CN104812179B - The hole copper preparation technology and printed circuit board (PCB) of a kind of printed circuit board (PCB) - Google Patents
The hole copper preparation technology and printed circuit board (PCB) of a kind of printed circuit board (PCB) Download PDFInfo
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- CN104812179B CN104812179B CN201510190993.8A CN201510190993A CN104812179B CN 104812179 B CN104812179 B CN 104812179B CN 201510190993 A CN201510190993 A CN 201510190993A CN 104812179 B CN104812179 B CN 104812179B
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- Prior art keywords
- circuit board
- printed circuit
- pcb
- copper
- hole
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
Abstract
The invention belongs to art of printed circuit boards, it is related to a kind of hole copper preparation technology of printed circuit board (PCB), and in particular to the hole copper preparation technology and printed circuit board (PCB) of a kind of thick copper circuit board.The disposable copper plating of the mode for employing bevelling plating of the present invention, its advantage is that the face copper of plating is thicker, can be effectively improved the thick uniformity of electro-coppering；Using this step of selective resin consent, can be very good to shorten Making programme, so as to shorten the production cycle of product, and Making programme is optimized, critical technological point is weakened, it is often more important that, the quality of product and the output of product can be preferably lifted, there is great market prospects and economic value.
Description
Technical field
The present invention relates to a kind of hole copper preparation technology of printed circuit board (PCB), and in particular to a kind of hole copper of thick copper circuit board
Standby technique and printed circuit board (PCB).
Background technology
In recent years, as the high speed development of electronic product, the wiring density of printed circuit board (PCB) improve constantly, circuit is increasingly
Carefully, through hole radius-thickness ratio is increasing, and downstream client is to the thick requirement of the copper of connecting hole and circuit also more and more higher, especially hole copper
Thickness requirement is more strict, it usually needs and hole copper thickness is more than or equal to 38 μm, and some even require that hole copper thickness is more than 60 μm,
Far above IPC-3 level copper thickness standards.But copper layer thickness is too high, the making of fine-line will appear from difficulty.In the printing of routine
During circuit board making, an electric plating of whole board typically is used on the basis of heavy copper, i.e., according to customer requirement, in printed circuit
The table copper thickness and hole copper thickness of customer requirement are disposably electroplated on substrate, for heavy copper+electric plating of whole board mode；Or in once full plate
A graphic plating is aided in after plating again, i.e., heavy copper+electric plating of whole board+graphic plating mode.Although above two method can expire
The making requirement of sufficient plain bore copper, but for thick hole copper circuit board, it is more harsh to technological requirement, commonsense method is
It can not meet, easily influence reliability of the client to product.As first method can not meet device to hole copper thickness requirement be more than or
Situation equal to 38 μm；And second method when graphic plating then be present face copper can increase a lot, add circuit etching difficulty
The shortcomings that, and the defects of pressing from both sides film is easily caused, and it is unsuitable for the wiring board production method of selective filling holes with resin.And due to table
There is contradiction in the requirement of copper thickness, the making for high thickness to diameter ratio, fine printed circuit board (PCB) is conventional with the requirement of hole copper thickness
There is bottleneck in print circuit plates making method, it is difficult to can not even produce the printed circuit board (PCB) of high thickness to diameter ratio, fine-line.
In order to solve the above technical problems, Chinese patent literature CN101841972 A disclose a kind of high thickness to diameter ratio, fine lines
The preparation method of PCB plate, it uses electric plating of whole board twice, is not plated using an once plated hole copper between electric plating of whole board twice
The flow of table copper, above-mentioned preparation method can reduce table copper thickness, but this method obtains while hole copper thickness requirement is met
To printed circuit board (PCB) easily there is burr, product yield is low, poor quality, while the above method, and technological process is complicated, production week
Phase is long, precise circuit board plating difficulty is larger, requires high to electroplating hole equipment and electroplating liquid medicine photo etching；And waste a large amount of copper moneys
Source, water resource and power resource, energy-saving, the industry state basic policy of emission reduction of country's proposition is not met.
The content of the invention
Therefore, it is an object of the present invention to easily there is the defects of burr, product yield in printed circuit board (PCB) in the prior art
Low, production cycle length, circuit etches the production method that difficulty is big, is not suitable for selective resin consent, production cost height, wasted
The technical problem of ample resources, for above the deficiencies in the prior art, there is provided a kind of cost is low, effect is good, production yield is high
Printed circuit board (PCB) electroplate technology.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of hole copper preparation technology of printed circuit board (PCB), and the preparation technology comprises the following steps：
(1) drilling formation is carried out according to preset aperture to printed circuit board (PCB)；
(2) to after drilling the printed circuit board (PCB) carry out electroless copper plating processing, make nonconducting hole turn into metal aperture from
It is and conductive；
(3) electroplating surface Copper treatment is carried out to the printed circuit board surface and metal hole wall；
(4) figure corresponding with the metal aperture is made using the film, is opened a window in the position of the metal aperture, and to windowing
Metal hole plating copper；
(5) confirm that metal hole plating copper effect meets to take off the film after requiring, selectivity is carried out to the metal aperture
Filling holes with resin, abrasive belt grinding leveling is carried out after filling holes with resin；
(6) after being tested and analyzed to the printed circuit board (PCB), to the heavy nickel gold of hole inwall and printed circuit board (PCB) is subjected to gong
Sheet metal forming.
Plating mode in the step (3) is the mode of bevelling plating, is concretely comprised the following steps：First to the printed circuit board (PCB)
Once electroplated, then lower plate then carries out second time electroplating by the side that original clip point is electroplated to falling.
The radius-thickness ratio of the metal aperture is less than or equal to 8: 1.
In the step (4), the windows radius of the film is bigger 75-150um than metal pore radius.
Further, also include the core plate containing internal layer circuit, prepreg and outer copper foil before the step (1)
The step of lamination turns into complete printed circuit board (PCB).
In the step (6), the silk-screen welding resistance uses catch point wire mark brush, and the resist thickness is 12 μm -50 μm.
In the step (6), during the heavy nickel gold, nickel layer thickness is 2.5-5 μm, and layer gold thickness is 0.075-
0.175μm。
The invention also discloses a kind of printed circuit board (PCB), and it contains the copper hole that described hole copper preparation technology obtains.
The above-mentioned technical proposal of the present invention has advantages below compared with prior art：
(1) the hole copper preparation technology of printed circuit board (PCB) of the present invention, disclosure satisfy that art of printed circuit boards to high hole
The requirement of copper thickness, only containing once electric plating of whole board and a plated hole step, simplify Making programme, shorten the production cycle,
Cost of manufacture has been saved, and the making requirement to thick hole copper and needs selective resin consent product can be met；Obtained print
Peak at brush wiring board aperture is improved well, is improved the yield of product, is improved the quality of product.
(2) the hole copper preparation technology of printed circuit board (PCB) of the present invention, disposably by face by the way of bevelling plating
Copper plating is enough, reaches the face copper thickness requirement of client, and the copper thickness that the abrasive belt grinding after follow-up filling holes with resin consumes is considered
Enter, the benefit by the way of bevelling plating is that the face copper of plating is thicker, can be effectively improved the thick uniformity of electro-coppering.
Brief description of the drawings
In order that present disclosure is more likely to be clearly understood, specific embodiment and combination below according to the present invention
Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation for the hole copper that the hole copper preparation technology of printed circuit board (PCB) of the present invention is prepared；
Fig. 2 is the hole copper preparation technology flow chart of printed circuit board (PCB) of the present invention.
Reference is expressed as in figure：1- bottoms layers of copper, 2- electric plating of whole board layers of copper, 3- plated hole layers of copper.
Embodiment
As depicted in figs. 1 and 2, the present embodiment provides a kind of hole copper preparation technology of wiring board, and the preparation technology includes
Following steps：
(1) core plate containing internal layer circuit, prepreg and bottom layers of copper 1 using the typesetting of preventing wrinkle method and are laminated
Processing, obtains printed circuit board (PCB), and the hole of preset aperture is bored in printed circuit board (PCB) outer layer；
(2) electroless copper plating processing is carried out to the printed circuit board (PCB), nonconducting hole wall is turned into metal aperture so as to conductive.
During electroless copper plating, in addition to twice chemistry removing glue the step of.(3) to printed circuit board (PCB) by the way of bevelling plating
Surface and the disposable surfacing copper 42um of metal hole wall, obtain electric plating of whole board layers of copper 2, detailed process is：First with 1.75 amperes/square
The current density plating 60min of decimetre, then lower plate by the side that original clip point is electroplated to falling, then by 1.75 amperes/square decimeter
Current density plating 60min.
(4) outer layer plating hole pattern corresponding with the metal aperture is made using the film, film catch point is unilateral bigger than boring nozzle
0.1mm, the film is opened a window in the position of the metal aperture, and to the metal hole plating copper 30um after windowing, obtains plated hole layers of copper 3,
The metal aperture radius-thickness ratio is 4.7374.
(5) after confirming that hole copper reaches requirement, the film on surface is carried out moving back film taking off film line, then using antivacuum consent
Machine carries out selective resin consent in a manner of aluminium flake consent, and the unnecessary resin in aperture is carried out into abrasive band removing and whole after resin solidification
Platen surface.
(6) negative film etching is carried out to outer graphics, then carries out outer layer automatic optics inspection, detect the presence of surface defect,
Silk-screen welding resistance is carried out by the way of silk-screen printing afterwards, resist thickness is 25 μm, and section point is carried out to the semi-finished product of group postwelding
Analysis, judges whether resist thickness meets the requirements, then sinks nickel gold to the metal aperture inwall to improve corrosion resistance or meet low
Resistance value requirement, wherein, nickel layer thickness be 3 μm, layer gold thickness be 0.15 μm, finally by the printed circuit board (PCB) carry out gong plate into
Type, obtain the printed circuit board (PCB) with macropore copper thickness.
Hole copper preparation technology described in the present embodiment, only obtain high hole containing once electric plating of whole board and a plated hole step
The printed circuit board (PCB) of copper thickness, simplifies Making programme, shortens the production cycle, has saved cost of manufacture, and obtained print
Peak at brush wiring board aperture has obtained good improvement, improves the yield of product, improves the quality of product.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (5)
1. the hole copper preparation technology of a kind of printed circuit board (PCB), it is characterised in that the preparation technology comprises the following steps：
(1) drilling formation is carried out according to preset aperture to printed circuit board (PCB)；
(2) electroless copper plating processing is carried out to the printed circuit board (PCB), nonconducting hole is turned into metal aperture so as to conductive；
(3) electroplating surface Copper treatment is carried out to the printed circuit board surface and metal hole wall；
(4) figure corresponding with the metal aperture is made using the film, is opened a window in the position of the metal aperture, and to the gold of windowing
Belong to hole plating copper；
(5) confirm that metal hole plating copper effect meets to take off the film after requiring, selective resin is carried out to the metal aperture
Consent, abrasive belt grinding leveling is carried out after filling holes with resin；
(6) after silk-screen welding resistance, detection and analysis being carried out to the printed circuit board (PCB), to the heavy nickel gold of hole inwall and printed circuit board (PCB) is entered
Row gong sheet metal forming；
Plating mode in the step (3) is the mode of bevelling plating, is concretely comprised the following steps：First the printed circuit board (PCB) is carried out
Once electroplate, then lower plate exchanges the side that original clip point is electroplated, then carries out second time electroplating；
The radius-thickness ratio of the metal aperture is less than or equal to 8:1；
In the step (4), the windows radius of the film is bigger than metal pore radius 75-150 μm.
2. the hole copper preparation technology of printed circuit board (PCB) according to claim 1, it is characterised in that before the step (1)
The step of also including the core plate containing internal layer circuit, prepreg and outer copper foil lamination turning into complete printed circuit board (PCB).
3. the hole copper preparation technology of printed circuit board (PCB) according to claim 1, it is characterised in that in the step (6), institute
State silk-screen welding resistance and use catch point wire mark brush, the resist thickness is 12 μm -50 μm.
4. the hole copper preparation technology of printed circuit board (PCB) according to claim 1, it is characterised in that in the step (6), institute
During stating heavy nickel gold, nickel layer thickness is 2.5-5 μm, and layer gold thickness is 0.075-0.175 μm.
5. a kind of printed circuit board (PCB), it is characterised in that it contains is obtained as the hole copper preparation technology described in claim any one of 1-4
The copper hole arrived.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510190993.8A CN104812179B (en) | 2015-04-21 | 2015-04-21 | The hole copper preparation technology and printed circuit board (PCB) of a kind of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510190993.8A CN104812179B (en) | 2015-04-21 | 2015-04-21 | The hole copper preparation technology and printed circuit board (PCB) of a kind of printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104812179A CN104812179A (en) | 2015-07-29 |
| CN104812179B true CN104812179B (en) | 2017-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510190993.8A Expired - Fee Related CN104812179B (en) | 2015-04-21 | 2015-04-21 | The hole copper preparation technology and printed circuit board (PCB) of a kind of printed circuit board (PCB) |
Country Status (1)
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142361A (en) * | 2015-08-04 | 2015-12-09 | 永利电子铜陵有限公司 | Resin hole-plugging process for PCB through holes |
| CN107347229A (en) * | 2016-05-06 | 2017-11-14 | 鹤山市中富兴业电路有限公司 | The process of wiring board selective resin consent |
| CN109640529A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of manufacture craft of two-sided super thick copper sheet |
| CN110225658A (en) * | 2019-03-21 | 2019-09-10 | 深圳崇达多层线路板有限公司 | A kind of production method meeting hole copper thickness and table copper thickness can be limited and be the PCB that nut cap is handled |
| CN113068327A (en) * | 2021-02-26 | 2021-07-02 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with uniformly plated holes |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1117283A1 (en) * | 1998-09-14 | 2001-07-18 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN103118506A (en) * | 2013-01-22 | 2013-05-22 | 金悦通电子（翁源）有限公司 | Electroplating hole filling method for via hole on bonding pad |
| CN103533766A (en) * | 2013-10-22 | 2014-01-22 | 东莞生益电子有限公司 | Fabrication method of circuit board and circuit board fabricated by method |
| CN103796449A (en) * | 2014-01-24 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing high-thickness-to-diameter-ratio circuit board plated filled via hole |
-
2015
- 2015-04-21 CN CN201510190993.8A patent/CN104812179B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1117283A1 (en) * | 1998-09-14 | 2001-07-18 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN103118506A (en) * | 2013-01-22 | 2013-05-22 | 金悦通电子（翁源）有限公司 | Electroplating hole filling method for via hole on bonding pad |
| CN103533766A (en) * | 2013-10-22 | 2014-01-22 | 东莞生益电子有限公司 | Fabrication method of circuit board and circuit board fabricated by method |
| CN103796449A (en) * | 2014-01-24 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing high-thickness-to-diameter-ratio circuit board plated filled via hole |
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| Publication number | Publication date |
|---|---|
| CN104812179A (en) | 2015-07-29 |
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