CN110408904A - A kind of spattering filming device - Google Patents
A kind of spattering filming device Download PDFInfo
- Publication number
- CN110408904A CN110408904A CN201910858667.8A CN201910858667A CN110408904A CN 110408904 A CN110408904 A CN 110408904A CN 201910858667 A CN201910858667 A CN 201910858667A CN 110408904 A CN110408904 A CN 110408904A
- Authority
- CN
- China
- Prior art keywords
- rotation
- turntable
- substrate tray
- vacuum
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 31
- 230000005540 biological transmission Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 230000008021 deposition Effects 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 45
- 238000004544 sputter deposition Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 7
- 238000000151 deposition Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000011553 magnetic fluid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 210000000170 cell membrane Anatomy 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to technical field of film preparation, more particularly to a kind of spattering filming device, it is characterized by: the revolution motor that the vacuum film formation outdoor is arranged in one in the substrate tray revolution turntable is drivingly connected and rotates under its driving, the rotation vacuum motor that the vacuum film formation chamber interior is arranged in one in the substrate tray rotation turntable is mutually drivingly connected, the rotation vacuum motor is connected by the conducting slip ring that the vacuum film formation outdoor is arranged in one in vacuum iontophoresis electrode, the substrate tray rotation turntable rotates under the driving of the rotation vacuum motor.The invention has the advantages that realizing the adjustment of substrate tray public affairs rotation revolving speed ratio, it is remarkably improved substrate deposition difference Coating Materials film thickness uniformity, can meet the film of high-precision low defect prepares needs；The dust generated using its frictional vibration when driving gear set is reduced, and then reduces the generation of substrate film defect.
Description
Technical field
The present invention relates to technical field of film preparation more particularly to a kind of spattering filming devices.
Background technique
Optical thin film typically refers to one or more layers deielectric-coating being coated on optical element (substrate) or metal film or is situated between
The mixed membranous layer of plasma membrane and metal film composition.Optical thin film can play the reflection for decreasing or increasing light, beam splitting, color separation, optical filtering, partially
The effects of vibration.
There are two ways to optical thin film is often used is prepared, one is sputtering methods, and one is evaporations.In sputtering method, lead to
It is often using ion bombardment target material surface, the atom of target is shelled out and is deposited on substrate surface film forming.In evaporation,
Usually make substrate surface deposit optical film in the way of electron beam or thermal evaporation.
Conventional film formation device improves the uniform of substrate surface deposition film by substrate tray (workpiece plate) public Self-rotation structure
Property.The public rotation revolving speed ratio of the uniformity and precision and substrate tray (workpiece plate) of substrate surface deposition film, substrate tray
Public rotation revolving speed is closely bound up.And public rotation revolving speed ratio phase not to the utmost needed for different Coating Materials acquisition high uniformity films
Together.So conventional public affairs rotation film formation device, which passes through additional mask structure being, corrects film thickness, realize that substrate obtains different Coating Materials
High uniformity (high-precision) film.
In addition, public rotation film formation device common at present is to realize substrate tray (workpiece plate) using inlet side gear drive
Public rotation.But, the transmission ratio that gear-driven public Self-rotation structure is usually fixed, cannot achieve and freely adjust substrate tray
(workpiece plate) public affairs rotation rotating ratio.And substrate tray (workpiece plate) high speed rotation, inlet side gear drive are also easy to produce dust, thus
The appearance for influencing film product, is not able to satisfy high-quality plated film demand.
Summary of the invention
The purpose of the present invention is providing a kind of spattering filming device according to above-mentioned the deficiencies in the prior art, by mutually only
Two sets of vertical drive systems respectively drive the independent rotation of substrate tray revolution turntable and substrate tray rotation turntable, realize it is public from
The accurate adjustment of speed ratio of walking around example, and then control base board deposits different Coating Materials film thickness uniformities；And vacuum is reduced as far as possible
The use of side gear transmission, reduces the open defect of film product.
The object of the invention realization is completed by following technical scheme:
A kind of spattering filming device, including setting are walked around certainly in the indoor substrate tray revolution turntable of vacuum film formation, substrate tray
Platform, wherein substrate tray revolution turntable can revolve in the vacuum film formation room, the substrate tray rotation turntable and institute
It states substrate tray revolution turntable to be connected and can the rotation in the vacuum film formation room, it is characterised in that: the substrate tray public affairs
The revolution motor that the vacuum film formation outdoor is arranged in one in platform of walking around is drivingly connected and rotates under its driving, the substrate
The rotation vacuum motor that the vacuum film formation chamber interior is arranged in one in pallet rotation turntable is mutually drivingly connected, the rotation vacuum
Motor is connected by the conducting slip ring that the vacuum film formation outdoor is arranged in one in vacuum iontophoresis electrode, the substrate tray
Rotation turntable rotates under the driving of the rotation vacuum motor.
Several sub- turntables of setting, the sub- turntable are connected separately with non-contact magnetically below the substrate tray rotation turntable
Power is driven component, several described sub- turntables can be driven component by the respective non-contact magnetic force respectively and realize in the base
Multistage rotation under the driving of sheet tray rotation turntable.
The substrate that the substrate tray rotation turntable is carried is in horizontal positioned or vertical placement.
The revolution motor connects the substrate tray revolution turntable by transmission mechanism.
The invention has the advantages that realizing the adjustment of substrate tray public affairs rotation revolving speed ratio, it is remarkably improved substrate deposition not
With Coating Materials film thickness uniformity, can meet the film of high-precision low defect prepares needs；When reducing using driving gear set
The dust that its frictional vibration generates, and then reduce the generation of substrate film defect.
Detailed description of the invention
Fig. 1 is the first structural schematic diagram of the invention；
Fig. 2 is second of structural schematic diagram of the invention；
Fig. 3 is the third structural schematic diagram of the invention.
Specific embodiment
Feature of present invention and other correlated characteristics are described in further detail by embodiment below in conjunction with attached drawing, so as to
In the understanding of technical staff of the same trade:
As shown in Figure 1-3, marking 1-14 to respectively indicate in figure are as follows: revolve turntable 2, substrate tray for vacuum film formation room 1, substrate tray
Rotation turntable 3, substrate 4, sputtering unit 5, reaction member 6, revolution motor 7, conducting slip ring 8, vacuum iontophoresis electrode 9, magnetic fluid
10, non-contact magnetic force is driven component 11, sub- turntable 12, rotation vacuum motor 13, drive mechanism 14.
Embodiment one: sputtering method usually prepares optical thin film using metal mode sputtering, and preparation method is when substrate support
When disk (workpiece plate) rotation is to sputtering unit, substrate deposition target material film, when substrate tray is rotated to reaction member, base
The target material film of plate surface deposition reacts to form optical thin film.As shown in Figure 1, the spattering filming device master in the present embodiment
Body is vacuum film formation room 1, internal to be used as film formation space, includes that substrate tray revolution turntable 2 and substrate tray are walked around certainly
Platform 3, wherein substrate tray revolution turntable 2 can revolve in vacuum film formation room 1, and substrate tray rotation turntable 3 is connected to substrate support
Disk revolve turntable 2 lower section and its can the rotation in vacuum film formation room 1.The lower section of substrate tray rotation turntable 3 is mounted with respectively
Horizontal positioned substrate 4.Sputtering unit 5 and reaction member 6 are additionally provided in the lower section of substrate tray rotation turntable 3；Substrate 4 with
Substrate tray revolution turntable 2 revolution and the rotation of substrate tray rotation turntable 3 moved in vacuum film formation room 1, and pass through
Sputtering unit 5 and reaction member 6 are crossed, to realize the film forming on 4 surface of substrate.
As shown in Figure 1, the spattering filming device in the present embodiment can realize freely adjusting for public rotation revolving speed ratio, thus
Improve the uniformity that substrate 4 deposits different Coating Materials film thickness.
Specifically, the center of turntable 2 is provided with shaft as shown in Figure 1, substrate tray revolves, the shaft and setting
Revolution motor 7 in the outside of vacuum film formation room 1 is connected, by revolution motor 7 be operated alone and the transmission of shaft, substrate
Pallet revolution turntable 2 can revolve in the inside of vacuum film formation room 1.In the shaft injection position periphery at 1 top of vacuum film formation room
It is provided with magnetic fluid 10, the magnetic fluid 10 is for protecting shaft.
It is also provided with shaft in the center of substrate tray rotation turntable 3, which is connected with rotation vacuum motor 13
It connects, which is arranged in the inside of vacuum film formation room 1, i.e. inlet side.Rotation vacuum motor 13 is led by vacuum
Enter electrode 9 to be connected with conducting slip ring 8, conducting slip ring 8 is arranged in the outside of vacuum film formation room 1, i.e. atmospheric side；Conducting slip ring 8
As the power part of rotation vacuum motor 13, drive the work of rotation vacuum motor 13 to which substrate be operated alone by shaft
Inside rotation of the pallet rotation turntable 3 in vacuum film formation room 1.
As above as it can be seen that substrate tray revolution turntable 2 is operated alone by revolution motor 7, substrate tray rotation turntable 3 is by rotation
Vacuum motor 13 and conducting slip ring 8 are operated alone, and make the public affairs of substrate tray revolution turntable 2 and substrate tray rotation turntable 3 certainly
Speed ratio of walking around example can freely adjust and the high speed rotation of public rotation, and then control base board deposits different Coating Materials uniform film thickness
Property.
Embodiment two: as shown in Fig. 2, the present embodiment compared to embodiment one the difference is that: substrate tray from
The walk around lower section of platform 3 is additionally provided with multistage sub- turntable structure, and the sub- turntable structure of the multistage includes multiple sub- turntables 12, sub- turntable 12
Quantity can select according to the actual situation, but general sub- turntable 12 is using the shaft of substrate tray rotation turntable 3 as symmetrical centre
It is arranged symmetrically, to guarantee film thickness uniformity.Sub- turntable 12 is connected with non-contact magnetic force transmission component 11, non-contact magnetic force transmission
Component 11 can be adapted with the shaft of substrate tray rotation turntable 3, and its role is to by the shaft of substrate tray rotation turntable 3
Rotation be transferred on sub- turntable 12 so that each independent sub- turntable 3 can be independent in the lower section of substrate tray rotation turntable 3
Rotation.For embodiment one, film-forming accuracy more can be improved.
Embodiment three: as shown in figure 3, the present embodiment compared to embodiment one the difference is that: substrate tray from
The substrate 4 that the lower section loading of platform 3 of walking around is arranged vertically, and be then disposed in vacuum film formation room 1 and be adapted with the position of substrate 4
Sputtering unit 5 and reaction member 6.In conjunction with the embodiments one, different loading patterns may be selected according to different substrate sizes, it is full
The film forming of sufficient different substrate needs.
At the same time, the present embodiment compared to embodiment one another difference is that: revolution motor 7 pass through driver
Its power is transferred to the shaft of substrate tray revolution turntable 2 by structure 14, in order to which the later period repairs maintenance to revolution motor 7.
Above-described embodiment is in the specific implementation: conducting slip ring 8 can be made of rotation electrode, brush.
Although above embodiments are elaborated referring to conception and embodiment of the attached drawing to the object of the invention, this
Field those of ordinary skill will recognize, still can be right in the case where no disengaging claim limits the precondition of range
The present invention makes various modifications and variations therefore will not repeat them here.
Claims (4)
1. a kind of spattering filming device, including setting is in vacuum film formation indoor substrate tray revolution turntable, substrate tray rotation
Turntable, wherein the substrate tray revolution turntable can revolve in the vacuum film formation room, the substrate tray rotation turntable with
Substrate tray revolution turntable is connected and can the rotation in the vacuum film formation room, it is characterised in that: the substrate tray
The revolution motor that the vacuum film formation outdoor is arranged in one in revolution turntable is drivingly connected and rotates under its driving, the base
The rotation vacuum motor that the vacuum film formation chamber interior is arranged in one in sheet tray rotation turntable is mutually drivingly connected, and the rotation is true
Empty motor is connected by the conducting slip ring that the vacuum film formation outdoor is arranged in one in vacuum iontophoresis electrode, the substrate support
Disk rotation turntable rotates under the driving of the rotation vacuum motor.
2. a kind of spattering filming device according to claim 1, it is characterised in that: below the substrate tray rotation turntable
Several sub- turntables are set, and the sub- turntable is connected separately with non-contact magnetic force transmission component, several described sub- turntables can divide
Component is not driven by the respective non-contact magnetic force and realizes the multistage rotation under substrate tray rotation turntable driving.
3. a kind of spattering filming device according to claim 1, it is characterised in that: the substrate tray rotation turntable is held
The substrate of load is in horizontal positioned or vertical placement.
4. a kind of spattering filming device according to claim 1, it is characterised in that: the revolution motor passes through transmission mechanism
Connect the substrate tray revolution turntable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910858667.8A CN110408904A (en) | 2019-09-11 | 2019-09-11 | A kind of spattering filming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910858667.8A CN110408904A (en) | 2019-09-11 | 2019-09-11 | A kind of spattering filming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110408904A true CN110408904A (en) | 2019-11-05 |
Family
ID=68370497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910858667.8A Pending CN110408904A (en) | 2019-09-11 | 2019-09-11 | A kind of spattering filming device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110408904A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110819959A (en) * | 2019-12-02 | 2020-02-21 | 深圳市晶相技术有限公司 | Physical vapor deposition equipment |
| CN112981356A (en) * | 2021-03-16 | 2021-06-18 | 光驰科技(上海)有限公司 | Coating equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05314540A (en) * | 1992-05-08 | 1993-11-26 | Kuraray Co Ltd | Sputtering device |
| JP2002097570A (en) * | 2000-07-17 | 2002-04-02 | Murata Mfg Co Ltd | Film forming apparatus |
| CN1641068A (en) * | 2004-01-14 | 2005-07-20 | 电子科技大学 | Method for determining optimum rotation rate for multi-station-type coating apparatus |
| CN2859087Y (en) * | 2005-06-13 | 2007-01-17 | 北京东方新材科技有限公司 | Gearing device used in vacuum coating field |
| JP2011026652A (en) * | 2009-07-23 | 2011-02-10 | Canon Inc | Apparatus for forming film on both surfaces |
| CN105603377A (en) * | 2016-02-23 | 2016-05-25 | 东莞市汇成真空科技有限公司 | Vacuum plating workpiece rotating stand motion mechanism allowing speed to be adjusted independently during revolution and autorotation |
| CN206502858U (en) * | 2017-01-23 | 2017-09-19 | 福建省诺希科技园发展有限公司 | A kind of circular flat target magnetic control sputtering substrate motion device |
| CN210420144U (en) * | 2019-09-11 | 2020-04-28 | 光驰科技(上海)有限公司 | Sputtering film forming device |
| CN112251730A (en) * | 2020-12-04 | 2021-01-22 | 光驰科技(上海)有限公司 | Non-contact revolution and rotation rotating frame system for vacuum coating |
-
2019
- 2019-09-11 CN CN201910858667.8A patent/CN110408904A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05314540A (en) * | 1992-05-08 | 1993-11-26 | Kuraray Co Ltd | Sputtering device |
| JP2002097570A (en) * | 2000-07-17 | 2002-04-02 | Murata Mfg Co Ltd | Film forming apparatus |
| CN1641068A (en) * | 2004-01-14 | 2005-07-20 | 电子科技大学 | Method for determining optimum rotation rate for multi-station-type coating apparatus |
| CN2859087Y (en) * | 2005-06-13 | 2007-01-17 | 北京东方新材科技有限公司 | Gearing device used in vacuum coating field |
| JP2011026652A (en) * | 2009-07-23 | 2011-02-10 | Canon Inc | Apparatus for forming film on both surfaces |
| CN105603377A (en) * | 2016-02-23 | 2016-05-25 | 东莞市汇成真空科技有限公司 | Vacuum plating workpiece rotating stand motion mechanism allowing speed to be adjusted independently during revolution and autorotation |
| CN206502858U (en) * | 2017-01-23 | 2017-09-19 | 福建省诺希科技园发展有限公司 | A kind of circular flat target magnetic control sputtering substrate motion device |
| CN210420144U (en) * | 2019-09-11 | 2020-04-28 | 光驰科技(上海)有限公司 | Sputtering film forming device |
| CN112251730A (en) * | 2020-12-04 | 2021-01-22 | 光驰科技(上海)有限公司 | Non-contact revolution and rotation rotating frame system for vacuum coating |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110819959A (en) * | 2019-12-02 | 2020-02-21 | 深圳市晶相技术有限公司 | Physical vapor deposition equipment |
| CN112981356A (en) * | 2021-03-16 | 2021-06-18 | 光驰科技(上海)有限公司 | Coating equipment |
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