CN113068327A - Method for manufacturing circuit board with uniformly plated holes - Google Patents
Method for manufacturing circuit board with uniformly plated holes Download PDFInfo
- Publication number
- CN113068327A CN113068327A CN202110216598.8A CN202110216598A CN113068327A CN 113068327 A CN113068327 A CN 113068327A CN 202110216598 A CN202110216598 A CN 202110216598A CN 113068327 A CN113068327 A CN 113068327A
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- CN
- China
- Prior art keywords
- plated
- hole
- circuit board
- holes
- plating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Abstract
The invention discloses a method for manufacturing a circuit board with uniformly plated holes, which sequentially comprises the following steps: performing pretreatment to form a multilayer circuit board; drilling and plate electronics: presetting a plated hole region and a non-plated hole region on the circuit board, drilling holes on the plated hole region, and then performing board electricity on the circuit board after drilling holes; outer layer hole plating pattern: determining a hole to be plated, which needs to be plated, in a plurality of holes formed by drilling, and windowing at the position of the hole to be plated, wherein the windowing size is larger than the single side of the hole to be plated; windowing is carried out on the non-plated hole area to form a plurality of exposed dispersed current pads; plating holes: thickening hole copper in the hole to be plated; grinding a plate: grinding the orifice and the dispersed current pad after hole plating to enable the surface of the circuit board to be flat; and (5) post-flow processing. The invention has good hole plating effect, avoids the problems of small holes, hole blockage or plate burning of the plated holes, and the dispersed current pad plays a role in dispersing current, ensures uniform electroplating during hole plating and improves the quality of products.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for manufacturing a circuit board with uniformly plated holes.
Background
With the development of circuit boards, the requirements on the quality and reliability of the circuit boards are higher and higher, in order to obtain higher reliability, the requirements on the hole copper of through holes are also correspondingly higher, especially at the position of a connection heat dissipation area, the minimum value of the requirements on the hole copper thickness is even 2mil, the line width and the space of a circuit are generally 4mil, and the requirements on the hole copper thickness and the circuit size cannot be completely met by the conventional primary copper and secondary copper processes. In the prior art, after the circuit board is drilled, copper deposition electroplating is directly carried out on a formed through hole, because the plated area is small, current is concentrated at the position of an orifice during hole plating, electroplating is not uniform, the hole diameters at two ends of the hole are small, and even the problems of abnormal quality such as hole plugging, board burning and the like occur.
Disclosure of Invention
The invention provides a method for manufacturing a circuit board with uniformly plated holes, which aims to solve the problems of small aperture, hole blockage, board burning and the like caused by nonuniform electroplating during hole plating of the circuit board.
A manufacturing method of a circuit board with uniformly plated holes sequentially comprises the following steps:
performing pretreatment to form a multilayer circuit board;
drilling and plate electronics: presetting a plated hole region and a non-plated hole region on the circuit board, drilling holes on the plated hole region, and then performing board electricity on the circuit board after drilling holes;
outer layer hole plating pattern: determining a hole to be plated, which needs to be plated, in a plurality of holes formed by drilling, and windowing at the position of the hole to be plated, wherein the windowing size is larger than the single side of the hole to be plated; windowing is carried out on the non-plated hole area to form a plurality of exposed dispersed current pads;
plating holes: thickening hole copper in the hole to be plated;
grinding a plate: grinding the orifice and the dispersed current pad after hole plating to enable the surface of the circuit board to be flat;
and (5) post-flow processing. The manufacturing method of the invention has lower cost, and the thickness of the hole copper in the formed electroplating hole is more uniform, thus improving the yield of the electroplating hole and ensuring the quality of the circuit board product.
Optionally, the front flow processing sequentially comprises cutting, inner layer patterning, inner layer AOI, pressing and cutting and grinding, the circuit board is subjected to membrane removal after hole plating, and then the circuit board is subjected to plate grinding after membrane removal.
Optionally, the post-process treatment sequentially comprises outer layer circuit pattern, pattern electroplating, outer layer etching, outer layer AOI, solder mask, character, surface treatment and molding.
Optionally, the step of molding the circuit board is as follows: electrical testing, FQC, OQC, and packaging.
Optionally, the windowing size is 4-8 mil larger than the single edge of the hole to be plated, and the electroplating effect of the hole to be plated can be improved.
Optionally, the windowing size of windowing on the non-plated hole area is 10-20 mil, so that the plated hole effect can be improved, and abnormal quality is avoided.
Optionally, the distances between the dispersing currents pad are equal.
Optionally, the grinding is performed by using a belt grinding plate, so that the grinding effect is good.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for manufacturing a circuit board with uniformly plated holes, which improves and optimizes the process, has good hole plating effect and avoids the problems of small holes, hole blockage or board burning of plated holes; the hole plating device is characterized in that holes are drilled in a hole plating area, a dispersed current pad is arranged on a non-hole plating area, windows are formed in positions of holes to be plated, the dispersed current pad plays a role in dispersing current, the problem of abnormal quality caused by current concentration can be solved, electroplating uniformity during hole plating is guaranteed, and product quality is improved.
Drawings
FIG. 1 is a flow chart of the method of making a circuit board with uniform plated holes of the present invention.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments.
A manufacturing method of a circuit board with uniformly plated holes sequentially comprises the following steps:
performing pretreatment to form a multilayer circuit board; the front flow processing sequentially comprises cutting, inner layer graph, inner layer AOI, pressing and cutting grinding, specifically, the cutting cuts a plurality of substrates, the inner layer graph is manufactured on the substrate positioned on the inner layer of the circuit board after subsequent pressing, the inner layer AOI ensures the quality, and the qualified substrates are pressed.
Drilling and plate electronics: presetting a plated hole area and a non-plated hole area on the circuit board, drilling holes on the plated hole area, and then performing board electricity on the circuit board after drilling holes.
Outer layer hole plating pattern: and (3) determining a hole to be plated, which needs to be plated, in a plurality of holes formed by drilling, windowing at the position of the hole to be plated, wherein the windowing size is larger than the single side of the hole to be plated, and in some embodiments, the windowing size is 4-8 mil larger than the single side of the hole to be plated. Windowing is performed on the non-plated hole area to form a plurality of exposed dispersed current pads, and in some embodiments, the windowing size of the windowing performed on the non-plated hole area is 10-20 mils, preferably 10 mils.
Plating holes: thickening the hole copper in the hole to be plated. And (4) setting proper electroplating parameters for plating holes according to the thickness requirement of the hole copper.
Specifically, the area that receives the plating can be increased to the dispersed current pad when the plating hole, prevents that the plating hole current transition from concentrating, plays the effect of dispersed current, and the hole copper thickness of plating hole both ends position is little than its middle section position hole copper thickness difference, and the plating hole is even, effectual. In some embodiments, the spacing between the spreading currents pad is equal.
Grinding a plate: and grinding the orifice and the dispersed current pad after hole plating to enable the board surface of the circuit board to be flat, wherein the grinding adopts a belt grinding board. Copper is electroplated in the holes to be plated and the dispersed current pad during hole plating, and redundant copper on the surface of the circuit board can be removed by the abrasive belt grinding plate, so that the surface is smooth. And (3) removing the film of the circuit board after hole plating, grinding the circuit board after the film is removed, and adjusting the abrasive belt grinding parameters according to the thickness of the circuit board after the film is removed.
And (5) post-flow processing. The post-process treatment sequentially comprises outer layer circuit pattern, pattern electroplating, outer layer etching, outer layer AOI, solder mask, character, surface treatment and molding. The following steps are carried out on the circuit board after molding in sequence: electrical testing, FQC, OQC, and packaging. The electrical test, FQC and OQC ensure the quality of the outgoing circuit board product.
The invention provides a method for manufacturing a circuit board with uniformly plated holes, which improves and optimizes the process, has good hole plating effect and avoids the problems of small holes, hole blockage or board burning of plated holes; the hole plating device is characterized in that holes are drilled in a hole plating area, a dispersed current pad is arranged on a non-hole plating area, windows are formed in positions of holes to be plated, the dispersed current pad plays a role in dispersing current, the problem of abnormal quality caused by current concentration can be solved, electroplating uniformity during hole plating is guaranteed, and product quality is improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (8)
1. A method for manufacturing a circuit board with uniformly plated holes is characterized by comprising the following steps: the method sequentially comprises the following steps:
performing pretreatment to form a multilayer circuit board;
drilling and plate electronics: presetting a plated hole region and a non-plated hole region on the circuit board, drilling holes on the plated hole region, and then performing board electricity on the circuit board after drilling holes;
outer layer hole plating pattern: determining a hole to be plated, which needs to be plated, in a plurality of holes formed by drilling, and windowing at the position of the hole to be plated, wherein the windowing size is larger than the single side of the hole to be plated; windowing is carried out on the non-plated hole area to form a plurality of exposed dispersed current pads;
plating holes: thickening hole copper in the hole to be plated;
grinding a plate: grinding the orifice and the dispersed current pad after hole plating to enable the surface of the circuit board to be flat;
and (5) post-flow processing.
2. The method for manufacturing a circuit board with uniform plated holes according to claim 1, wherein the method comprises the following steps: the front flow processing sequentially comprises cutting, inner layer pattern forming, inner layer AOI forming, pressing and cutting grinding, the circuit board is subjected to membrane removal after hole plating, and then the circuit board is subjected to plate grinding after membrane removal.
3. The method for manufacturing a circuit board with uniform plated holes according to claim 1, wherein the method comprises the following steps: the post-flow processing sequentially comprises outer-layer circuit pattern, pattern electroplating, outer-layer etching, outer-layer AOI, solder mask, character, surface treatment and molding.
4. The method for manufacturing a circuit board with uniform plated holes according to claim 3, wherein the method comprises the following steps: the molded circuit board is sequentially subjected to the following steps: electrical testing, FQC, OQC, and packaging.
5. The method for manufacturing a circuit board with uniform plated holes according to claim 1, wherein the method comprises the following steps: the windowing size is 4-8 mil larger than the single edge of the hole to be plated.
6. The method for manufacturing a circuit board with uniform plated holes according to claim 1, wherein the method comprises the following steps: the windowing size of windowing on the non-plated hole area is 10-20 mil.
7. The method for manufacturing a circuit board with uniform plated holes according to claim 1, wherein the method comprises the following steps: the intervals between the dispersed currents pad are equal.
8. The method for manufacturing a circuit board with uniform plated holes according to claim 1, wherein the method comprises the following steps: and the grinding adopts a belt grinding plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110216598.8A CN113068327A (en) | 2021-02-26 | 2021-02-26 | Method for manufacturing circuit board with uniformly plated holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110216598.8A CN113068327A (en) | 2021-02-26 | 2021-02-26 | Method for manufacturing circuit board with uniformly plated holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113068327A true CN113068327A (en) | 2021-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110216598.8A Pending CN113068327A (en) | 2021-02-26 | 2021-02-26 | Method for manufacturing circuit board with uniformly plated holes |
Country Status (1)
| Country | Link |
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| CN (1) | CN113068327A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697666A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Circuit board plating device and method |
| CN101951735A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Coppering and porefilling process for circuit board |
| CN104812179A (en) * | 2015-04-21 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Hole copper preparation technology of printed circuit board and printed circuit board |
| CN105704919A (en) * | 2016-02-25 | 2016-06-22 | 江门崇达电路技术有限公司 | PTH on PCB and manufacturing method of PCB |
-
2021
- 2021-02-26 CN CN202110216598.8A patent/CN113068327A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697666A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Circuit board plating device and method |
| CN101951735A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Coppering and porefilling process for circuit board |
| CN104812179A (en) * | 2015-04-21 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Hole copper preparation technology of printed circuit board and printed circuit board |
| CN105704919A (en) * | 2016-02-25 | 2016-06-22 | 江门崇达电路技术有限公司 | PTH on PCB and manufacturing method of PCB |
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Application publication date: 20210702 |
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| RJ01 | Rejection of invention patent application after publication |