CN108611612B - Vacuum sputtering equipment and sputtering method - Google Patents
Vacuum sputtering equipment and sputtering method Download PDFInfo
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- CN108611612B CN108611612B CN201810559716.3A CN201810559716A CN108611612B CN 108611612 B CN108611612 B CN 108611612B CN 201810559716 A CN201810559716 A CN 201810559716A CN 108611612 B CN108611612 B CN 108611612B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses vacuum sputtering equipment and a sputtering method, which comprise a vacuum chamber, a vacuumizing device, a transmission device for transmitting a base material, a target material, an air supply system and a baffle mechanism, wherein the target material is arranged in the vacuum chamber and is electrically connected with a power supply arranged outside the vacuum chamber, the transmission device is arranged below the target material, the base material is wound on the transmission device and is driven to enter the lower part of the target material by the transmission device, the vacuum sputtering equipment is also provided with a turnover mechanism, the turnover mechanism is arranged between the vacuum chamber and the baffle plate of an unwinding roller and a winding roller, and a balance coil is arranged at the central position of the target material, and the vacuum sputtering equipment has the beneficial effects that: the vacuum sputtering equipment can realize that the front and the back of the base material are sputtered in the same vacuum chamber, and improve the sputtering uniformity.
Description
Technical Field
The invention relates to the technical field of vacuum sputtering, in particular to vacuum sputtering equipment and a sputtering method.
Background
At present, the magnetron sputtering coating technology is widely applied due to the advantages of simple processing, convenient installation, compact coating film layer, high bonding strength, long-time mass production and the like. In the conventional art, a magnetron sputtering apparatus generally includes a substrate, a target backing plate, and the like disposed in a vacuum chamber. The current magnetron sputtering coating process is generally as follows: and in a vacuum state, applying an electric field between the target and the substrate, enabling electrons to move at a high speed under the action of the electric field and collide with argon atoms introduced into the chamber to ionize a large amount of argon ions, bombarding the target by the argon ions under the action of the electric field, sputtering a large amount of target atoms, and then uniformly depositing the sputtered target atoms on the surface of the substrate to form a metal film. In the process, the magnetron sputtering device can guide the direction of argon ions bombarding the target material, thereby controlling the target material atoms to move towards the position direction of the corresponding deposited metal film. However, the movement direction of sputtered target atoms is not correct, target atoms not only reach the surface of the substrate to deposit and form a metal film, but also a part of target atoms are sputtered to the outside of the substrate, so that a large amount of sputtered objects (such as metal films) are generated outside the substrate to pollute the chamber and bring inconvenience to later maintenance, and a quartz wafer close to the middle part of the rod-shaped metal target needs to obtain more metal molecules than a substrate far away from the middle part of the rod-shaped metal target, so that the effective thickness for obtaining more metal molecules is increased, and thus the consistency of a large number of simultaneously sputtered electrode films is poor, which becomes a great disadvantage.
Under the circumstances, it is urgently required to solve the above-mentioned problems and provide a simple and easy technique for providing a good consistency to a substrate on which a large number of metal electrode films are simultaneously plated by a vacuum sputtering apparatus.
Disclosure of Invention
In order to overcome the problems in the prior art, the invention provides vacuum sputtering equipment.
The invention discloses vacuum sputtering equipment, which comprises a vacuum chamber, a vacuumizing device, a transmission device for transmitting a base material, a target material, an air supply system and a baffle plate mechanism, and has the innovation points that: the target material is arranged in the vacuum chamber, the target material is electrically connected with a power supply arranged outside the vacuum chamber, a transmission device is arranged below the target material, and the substrate is wound on the transmission device and is driven to enter the lower part of the target material through the transmission device.
Further, transmission includes unwinding roller, wind-up roll and driving roller, and unwinding roller and rolling rod are installed respectively at the left and right sides wall of vacuum chamber relatively, and the substrate winds to on unwinding roller, receives the rod through the substrate even, and the driving roller is installed between unwinding roller and rolling rod.
Furthermore, the unwinding roller and the winding roller are respectively sleeved with a protection plate, an opening is formed in the protection plate, part of the base material is exposed below the target material through the opening, and the unwinding roller and the winding roller are connected.
Furthermore, still install tilting mechanism on the vacuum sputtering equipment, tilting mechanism all is installed between the guard plate and the vacuum chamber of unwinding roller and rolling rod both.
Further, tilting mechanism includes motor, fixing base, extensible member and upset piece, and the motor is installed outside the vacuum chamber for control extensible member and the action of upset piece, the fixing base is installed in the vacuum chamber lateral wall, and the fixing base fastening is passed through to the extensible member bottom, and the through-hole has been seted up to the flexible end of extensible member, and the upset piece passes through-hole mutually perpendicular installation with the extensible member.
Furthermore, the turning part adopts a rotary cylinder, and the rotary cylinder is connected with the protection plate through a rotating shaft.
Furthermore, a balance coil is arranged at the center of the target and is connected with a power supply.
Further, the vacuum sputtering device is also provided with a protection device, and the protection device is arranged between the substrate and the target and is positioned above the edge of the substrate.
Furthermore, protector includes framework and telescopic machanism, the framework comprises four frame mutually perpendicular, and frame one side is installed at the vacuum chamber through telescopic machanism, and the opposite side top is installed on the frame of vertically with it, and the frame has seted up the spout towards adjacent frame one side, and the frame top of vertically with it is installed in the spout.
The invention also provides a vacuum sputtering method for manufacturing the base material coating film by using the vacuum sputtering equipment, which comprises the following specific steps:
step 1, winding the base material on an unwinding roller and a winding roller, supporting the middle position of the base material by a driving roller,
step 3, vacuumizing the vacuum chamber;
filling argon into the whole working chamber, starting high voltage between the target material and the substrate to generate charged argon ions, impacting the target material directionally at high speed under the action of negative target voltage, and sputtering metal molecules to the surface of the substrate through a protection device;
and 5: starting the balance coil to generate an additional electromagnetic field, and influencing the comprehensive direction and strength of the whole electromagnetic field formed by the main electromagnetic field and the additional electromagnetic field; uniformly sputtering a large amount of metal molecules to the surface of a base material;
and 6, after the sputtering of the upper surface of the substrate is finished, turning the substrate by 180 degrees through a turning mechanism, falling the substrate onto a transmission device, repeating the steps 4-5 until the front surface and the back surface of the substrate are coated with films, and then rolling the substrate by a rolling rod.
Compared with the prior art, the invention has the beneficial effects that:
(1) the vacuum sputtering equipment can realize that the front and the back of the base material are sputtered in the same vacuum chamber, and improve the sputtering uniformity;
(2) the balance coil is arranged at the center of the target and connected with a power supply, and under the condition of electrifying, the balance coil generates an additional electromagnetic field, and the total electromagnetic field in the sputtering process is influenced by the additional electromagnetic field, so that the metal molecular weight reaching the surface of the base material near the balance coil is reduced, the metal molecules generated by the rod-shaped metal target can be sputtered onto the base material in a balanced manner, and the uniformity degree of the molecular weight on the surface of the base material is improved.
(3) Guarantee at the sputtering in-process through protector, with the whole base material surfaces that sputter of metal atom, the non-staining cavity, the size of framework is adjusted along with the area size that the base material exposes at the vacuum chamber, therefore this protector is applicable to not unidimensional base material, can be under the condition that need not open the chamber, realizes calibrating the position that shelters from the device to easy operation.
Drawings
FIG. 1 is a front view of a vacuum sputtering apparatus;
fig. 2 is a plan view of the vacuum sputtering apparatus.
Reference is made thereto in connection with the accompanying drawings:
1-vacuum chamber, 2-target, 3-unwinding roller, 4-winding roller, 5-substrate, 6-fixing seat, 7-telescopic part, 8-protective device, 81-frame, 82-telescopic mechanism and 83-sliding chute.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
This embodiment discloses a vacuum sputtering equipment, including vacuum chamber 1, evacuating device, the transmission that is used for driving substrate 5, target 2, air feed system and baffle mechanism, target 2 installs in vacuum chamber 1, and target 2 is connected with the power electricity that sets up outside vacuum chamber 1, sets up transmission in the below of target 2, and substrate 5 twines on transmission, drives substrate 5 through transmission and gets into the target 2 below.
The transmission device comprises an unwinding roller 3, a winding roller and a transmission roller, the unwinding roller 3 and the winding roller 4 are respectively and oppositely arranged on the left side wall and the right side wall of the vacuum chamber 1, the base material 5 is wound on the unwinding roller 3 and is connected with the winding roller 4 through the base material 5, and the transmission roller is arranged between the unwinding roller 3 and the winding roller 4 and is used for horizontally transmitting the base material 5 below the target material 2 so as to be convenient for sputtering metal ions on the base material 5; the unwinding roller 3 and the winding roller 4 are respectively sleeved with a protection plate, the protection plate is provided with an opening, part of the base material 5 is exposed below the target material 2 through the opening, and the unwinding roller 3 and the winding roller 4 are connected.
The simple vacuum sputtering equipment is generally provided with the target 2 only above the substrate 5, if sputtering needs to be carried out on both the front side and the back side of the target 2, the vacuum sputtering equipment with the target 2 arranged above and below the substrate 5 needs to be adopted, but when the vacuum sputtering equipment is used for preparing the substrate 5 which only needs single-side sputtering, only one target 2 works and the other target 2 is vacant, atoms can be deposited at the bottom of the vacuum chamber in the sputtering process, so that the targets 2 are not ideal to be simultaneously installed on the front side and the back side of the substrate 5, sputtering can be realized in the same vacuum chamber 1 for realizing the front side and the back side of the substrate 5, the vacuum sputtering equipment of the embodiment is also provided with the turnover mechanism, the turnover mechanism is installed between the protection plate of the unwinding roller 3 and the vacuum chamber 1, and similarly, the turnover mechanism is installed between the protection. Tilting mechanism includes motor, fixing base 6, extensible member 7 and upset piece, and the motor is installed in vacuum chamber 1 outside for control extensible member 7 and the action of upset piece, fixing base 6 is installed in 1 lateral wall of vacuum chamber, and fixing base 6 fastening is passed through to 7 bottoms of extensible member, prevents that skew from appearing in extensible member 7, and the through-hole has been seted up to the flexible end of extensible member 7, and the upset piece passes through-hole mutually perpendicular installation with extensible member 7, and extensible member 7 can adopt cylinder or pneumatic cylinder in this embodiment. The turning piece adopts a rotary cylinder, the rotary cylinder is connected with the protection plate through a rotating shaft, the rotary cylinder drives the unwinding roller 3 or the winding roller 4 in the protection plate to turn through the rotating shaft, when the unwinding roller 3 and the winding roller 4 turn over, the substrate 5 is ensured not to deviate and curl, when the substrate 5 needs to turn over, the motor controls the extensible piece 7 to lift the unwinding roller 3 and the winding roller 4 by a certain height, the lifting height is more than half of the width of the substrate 5, and the situation that the substrate 5 touches the driving roller in the turning process to damage the surface of the substrate 5 is avoided; after the lifting, the motor controls the turnover piece base material 5, the turnover angle can be adjusted according to actual conditions, in the embodiment, the base material 5 needs to be turned over by 180 degrees, and after the turnover, the motor controls the telescopic piece 7 to fall back until the lower surface of the base material 5 contacts the transmission roller.
In an embodiment, the substrate 5 is sputtered by means of the target 2, and due to the fixed position of the target 2, during sputtering the substrate 5 close to the target 2 receives a significantly higher molecular weight of the metal than the substrate 5 far from the target 2, which results in a substrate 5 sputtered in the same vacuum chamber 1, the molecular weight obtained by sputtering decreasing from the central region towards the peripheral region, causing inconsistencies. In order to ensure that the molecular weights of the regions on the substrate 5 are consistent, in the embodiment, a balance coil is arranged at the central position of the target material 2, the balance coil is connected with a power supply, and under the condition of electrifying, the balance coil generates an additional electromagnetic field, and the total electromagnetic field in the sputtering process is influenced by the additional electromagnetic field, so that the metal molecular weight reaching the surface of the substrate 5 near the balance coil is reduced, the metal molecules generated by the rod-shaped metal target can be uniformly sputtered onto the substrate 5, and the uniformity degree of the molecular weight on the surface of the substrate 5 is improved.
During the sputtering process, not all metal atoms will be sputtered onto the surface of the substrate 5, and some metal atoms will be sputtered onto the outside of the substrate 5, so that a large amount of sputtered material (e.g. metal film) is generated outside the substrate to contaminate the chamber, and cause inconvenience for the later maintenance. In this embodiment, the vacuum sputtering apparatus is further provided with a protection device 8, the protection device 8 is installed between the substrate 5 and the target 2, and the protection device 8 is disposed above the edge of the substrate 5. The protection device 8 comprises a frame body and a telescopic mechanism 82, the frame body is composed of four frames 81 which are perpendicular to each other, one side of each frame 81 is installed in the vacuum chamber 1 through the telescopic mechanism 82, the top of the other side of each frame is installed on the frame 81 perpendicular to the other side of each frame, the frame 81 faces one side of the adjacent frame 81 and is provided with a sliding groove 83, the top end of the frame 81 perpendicular to the frame is installed in the sliding groove 83, the frame 81 changes the size of the frame body through the telescopic mechanism 82, the size of the frame body is adjusted along with the size of the area of the substrate 5 exposed in the vacuum chamber 1, therefore, the protection device 8 is applicable to the substrates 5 with different sizes, the position of the shielding device can be calibrated.
The embodiment also provides a vacuum sputtering method for manufacturing a coating film by using the vacuum sputtering equipment, which comprises the following specific steps:
step 1, winding a base material 5 on an unwinding roller 3 and a winding roller 4, supporting the middle position of the base material by a driving roller,
step 3, vacuumizing the vacuum chamber 1;
step 4, filling argon into the whole vacuum chamber 1, starting high voltage between the target material 2 and the substrate 5 to generate charged argon ions, impacting the target material 2 at high speed in a directional manner under the action of target negative voltage, and sputtering metal molecules to the surface of the substrate 5 through the protective device 8;
and 5: starting the balance coil to generate an additional electromagnetic field, and influencing the comprehensive direction and strength of the whole electromagnetic field formed by the main electromagnetic field and the additional electromagnetic field; uniformly sputtering a large amount of metal molecules to the surface of the substrate 5;
and 6, after the sputtering of the upper surface of the substrate 5 is finished, turning the substrate 5 by 180 degrees through a turning mechanism, dropping the substrate onto a transmission device, repeating the steps 4-5 until the front surface and the back surface of the substrate 5 are coated with films, and then rolling the substrate by a rolling rod 4.
While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as described herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. The utility model provides a vacuum sputtering equipment, includes vacuum chamber (1), evacuating device, is used for the transmission of transmission substrate (5), target (2), gas supply system and baffle mechanism, its characterized in that: the target (2) is arranged in the vacuum chamber (1), the target (2) is electrically connected with a power supply arranged outside the vacuum chamber (1), a transmission device is arranged below the target (2), the substrate (5) is wound on the transmission device, the substrate (5) is driven by the transmission device to enter the lower part of the target (2), the vacuum sputtering equipment is further provided with a protection device (8), the protection device (8) is arranged between the substrate (5) and the target (2) and is positioned above the edge of the substrate (5), the protection device (8) comprises a frame body and a telescopic mechanism (82), the frame body is composed of four frames (81) which are perpendicular to each other, one side of each frame (81) is arranged in the vacuum chamber (1) through the telescopic mechanism (82), the top of the other side of each frame is arranged on the frame (81) which is perpendicular to the frame, a chute (83) is arranged on one side of each frame (81) facing the adjacent frame, the top end of the frame (81) vertical to the frame is arranged in the sliding groove (83).
2. The vacuum sputtering apparatus according to claim 1, characterized in that: the transmission device comprises an unwinding roller (3), a winding roller and a transmission roller, wherein the unwinding roller (3) and the winding roller (4) are respectively and relatively installed on the left side wall and the right side wall of the vacuum chamber (1), the base material (5) winds to the unwinding roller (3), the winding roller (4) is connected through the base material (5), and the transmission roller is installed between the unwinding roller (3) and the winding roller (4).
3. The vacuum sputtering apparatus according to claim 2, characterized in that: the outer parts of the unwinding roller (3) and the winding roller (4) are respectively sleeved with a protective plate, an opening is formed in the protective plate, part of the base material (5) is exposed below the target material (2) through the opening, and the unwinding roller (3) is connected with the winding roller (4).
4. The vacuum sputtering apparatus according to claim 3, characterized in that: still install tilting mechanism on the vacuum sputtering equipment, all install tilting mechanism between protection plate and vacuum chamber (1) between unreeling roller (3) and wind-up roll (4).
5. The vacuum sputtering apparatus according to claim 4, characterized in that: the turnover mechanism comprises a motor, a fixing seat (6), a telescopic piece (7) and a turnover piece, wherein the motor is installed outside the vacuum chamber (1) and used for controlling the telescopic piece (7) and the turnover piece to move, the fixing seat (6) is installed on the side wall of the vacuum chamber (1), the bottom of the telescopic piece (7) is fastened through the fixing seat (6), a through hole is formed in the telescopic end of the telescopic piece (7), and the turnover piece and the telescopic piece (7) are installed through the through hole in a mutually perpendicular mode.
6. The vacuum sputtering apparatus according to claim 5, characterized in that: the turnover part adopts a rotary cylinder, and the rotary cylinder is connected with the protection plate through a rotating shaft.
7. The vacuum sputtering apparatus according to claim 1, characterized in that: and a balance coil is arranged at the central position of the target (2) and is connected with a power supply.
8. The sputtering method for manufacturing a coating film by using the vacuum sputtering device according to claim 4, comprising the following steps:
step 1, winding a base material (5) onto an unwinding roller (3) and a winding roller (4), supporting the middle position of the base material by a driving roller,
step 2, adjusting the frame body size of the protective device (8) according to the size of the substrate (5) exposed in the vacuum chamber (1), and arranging each frame (81) above the edge of the exposed substrate (5);
step 3, vacuumizing the vacuum chamber (1);
step 4, filling argon into the whole vacuum chamber (1), starting high voltage between the target material (2) and the substrate (5) to generate charged argon ions, impacting the target material (2) at high speed in a directional manner under the action of negative target voltage, and sputtering metal molecules to the surface of the substrate (5) through a protective device (8);
and 5: starting the balance coil to generate an additional electromagnetic field, and influencing the comprehensive direction and strength of the whole electromagnetic field formed by the main electromagnetic field and the additional electromagnetic field; uniformly sputtering a large amount of metal molecules to the surface of the base material (5);
and 6, after the sputtering of the upper surface of the substrate (5) is finished, turning the substrate (5) by 180 degrees through the turning mechanism, falling the substrate back onto the transmission device, repeating the steps 4-5 until the front surface and the back surface of the substrate (5) are coated with films, and then winding the substrate by the winding roller (4).
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| CN201810559716.3A CN108611612B (en) | 2018-06-02 | 2018-06-02 | Vacuum sputtering equipment and sputtering method |
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| CN201810559716.3A CN108611612B (en) | 2018-06-02 | 2018-06-02 | Vacuum sputtering equipment and sputtering method |
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| CN110184581B (en) * | 2019-06-25 | 2021-06-29 | 苏州新材料研究所有限公司 | Multidirectional film coating method |
| CN110846892A (en) * | 2019-12-05 | 2020-02-28 | 浙江工业大学 | Winding type fiber film coating device in magnetron sputtering |
| CN114134476A (en) * | 2021-12-28 | 2022-03-04 | 北京中钞钞券设计制版有限公司 | Magnetron sputtering printing plate coating equipment for bank notes |
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| CN102181841A (en) * | 2011-05-18 | 2011-09-14 | 应达利电子(深圳)有限公司 | Metal vacuum sputtering device and method |
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