CN210420144U - Sputtering film forming device - Google Patents
Sputtering film forming device Download PDFInfo
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- CN210420144U CN210420144U CN201921510677.4U CN201921510677U CN210420144U CN 210420144 U CN210420144 U CN 210420144U CN 201921510677 U CN201921510677 U CN 201921510677U CN 210420144 U CN210420144 U CN 210420144U
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Abstract
The utility model relates to a film preparation technical field especially relates to a sputter film forming device, its characterized in that: the substrate tray revolution turntable is in driving connection with a revolution motor arranged outside the vacuum film forming chamber and rotates under the driving of the revolution motor, the substrate tray rotation turntable is in driving connection with a rotation vacuum motor arranged inside the vacuum film forming chamber, the rotation vacuum motor is connected with a conductive slip ring arranged outside the vacuum film forming chamber through a vacuum leading-in electrode, and the substrate tray rotation turntable rotates under the driving of the rotation vacuum motor. The utility model has the advantages that: the adjustment of the revolution-rotation speed ratio of the substrate tray is realized, the thickness uniformity of different coating material films deposited on the substrate can be obviously improved, and the preparation requirement of high-precision low-defect films can be met; the dust generated by friction vibration of the transmission gear set is reduced, and the defects of the substrate film are further reduced.
Description
Technical Field
The utility model relates to a film preparation technical field especially relates to a sputter film forming device.
Background
The optical thin film generally refers to one or more layers of dielectric films or metal films, or a mixed film layer composed of a dielectric film and a metal film, which are plated on an optical element (substrate). The optical film may function to reduce or increase light reflection, beam splitting, color separation, filtering, polarization, and the like.
There are two common methods for preparing optical films, one is sputtering and the other is evaporation. In the sputtering method, ions are generally used to bombard the surface of the target material, and atoms of the target material are bombarded out and deposited on the surface of the substrate to form a film. In the evaporation method, an optical thin film is generally deposited on the surface of the substrate by means of electron beam or thermal evaporation.
The conventional film forming apparatus improves the uniformity of a deposited film on the surface of a substrate by a revolution and rotation structure of a substrate tray (workpiece tray). The uniformity and precision of the deposited film on the substrate surface are closely related to the revolution/rotation speed ratio of the substrate tray (workpiece tray). And the revolution and rotation speed ratios required for obtaining the high-uniformity film by different coating materials are different. Therefore, the conventional revolution and rotation film forming device corrects the film thickness by adding a mask plate structure, and realizes that the substrate obtains high-uniformity (high-precision) films of different coating materials.
In addition, a common revolution/rotation film forming apparatus realizes revolution/rotation of a substrate tray (workpiece tray) by using vacuum-side gear transmission. However, the revolution/rotation structure of the gear transmission is usually a fixed transmission ratio, and the revolution/rotation speed ratio of the substrate tray (workpiece tray) cannot be freely adjusted. And the substrate tray (workpiece tray) rotates at a high speed, and dust is easily generated by the transmission of the vacuum side gear, so that the appearance of a film product is influenced, and the requirement of high-quality film coating cannot be met.
Disclosure of Invention
The utility model aims at providing a sputtering film forming device according to the defects of the prior art, which respectively drives the independent rotation of the substrate tray revolution turntable and the substrate tray rotation turntable through two independent sets of driving systems to realize the accurate adjustment of revolution and rotation speed proportion and further control the thickness uniformity of different film coating material films deposited on the substrate; and the use of the vacuum side gear transmission is reduced as much as possible, and the appearance defects of the film product are reduced.
The utility model discloses the purpose is realized accomplishing by following technical scheme:
a sputtering film forming apparatus includes a substrate tray revolution turntable and a substrate tray rotation turntable which are arranged in a vacuum film forming chamber, wherein the substrate tray revolution turntable can revolve in the vacuum film forming chamber, the substrate tray rotation turntable is connected with the substrate tray revolution turntable and can rotate in the vacuum film forming chamber, and the sputtering film forming apparatus is characterized in that: the substrate tray revolution turntable is in driving connection with a revolution motor arranged outside the vacuum film forming chamber and rotates under the driving of the revolution motor, the substrate tray rotation turntable is in driving connection with a rotation vacuum motor arranged inside the vacuum film forming chamber, the rotation vacuum motor is connected with a conductive slip ring arranged outside the vacuum film forming chamber through a vacuum leading-in electrode, and the substrate tray rotation turntable rotates under the driving of the rotation vacuum motor.
The substrate tray rotation turntable is characterized in that a plurality of sub-turntables are arranged below the substrate tray rotation turntable, the sub-turntables are respectively connected with non-contact magnetic transmission parts, and the plurality of sub-turntables can respectively realize multi-stage rotation driven by the substrate tray rotation turntable through the respective non-contact magnetic transmission parts.
The substrate supported by the substrate tray rotation turntable is horizontally or vertically placed.
The revolution motor is connected with the substrate tray revolution turntable through a transmission mechanism.
The utility model has the advantages that: the adjustment of the revolution-rotation speed ratio of the substrate tray is realized, the thickness uniformity of different coating material films deposited on the substrate can be obviously improved, and the preparation requirement of high-precision low-defect films can be met; the dust generated by friction vibration of the transmission gear set is reduced, and the defects of the substrate film are further reduced.
Drawings
Fig. 1 is a first schematic structural diagram of the present invention;
FIG. 2 is a second schematic structural view of the present invention;
fig. 3 is a schematic view of a third structure of the present invention.
Detailed Description
The features of the present invention and other related features are described in further detail below by way of example in conjunction with the accompanying drawings to facilitate understanding by those skilled in the art:
as shown in fig. 1-3, the labels 1-14 are respectively shown as: the device comprises a vacuum film forming chamber 1, a substrate tray revolution turntable 2, a substrate tray rotation turntable 3, a substrate 4, a sputtering unit 5, a reaction unit 6, a revolution motor 7, a conductive slip ring 8, a vacuum leading-in electrode 9, a magnetic fluid 10, a non-contact magnetic transmission part 11, a sub-turntable 12, a rotation vacuum motor 13 and a transmission structure 14.
The first embodiment is as follows: the sputtering method generally uses metal mode sputtering to prepare an optical thin film by depositing a target material thin film on a substrate when a substrate tray (workpiece tray) is rotated to a sputtering unit and reacting the target material thin film deposited on the surface of the substrate to form the optical thin film when the substrate tray is rotated to a reaction unit. As shown in fig. 1, the sputtering film forming apparatus according to the present embodiment includes a vacuum film forming chamber 1, and a substrate tray revolving turntable 2 and a substrate tray rotating turntable 3, which are provided as a film forming space, wherein the substrate tray revolving turntable 2 is revolvable in the vacuum film forming chamber 1, and the substrate tray rotating turntable 3 is connected below the substrate tray revolving turntable 2 and is rotatable in the vacuum film forming chamber 1. Substrates 4 placed horizontally are loaded below the substrate tray rotating table 3. A sputtering unit 5 and a reaction unit 6 are also arranged below the substrate tray rotation turntable 3; the substrate 4 moves in the vacuum film forming chamber 1 along with the revolution of the substrate tray revolution turntable 2 and the rotation of the substrate tray rotation turntable 3, and passes through the sputtering unit 5 and the reaction unit 6, thereby realizing the film formation on the surface of the substrate 4.
As shown in fig. 1, the sputtering film forming apparatus in this embodiment can freely adjust the revolution/rotation ratio, thereby improving the uniformity of the film thickness of different coating materials deposited on the substrate 4.
Specifically, as shown in fig. 1, a rotating shaft connected to a revolving motor 7 provided outside the vacuum film forming chamber 1 is provided at the center of the substrate tray revolving table 2, and the substrate tray revolving table 2 is made to revolve inside the vacuum film forming chamber 1 by the individual driving of the revolving motor 7 and the transmission of the rotating shaft. A magnetic fluid 10 is arranged at the periphery of the penetrating position of the rotating shaft at the top of the vacuum film forming chamber 1, and the magnetic fluid 10 is used for protecting the rotating shaft.
A rotating shaft is also provided at the center position of the substrate tray rotating table 3, and the rotating shaft is connected to a rotating vacuum motor 13, and the rotating vacuum motor 13 is disposed inside the vacuum film forming chamber 1, i.e., on the vacuum side. The rotation vacuum motor 13 is connected with the conductive slip ring 8 through the vacuum leading-in electrode 9, and the conductive slip ring 8 is arranged outside the vacuum film forming chamber 1, namely on the atmosphere side; the conductive slip ring 8 is a power component of the rotation vacuum motor 13, and drives the rotation vacuum motor 13 to operate so as to independently drive the substrate tray rotation turntable 3 to rotate inside the vacuum film forming chamber 1 through the rotating shaft.
As can be seen from the above, the substrate tray revolution turntable 2 is driven by the revolution motor 7 alone, and the substrate tray rotation turntable 3 is driven by the rotation vacuum motor 13 and the conductive slip ring 8 alone, so that the revolution-rotation speed ratio of the substrate tray revolution turntable 2 and the substrate tray rotation turntable 3 can be freely adjusted and rotated at high speed, thereby controlling the thickness uniformity of different coating material films deposited on the substrate.
Example two: as shown in fig. 2, the difference between the first embodiment and the second embodiment is: a multi-stage sub-turntable structure is further arranged below the substrate tray rotation turntable 3, the multi-stage sub-turntable structure comprises a plurality of sub-turntables 12, the number of the sub-turntables 12 can be selected according to actual conditions, but the sub-turntables 12 are generally symmetrically arranged by taking the rotating shaft of the substrate tray rotation turntable 3 as a symmetric center, so that the uniformity of the film thickness is ensured. The sub-turntable 12 is connected with a non-contact magnetic transmission part 11, the non-contact magnetic transmission part 11 can be matched with the rotating shaft of the substrate tray rotation turntable 3, and the function of the non-contact magnetic transmission part 11 is to transmit the rotation of the rotating shaft of the substrate tray rotation turntable 3 to the sub-turntable 12, so that each independent sub-turntable 3 can independently rotate below the substrate tray rotation turntable 3. The film formation accuracy can be improved more than in the first embodiment.
Example three: as shown in fig. 3, the difference between the first embodiment and the second embodiment is: a substrate 4 arranged vertically is loaded below the substrate tray rotation table 3, and a sputtering unit 5 and a reaction unit 6 are arranged in the vacuum film forming chamber 1 in accordance with the position of the substrate 4. With reference to the first embodiment, different loading modes can be selected according to different substrate sizes, so as to meet the film formation requirements of different substrates.
Meanwhile, another difference of the present embodiment compared to the first embodiment is that: the revolution motor 7 transmits its power to the rotation shaft of the substrate tray revolution turntable 2 through the transmission mechanism 14, so that the revolution motor 7 can be maintained at a later stage.
The above embodiments are embodied as follows: the conductive slip ring 8 may be constituted by a rotating electrode, a brush.
Although the conception and the embodiments of the present invention have been described in detail with reference to the drawings, those skilled in the art will recognize that various changes and modifications can be made therein without departing from the scope of the appended claims.
Claims (4)
1. A sputtering film forming apparatus includes a substrate tray revolution turntable and a substrate tray rotation turntable which are arranged in a vacuum film forming chamber, wherein the substrate tray revolution turntable can revolve in the vacuum film forming chamber, the substrate tray rotation turntable is connected with the substrate tray revolution turntable and can rotate in the vacuum film forming chamber, and the sputtering film forming apparatus is characterized in that: the substrate tray revolution turntable is in driving connection with a revolution motor arranged outside the vacuum film forming chamber and rotates under the driving of the revolution motor, the substrate tray rotation turntable is in driving connection with a rotation vacuum motor arranged inside the vacuum film forming chamber, the rotation vacuum motor is connected with a conductive slip ring arranged outside the vacuum film forming chamber through a vacuum leading-in electrode, and the substrate tray rotation turntable rotates under the driving of the rotation vacuum motor.
2. The sputtering film forming apparatus according to claim 1, wherein: the substrate tray rotation turntable is characterized in that a plurality of sub-turntables are arranged below the substrate tray rotation turntable, the sub-turntables are respectively connected with non-contact magnetic transmission parts, and the plurality of sub-turntables can respectively realize multi-stage rotation driven by the substrate tray rotation turntable through the respective non-contact magnetic transmission parts.
3. The sputtering film forming apparatus according to claim 1, wherein: the substrate supported by the substrate tray rotation turntable is horizontally or vertically placed.
4. The sputtering film forming apparatus according to claim 1, wherein: the revolution motor is connected with the substrate tray revolution turntable through a transmission mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921510677.4U CN210420144U (en) | 2019-09-11 | 2019-09-11 | Sputtering film forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921510677.4U CN210420144U (en) | 2019-09-11 | 2019-09-11 | Sputtering film forming device |
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| Publication Number | Publication Date |
|---|---|
| CN210420144U true CN210420144U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921510677.4U Active CN210420144U (en) | 2019-09-11 | 2019-09-11 | Sputtering film forming device |
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| CN (1) | CN210420144U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408904A (en) * | 2019-09-11 | 2019-11-05 | 光驰科技(上海)有限公司 | A kind of spattering filming device |
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2019
- 2019-09-11 CN CN201921510677.4U patent/CN210420144U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408904A (en) * | 2019-09-11 | 2019-11-05 | 光驰科技(上海)有限公司 | A kind of spattering filming device |
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