CN107858644A - 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 - Google Patents

金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 Download PDF

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Publication number
CN107858644A
CN107858644A CN201711267436.7A CN201711267436A CN107858644A CN 107858644 A CN107858644 A CN 107858644A CN 201711267436 A CN201711267436 A CN 201711267436A CN 107858644 A CN107858644 A CN 107858644A
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China
Prior art keywords
metallic plate
deposition mask
sample
face
metal sheet
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Pending
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CN201711267436.7A
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English (en)
Chinese (zh)
Inventor
池永知加雄
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of CN107858644A publication Critical patent/CN107858644A/zh
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/22Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/26Methods of annealing
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5806Thermal treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • C23F1/04Chemical milling
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/28Acidic compositions for etching iron group metals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201711267436.7A 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 Pending CN107858644A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013-002924 2013-01-10
JP2013002924 2013-01-10
JP2013153920A JP5382257B1 (ja) 2013-01-10 2013-07-24 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP2013-153920 2013-07-24
CN201480003438.3A CN104838037B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法

Related Parent Applications (1)

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CN201480003438.3A Division CN104838037B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法

Publications (1)

Publication Number Publication Date
CN107858644A true CN107858644A (zh) 2018-03-30

Family

ID=50036549

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201480003438.3A Active CN104838037B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法
CN201911326369.0A Pending CN110938798A (zh) 2013-01-10 2014-01-10 蒸镀掩模的制造方法
CN201711267436.7A Pending CN107858644A (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法
CN201711267429.7A Active CN108048793B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法

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CN201480003438.3A Active CN104838037B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法
CN201911326369.0A Pending CN110938798A (zh) 2013-01-10 2014-01-10 蒸镀掩模的制造方法

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CN201711267429.7A Active CN108048793B (zh) 2013-01-10 2014-01-10 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法

Country Status (4)

Country Link
JP (1) JP5382257B1 (ja)
KR (2) KR102087056B1 (ja)
CN (4) CN104838037B (ja)
WO (1) WO2014109394A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111254386A (zh) * 2020-03-26 2020-06-09 昆山国显光电有限公司 掩膜条及掩膜板

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JP5455099B1 (ja) 2013-09-13 2014-03-26 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
JP5516816B1 (ja) 2013-10-15 2014-06-11 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP6698265B2 (ja) * 2014-02-14 2020-05-27 大日本印刷株式会社 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体
JP5641462B1 (ja) * 2014-05-13 2014-12-17 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
DE202016008840U1 (de) 2015-02-10 2020-02-11 Dai Nippon Printing Co., Ltd. Metallblech
KR101603200B1 (ko) * 2015-04-24 2016-03-14 엘지이노텍 주식회사 금속기판 및 이를 이용한 증착용마스크
EP3993075A1 (en) * 2015-04-24 2022-05-04 Lg Innotek Co. Ltd Deposition mask
CN110144547B (zh) * 2016-04-14 2021-06-01 凸版印刷株式会社 蒸镀掩模用基材、蒸镀掩模用基材的制造方法及蒸镀掩模的制造方法
KR102624714B1 (ko) 2016-09-12 2024-01-12 삼성디스플레이 주식회사 마스크 및 이를 포함하는 마스크 조립체의 제조방법
CN109689921A (zh) * 2016-09-14 2019-04-26 夏普株式会社 掩模片、蒸镀掩模、显示面板的制造方法
EP3521482A4 (en) * 2016-09-29 2020-08-12 Dai Nippon Printing Co., Ltd. VAPOR DEPOSIT MASK PACKAGING AND VAPOR DEPOSIT MASK PACKAGING PROCESS
EP3524710B8 (en) * 2016-10-07 2024-01-24 Dai Nippon Printing Co., Ltd. Method of manufacturing deposition mask, intermediate product to which deposition mask is allocated, and deposition mask
US11220736B2 (en) * 2016-11-18 2022-01-11 Dai Nippon Printing Co., Ltd. Deposition mask
JP7121918B2 (ja) * 2016-12-14 2022-08-19 大日本印刷株式会社 蒸着マスク装置及び蒸着マスク装置の製造方法
JP6851820B2 (ja) * 2016-12-28 2021-03-31 マクセルホールディングス株式会社 蒸着用マスク並びにその設置方法及び製造方法
KR102333411B1 (ko) * 2017-01-10 2021-12-02 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크 장치의 제조 방법 및 증착 마스크의 제조 방법
CN110578119A (zh) * 2018-06-08 2019-12-17 大日本印刷株式会社 金属板、卷绕体及其梱包方法和保管方法、梱包体、蒸镀掩模的制造方法
JP7137793B2 (ja) * 2018-07-09 2022-09-15 大日本印刷株式会社 蒸着マスクの良否判定方法、蒸着マスクの製造方法、蒸着マスク装置の製造方法、蒸着マスクの選定方法および蒸着マスク
KR20210049888A (ko) * 2018-09-27 2021-05-06 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 메탈 마스크 재료 및 그의 제조 방법과 메탈 마스크
JP2019151936A (ja) * 2019-06-11 2019-09-12 大日本印刷株式会社 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体
WO2022092848A1 (ko) * 2020-10-30 2022-05-05 에이피에스홀딩스 주식회사 증착 마스크
KR20220069397A (ko) * 2020-11-20 2022-05-27 엘지이노텍 주식회사 Oled 화소 증착을 위한 증착용 마스크
CN113005399A (zh) * 2021-02-23 2021-06-22 合肥鑫晟光电科技有限公司 掩膜板的制作方法及掩膜板

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