stability of production efficiency and equipment, and adjustment effect cannot confirm immediately, and vacuum coating is needed just to can confirm that,
Sometimes it does not reach requirement, needs to correct repeatedly；Process gas segmentation gas supply, it is unstable and easy that atmosphere is easy fluctuation adjustment effect
It is influenced by other deflation such as substrate；And target is also changed using different time sections uniform film thickness after being adjusted with upper type.
In conclusion the magnetic control sputtering film plating device of the prior art, it is longitudinally uniform in substrate film coating to be easy to appear film layer
The bad phenomenon of property, and when being adjusted to film thickness, needing vacuum breaker environment just can be carried out, to influence production efficiency and equipment
Stability.
Summary of the invention
The present invention provides a kind of magnetic control sputtering film plating device, can downward the case where not destroying the vacuum environment of vacuum chamber
The thickness of the whole film layer on the indoor substrate of the vacuum chamber.
To solve the above problems, technical solution provided by the invention is as follows:
The present invention provides a kind of magnetic control sputtering film plating device, comprising:
Vacuum chamber, is provided with a sputter coating area, and the sputter coating area is located in the middle part of the vacuum chamber；
Magnetic control target is set in the vacuum chamber, and the magnetic control target is located in the sputter coating area, the magnetic
Target is controlled to sputter predetermined membrane material in the indoor substrate of the vacuum chamber to setting；
Carrying platform, it is mobile relative to the magnetic control target to carry the substrate, and to control the substrate；And
Film thickness automatic tester is set on the outside of the chamber bottom, and the film thickness automatic tester is to detect
The thickness of film layer is formed by by the predetermined membrane material for sputtering on the substrate, and generates the thickness information of the film layer；
Regulating mechanism is set to the side in the sputter coating area, and the regulating mechanism includes controllable register, the adjusting
Mechanism is mobile to control the controllable register according to the thickness information, to be blocked using the controllable register or partial occlusion
The predetermined membrane material to the substrate is sputtered, and then adjusts the thickness of the film layer.
According to one preferred embodiment of the present invention, the regulating mechanism includes servo motor, the first transmission gear, the second transmission
Gear, third transmission gear, vertical adjustment bar and lateral adjustments bar.
According to one preferred embodiment of the present invention, the servo motor is set on the outside of the chamber bottom, and described the
One transmission gear is connected to the servo motor output shaft end, and second transmission gear is set to vertical adjustment bar one end
And engaged with first transmission gear, the vertical adjustment bar protrudes into the vacuum chamber by the chamber bottom through-hole
Room, the third transmission gear are set to the vertical adjustment bar other end, the lateral adjustments bar and the third driving cog
Wheel engagement.
According to one preferred embodiment of the present invention, the controllable register includes at least two sub- controllable registers, at least two institutes
It states sub- controllable register and is longitudinally arranged in parallel in the same plane towards the substrate.
According to one preferred embodiment of the present invention, it is wide to be greater than the substrate for the overall width of at least two sub- controllable registers
Degree.
According to one preferred embodiment of the present invention, the lateral adjustments bar includes the corresponding sub- controllable register respective numbers
Laterally sub- adjusting rod, the vertical adjustment bar includes the sub- adjusting rod in longitudinal direction of the corresponding sub- controllable register respective numbers.
According to one preferred embodiment of the present invention, a sub- controllable register connects a sub- adjusting rod of transverse direction, the cross
It is connect to the opposite other end of sub- adjusting rod by a third transmission gear with a sub- adjusting rod in longitudinal direction, the longitudinal direction
Sub- adjusting rod is connect by second transmission gear with first transmission gear with a servo motor.
According to one preferred embodiment of the present invention, each servo motor independent control.
According to one preferred embodiment of the present invention, the chamber bottom includes: opposite with each sub- adjusting rod in longitudinal direction
The through-hole answered, any sub- adjusting rod in longitudinal direction are tightly connected with the corresponding through-hole.
According to one preferred embodiment of the present invention, when the substrate layer thickness is greater than predetermined thickness value, the institute of corresponding region
Sub- controllable register is stated from moving horizontally close to described substrate one end to the other end；The substrate layer thickness is less than predetermined thickness value
When, the sub- controllable register of corresponding region is moved horizontally by the direction far from the substrate.
The invention has the benefit that magnetic control provided by the present invention splashes compared to existing magnetic control sputtering film plating device
Penetrate coating apparatus, by regulating mechanism, film thickness automatic tester, make controllable register by the regulating mechanism inside and outside vacuum chamber come
On-line tuning film thickness is located at the vacuum chamber to reach the adjustment in the case where not destroying the vacuum environment of the vacuum chamber
The purpose of the thickness of film layer on interior substrate, and the vacuum environment of vacuum chamber is maintained, guaranteeing the same of film thickness uniformity
When improve production cycle of equipment.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is magnetic control sputtering film plating device top view provided in an embodiment of the present invention；
Fig. 2 is magnetic control sputtering film plating device side view provided in an embodiment of the present invention.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The present invention is directed to existing magnetic control sputtering film plating device, solves the magnetic control sputtering film plating device of the prior art,
When being easy to appear film layer longitudinal uniformity bad phenomenon when substrate film coating, and being adjusted to film thickness, vacuum breaker environment is needed
It can be carried out, so that the embodiment of the present invention is able to solve the defect the technical issues of influencing the stability of production efficiency and equipment.
As shown in Figure 1, magnetic control sputtering film plating device top view provided in an embodiment of the present invention, magnetron sputtering of the invention
Film device includes: vacuum chamber 101, and a sputter coating area 102 is arranged in the vacuum chamber 101；Magnetic control target 103 is set to institute
It states in vacuum chamber 101, and the magnetic control target 103 is located in the sputter coating area 102, the formation of magnetic control target 103 is splashed
Radion is to sputter predetermined membrane material to the substrate 104 being arranged in the vacuum chamber 101；Carrying platform, to carry
Substrate 104 is stated, and mobile relative to the magnetic control target 103 to control the substrate 104；And film thickness automatic tester 105,
It is set to 101 bottom outside of vacuum chamber, the film thickness automatic tester 105 is to detect by sputtering at the substrate
The predetermined membrane material on 104 is formed by the thickness of film layer, and generates the thickness information of the film layer；Regulating mechanism 120, if
It is placed in the side in the sputter coating area 102, the regulating mechanism 120 includes controllable register 112, and the regulating mechanism 120 is used
It is mobile to control the controllable register 112 according to the thickness information, to be blocked using the controllable register 112 or partial occlusion
The predetermined membrane material to the substrate 104 is sputtered, and then adjusts the thickness of the film layer.
The regulating mechanism 120, including servo motor 106, the first transmission gear 107, the second transmission gear 108, third
Transmission gear 110, vertical adjustment bar 109 and lateral adjustments bar 111；The servo motor 106 is set to the vacuum chamber
101 outsides, first transmission gear 107 are connected to 106 output shaft end of servo motor, second transmission gear 108
It is set to described 109 one end of vertical adjustment bar and is engaged with first transmission gear 107, the vertical adjustment bar 109 passes through
101 bottom through-hole of vacuum chamber protrudes into the vacuum chamber 101, and the vertical adjustment bar 109 and the through-hole seal
Connection, the third transmission gear 110 are set to 109 other end of vertical adjustment bar, the lateral adjustments bar 111 with it is described
Third transmission gear 110 engages；The controllable register 112 is connect with the other end of the lateral adjustments bar 111.
As shown in Fig. 2, magnetic control sputtering film plating device side view provided in an embodiment of the present invention, include in vacuum chamber 207
Controllable register, the controllable register include at least two sub- controllable registers 201, at least two sub- controllable registers 201 towards
Substrate 204 is longitudinal in the same plane to be arranged in parallel, and the overall width of at least two sub- controllable registers 201 is greater than the base
204 width of plate.Lateral adjustments bar includes the sub- adjusting rod 202 of transverse direction of corresponding sub- 201 respective numbers of controllable register, longitudinal to adjust
Pole includes the sub- adjusting rod in longitudinal direction of corresponding sub- 201 respective numbers of controllable register, a sub- connection of controllable register 201 one
The opposite other end of the sub- adjusting rod 202 of transverse direction, the sub- adjusting rod 202 of transverse direction passes through a third transmission gear 203 and one
Longitudinal sub- adjusting rod connection, the sub- adjusting rod in longitudinal direction are connected to one with one first transmission gear by one second transmission gear and watch
Motor is taken, 207 bottom of vacuum chamber includes at least two through-holes, and a sub- adjusting rod in longitudinal direction and the corresponding through-hole are close
Envelope connection, and each servo motor independent control.
Magnetic control target 206 is set in the vacuum chamber 207, to described in being arranged in the vacuum chamber 207
Substrate 204 sputters predetermined membrane material, and film thickness automatic tester 205 is detected by the institute of the different zones sputtered on the substrate 204
The thickness that predetermined membrane material is formed by film layer is stated, and generates the thickness information of the film layer of corresponding region.The regulating mechanism
To the thickness information according to different zones, the sub- movement of controllable register 201 described in corresponding region is controlled, to utilize the sub- tune
Section baffle 201 blocks or partial occlusion sputters the predetermined membrane material to the substrate 204, and then adjusts the thickness of the film layer
Degree.
The automatic regulating system that the film thickness automatic tester passes through its automatic detection conversion system and the regulating mechanism
It adjusts to achieve the purpose that the thicknesses of layers of the substrate is uniform, the magnetic control sputtering film plating device realizes the work of above-mentioned purpose
Include: as process
Step S01, the magnetic control target in vacuum chamber sputters predetermined membrane material to the substrate relatively moved to it；
Step S02, film thickness automatic tester to detect the thicknesses of layers with controllable register corresponding position automatically；
Step S03, the measures of dispersion of the thicknesses of layers and target layer thickness of detection is by film thickness automatic tester to change
Calculate the amount that controllable register needs to adjust；
Step S04, controllable register needs the amount adjusted by automatic checkout system to be transmitted to servo motor；
Step S05, servo motor is to send regulated quantity to longitudinal tune by the first transmission gear, the second transmission gear
Pole；
Step S06, vertical adjustment bar is to send regulated quantity to lateral adjustments bar by third transmission gear；
Step S07, the movement of lateral adjustments bar moved horizontally to drive controllable register.
According to above-mentioned steps, the film thickness automatic tester detects the thicknesses of layers of the different zones of the substrate, and raw
At the corresponding thicknesses of layers information, and converse the amount that the regulating mechanism needs to adjust, the automatic detection system described later
System is transmitted to each servo motor will adjust information, and each servo motor is to drive the corresponding sub- controllable register
It is uniform to reach thicknesses of layers to do corresponding adjusting.When the thicknesses of layers is greater than predetermined thickness value, the sub- tune of corresponding region
Section baffle is blocked from moving horizontally close to described substrate one end to the other end or partial occlusion is sputtered to the described pre- of the substrate
Determine membrane material；When the thicknesses of layers is less than predetermined thickness value, the sub- controllable register of corresponding region is by the separate substrate
Direction moves horizontally, and the predetermined membrane material is made to be splashed to the corresponding region of the substrate, to achieve the purpose that thicknesses of layers is uniform.
Compared to existing magnetic control sputtering film plating device, magnetic control sputtering film plating device provided by the present invention passes through adjusting
Mechanism, film thickness automatic tester make controllable register by the regulating mechanism inside and outside vacuum chamber come on-line tuning film thickness, to reach
In the case where not destroying the vacuum environment of the vacuum chamber, adjustment is located at the film layer on the indoor substrate of the vacuum chamber
The purpose of thickness, and the vacuum environment of vacuum chamber is maintained, the production of equipment is improved while guaranteeing film thickness uniformity
Period.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (9)
1. a kind of magnetic control sputtering film plating device characterized by comprising
Vacuum chamber, is provided with a sputter coating area, and the sputter coating area is located in the middle part of the vacuum chamber；
Magnetic control target is set in the vacuum chamber, and the magnetic control target is located in the sputter coating area, the magnetic control target
To sputter predetermined membrane material in the indoor substrate of the vacuum chamber to setting；
Carrying platform, it is mobile relative to the magnetic control target to carry the substrate, and to control the substrate；And
Film thickness automatic tester, the film thickness automatic tester is to detect by sputtering the predetermined membrane material on the substrate
It is formed by the thickness of film layer, and generates the thickness information of the film layer；
Regulating mechanism, is set to the side in the sputter coating area, and the regulating mechanism includes servo motor, the first driving cog
Wheel, the second transmission gear, third transmission gear, vertical adjustment bar, lateral adjustments bar and controllable register；
The regulating mechanism is to control the controllable register movement according to the thickness information, to be hidden using the controllable register
Gear or partial occlusion sputter the predetermined membrane material to the substrate, and then adjust the thickness of the film layer.
2. magnetic control sputtering film plating device according to claim 1, which is characterized in that the servo motor is set to described true
On the outside of chamber bottom, first transmission gear is connected to the servo motor output shaft end, and second transmission gear is set
It is placed in vertical adjustment bar one end and is engaged with first transmission gear, the vertical adjustment bar passes through the vacuum chamber
Bottom through-hole protrudes into the vacuum chamber, and the third transmission gear is set to the vertical adjustment bar other end, the transverse direction
Adjusting rod is engaged with the third transmission gear.
3. magnetic control sputtering film plating device according to claim 2, which is characterized in that the controllable register includes at least two
Sub- controllable register, at least two sub- controllable registers are longitudinally arranged in parallel in the same plane towards the substrate.
4. magnetic control sputtering film plating device according to claim 3, which is characterized in that at least two sub- controllable registers
Overall width is greater than the substrate width.
5. magnetic control sputtering film plating device according to claim 3, which is characterized in that the lateral adjustments bar includes corresponding institute
The sub- adjusting rod of transverse direction of sub- controllable register respective numbers is stated, the vertical adjustment bar includes the corresponding sub- controllable register respective counts
The sub- adjusting rod in the longitudinal direction of amount.
6. magnetic control sputtering film plating device according to claim 5, which is characterized in that a sub- controllable register connects an institute
Laterally sub- adjusting rod is stated, the opposite other end of the sub- adjusting rod of transverse direction passes through a third transmission gear and a longitudinal direction
Sub- adjusting rod connection, the sub- adjusting rod in longitudinal direction pass through second transmission gear and first transmission gear and an institute
State servo motor connection.
7. magnetic control sputtering film plating device according to claim 6, which is characterized in that each servo motor independent control.
8. magnetic control sputtering film plating device according to claim 5, which is characterized in that the chamber bottom include: with
The corresponding through-hole of each sub- adjusting rod in the longitudinal direction, any sub- adjusting rod in longitudinal direction connect with the corresponding through-hole sealing
It connects.
9. magnetic control sputtering film plating device according to claim 8, which is characterized in that the substrate layer thickness is greater than predetermined
When thickness value, the sub- controllable register of corresponding region close to described substrate one end to the other end from moving horizontally；The substrate
When thicknesses of layers is less than predetermined thickness value, the sub- controllable register of corresponding region is moved by the direction level far from the substrate
It is dynamic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710709875.2A CN107313020B (en) | 2017-08-18 | 2017-08-18 | A kind of magnetic control sputtering film plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710709875.2A CN107313020B (en) | 2017-08-18 | 2017-08-18 | A kind of magnetic control sputtering film plating device |
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| Publication Number | Publication Date |
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| CN107313020A CN107313020A (en) | 2017-11-03 |
| CN107313020B true CN107313020B (en) | 2019-09-13 |
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| CN201710709875.2A Active CN107313020B (en) | 2017-08-18 | 2017-08-18 | A kind of magnetic control sputtering film plating device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111074230A (en) * | 2018-10-19 | 2020-04-28 | 东泰高科装备科技有限公司 | On-line detection device and method for coating uniformity and coating equipment |
| CN111455343A (en) * | 2019-01-18 | 2020-07-28 | 北京铂阳顶荣光伏科技有限公司 | Film coating machine and film coating control method |
| CN109881165A (en) * | 2019-03-11 | 2019-06-14 | 信利光电股份有限公司 | A kind of film coating correction plate |
| CN111647867A (en) * | 2020-07-02 | 2020-09-11 | 杭州企势科技有限公司 | Magnetron sputtering control mechanism of vacuum coating machine |
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| CN101538701A (en) * | 2009-01-09 | 2009-09-23 | 湖州金泰科技股份有限公司 | Mid-frequency direct current compound magnetron sputtering device |
| CN101611164A (en) * | 2006-06-22 | 2009-12-23 | 芝浦机械电子株式会社 | Film-forming apparatus and film |
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| CN101611164A (en) * | 2006-06-22 | 2009-12-23 | 芝浦机械电子株式会社 | Film-forming apparatus and film |
| JP2010018851A (en) * | 2008-07-10 | 2010-01-28 | Panasonic Corp | Film deposition apparatus |
| CN102171379A (en) * | 2008-09-30 | 2011-08-31 | 佳能安内华股份有限公司 | Sputtering apparatus and sputtering method |
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| CN107313020A (en) | 2017-11-03 |
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