KR101761494B1 - 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 - Google Patents

금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 Download PDF

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KR101761494B1
KR101761494B1 KR1020157009821A KR20157009821A KR101761494B1 KR 101761494 B1 KR101761494 B1 KR 101761494B1 KR 1020157009821 A KR1020157009821 A KR 1020157009821A KR 20157009821 A KR20157009821 A KR 20157009821A KR 101761494 B1 KR101761494 B1 KR 101761494B1
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South Korea
Prior art keywords
metal plate
deposition mask
sample
etched
manufacturing
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KR1020157009821A
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English (en)
Korean (ko)
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KR20150103655A (ko
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치카오 이케나가
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다이니폰 인사츠 가부시키가이샤
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Priority to KR1020177020095A priority Critical patent/KR102087056B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/22—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/26—Methods of annealing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5806—Thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C23F1/04—Chemical milling
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020157009821A 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 KR101761494B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020177020095A KR102087056B1 (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2013-002924 2013-01-10
JP2013002924 2013-01-10
JP2013153920A JP5382257B1 (ja) 2013-01-10 2013-07-24 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JPJP-P-2013-153920 2013-07-24
PCT/JP2014/050346 WO2014109394A1 (ja) 2013-01-10 2014-01-10 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法

Related Child Applications (1)

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KR1020177020095A Division KR102087056B1 (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Publications (2)

Publication Number Publication Date
KR20150103655A KR20150103655A (ko) 2015-09-11
KR101761494B1 true KR101761494B1 (ko) 2017-07-25

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KR1020177020095A KR102087056B1 (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020157009821A KR101761494B1 (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020177020095A KR102087056B1 (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Country Status (4)

Country Link
JP (1) JP5382257B1 (ja)
KR (2) KR102087056B1 (ja)
CN (4) CN104838037B (ja)
WO (1) WO2014109394A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2022108152A1 (ko) * 2020-11-20 2022-05-27 엘지이노텍 주식회사 Oled 화소 증착을 위한 증착용 마스크

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JP5516816B1 (ja) 2013-10-15 2014-06-11 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP6698265B2 (ja) * 2014-02-14 2020-05-27 大日本印刷株式会社 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体
JP5641462B1 (ja) * 2014-05-13 2014-12-17 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
DE202016008840U1 (de) 2015-02-10 2020-02-11 Dai Nippon Printing Co., Ltd. Metallblech
KR101603200B1 (ko) * 2015-04-24 2016-03-14 엘지이노텍 주식회사 금속기판 및 이를 이용한 증착용마스크
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KR102624714B1 (ko) 2016-09-12 2024-01-12 삼성디스플레이 주식회사 마스크 및 이를 포함하는 마스크 조립체의 제조방법
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JP6851820B2 (ja) * 2016-12-28 2021-03-31 マクセルホールディングス株式会社 蒸着用マスク並びにその設置方法及び製造方法
KR102333411B1 (ko) * 2017-01-10 2021-12-02 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크 장치의 제조 방법 및 증착 마스크의 제조 방법
CN110578119A (zh) * 2018-06-08 2019-12-17 大日本印刷株式会社 金属板、卷绕体及其梱包方法和保管方法、梱包体、蒸镀掩模的制造方法
JP7137793B2 (ja) * 2018-07-09 2022-09-15 大日本印刷株式会社 蒸着マスクの良否判定方法、蒸着マスクの製造方法、蒸着マスク装置の製造方法、蒸着マスクの選定方法および蒸着マスク
KR20210049888A (ko) * 2018-09-27 2021-05-06 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 메탈 마스크 재료 및 그의 제조 방법과 메탈 마스크
JP2019151936A (ja) * 2019-06-11 2019-09-12 大日本印刷株式会社 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体
CN111254386A (zh) * 2020-03-26 2020-06-09 昆山国显光电有限公司 掩膜条及掩膜板
WO2022092848A1 (ko) * 2020-10-30 2022-05-05 에이피에스홀딩스 주식회사 증착 마스크
CN113005399A (zh) * 2021-02-23 2021-06-22 合肥鑫晟光电科技有限公司 掩膜板的制作方法及掩膜板

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