CN108611612A - A kind of vacuum sputtering equipment and sputtering method - Google Patents
A kind of vacuum sputtering equipment and sputtering method Download PDFInfo
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- CN108611612A CN108611612A CN201810559716.3A CN201810559716A CN108611612A CN 108611612 A CN108611612 A CN 108611612A CN 201810559716 A CN201810559716 A CN 201810559716A CN 108611612 A CN108611612 A CN 108611612A
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- base material
- target
- vacuum
- vacuum chamber
- sputtering equipment
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Abstract
The present invention discloses a kind of vacuum sputtering equipment and sputtering methods, including vacuum chamber, vacuum extractor, transmission device for being driven base material, target, air supply system and baffle mechanism, target is installed in vacuum chamber, target and the power electric connection being arranged outside vacuum chamber, in the lower section of target, transmission device is set, base material is wound on transmission device, base material is driven to enter generated beneath by transmission device, switching mechanism is also equipped on vacuum sputtering equipment, the switching mechanism is mounted between the protective plate and vacuum chamber of both let off roll and winding rod, balance coil is arranged in the center position of target, the beneficial effects of the invention are as follows：The vacuum sputtering equipment of the present invention can realize that base material positive and negative is sputtered in same vacuum chamber, and improve the uniformity of sputtering.
Description
Technical field
The present invention relates to vacuum sputtering technique field more particularly to a kind of vacuum sputtering equipments and sputtering method.
Background technology
Currently, magnetron sputtering technology because with process simple, easy for installation, plated film film layer is fine and close, bond strength is high,
The advantages that can producing in enormous quantities for a long time and be widely used.In traditional handicraft, magnetic control sputtering device generally includes to be arranged true
The indoor substrate of cavity, target, target backboard etc..The process of magnetron sputtering plating is typically at present：Under vacuum state, in target
Apply electric field between substrate, electronics high-speed motion and touches under the action of electric field with the ar atmo for being passed through argon gas in chamber
It hitting and ionizes out a large amount of argon ion, argon ion bombards target under the action of electric field, sputters a large amount of target atom, then,
The target atom sputtered forms metallic film in substrate surface uniform deposition.In the process, magnetic control sputtering device can draw
The direction for leading argon ion bombardment target, to control locality movement of the target atom towards corresponding deposited metal film.But
The direction of motion for being the target atom sputtered is not that accurately, target atom is in addition to that can reach substrate surface deposition
It is formed except metallic film, some target atom can be splashed to except substrate, largely be splashed to be generated outside substrate
Object (such as metallic film) pollution chamber is penetrated, and inconvenience is brought to the maintenance in later stage, and from rodlike metallic target middle part
The close quartz wafer in position obtains more metallic molecules than the base material remote from position among rodlike metallic target, to increase this
The effective thickness of more metallic molecules is obtained a bit, and it is poor to allow for a large amount of sputtering electrode film consistency at the same time in this way, becomes one
A great unfavorable factor.
In the case, above-mentioned problems in the urgent need to address provide a kind of simple and practicable technology, to make simultaneously
The base material that metal electrode film is largely plated by vacuum sputtering equipment has preferable consistency.
Invention content
To overcome the safety issue of bank note transporting box coded lock existing in the prior art, the present invention provides a kind of online prisons
Control coded lock.
The present invention discloses a kind of vacuum sputtering equipments, including vacuum chamber, vacuum extractor, the biography for being driven base material
Dynamic device, target, air supply system and baffle mechanism, innovative point are：The target is installed in vacuum chamber, target with set
The power electric connection outside vacuum chamber is set, transmission device is set in the lower section of target, base material is wound on transmission device, passes through
Transmission device drives base material to enter generated beneath.
Further, the transmission device includes let off roll, wind-up roll and live-roller, and let off roll and winding rod are opposite respectively
Mounted on the left and right sides wall of vacuum chamber, base material connects winding rod, live-roller is mounted on around on let off roll by base material
Between let off roll and winding rod.
Further, it is cased with protective plate respectively outside the let off roll and winding rod, opening is offered on the protective plate,
Part thereof is exposed to generated beneath by opening, and let off roll is connected with winding rod.
Further, switching mechanism, the protection of the let off roll and both winding rods are also equipped on vacuum sputtering equipment
Switching mechanism is mounted between plate and vacuum chamber.
Further, the switching mechanism includes motor, fixed seat, extensible member and flip piece, and motor is installed on vacuum chamber
Outdoor, for controlling extensible member and flip piece action, the fixed seat is installed on vacuum chamber side wall, and extensible member bottom passes through
Fixed seat fastens, and the telescopic end of extensible member offers through-hole, and flip piece is mutually perpendicular to install with extensible member by through-hole.
Further, the flip piece uses rotary cylinder, is connected by shaft between rotary cylinder and protective plate.
Further, balance coil is arranged in the center position of the target, and balance coil is connect with power supply.
Further, the vacuum sputtering equipment is additionally provided with protective device, and the protective device is installed on base material and target
Between, and the top at material edge.
Further, the protective device includes framework and telescoping mechanism, and the framework is mutually perpendicular to by four frames
It constitutes, frame side is mounted on vacuum chamber by telescoping mechanism, is mounted on frame normal thereto at the top of the other side, frame
Sliding slot is offered on towards adjacent frame side, frame top normal thereto is installed in sliding slot.
It is specific to walk the present invention also provides a kind of vacuum sputtering methods making base material plated film of above-mentioned vacuum sputtering equipment
It is rapid as follows：
Step 1, by base material around on let off roll and wind-up roll, with live-roller supporting base material centre position,
Step 2, the size that vacuum chamber is exposed to according to base material adjusts the framework size of protective device, and each frame is arranged
Above exposed material edge；
Step 3, vacuum chamber is vacuumized；
Step 4, argon gas is full of entire operating room, starts the high voltage between target and base material, generates electrically charged argon gas
Ion, orients high-speed impact target under the action of target negative voltage, and metallic molecule is sputtered onto substrate surface by protective device；
Step 5：Start balance coil and generate additional electrical magnetic field, influences the entire electricity of main electromagnetic field and the formation of additional electrical magnetic field
The synthesis direction in magnetic field and intensity；A large amount of metallic molecule is equably splashed to positioned at base material, surface；
Step 6, after the completion of substrate upper surface sputtering, base material is overturn 180 ° by switching mechanism, base material is fallen after rise to transmission
On device, and step 4-5 is repeated, until base material tow sides are wound after completing plated film by winding rod.
Compared with prior art, the beneficial effects of the invention are as follows：
(1) vacuum sputtering equipment of the present invention can realize that base material positive and negative is sputtered in same vacuum chamber, and improve and splash
The uniformity penetrated；
(2) balance coil is arranged in the center position of the target, and balance coil connect with power supply, in energization,
Balance coil generates additional electrical magnetic field, influences total electromagnetic field in sputtering process by additional electrical magnetic field, is reached to reduce
The metallic molecule amount of substrate surface near balance coil enables the sputtering of metallic molecule equilibrium caused by rodlike metallic target
Onto base material, the molecular weight uniform degree of substrate surface is improved.
(3) ensured in sputtering process by protective device, metallic atom is all splashed to substrate surface, does not pollute chamber
Room, the size that the size of framework follows base material to be exposed at vacuum chamber is adjusted, therefore the protective device is applicable to not
With the base material of size, it can realize and the position of radical occlusion device is calibrated, and operate letter without beginning to speak
It is single.
Description of the drawings
Fig. 1 is vacuum sputtering equipment front view；
Fig. 2 is vacuum sputtering equipment vertical view.
It is marked on it in conjunction with attached drawing：
1- vacuum chambers, 2- targets, 3- let off roll, 4- wind rod, 5- base materials, 6- fixed seats, 7- extensible members, 8- protection dresses
It sets, 81- frames, 82- telescoping mechanisms, 83- sliding slots.
Specific implementation mode
Below in conjunction with drawings and examples, the present invention will be described in further detail.It should be appreciated that described herein
Specific examples are only used to explain the present invention, is not intended to limit the present invention.
Present embodiment discloses a kind of vacuum sputtering equipment, including vacuum chamber 1, vacuum extractor, for being driven base
Transmission device, target 2, air supply system and the baffle mechanism of material 5, the target 2 are installed in vacuum chamber 1, target 2 and setting
Transmission device is arranged in the lower section of target 2 in power electric connection outside vacuum chamber 1, and base material 5 is wound on transmission device, is led to
Crossing transmission device drives base material 5 to enter 2 lower section of target.
The transmission device includes let off roll 3, wind-up roll and live-roller, and let off roll 3 is mounted on relatively respectively with winding rod 4
The left and right sides wall of vacuum chamber 1, base material 5 connect winding rod 4, live-roller is mounted on around on let off roll 3 by base material 5
Between let off roll 3 and winding rod 4, it is driven in 2 lower horizontal of target with then base material 5, base material 5 is sputtered in convenient for metal ion
On；It is cased with protective plate respectively outside the let off roll 3 and winding rod 4, opening is offered on the protective plate, part thereof 5 is logical
It crosses opening and is exposed to 2 lower section of target, and let off roll 3 is connected with winding rod 4.
Target 2 is normally only set just now on base material 5 on easy vacuum sputtering equipment, if desired in the positive and negative of target 2
Two sides is sputtered, then is needed using having the vacuum sputtering equipment that about 5 base material is equipped with target 2, but such vacuum
When sputtering equipment prepares the base material 5 for only needing single side to sputter, only one target 2 works, and another target 2 is vacant, due to sputtering process
Middle atom can be deposited on cavity bottom, therefore it is unsatisfactory in 5 positive and negative of base material to install target 2 simultaneously, to realize that base material 5 is positive and negative
Face can realize sputtering in same vacuum chamber 1, and switching mechanism is also equipped on the vacuum sputtering equipment of present embodiment, described
Switching mechanism is installed between the protective plate and vacuum chamber 1 of let off roll 3, similarly, winds the protective plate and vacuum chamber of rod 4
Switching mechanism is installed between 1.The switching mechanism includes motor, fixed seat 6, extensible member 7 and flip piece, and motor is installed on very
Outside plenum chamber 1, for controlling extensible member 7 and flip piece action, the fixed seat 6 is installed on 1 side wall of vacuum chamber, extensible member
7 bottoms are fastened by fixed seat 6, prevent extensible member 7 from deviating, and the telescopic end of extensible member 7 offers through-hole, flip piece with stretch
Contracting part 7 is mutually perpendicular to install by through-hole, and cylinder or hydraulic cylinder can be used in extensible member 7 in present embodiment.The flip piece is adopted
With rotary cylinder, it is connected by shaft between rotary cylinder and protective plate, rotary cylinder is driven by shaft inside protective plate
Let off roll 3 or winding rod 4 are overturn together, and both let off roll 3 and winding rod 4 are in rotary movement, it is ensured that base material 5 is not in
Let off roll 3 and winding rod 4 are first lifted certain height by offset and curling when base material 5 needs overturning by motor control extensible member 7
Degree, the height of lifting should be more than the half of 5 width of base material, avoid touching live-roller in switching process base material 5, destroy base material
5 surfaces；Motor control flip piece base material 5 after lifting, the angle of overturning can be adjusted according to actual conditions, present embodiment
In, 180 ° of overturning needed for base material 5, after overturning, motor controls extensible member 7 and falls after rise, until 5 lower surface Contact Transmission roller of base material is
It can.
In embodiments, base material 5 is sputtered by target 2, since the position of target 2 is fixed, in sputtering process
In, the metallic molecule amount received close to the base material 5 of target 2 is apparently higher than the base material 5 far from target 2, can cause same in this way
The base material 5 sputtered in vacuum chamber 1, the molecular weight for sputtering acquisition are gradually decreased from central area to neighboring area, cause to differ
Cause property.To ensure the molecular weight in each region on base material 5 there are consistency, in present embodiment, the center position of the target 2
Balance coil is set, and balance coil is connect with power supply, and in energization, balance coil generates additional electrical magnetic field, by additional
Total electromagnetic field in electromagnetic field effects sputtering process, to reduce the metal point for reaching 5 surface of base material near balance coil
Son amount enables metallic molecule caused by rodlike metallic target is balanced to be splashed on base material 5, improves the molecule on 5 surface of base material
Measure uniformity coefficient.
In sputtering process, and not all metallic atom can be splashed to 5 surface of base material, and there are part metals atom sputterings
To outside base material 5, chamber is polluted to generate a large amount of sputtering object (such as metallic film) outside substrate, and to the maintenance band in later stage
Carry out inconvenience.In present embodiment, which is additionally provided with protective device 8, and the protective device 8 is installed on base material
Between 5 and target 2, protective device 8 is set to the top of 5 edge of base material.The protective device 8 includes framework and telescopic machine
Structure 82, the framework are mutually perpendicular to constitute by four frames 81, and 81 side of frame is mounted on vacuum chamber by telescoping mechanism 82
1, be mounted on frame 81 normal thereto at the top of the other side, frame 81 towards offering sliding slot 83 on 81 side of adjacent frame,
81 top of frame normal thereto is installed in sliding slot 83, frame 81 by telescoping mechanism 82 change framework size, framework it is big
The small size for following base material 5 to be exposed at vacuum chamber 1 is adjusted, thus the protective device 8 be applicable to it is various sizes of
Base material 5 can be realized and calibrated to the position of radical occlusion device, and is easy to operate without beginning to speak.
Present embodiment additionally provides a kind of vacuum sputtering methods making plated film of above-mentioned vacuum sputtering equipment, specific to walk
It is rapid as follows：
Step 1, by base material 5 around on let off roll 3 and wind-up roll 4, with live-roller supporting base material centre position,
Step 2, the size that vacuum chamber 1 is exposed to according to base material 5 adjusts the framework size of protective device 8, by each frame
81 are arranged above exposed 5 edge of base material；
Step 3, vacuum chamber 1 is vacuumized；
Step 4, argon gas is full of entire vacuum chamber 1, starts the high voltage between target 2 and base material 5, generated electrically charged
Argon gas ion orients high-speed impact target 2 under the action of target negative voltage, and metallic molecule is sputtered onto base material 5 by protective device 8
Surface；
Step 5：Start balance coil and generate additional electrical magnetic field, influences the entire electricity of main electromagnetic field and the formation of additional electrical magnetic field
The synthesis direction in magnetic field and intensity；A large amount of metallic molecule is equably splashed to positioned at 5 surface of base material；
Step 6, after the completion of the sputtering of 5 upper surface of base material, base material 5 is overturn 180 ° by switching mechanism, base material is fallen after rise to biography
On dynamic device, and step 4-5 is repeated, until 5 tow sides of base material are wound after completing plated film by winding rod 4.
The preferred embodiment of the present invention has shown and described in above description, as previously described, it should be understood that the present invention is not office
Be limited to form disclosed herein, be not to be taken as excluding other embodiments, and can be used for various other combinations, modification and
Environment, and can be changed by the above teachings or related fields of technology or knowledge in the scope of the invention is set forth herein
It is dynamic.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be appended by the present invention
In scope of the claims.
Claims (10)
1. a kind of vacuum sputtering equipment, including vacuum chamber (1), vacuum extractor, the transmission device for being driven base material (5),
Target (2), air supply system and baffle mechanism, it is characterised in that：The target (2) is installed in vacuum chamber (1), target (2)
Transmission device is arranged in the lower section of target (2) in power electric connection with setting in vacuum chamber (1) outside, and base material (5) is wound in biography
On dynamic device, base material (5) is driven to enter below target (2) by transmission device.
2. vacuum sputtering equipment according to claim 1, it is characterised in that：The transmission device includes let off roll (3), receives
Winding up roller and live-roller, let off roll (3) is with winding rod (4) respectively with respect to the left and right sides wall mounted on vacuum chamber (1), base material
(5) around on let off roll (3), winding rod (4) is connected by base material (5), live-roller is mounted on let off roll (3) and winding rod
(4) between.
3. vacuum sputtering equipment according to claim 2, it is characterised in that：The let off roll (3) and winding rod (4) are external
It is cased with protective plate respectively, opening is offered on the protective plate, part thereof (5) is exposed to by opening below target (2), and
Let off roll (3) is connected with winding rod (4).
4. vacuum sputtering equipment according to claim 3, it is characterised in that：Tipper is also equipped on vacuum sputtering equipment
It is mounted on switching mechanism between the protective plate and vacuum chamber (1) of both structure, the let off roll (3) and winding rod (4).
5. vacuum sputtering equipment according to claim 4, it is characterised in that：The switching mechanism includes motor, fixed seat
(6), extensible member (7) and flip piece, motor are installed on vacuum chamber (1) outside, dynamic for controlling extensible member (7) and flip piece
Make, the fixed seat (6) is installed on vacuum chamber (1) side wall, and extensible member (7) bottom is fastened by fixed seat (6), extensible member
(7) telescopic end offers through-hole, and flip piece is mutually perpendicular to install with extensible member (7) by through-hole.
6. vacuum sputtering equipment according to claim 5, it is characterised in that：The flip piece uses rotary cylinder, rotation
It is connected by shaft between cylinder and protective plate.
7. vacuum sputtering equipment according to claim 1, it is characterised in that：The center position of the target (2) is arranged
Balance coil, balance coil are connect with power supply.
8. vacuum sputtering equipment according to claim 1, it is characterised in that：The vacuum sputtering equipment is additionally provided with protection dress
It sets (8), the protective device (8) is installed between base material (5) and target (2), and the top in base material (5) edge.
9. vacuum sputtering equipment according to claim 8, it is characterised in that：The protective device (8) include framework and
Telescoping mechanism (82), the framework are mutually perpendicular to constitute by four frames (81), and frame (81) side passes through telescoping mechanism (82)
It mounted on vacuum chamber (1), is mounted on frame (81) normal thereto at the top of the other side, frame (81) is towards adjacent frame
(81) sliding slot (83) is offered on side, frame normal thereto (81) top is installed in sliding slot (83).
10. a kind of sputtering method making plated film of above-mentioned vacuum sputtering equipment, is as follows：
Step 1, by base material (5) around on let off roll (3) and wind-up roll (4), with live-roller supporting base material centre position,
Step 2, the framework size of the size adjustment protective device (8) of vacuum chamber (1), Jiang Gebian are exposed to according to base material (5)
Frame (81) is arranged above exposed base material (5) edge；
Step 3, vacuum chamber (1) is vacuumized；
Step 4, argon gas is full of entire vacuum chamber (1), starts the high voltage between target (2) and base material (5), generate electrification
Lotus argon gas ion, orients high-speed impact target (2) under the action of target negative voltage, and metallic molecule is sputtered by protective device (8)
To base material (5) surface；
Step 5：Start balance coil and generate additional electrical magnetic field, influences the entire electromagnetic field of main electromagnetic field and the formation of additional electrical magnetic field
Synthesis direction and intensity；A large amount of metallic molecule is equably splashed to positioned at base material (5) surface；
Step 6, after the completion of the sputtering of base material (5) upper surface, base material (5) is overturn 180 ° by switching mechanism, base material is fallen after rise to biography
On dynamic device, and step 4-5 is repeated, until base material (5) tow sides are wound after completing plated film by winding rod (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810559716.3A CN108611612B (en) | 2018-06-02 | 2018-06-02 | Vacuum sputtering equipment and sputtering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810559716.3A CN108611612B (en) | 2018-06-02 | 2018-06-02 | Vacuum sputtering equipment and sputtering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108611612A true CN108611612A (en) | 2018-10-02 |
| CN108611612B CN108611612B (en) | 2020-08-28 |
Family
ID=63664509
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810559716.3A Expired - Fee Related CN108611612B (en) | 2018-06-02 | 2018-06-02 | Vacuum sputtering equipment and sputtering method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108611612B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110184581A (en) * | 2019-06-25 | 2019-08-30 | 苏州新材料研究所有限公司 | A kind of method of multi-faceted plated film |
| CN110846892A (en) * | 2019-12-05 | 2020-02-28 | 浙江工业大学 | Winding type fiber film coating device in magnetron sputtering |
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| CN110184581A (en) * | 2019-06-25 | 2019-08-30 | 苏州新材料研究所有限公司 | A kind of method of multi-faceted plated film |
| CN110184581B (en) * | 2019-06-25 | 2021-06-29 | 苏州新材料研究所有限公司 | Multidirectional film coating method |
| CN110846892A (en) * | 2019-12-05 | 2020-02-28 | 浙江工业大学 | Winding type fiber film coating device in magnetron sputtering |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108611612B (en) | 2020-08-28 |
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