CN212329646U - Additive manufacturing monitoring system and selective electron beam melting additive manufacturing equipment - Google Patents
Additive manufacturing monitoring system and selective electron beam melting additive manufacturing equipment Download PDFInfo
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- CN212329646U CN212329646U CN202021372148.5U CN202021372148U CN212329646U CN 212329646 U CN212329646 U CN 212329646U CN 202021372148 U CN202021372148 U CN 202021372148U CN 212329646 U CN212329646 U CN 212329646U
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- 238000010894 electron beam technology Methods 0.000 title claims abstract description 101
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 73
- 239000000654 additive Substances 0.000 title claims abstract description 67
- 230000000996 additive effect Effects 0.000 title claims abstract description 67
- 238000012544 monitoring process Methods 0.000 title claims abstract description 50
- 238000002844 melting Methods 0.000 title claims abstract description 34
- 230000008018 melting Effects 0.000 title claims abstract description 34
- 238000005286 illumination Methods 0.000 claims abstract description 39
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 abstract description 22
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- 230000001681 protective effect Effects 0.000 description 2
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- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The utility model provides a vibration material disk monitoring system and electron beam selective melting vibration material disk equipment relates to vibration material disk technical field. The additive manufacturing monitoring system comprises an image acquisition device, an illumination device and a turntable. The turntable is connected to the vacuum chamber, a first through hole and a second through hole which are separated from each other are formed in the turntable, and the first through hole is formed in the center of the turntable. The electron beam irradiates on the preset area through the first through hole. The turntable rotates relative to the vacuum chamber to enable the second through hole to correspond to the illuminating device or the image collecting device, the illuminating light can penetrate through the second through hole to irradiate the preset area, and the image collecting device is used for collecting the image of the preset area through the second through hole. The utility model also provides an electron beam selective melting vibration material disk equipment. The utility model provides a vibration material disk monitoring system and electron beam selective melting vibration material disk equipment can effectual protection observation camera lens not polluted by metal vapor, but long-time real-time supervision vibration material disk manufacturing process, and can reduce the maintenance cost.
Description
Technical Field
The utility model relates to a vibration material disk makes technical field, particularly, relates to a vibration material disk makes monitoring system and electron beam selective melting vibration material disk equipment.
Background
The additive manufacturing is a manufacturing technology which integrates computer aided design, material processing and forming technology, and directly manufactures solid objects by stacking special metal materials, non-metal materials and medical materials layer by layer in modes of extrusion, sintering, melting, photocuring, spraying and the like through software and numerical control systems on the basis of digital model files. The selective melting additive manufacturing of the electron beams refers to a powder bed additive manufacturing technology which utilizes the electron beams as heat sources, has the advantages of high energy utilization rate, no reflection, high power density, high scanning speed, no pollution to vacuum environment and the like, and is suitable for forming and manufacturing refractory and high-performance metal materials such as titanium alloy, titanium-aluminum-based alloy and the like. Because the selective melting and material increase manufacturing of the electron beam requires powder laying layer by layer, the powder laying quality needs to be monitored in real time, and therefore the forming quality is prevented from being influenced. For example, a powder spreading scraper is damaged, which can cause uneven powder spreading and directly affect the forming quality of the next layer. However, the selective melting and additive manufacturing of a part by an electron beam often requires several to dozens of hours of continuous work, which causes a large amount of metal vapor due to metal melting and pollutes an optical observation lens, thereby making it difficult to complete real-time monitoring of the whole part manufacturing process.
The current on-line monitoring technology for the selective melting additive manufacturing process of the electron beam comprises the following steps: the CCD industrial camera is arranged on a vacuum chamber, a transparent protective film which is the same as a glue roll is added in front of a camera lens, a motor can drive the transparent film to rotate, the film polluted by metal vapor is rotated away, and meanwhile, a new protective film is unfolded in front of the lens. The disadvantage of this method is that the film roll needs to be replaced regularly, each roll of film can work for about 40 hours, and the cost of the high-temperature resistant transparent film is high. Meanwhile, the light source of the observation device is from the spot illumination after the filament of the electron gun is heated, and the defect that the observation cannot be carried out when the electron gun is not started is overcome. The commonly used observation system is realized by combining a reflecting lens and a CCD camera, a reflector is arranged beside the axis of an electron beam in the electron gun and forms an included angle of 45 degrees with the horizontal plane, the camera is horizontally arranged outside the electron gun body and is opposite to the position of the reflector, and the observation of a processing area is realized through the reflector. The reflector is arranged right above the beam processing area, so the reflector is very easily polluted by metal vapor, the method for protecting the reflector against metal vapor pollution is to add a movable or electric baffle below the reflector, the baffle is opened when the beam position is corrected before processing, the observation is effective, and when the electron beam is in the processing process, the baffle is closed to shield the light path of the reflector, so that the metal vapor is prevented from polluting the lens. A disadvantage of this observation system is that the entire process cannot be observed in real time.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a vibration material disk monitoring system, it can effectual protection observation camera lens not polluted by metal vapor, and continuous operation time is long to can reduce the maintenance cost.
The utility model discloses an aim still includes, provides an electron beam election district melting vibration material disk equipment, and it adopts above-mentioned vibration material disk monitoring system, can effectual protection observation camera lens not polluted by metal vapor, and long-time clear observation can reduce the maintenance cost.
The embodiment of the utility model discloses a can realize like this:
an embodiment of the utility model provides an additive manufacturing monitoring system is applied to electron beam election district melting additive manufacturing equipment, electron beam additive manufacturing equipment includes electron beam gun, real empty room and workstation, be equipped with the accommodation space in the real empty room, the workstation sets up the accommodation space bottom, the electron beam gun install in real empty room, and be used for to preset region on the workstation sends the electron beam.
The additive manufacturing monitoring system comprises an image acquisition device, an illumination device and a turntable.
The image acquisition device and the illumination device are both arranged in the vacuum chamber.
The turntable is connected to the vacuum chamber, a first through hole and a second through hole are formed in the turntable, the first through hole is formed in the rotation center of the turntable, and the second through hole and the first through hole are arranged at intervals.
The first through hole and the electron beam gun are coaxially arranged, and the electron beam can penetrate through the first through hole to irradiate the preset area.
The turntable can rotate relative to the vacuum chamber to enable the second through hole to correspond to the illuminating device, the illuminating device is used for emitting illuminating light, and the illuminating light can penetrate through the second through hole to irradiate the preset area.
The turntable can also rotate relative to the vacuum chamber so that the second through hole corresponds to the image acquisition device, and the image acquisition device is used for acquiring the image of the preset area through the second through hole.
Optionally, the number of the second through holes is multiple, the second through holes are arranged around the first through hole, and the second through holes are arranged in a circle around the first through hole.
Optionally, a plurality of the second through holes are arranged at equal intervals.
Optionally, the additive manufacturing monitoring system further includes a driving device, the driving device is installed at the top of the accommodating space, and the driving device is connected to the turntable and is used for driving the turntable to rotate relative to the vacuum chamber.
Optionally, the driving device has an output gear for outputting power, and the turntable is provided with a gear ring adapted to the output gear, and the gear ring is engaged with the output gear.
Optionally, the ring gear is disposed on a side surface close to the electron beam gun in the axial direction of the turntable, and the ring gear is disposed on an outer periphery of the side surface.
Optionally, the image capturing device and the illuminating device are respectively disposed on two sides of the electron beam gun, and an axis of the image capturing device, an axis of the illuminating device, and an axis of the electron beam gun are in a preset plane.
The axis of the driving device and the preset plane are arranged at an included angle.
Optionally, the turntable includes a central portion and a peripheral portion, the peripheral portion is disposed around the central portion, the peripheral portion has a first side surface and a second side surface opposite to each other along an axis, the central portion protrudes from the first side surface, and a mounting hole corresponding to the central portion is formed in a recessed manner on the second side surface, and the mounting hole is used for being in running fit with a rotating shaft inside the vacuum chamber.
The first through hole is formed in the center of the central portion, and the second through hole is formed in the peripheral portion.
The electron beam selective melting additive manufacturing equipment comprises an electron beam gun, a vacuum chamber, a workbench and an additive manufacturing monitoring system, wherein a containing space is arranged in the vacuum chamber, the workbench is arranged at the bottom of the containing space, and the electron beam gun is installed in the vacuum chamber and is used for emitting electron beams to a preset area on the workbench.
The additive manufacturing monitoring system comprises an image acquisition device, an illumination device and a turntable.
The image acquisition device and the illumination device are both arranged in the vacuum chamber.
The turntable is connected to the vacuum chamber, a first through hole and a second through hole are formed in the turntable, the first through hole is formed in the rotation center of the turntable, and the second through hole and the first through hole are arranged at intervals.
The first through hole and the electron beam gun are coaxially arranged, and the electron beam can penetrate through the first through hole to irradiate the preset area.
The turntable can rotate relative to the vacuum chamber to enable the second through hole to correspond to the illuminating device, the illuminating device is used for emitting illuminating light, and the illuminating light can penetrate through the second through hole to irradiate the preset area.
The turntable can also rotate relative to the vacuum chamber so that the second through hole corresponds to the image acquisition device, and the image acquisition device is used for acquiring the image of the preset area through the second through hole.
Optionally, the top of the vacuum chamber is provided with a first mounting hole, a second mounting hole and a third mounting hole which are arranged at intervals, and the first mounting hole is formed towards the preset area.
The axis of the second mounting hole is obliquely arranged relative to the axis of the first mounting hole, so that the second mounting hole faces the preset area.
The axis of the third mounting hole is obliquely arranged relative to the axis of the first mounting hole, so that the third mounting hole faces the preset area.
The electron beam gun is arranged corresponding to the first mounting hole, so that an electron beam penetrates through the first mounting hole to irradiate the preset area, the illuminating device is arranged corresponding to the second mounting hole, so that the illuminating light penetrates through the second mounting hole to irradiate the preset area, and the image acquisition device is arranged corresponding to the third mounting hole, so that the image acquisition device penetrates through the third mounting hole to acquire an image of the preset area.
The utility model discloses additive manufacturing monitoring system includes for prior art's beneficial effect:
the electron beam gun can emit electron beams towards the workbench, the electron beams can penetrate through the first through hole to be projected on the workbench, and then the purpose of melting metal can be achieved. Can rotate through the control carousel, and when the rotational speed of control carousel reached certain rotational speed for the second through-hole is greater than image acquisition device's frame rate corresponding to image acquisition device's rotatory passing frequency, can realize that image acquisition device is clear to predetermine the region on the monitoring table, and lighting device can throw the illumination light at predetermineeing the region effectively simultaneously, and then can carry out clear monitoring to the vibration material disk. In addition, when the additive manufacturing is performed, the accommodating space needs to be vacuumized, and at the moment, the metal vapor moves slowly in the accommodating space in the vacuum state, so that the metal vapor is easily attached to the rotating turntable, the metal vapor is prevented from moving to the lens of the image acquisition device, and the light path of the image acquisition device can be prevented from being polluted. Similarly, the metal vapor can be prevented from polluting the lens of the lighting device, and further the light path of the lighting device is prevented from being polluted. The observation lens can be effectively protected from being polluted by metal vapor, the long-time real-time monitoring of the additive manufacturing monitoring system is realized, the continuous working time is greatly prolonged, and the technical problem of reducing the maintenance cost can be realized.
The utility model provides an electron beam selective melting vibration material disk equipment is the same for prior art's beneficial effect with the vibration material disk monitoring system who provides for the above-mentioned beneficial effect of prior art for prior art, no longer gives unnecessary details here.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of an electron beam selective melting additive manufacturing apparatus provided in an embodiment of the present application;
fig. 2 is a schematic cross-sectional structural view of an electron beam selective melting additive manufacturing apparatus provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of a first view angle of a turntable provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of a second view angle of the turntable provided in the embodiment of the present application;
fig. 5 is a schematic structural diagram of a third view angle of the turntable provided in the embodiment of the present application;
FIG. 6 is a schematic cross-sectional structural view of an electron beam selective melting additive manufacturing apparatus provided in an embodiment of the present application;
fig. 7 is an enlarged schematic view of a portion a in fig. 6.
Icon: 10-electron beam selective melting additive manufacturing equipment; 100-an additive manufacturing monitoring system; 110-an image acquisition device; 120-a lighting device; 130-a turntable; 131-a first via; 132-a second via; 133-center section; 134-a peripheral portion; 1341-a first side; 1342-a second side; 1343-mounting holes; 135-a gear ring; 140-a display; 200-vacuum chamber; 210-an accommodating space; 220-first mounting hole; 230-a second mounting hole; 240-third mounting hole; 250-a rotating shaft; 300-an electron beam gun; 310-an electron beam; 400-a workbench; 410-a preset area; 500-a drive device; 510-output gear.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the products of the present invention are used, the description is only for convenience of description and simplification, but the indication or suggestion that the indicated device or element must have a specific position, be constructed and operated in a specific orientation, and thus, should not be interpreted as a limitation of the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1, the present application provides an electron beam selective melting additive manufacturing apparatus 10, where the electron beam selective melting additive manufacturing apparatus 10 is a powder bed additive manufacturing technical apparatus using an electron beam as a heat source, and is capable of directly manufacturing a solid object by stacking dedicated metal materials, non-metal materials, and medical materials layer by layer in a manner of extrusion, sintering, melting, photocuring, spraying, and the like. Moreover, the selective melting additive manufacturing equipment 10 for the electron beam provided by the application can reduce maintenance cost, observe clearly, effectively protect an observation lens from being polluted by metal vapor, greatly prolong the continuous working time of an additive manufacturing monitoring system, and realize the continuous working time of more than 1000 hours.
The selective electron beam melting additive manufacturing equipment 10 comprises an electron beam gun 300, a vacuum chamber 200, a workbench 400 and an additive manufacturing monitoring system 100. The vacuum chamber 200 has an accommodating space 210 therein, and the accommodating space 210 provides a place for additive manufacturing, that is, additive manufacturing is performed in the accommodating space 210. The worktable 400 is disposed inside the accommodating space 210, and the worktable 400 is located at the bottom of the accommodating space 210 for placing a metal material to be processed. The accommodating space 210 may be vacuumized to ensure the quality of additive manufacturing. It should be noted that the work table 400 has a predetermined area 410, and the predetermined area 410 is used for placing a metal material to be processed. Both electron beam gun 300 and additive manufacturing monitoring system 100 are mounted on vacuum chamber 200. The electron beam gun 300 is configured to emit an electron beam 310 to the predetermined area 410, so that the electron beam 310 can be projected on the metal material to be processed in the predetermined area 410, and the processing of the metal material can be realized by using the electron beam 310 as a heat source. Additive manufacturing monitoring system 100 is configured to monitor predetermined area 410 in real time to avoid affecting the forming quality. For example, the powder spreading scraper is damaged, so that the powder spreading is not uniform, and the forming quality of the next layer is directly influenced; at this moment, can monitor the shop powder through additive manufacturing monitoring system 100, send out the early warning when shop powder is inhomogeneous, and then can make things convenient for the operator to carry out troubleshooting to realize avoiding influencing the purpose of shaping quality.
In an embodiment of the application, the additive manufacturing monitoring system 100 includes an image acquisition device 110, an illumination device 120, and a carousel 130. The image capture device 110 and the illumination device 120 are both mounted on the vacuum chamber 200. The image acquisition device 110 is configured to acquire an image of the preset area 410, so as to achieve the purpose of observing and monitoring the additive manufacturing process in the preset area 410; the illumination device 120 is configured to project illumination light to the preset area 410, so as to improve the definition of the image of the preset area 410 acquired by the image acquisition device 110, and ensure an effective observation and monitoring effect. The turntable 130 is rotatably connected to the vacuum chamber 200, i.e., the turntable 130 is capable of rotating relative to the vacuum chamber 200. Moreover, the turntable 130 is provided with a first through hole 131 and a second through hole 132, the first through hole 131 is provided at the rotation center of the turntable 130, that is, when the turntable 130 rotates relative to the vacuum chamber 200, the position of the first through hole 131 relative to the vacuum chamber 200 is kept unchanged; the second through hole 132 is spaced apart from the first through hole 131 such that the second through hole 132 rotates in a circumferential direction around the first through hole 131 when the turntable 130 rotates with respect to the vacuum chamber 200.
It should be noted that, referring to fig. 1 and fig. 2, the electron beam gun 300, the image capturing device 110 and the illuminating device 120 are disposed outside the vacuum chamber 200. In order to facilitate the electron beam 310 emitted from the electron beam gun 300 to project onto the predetermined region 410 of the worktable 400, the vacuum chamber 200 is opened with a first mounting hole 220, and the first mounting hole 220 is disposed toward the predetermined region 410, the electron beam gun 300 is disposed corresponding to the first mounting hole 220, and the electron beam 310 emitted from the electron beam gun 300 can project onto the predetermined region 410 through the first mounting hole 220. Next, in order to facilitate the illumination device 120 to project the illumination light to the preset area 410, the vacuum chamber 200 further has a second mounting hole 230, the second mounting hole 230 is disposed toward the preset area 410, and the illumination device 120 is disposed corresponding to the second mounting hole 230, so that the illumination light can be projected to the preset area 410 through the second mounting hole 230. In addition, in order to facilitate the image acquisition device 110 to acquire the image of the preset area 410, a third installation hole 240 is further formed in the vacuum chamber 200, the third installation hole 240 is disposed toward the preset area 410, and the image acquisition device 110 is disposed corresponding to the third installation hole 240, so that the image acquisition device 110 can acquire the image of the preset area 410 through the third installation hole 240.
Wherein, in order to avoid the electron beam gun 300, the image capturing device 110 and the illumination device 120 from affecting each other when being mounted, the first mounting hole 220, the second mounting hole 230 and the third mounting hole 240 are spaced apart from each other. Optionally, the axis of the first mounting hole 220 is perpendicular to the plane of the predetermined area 410, so that the electron beam 310 is aligned with the predetermined area 410, thereby ensuring that the electron beam 310 can be accurately projected to the predetermined area 410. In order to facilitate the illumination light emitted by the illumination device 120 to be projected on the preset area 410 and to facilitate the image acquisition device 110 to acquire the image of the preset area 410, the axis of the second mounting hole 230 is inclined with respect to the axis of the first mounting hole 220, and the axis of the third mounting hole 240 is inclined with respect to the axis of the first mounting hole 220; optionally, the axis of the first mounting hole 220, the axis of the second mounting hole 230, and the axis of the third mounting hole 240 intersect at the predetermined area 410. In addition, in some embodiments of the present application, the illumination device 120 and the image capture device 110 are disposed on both sides of the electron beam gun 300, in other words, an axis of the image capture device 110, an axis of the illumination device 120, and an axis of the electron beam gun 300 are in a preset plane, such that an axis of the first mounting hole 220, an axis of the second mounting hole 230, and an axis of the third mounting hole 240 are in the preset plane. Of course, in other embodiments, the arrangement positions of the electron beam gun 300, the illumination device 120 and the image capturing device 110 may be different, and it is only necessary to ensure that the electron beam 310 can be projected on the preset region 410, that the illumination light can be projected on the preset region 410, and that the image capturing device 110 can capture the image of the preset region 410.
In some embodiments of the present application, transparent lead glass is filled in the first mounting hole 220, the second mounting hole 230, and the third mounting hole 240, so as to prevent X-rays inside the vacuum chamber 200 from leaking out and prevent X-rays from injuring an operator on the premise that the electron beam gun 300, the lighting device 120, and the image collecting device 110 can normally operate. Certainly, by filling the transparent lead glass in the first mounting hole 220, the second mounting hole 230 and the third mounting hole 240, the accommodating space 210 can be sealed, so that the sealing performance of the accommodating space 210 is improved, and the vacuum-pumping process of the accommodating space 210 is facilitated.
In an embodiment of the application, the additive manufacturing monitoring system 100 may further include a display 140, the display 140 having a movable reticle and coordinate recording function, the display 140 being electrically connected to the image capturing device 110 for real-time imaging of the working area for facilitating observation and monitoring by an operator.
In addition, referring to fig. 1, 3, 4 and 5, the turntable 130 is disposed between the worktable 400 and the electron beam gun 300, and the first through hole 131 is disposed corresponding to the electron beam gun 300, so that the electron beam 310 emitted from the electron beam gun 300 can pass through the first through hole 131 and be projected on the preset area 410 of the worktable 400; moreover, in order to facilitate the illumination light emitted by the illumination device 120 to be projected to the preset area 410, the turntable 130 rotates relative to the vacuum chamber 200, and the second through hole 132 can be made to correspond to the illumination device 120, so that the illumination light can be projected to the preset area 410 of the worktable 400 through the second through hole 132; accordingly, in order to facilitate the image capturing device 110 to capture the image of the predetermined area 410, the turntable 130 rotates relative to the vacuum chamber 200, and the second through hole 132 can be made to correspond to the image capturing device 110, and the image capturing device 110 can capture the image of the predetermined area 410 through the second through hole 132.
It should be noted that, when the rotation speed of the turntable 130 reaches the first preset speed, the first frequency of the second through hole 132 corresponding to the image capturing device 110 is greater than the frame rate of the image capturing device 110, and at this time, the image capturing device 110 can capture a clear image, so as to clearly observe and monitor the additive manufacturing process in the preset area 410. The second through hole 132 corresponds to the image capturing device for the first time to start timing, the turntable 130 rotates for the first time at the first preset speed for a week, and the second through hole 132 corresponds to the image capturing device 110 for the second time, and at this time, the first frequency of the second through hole 132 corresponding to the image capturing device 110 is equal to the reciprocal of the first time. Accordingly, the first predetermined speed is equal to pi divided by the first time, and the first predetermined speed refers to the angular speed of the rotation of the turntable 130. Similarly, when the rotation speed of the turntable 130 reaches the first preset speed, the illumination light emitted by the illumination device 120 can be effectively projected onto the preset area 410, thereby ensuring that the image capturing device 110 can capture a clear image.
In some embodiments of the present application, the image capture device 110 employs a CCD industrial camera. Of course, in other embodiments of the present application, the image capturing apparatus 110 may also employ other image capturing devices.
Further, in order to allow a large control range of the rotation speed of the dial 130, the rotation speed of the dial 130 is conveniently controlled. In some embodiments of the present application, the second through holes 132 are multiple, the multiple second through holes 132 are disposed around the first through hole 131, and the multiple second through holes 132 form a circle with the first through hole 131 as a center. At this time, only when the turntable 130 is rotated, the second frequency of the two adjacent second through holes 132 corresponding to the image capturing device 110 in sequence is greater than the frame rate of the image capturing device 110, so that the purpose of capturing a clear image by the image capturing device 110 can be achieved. It should be noted that, when one of the second through holes 132 corresponds to the image capturing device 110, the rotating disc 130 rotates at a second preset speed for a second time, and makes another adjacent second through hole 132 correspond to the image capturing device 110, and at this time, the second frequency of the two adjacent second through holes 132 sequentially corresponding to the image capturing device 110 is equal to the reciprocal of the second time. Accordingly, the second preset speed is equal to the radian between two adjacent second through holes 132 divided by the second time, wherein the second preset speed refers to the angular speed of the rotation of the rotating disc 130.
It should be noted that, when the first frequency and the second frequency both satisfy a frame rate greater than the image capturing device 110 and the first frequency is equal to the second frequency, the first time is equal to the second time. Because the radian between two adjacent second through holes 132 is less than pi, it indicates that the second preset speed is less than the first preset speed, that is, when the plurality of second through holes 132 are formed in the turntable 130, the rotating speed of the turntable 130 can be lower, and the rotating speed control range of the turntable 130 is larger, which is more beneficial to controlling the rotating speed of the turntable 130, so that the rotating speed of the turntable 130 has a larger control range, and the rotating speed of the turntable 130 can be conveniently controlled.
In addition, in order to further facilitate the control of the rotation speed of the turntable 130 and to make the rotation of the turntable 130 more stable, in some embodiments of the present application, the plurality of second through holes 132 are disposed at equal intervals, so that the radians between any two adjacent second through holes 132 are the same, and further the second frequencies of two adjacent second through holes 132 sequentially corresponding to the image capturing device 110 are the same, which can facilitate the control of the rotation speed of the turntable 130. In addition, when the second through holes 132 are arranged at equal intervals, the mass distribution of the turntable 130 is uniform, so that the shaking caused by the uneven quality of the turntable 130 can be avoided, and the stability of the rotation of the turntable 130 is further ensured.
In some embodiments of the present application, the turntable 130 includes a central portion 133 and a peripheral portion 134, the peripheral portion 134 is disposed around the central portion 133, the peripheral portion 134 has a first side 1341 and a second side 1342 disposed opposite to each other along an axial direction, the central portion 133 protrudes from the first side 1341, and a mounting hole 1343 corresponding to the central portion 133 is formed on the second side 1342 in a recessed manner, and the mounting hole 1343 is configured to be rotatably engaged with the rotating shaft 250 inside the vacuum chamber 200. In other words, the turntable 130 can be regarded as a disk, in which the middle portion of the disk is protruded to one side in the axial direction thereof and is formed with a groove, the protruded portion forms a central portion 133, the outer peripheral portion 134 is the outer peripheral portion 133, and the groove is the mounting hole 1343. In addition, the first through hole 131 is opened in the middle of the central portion 133, and the first through hole 131 communicates with the mounting hole 1343. The second through holes 132 are formed on the peripheral portion 134, wherein when there are a plurality of second through holes 132, the plurality of second through holes 132 are disposed on the peripheral portion 134 at equal intervals.
In an embodiment of the present application, referring to fig. 1, 6 and 7, a rotating shaft 250 is disposed at the top of the vacuum chamber 200, the rotating shaft 250 is hollow and cylindrical, and a hole inside the rotating shaft 250 corresponds to the first mounting hole 220, so that the electron beam 310 can pass through the hole in the center of the rotating shaft 250 after passing through the first mounting hole 220, and the rotating shaft 250 is prevented from affecting the projection of the electron beam 310. When the mounting hole 1343 is correspondingly mounted on the rotation shaft 250, the first through hole 131 is disposed corresponding to the central hole of the rotation shaft 250 to ensure that the electron beam 310 can be projected on the predetermined area 410 through the first through hole 131. Further, a bearing is provided between the inner peripheral wall of the mounting hole 1343 and the outer peripheral wall of the rotary shaft 250, thereby ensuring that the dial 130 can be rotated stably and efficiently.
Further, in the embodiment of the present application, the additive manufacturing monitoring system 100 further includes a driving device 500, the driving device 500 is installed on the top of the accommodating space 210, and the driving device 500 is in transmission connection with the turntable 130 for driving the turntable 130 to rotate relative to the vacuum chamber 200.
Alternatively, in some embodiments of the present application, the driving device 500 has an output gear 510 for outputting power, the rotating disc 130 is provided with a ring gear 135 adapted to the output gear 510, and the ring gear 135 is engaged with the output gear 510. When the driving device 500 outputs kinetic energy, the output gear 510 can rotate, and the output gear 510 can drive the gear ring 135 to rotate, so that the kinetic energy can be transmitted to the turntable 130 to drive the turntable 130 to rotate relative to the vacuum chamber 200. Of course, in other embodiments, the driving device 500 may also adopt other transmission modes, such as a chain transmission mode or a belt transmission mode.
Further, in some embodiments of the present application, the ring gear 135 is disposed on a side of the turntable 130 close to the electron beam gun 300 in the axial direction, i.e., the ring gear 135 is disposed on a side of the turntable 130 close to a top wall of the vacuum chamber 200. It should be noted that, in order to facilitate the mutual matching between the output gear 510 and the gear ring 135, a certain gap is provided between the turntable 130 and the top of the vacuum chamber 200, and the output gear 510 is disposed inside the gap. Of course, in other embodiments, the ring gear 135 may be disposed on a side of the turntable 130 away from the electron beam gun 300, or the ring gear 135 may be disposed on an outer circumference of the turntable 130 in a radial direction, or the like.
In addition, in order to avoid the driving device 500 from affecting the illumination light emitted by the illumination device 120 and to avoid the driving device 500 from affecting the image capturing device 110, the axis of the driving device 500 is disposed at an angle with respect to the predetermined plane. The preset plane is a plane formed by the axis of the image capturing device 110, the axis of the illuminating device 120, and the axis of the electron beam gun 300. This makes it possible to shift the optical path of the illumination light and the optical path of the image pickup device 110 from each other in the driving device 500, and it is possible to ensure that a clear image can be picked up by the image pickup device 110. Optionally, in some embodiments of the present application, the axis of the driving device 500 is perpendicular to the preset plane.
The working flow of additive manufacturing by the selective electron beam melting additive manufacturing device 10 provided in the embodiment of the present application is as follows: a metal material to be processed is placed on a preset area 410 of the table 400. Closing the accommodating space 210 and evacuating the accommodating space 210, optionally evacuating the accommodating space 210 to 5 × 10-3pa. The driving device 500 is started, so that the driving device 500 drives the turntable 130 to rotate relative to the vacuum chamber 200, and the rotation speed of the turntable 130 is adjusted so that the frequency of the second through holes 132 corresponding to the image capturing device 110 is greater than the frame rate of the image capturing device 110. The illumination device 120 and the image capture device 110 are activated,at this time, the illumination light can be projected on the predetermined area 410, and the image capturing device 110 can capture an image of the predetermined area 410. The electron beam gun 300 is turned on so that the electron beam 310 can be projected on a predetermined area 410 to process the metal material to be processed. The position of the reticle on the display 140 is adjusted so that the center of the reticle coincides with the center position of the electron beam 310, and the position coordinates of the reticle displayed on the display 140 are recorded. Then, the selective melting additive manufacturing process of the electron beam 310 can be performed, and at this time, the image acquisition device 110 can clearly acquire the image of the preset area 410, so as to perform clear real-time observation and monitoring.
In summary, in the additive manufacturing monitoring system 100 and the electron beam selective melting additive manufacturing apparatus 10 provided in the embodiment of the present application, the electron beam gun 300 can emit the electron beam 310 toward the work table 400, and the electron beam 310 can pass through the first through hole 131 and be projected on the work table 400, so as to achieve the purpose of melting metal. The control turntable 130 can rotate, when the rotating speed of the control turntable 130 reaches a certain rotating speed, the second through hole 132 is enabled to correspond to the frequency of the image acquisition device 110 and is larger than the frame rate of the image acquisition device 110, the clear preset area 410 on the monitoring workbench 400 of the image acquisition device 110 can be achieved, meanwhile, the illumination device 120 can effectively project illumination light on the preset area 410, and further clear monitoring can be conducted on additive manufacturing. In addition, when the additive manufacturing is performed, the accommodating space 210 needs to be evacuated to vacuum, and at this time, the metal vapor moves slowly in the accommodating space 210 in the vacuum state, so that the metal vapor is easily attached to the rotating turntable 130, and thus the metal vapor is prevented from moving to the lens of the image capturing device 110, and further the optical path of the image capturing device 110 can be prevented from being polluted. Similarly, the metal vapor can be prevented from contaminating the lens of the lighting device 120, and further the light path of the lighting device 120 is prevented from being contaminated. The observation lens can be effectively protected from being polluted by metal vapor, the continuous working time of the additive manufacturing monitoring system is prolonged to a great extent, the continuous working time of the additive manufacturing monitoring system for real-time monitoring can reach more than 1000 hours, and the maintenance cost can be reduced.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An additive manufacturing monitoring system is applied to electron beam selective melting additive manufacturing equipment, wherein the electron beam selective melting additive manufacturing equipment comprises an electron beam gun, a vacuum chamber and a workbench, a containing space is arranged in the vacuum chamber, the workbench is arranged at the bottom of the containing space, and the electron beam gun is installed in the vacuum chamber and is used for emitting electron beams to a preset area on the workbench;
the additive manufacturing monitoring system is characterized by comprising an image acquisition device, an illumination device and a turntable;
the image acquisition device and the illumination device are both arranged in the vacuum chamber;
the turntable is connected with the vacuum chamber, a first through hole and a second through hole are formed in the turntable, the first through hole is formed in the rotation center of the turntable, and the second through hole and the first through hole are arranged at intervals;
the first through hole and the electron beam gun are coaxially arranged, and the electron beam can penetrate through the first through hole to irradiate the preset area;
the turntable can rotate relative to the vacuum chamber to enable the second through hole to correspond to the illuminating device, the illuminating device is used for emitting illuminating light, and the illuminating light can penetrate through the second through hole to irradiate the preset area;
the turntable can also rotate relative to the vacuum chamber so that the second through hole corresponds to the image acquisition device, and the image acquisition device is used for acquiring the image of the preset area through the second through hole.
2. The additive manufacturing monitoring system according to claim 1, wherein the second through holes are a plurality of holes, the plurality of second through holes are arranged around the first through hole, and the plurality of second through holes are arranged around a circle with the first through hole as a center.
3. The additive manufacturing monitoring system of claim 2, wherein a plurality of the second through holes are equally spaced.
4. The additive manufacturing monitoring system according to any one of claims 1-3, further comprising a driving device mounted on top of the receiving space, the driving device being connected to the turntable and configured to drive the turntable to rotate relative to the vacuum chamber.
5. The additive manufacturing monitoring system according to claim 4, wherein the driving device has an output gear for outputting power, and the turntable is provided with a ring gear adapted to the output gear, and the ring gear is engaged with the output gear.
6. The additive manufacturing monitoring system according to claim 5, wherein the ring gear is provided on a side surface of the turntable near the electron beam gun in an axial direction thereof, and the ring gear is provided on an outer periphery of the side surface.
7. The additive manufacturing monitoring system according to claim 4, wherein the image capture device and the illumination device are disposed on either side of the electron beam gun, respectively, and an axis of the image capture device, an axis of the illumination device, and an axis of the electron beam gun are in a predetermined plane;
the axis of the driving device and the preset plane are arranged at an included angle.
8. The additive manufacturing monitoring system according to any one of claims 1-3, wherein the turntable comprises a central portion and a peripheral portion, the peripheral portion being disposed around the central portion and having first and second axially opposite sides, the central portion protruding from the first side and being recessed on the second side to form a mounting hole corresponding to the central portion, the mounting hole being adapted to rotatably engage with a rotating shaft inside the vacuum chamber;
the first through hole is formed in the center of the central portion, and the second through hole is formed in the peripheral portion.
9. An electron beam selective melting additive manufacturing apparatus comprising an additive manufacturing monitoring system according to any one of claims 1 to 8.
10. The selective electron beam melting additive manufacturing apparatus according to claim 9, wherein a first mounting hole, a second mounting hole, and a third mounting hole are formed at a top of the vacuum chamber at intervals, and the first mounting hole is formed toward the predetermined region;
the axis of the second mounting hole is obliquely arranged relative to the axis of the first mounting hole, so that the second mounting hole faces the preset area;
the axis of the third mounting hole is obliquely arranged relative to the axis of the first mounting hole, so that the third mounting hole faces the preset area;
the electron beam gun is arranged corresponding to the first mounting hole, so that an electron beam penetrates through the first mounting hole to irradiate the preset area, the illuminating device is arranged corresponding to the second mounting hole, so that the illuminating light penetrates through the second mounting hole to irradiate the preset area, and the image acquisition device is arranged corresponding to the third mounting hole, so that the image acquisition device penetrates through the third mounting hole to acquire an image of the preset area.
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| CN202021372148.5U CN212329646U (en) | 2020-07-13 | 2020-07-13 | Additive manufacturing monitoring system and selective electron beam melting additive manufacturing equipment |
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| CN202021372148.5U CN212329646U (en) | 2020-07-13 | 2020-07-13 | Additive manufacturing monitoring system and selective electron beam melting additive manufacturing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111644622A (en) * | 2020-07-13 | 2020-09-11 | 广东省焊接技术研究所（广东省中乌研究院） | Additive manufacturing monitoring system and selective electron beam melting additive manufacturing equipment |
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2020
- 2020-07-13 CN CN202021372148.5U patent/CN212329646U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111644622A (en) * | 2020-07-13 | 2020-09-11 | 广东省焊接技术研究所（广东省中乌研究院） | Additive manufacturing monitoring system and selective electron beam melting additive manufacturing equipment |
| CN111644622B (en) * | 2020-07-13 | 2023-12-08 | 广东省焊接技术研究所（广东省中乌研究院） | Additive manufacturing monitoring system and electron beam selective melting additive manufacturing equipment |
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Address after: 510000 363 Changxin Road, Tianhe District, Guangzhou, Guangdong. Patentee after: China Uzbekistan Welding Research Institute Guangdong Academy of Sciences Address before: 510000 courtyard, no.363, Changxing Road, Tianhe District, Guangzhou City, Guangdong Province Patentee before: Guangdong Welding Institute (China-Ukraine E.O. Paton Institute of Welding) |
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