CN112981356A - Coating equipment - Google Patents
Coating equipment Download PDFInfo
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- CN112981356A CN112981356A CN202110282427.5A CN202110282427A CN112981356A CN 112981356 A CN112981356 A CN 112981356A CN 202110282427 A CN202110282427 A CN 202110282427A CN 112981356 A CN112981356 A CN 112981356A
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- film forming
- forming chamber
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- crystal
- door
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- 239000011248 coating agent Substances 0.000 title claims description 19
- 238000000576 coating method Methods 0.000 title claims description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 239000013078 crystal Substances 0.000 claims abstract description 54
- 230000008020 evaporation Effects 0.000 claims abstract description 22
- 238000001704 evaporation Methods 0.000 claims abstract description 22
- 238000012544 monitoring process Methods 0.000 claims abstract description 11
- 238000012806 monitoring device Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 238000003032 molecular docking Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 7
- 239000000463 material Substances 0.000 abstract description 20
- 239000007888 film coating Substances 0.000 abstract description 4
- 238000009501 film coating Methods 0.000 abstract description 4
- 238000009776 industrial production Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 74
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 206010047571 Visual impairment Diseases 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- SJLISRWUWZVXNZ-UHFFFAOYSA-L diiodoytterbium Chemical compound I[Yb]I SJLISRWUWZVXNZ-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0694—Halides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a film coating device, which comprises a film forming chamber, wherein a substrate frame and a substrate disc are arranged in the film forming chamber, the substrate disc is used for carrying a product to be film-formed, the substrate frame is used for hanging and installing the substrate disc, the substrate frame is connected with a revolution rotating mechanism, the substrate disc is connected with a rotation rotating mechanism, and the revolution rotating mechanism and the rotation rotating mechanism are independent; an evaporation source is arranged in the film forming chamber and is positioned below the substrate disc; a crystal monitoring device is arranged in the film forming chamber and used for monitoring the thickness of a film to be formed on a product to be formed; a film forming chamber door is arranged on one side of the film forming chamber, and a door opening and closing mechanism and a locking mechanism are arranged between the film forming chamber and the film forming chamber door. The invention has the advantages that: the occupied space is small, the substrate loading capacity is large, and the productivity is effectively improved; the revolution and rotation speed is adjustable, the position and the angle of the substrate are adjustable, the position angle of the evaporation source is adjustable, and the material utilization rate and the film thickness uniformity can be obviously improved; high automation degree, suitability for industrial production and popularization.
Description
Technical Field
The invention relates to the technical field of optical film forming, in particular to a film coating device.
Background
In the field of optical film formation technology, in order to improve the uniformity of film formation, a product to be formed is often mounted on a substrate holder, and the substrate holder is rotated during the film formation process, so that a film material is uniformly coated on the surface of the product, and the purpose of improving the uniformity of film formation is achieved. At present, because the materials of the scintillator coating materials are special, the number of suitable coating devices is small, and the materials of the scintillator coating materials have certain harm to human bodies, so the use safety of the scintillator coating materials needs to be considered. Meanwhile, with the increasing market demand, the improvement of the productivity and the film forming quality becomes an urgent problem while ensuring the film forming quality.
Disclosure of Invention
The invention aims to provide a coating device according to the defects of the prior art, and the coating device is provided with a corresponding functional structure, so that the use safety of scintillator coating materials is ensured, the productivity is effectively improved, and the film forming quality is improved.
The purpose of the invention is realized by the following technical scheme:
a coating equipment is characterized in that: the film forming device comprises a film forming chamber, wherein a substrate frame and a substrate disc are arranged in the film forming chamber, the substrate disc is used for carrying a product to be formed into a film, the substrate frame is used for mounting the substrate disc in a hanging manner, the substrate frame is connected with a revolution rotating mechanism, the substrate disc is connected with a rotation rotating mechanism, and the revolution rotating mechanism and the rotation rotating mechanism are independent; an evaporation source is arranged in the film forming chamber and is positioned below the substrate disc; a crystal monitoring device is arranged in the film forming chamber and used for monitoring the thickness of a film to be formed on the product to be formed; a film forming chamber door is arranged on one side of the film forming chamber, and a door opening and closing mechanism and a locking mechanism are arranged between the film forming chamber and the film forming chamber door; and a pneumatic control device is arranged on one side of the film forming chamber and is connected with and controls the door opening and closing mechanism and the locking mechanism.
The revolution rotating mechanism and the rotation rotating mechanism can realize the joint work or the independent work.
Revolution rotary mechanism includes revolution motor, belt pulley mechanism, constitutes by the drive gear group and the axis of rotation that a plurality of gears mesh mutually, wherein revolution motor passes through belt pulley mechanism with the transmission initial point of drive gear group is connected, the drive terminal of drive gear group connects the axis of rotation, the axis of rotation with base plate frame fixed connection, revolution motor can drive base plate frame revolution.
The autorotation mechanism comprises an autorotation motor, a belt pulley mechanism, a transmission gear set and a connecting rod, wherein the transmission gear set is formed by meshing a plurality of gears, the autorotation motor is connected with the transmission starting end of the transmission gear set through the belt pulley mechanism, the transmission terminal of the transmission gear set is connected with the connecting rod, the connecting rod is fixedly connected with the substrate disc, and the autorotation motor can drive the substrate disc to autorotate.
One side of filming room door with it is articulated between the filming room main part with be provided with the switch door mechanism between the filming room door, the switch door mechanism is used for connection control opening and close of filming room door makes the rotatable opening or the rotatory closure of filming room door the side of filming room main part is provided with locking mechanism, locking mechanism is used for right behind the closure of filming room door the filming room door with docking position between the filming room main part locks.
The crystal monitoring device comprises a crystal body, a crystal protective cover is arranged on the periphery of the crystal body, an opening for monitoring the crystal body is formed in the crystal protective cover, a controllable crystal baffle which can be opened and closed is arranged between the crystal body and the crystal protective cover, and the opening and closing of the crystal baffle can switch the communication state between the crystal body and the opening in the crystal protective cover.
And a heating mechanism is arranged in the film forming chamber and used for heating the substrate, and the heating mechanism is a halogen lamp.
The film forming chamber is connected with a mechanical pump and a high vacuum pump.
The invention has the advantages that: the occupied space is small, the substrate loading capacity is large, and the productivity is effectively improved; the revolution and rotation speed is adjustable, the position and the angle of the substrate are adjustable, the position angle of the evaporation source is adjustable, and the material utilization rate and the film thickness uniformity can be obviously improved; high automation degree, suitability for industrial production and popularization.
Drawings
FIG. 1 is a top view of the structure of the present invention;
FIG. 2 is a structural elevation view of the present invention;
FIG. 3 is a schematic view of the inside of a film forming chamber according to the present invention;
FIG. 4 is a schematic view of the position of a substrate tray according to the present invention;
FIG. 5 is a schematic diagram of an arrangement of evaporation sources according to the present invention;
FIG. 6 is a schematic view of a crystal monitor according to the present invention.
Detailed Description
The features of the present invention and other related features are described in further detail below by way of example in conjunction with the following drawings to facilitate understanding by those skilled in the art:
as shown in fig. 1-6, the labels 1-35 are respectively shown as: the device comprises a mechanical pump 1, a high vacuum pump 2, a rotation motor 3, a revolution motor 4, a locking mechanism 5, a door opening and closing mechanism 6, a film forming chamber door 7, a film forming chamber 8, a crystal monitoring device 9, a pneumatic control device 10, a belt pulley assembly 11, a belt pulley assembly 12, a connecting rod 13, a pinion 14, an intermediate gear 15, a connecting flange 16, a central gear 17, an idler gear 18, a gear 19, a connecting rod 20, a connecting rod 21, a connecting rod 22, a pinion 23, an intermediate gear 24, a rotating shaft 25, a substrate frame 26, a substrate disc 27, an evaporation source 28, an evaporation source 29, an evaporation source 30, a heating mechanism 31, an evaporation source baffle 32, a crystal body 33, a crystal baffle 34 and a.
Example (b): as shown in fig. 1 and fig. 2, the main body of the film coating apparatus in this embodiment includes a film forming chamber 8, the inside of the film forming chamber 8 is used as a film forming space, and a product to be film-formed can be formed inside the film forming chamber 8.
A mechanical pump 1 and a high-vacuum pump 2 are connected to one side of the film forming chamber 8, wherein the mechanical pump 1 is used for forming a rough vacuum environment in the film forming chamber 8, and the high-vacuum pump 2 is used for further changing the rough vacuum environment into the high vacuum environment; the rough vacuum environment and the high vacuum environment refer to two environments with different vacuum degrees, and the vacuum degree of the high vacuum environment is higher than that of the rough vacuum environment.
As shown in fig. 1 and 3, a substrate holder 26 and a substrate tray 27 are provided inside the film forming chamber 8, wherein the substrate tray 27 is used for carrying a product to be formed into a film, and the substrate holder 26 is used for hanging and mounting the substrate holder 26.
In the present embodiment, in order to improve the film formation uniformity of the product to be film-formed, a rotation mechanism is provided in the film formation chamber 8, and the rotation mechanism includes a revolving rotation mechanism for effecting revolution of the substrate holder 26 and a rotating rotation mechanism for effecting rotation of the substrate disk 27.
As shown in fig. 3, the revolution rotating mechanism uses the revolution motor 4 as a driving element, the output end of the revolution motor 4 is connected with the power input end of the belt pulley assembly 11, the power output end of the belt pulley assembly 11 is connected with one end of the connecting rod 22, the other end of the connecting rod 22 is connected with the pinion 23, the pinion 23 is meshed with the intermediate gear 24, the intermediate gear 24 is fixedly connected with one end of the rotating shaft 25, and the other end of the rotating shaft 25 is fixedly connected with the substrate holder 26, so that the revolution motor 4 drives the substrate holder 26 to revolve in the film forming chamber 8.
The rotation mechanism adopts the rotation motor 3 as a prime mover, the output end of the rotation motor 3 is connected with the power input end of the belt pulley assembly 12, the power output end of the belt pulley assembly 12 is connected with one end of a connecting rod 13, the other end of the connecting rod 13 is connected with a pinion 14, the pinion 14 is meshed with an intermediate gear 15, the intermediate gear 15 is connected with a central gear 17 through a connecting flange 16, the central gear 17 is meshed with a gear 19 through an idler 18, the idler 18 is used for changing the rotation direction, and the gear 19 is connected and fixed with a substrate disc 22 through a connecting rod 20 and a connecting rod 21, so that the rotation motor 3 drives the substrate disc 27 to rotate.
In the present embodiment, as shown in fig. 3, the connection rod 20 and the connection rod 21 may be hinged to each other, so that the connection rod 20 and the connection rod 21 can rotate relatively to each other, thereby changing the inclination angle of the substrate tray 27 connected to the connection rod 21 to meet the requirements of different film forming processes.
As shown in fig. 4, three substrate disks 27 are provided below the substrate holder 26 in the present embodiment, and the three substrate disks 27 are symmetrically arranged in the circumferential direction of the substrate holder 26 to improve productivity.
As shown in fig. 3, an evaporation source 28, an evaporation source 29, and an evaporation source 30 are disposed below the substrate tray 27, wherein the evaporation source 28 is used for containing the main raw material of the scintillator type coating material, and the evaporation source 29 and the evaporation source 30 are respectively used for containing the additive material for improving the performance of the scintillator type coating material. As shown in fig. 5, a plurality of evaporation sources are disposed in the film forming chamber 8, a heating mechanism 31 is provided between the evaporation sources, the heating mechanism 31 is a halogen lamp, and the heating mechanism 31 is used to heat a product to be film-formed mounted on the substrate plate 27 to rapidly raise the temperature thereof, thereby balancing the unbalanced state of the heat source.
In this embodiment, the scintillator coating material includes CsI&TLI& SmI2The CsI is used as a main component of the scintillator, and when the CsI is used as a matrix, the radiation absorption efficiency of the scintillator is high, and the radiation damage is less; and thus CsI can be contained at the evaporation source 28. TLI is used as additive material for improving scintillation and luminous efficiency, SmI2Also as additive materials for improving the afterimage phenomenon in response to the still image to moving image, these additive materials may be contained at the evaporation source 29 or the evaporation source 30. In addition to this, SmI may be added2 、YbI2、 EuI2And the like, so as to further improve the afterimage phenomenon.
As shown in fig. 2 and fig. 6, a crystal monitoring device 9 is disposed on the top of the film forming chamber 8, and the crystal monitoring device 9 is used for monitoring the actual film thickness of the product to be formed on the lower substrate disc 27 in the film forming process, so as to effectively improve the film forming quality. The crystal monitoring device 9 is mainly composed of a crystal body 33, and a crystal protective cover 35 for protecting the crystal body 33 is arranged on the periphery of the crystal body 33, so that a coating material is prevented from being deposited on the crystal body; a monitoring hole is arranged on the crystal protective cover 35, and the crystal body 33 can monitor the film thickness of the product to be formed below through the monitoring hole. A crystal baffle 34 is arranged between the crystal body 33 and the crystal shield 35, and the crystal baffle 34 can be connected with a driving device to be opened and closed under the driving of the driving device. The crystal baffle 34 is used for switching the communication state between the monitoring holes on the crystal body 33 and the crystal protective cover 35, when the film thickness is monitored, the crystal baffle 34 is controlled to be opened, the crystal body 33 can monitor the film thickness through the monitoring holes, and when the film thickness is not required to be monitored, the crystal baffle 34 is controlled to be closed and blocked between the monitoring holes of the crystal body 33 and the crystal protective cover 35, so that the protective effect is achieved. In this embodiment, the opening and closing of the crystal shutter 34 can be controlled by setting the use time according to the actual use condition of the film forming process by a program.
As shown in fig. 1, in order to avoid the damage of the scintillator coating material located in the film forming chamber 8 to the operator, a lock mechanism 5 and a door opening and closing mechanism 6 are provided between the film forming chamber 8 and the film forming chamber door 7. The film forming chamber 8 and the film forming chamber door 7 are hinged to each other, so that the film forming chamber door 7 can be rotatably opened or closed. The door opening and closing mechanism 6 adopts a cylinder as a driving link, and a cylinder push rod is arranged in the cylinder and can stretch out and draw back under the driving of the cylinder. The flexible end of cylinder push rod can be connected with the mounting of fixing on filming room door 7 top, and the cylinder main part is erect and is established on filming room 8 and its slope that is certain angle is arranged. As shown in fig. 1, when the air cylinder performs the door opening action, the air cylinder push rod thereof is pushed out to apply a certain pushing force to the fixing piece fixed at the top end of the film forming chamber door 7, so that the film forming chamber door 7 is rotated to be opened; on the contrary, when the cylinder performs a door closing action, the cylinder rod thereof is retracted to rotate the film forming chamber door 7 closed. In this embodiment, the fixing member may be a stopper or a bar installed at the top end of the film forming chamber door 7.
As shown in fig. 1 and 2, two sets of locking mechanisms 5 are provided on the side of the film forming chamber 8 and corresponding to the opening direction of the film forming chamber door 7, the two sets of locking mechanisms 5 being arranged at regular intervals in the height direction of the film forming chamber 8. The two groups of locking mechanisms 5 have the same structure, all adopt cylinders as driving parts, and are internally provided with locking push rods which can be driven by the cylinders to stretch. The telescopic end of the locking push rod is connected with a pressing block. When the film forming chamber 8 performs a film forming process, the film forming chamber door 7 is in a closed state; at this moment, the cylinder of the locking mechanism 5 works, the locking push rod is pushed out and presses the pressing block at the butt joint position of the film forming chamber 8 and the film forming chamber door 7, and pressure is always applied in the execution process of the whole film forming process, so that the sealing property between the film forming chamber 8 and the film forming chamber door 7 is ensured, and meanwhile, the phenomenon that the harmful coating materials leak due to the fact that an operator opens the film forming chamber door 7 without paying attention to the operation personnel is avoided.
As shown in fig. 1, a pneumatic control device 10 is further provided on one side of the film forming chamber 8, and the pneumatic control device 10 powers the locking mechanism 5 and the cylinder of the door opening and closing mechanism 6 by compressed air.
In the embodiment, in specific implementation: in order to further ensure the safety of the coating equipment during use, in particular to avoid the life danger brought by the particularity of the scintillator coating materials. Except for realizing the automatic door opening and closing of the film forming chamber 8 through the door opening and closing mechanism 6, the operations of the upper and lower sheet actions of the internal substrate plate 27, the taking and placing of the crucible by the evaporation source and the like can be realized through the configuration of a grabbing manipulator and a corresponding structure, so that the film coating equipment and the operators are effectively separated, and the safety is ensured.
The embodiment has three working modes of rotation, revolution and combination of rotation and revolution, and can meet different requirements, and the working modes are as follows:
1) autorotation: the rotation motor 3 is driven by power, and the substrate tray 27 rotates by gear transmission.
Usage scenarios: the current use state of film formation; meanwhile, the manipulator (with a positioning function)/manual convenient operation can be realized.
2) Revolution: the revolution motor 4 is driven by power, and the substrate holder 26 revolves by gear transmission.
Usage scenarios: the disc taking is convenient and automatic. When the substrate holder 26 revolves, the substrate plate 27 can be driven to the door of the chamber, and the manipulator (including the positioning function)/manual convenient operation can be realized.
3) Rotation/revolution combination: the rotation motor 3 and the revolution motor 4 are driven simultaneously.
Usage scenarios: the planetary structure can form film in revolution and rotation, thus improving the film forming quality, reducing the cost, improving the utilization rate and the like.
The substrate holder 26 and the substrate disk 27 in this embodiment may be respectively connected with position detection devices, and the position detection devices are used for detecting the current positions of the substrate holder 26 and the substrate disk 27 so as to meet the needs of resetting, adjusting and the like.
Although the conception and the embodiments of the present invention have been described in detail with reference to the drawings, those skilled in the art will recognize that various changes and modifications can be made therein without departing from the scope of the appended claims, and therefore, they are not to be considered repeated herein.
Claims (8)
1. A coating equipment is characterized in that: the film forming device comprises a film forming chamber, wherein a substrate frame and a substrate disc are arranged in the film forming chamber, the substrate disc is used for carrying a product to be formed into a film, the substrate frame is used for mounting the substrate disc in a hanging manner, the substrate frame is connected with a revolution rotating mechanism, the substrate disc is connected with a rotation rotating mechanism, and the revolution rotating mechanism and the rotation rotating mechanism are independent; an evaporation source is arranged in the film forming chamber and is positioned below the substrate disc; a crystal monitoring device is arranged in the film forming chamber and used for monitoring the thickness of a film to be formed on the product to be formed; a film forming chamber door is arranged on one side of the film forming chamber, and a door opening and closing mechanism and a locking mechanism are arranged between the film forming chamber and the film forming chamber door; and a pneumatic control device is arranged on one side of the film forming chamber and is connected with and controls the door opening and closing mechanism and the locking mechanism.
2. The plating device according to claim 1, wherein: the revolution rotating mechanism and the rotation rotating mechanism can realize the joint work or the independent work.
3. The plating device according to claim 2, wherein: revolution rotary mechanism includes revolution motor, belt pulley mechanism, constitutes by the drive gear group and the axis of rotation that a plurality of gears mesh mutually, wherein revolution motor passes through belt pulley mechanism with the transmission initial point of drive gear group is connected, the drive terminal of drive gear group connects the axis of rotation, the axis of rotation with base plate frame fixed connection, revolution motor can drive base plate frame revolution.
4. The plating device according to claim 2, wherein: the autorotation mechanism comprises an autorotation motor, a belt pulley mechanism, a transmission gear set and a connecting rod, wherein the transmission gear set is formed by meshing a plurality of gears, the autorotation motor is connected with the transmission starting end of the transmission gear set through the belt pulley mechanism, the transmission terminal of the transmission gear set is connected with the connecting rod, the connecting rod is fixedly connected with the substrate disc, and the autorotation motor can drive the substrate disc to autorotate.
5. The plating device according to claim 1, wherein: one side of filming room door with it is articulated between the filming room main part with be provided with the switch door mechanism between the filming room door, the switch door mechanism is used for connection control opening and close of filming room door makes the rotatable opening or the rotatory closure of filming room door the side of filming room main part is provided with locking mechanism, locking mechanism is used for right behind the closure of filming room door the filming room door with docking position between the filming room main part locks.
6. The plating device according to claim 1, wherein: the crystal monitoring device comprises a crystal body, a crystal protective cover is arranged on the periphery of the crystal body, an opening for monitoring the crystal body is formed in the crystal protective cover, a controllable crystal baffle which can be opened and closed is arranged between the crystal body and the crystal protective cover, and the opening and closing of the crystal baffle can switch the communication state between the crystal body and the opening in the crystal protective cover.
7. The plating device according to claim 1, wherein: and a heating mechanism is arranged in the film forming chamber and used for heating the substrate, and the heating mechanism is a halogen lamp.
8. The plating device according to claim 1, wherein: the film forming chamber is connected with a mechanical pump and a high vacuum pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110282427.5A CN112981356A (en) | 2021-03-16 | 2021-03-16 | Coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110282427.5A CN112981356A (en) | 2021-03-16 | 2021-03-16 | Coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112981356A true CN112981356A (en) | 2021-06-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110282427.5A Pending CN112981356A (en) | 2021-03-16 | 2021-03-16 | Coating equipment |
Country Status (1)
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| CN (1) | CN112981356A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI783704B (en) * | 2021-09-30 | 2022-11-11 | 馗鼎奈米科技股份有限公司 | Surface treatment apparatus |
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2021
- 2021-03-16 CN CN202110282427.5A patent/CN112981356A/en active Pending
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI783704B (en) * | 2021-09-30 | 2022-11-11 | 馗鼎奈米科技股份有限公司 | Surface treatment apparatus |
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Application publication date: 20210618 |