CN104838037B - 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 - Google Patents

金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 Download PDF

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Publication number
CN104838037B
CN104838037B CN201480003438.3A CN201480003438A CN104838037B CN 104838037 B CN104838037 B CN 104838037B CN 201480003438 A CN201480003438 A CN 201480003438A CN 104838037 B CN104838037 B CN 104838037B
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Prior art keywords
metallic plate
deposition mask
sample
etched
region
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English (en)
Chinese (zh)
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CN104838037A (zh
Inventor
池永知加雄
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to CN201911326369.0A priority Critical patent/CN110938798A/zh
Priority to CN201711267429.7A priority patent/CN108048793B/zh
Priority to CN201711267436.7A priority patent/CN107858644A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/22—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/26—Methods of annealing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5806—Thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C23F1/04—Chemical milling
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201480003438.3A 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 Active CN104838037B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201911326369.0A CN110938798A (zh) 2013-01-10 2014-01-10 蒸镀掩模的制造方法
CN201711267429.7A CN108048793B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法
CN201711267436.7A CN107858644A (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013002924 2013-01-10
JP2013-002924 2013-01-10
JP2013-153920 2013-07-24
JP2013153920A JP5382257B1 (ja) 2013-01-10 2013-07-24 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
PCT/JP2014/050346 WO2014109394A1 (ja) 2013-01-10 2014-01-10 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法

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CN201711267436.7A Division CN107858644A (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法
CN201711267429.7A Division CN108048793B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法
CN201911326369.0A Division CN110938798A (zh) 2013-01-10 2014-01-10 蒸镀掩模的制造方法

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CN104838037A CN104838037A (zh) 2015-08-12
CN104838037B true CN104838037B (zh) 2017-11-21

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CN201711267436.7A Pending CN107858644A (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法
CN201911326369.0A Pending CN110938798A (zh) 2013-01-10 2014-01-10 蒸镀掩模的制造方法
CN201480003438.3A Active CN104838037B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法
CN201711267429.7A Active CN108048793B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法

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CN201911326369.0A Pending CN110938798A (zh) 2013-01-10 2014-01-10 蒸镀掩模的制造方法

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JP (1) JP5382257B1 (ja)
KR (2) KR102087056B1 (ja)
CN (4) CN107858644A (ja)
WO (1) WO2014109394A1 (ja)

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JP5455099B1 (ja) 2013-09-13 2014-03-26 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
JP5516816B1 (ja) 2013-10-15 2014-06-11 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP6698265B2 (ja) * 2014-02-14 2020-05-27 大日本印刷株式会社 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体
JP5641462B1 (ja) * 2014-05-13 2014-12-17 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
DE202016008840U1 (de) 2015-02-10 2020-02-11 Dai Nippon Printing Co., Ltd. Metallblech
EP3288097A4 (en) * 2015-04-24 2019-05-15 LG Innotek Co., Ltd. METAL SUBSTRATE AND SEPARATION MASK THEREWITH
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WO2017179719A1 (ja) * 2016-04-14 2017-10-19 凸版印刷株式会社 蒸着マスク用基材、蒸着マスク用基材の製造方法、および、蒸着マスクの製造方法
KR102624714B1 (ko) * 2016-09-12 2024-01-12 삼성디스플레이 주식회사 마스크 및 이를 포함하는 마스크 조립체의 제조방법
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KR102333411B1 (ko) * 2017-01-10 2021-12-02 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크 장치의 제조 방법 및 증착 마스크의 제조 방법
CN116083843A (zh) * 2017-09-07 2023-05-09 Lg伊诺特有限公司 金属材料oled沉积掩模及沉积掩模的残余应力的测量方法
CN110578119A (zh) * 2018-06-08 2019-12-17 大日本印刷株式会社 金属板、卷绕体及其梱包方法和保管方法、梱包体、蒸镀掩模的制造方法
KR20230051717A (ko) * 2018-07-09 2023-04-18 다이니폰 인사츠 가부시키가이샤 증착 마스크의 제조 방법 및 증착 마스크 장치의 제조 방법
WO2020067537A1 (ja) * 2018-09-27 2020-04-02 日鉄ケミカル＆マテリアル株式会社 メタルマスク材料及びその製造方法とメタルマスク
JP2019151936A (ja) * 2019-06-11 2019-09-12 大日本印刷株式会社 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体
CN111254386A (zh) * 2020-03-26 2020-06-09 昆山国显光电有限公司 掩膜条及掩膜板
WO2022092848A1 (ko) * 2020-10-30 2022-05-05 에이피에스홀딩스 주식회사 증착 마스크
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CN113005399A (zh) * 2021-02-23 2021-06-22 合肥鑫晟光电科技有限公司 掩膜板的制作方法及掩膜板

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