CN104792344B - 检测器、压印装置以及物品制造方法 - Google Patents

检测器、压印装置以及物品制造方法 Download PDF

Info

Publication number
CN104792344B
CN104792344B CN201510210155.2A CN201510210155A CN104792344B CN 104792344 B CN104792344 B CN 104792344B CN 201510210155 A CN201510210155 A CN 201510210155A CN 104792344 B CN104792344 B CN 104792344B
Authority
CN
China
Prior art keywords
optical system
diffraction grating
light
detector
diffracted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510210155.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN104792344A (zh
Inventor
岩井俊树
三岛和彦
前田普教
箕田贤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN104792344A publication Critical patent/CN104792344A/zh
Application granted granted Critical
Publication of CN104792344B publication Critical patent/CN104792344B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/36—Forming the light into pulses
    • G01D5/38—Forming the light into pulses by diffraction gratings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
    • G01D5/34707—Scales; Discs, e.g. fixation, fabrication, compensation
    • G01D5/34715—Scale reading or illumination devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201510210155.2A 2011-10-21 2012-10-16 检测器、压印装置以及物品制造方法 Active CN104792344B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011232121 2011-10-21
JP2011-232121 2011-10-21
JP2012-220718 2012-10-02
JP2012220718A JP5706861B2 (ja) 2011-10-21 2012-10-02 検出器、検出方法、インプリント装置及び物品製造方法
CN2012103925325A CN103105127A (zh) 2011-10-21 2012-10-16 检测器、压印装置以及物品制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2012103925325A Division CN103105127A (zh) 2011-10-21 2012-10-16 检测器、压印装置以及物品制造方法

Publications (2)

Publication Number Publication Date
CN104792344A CN104792344A (zh) 2015-07-22
CN104792344B true CN104792344B (zh) 2017-06-20

Family

ID=48135733

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201510210155.2A Active CN104792344B (zh) 2011-10-21 2012-10-16 检测器、压印装置以及物品制造方法
CN2012103925325A Pending CN103105127A (zh) 2011-10-21 2012-10-16 检测器、压印装置以及物品制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2012103925325A Pending CN103105127A (zh) 2011-10-21 2012-10-16 检测器、压印装置以及物品制造方法

Country Status (4)

Country Link
US (1) US8922786B2 (enExample)
JP (1) JP5706861B2 (enExample)
KR (1) KR101597387B1 (enExample)
CN (2) CN104792344B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8842294B2 (en) * 2011-06-21 2014-09-23 Canon Kabushiki Kaisha Position detection apparatus, imprint apparatus, and position detection method
JP6285666B2 (ja) * 2013-09-03 2018-02-28 キヤノン株式会社 検出装置、リソグラフィ装置、物品の製造方法及び検出方法
JP6541328B2 (ja) 2013-11-26 2019-07-10 キヤノン株式会社 検出装置、インプリント装置、および物品の製造方法
CN106415193B (zh) * 2014-03-21 2019-08-09 卡尔佩迪姆技术有限公司 用于在柔性基板上制造微型结构的系统和方法
JP6341883B2 (ja) * 2014-06-27 2018-06-13 キヤノン株式会社 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
WO2016092697A1 (ja) * 2014-12-12 2016-06-16 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6669432B2 (ja) * 2015-02-05 2020-03-18 旭化成株式会社 位置合わせ方法、インプリント方法、及びインプリント装置
JP6525628B2 (ja) * 2015-02-13 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
WO2016187453A1 (en) * 2015-05-19 2016-11-24 Kla-Tencor Corporation Self-moiré target design principles for measuring unresolved device-like pitches
JP6632252B2 (ja) * 2015-08-21 2020-01-22 キヤノン株式会社 検出装置、インプリント装置、物品の製造方法及び照明光学系
JP6604793B2 (ja) * 2015-09-17 2019-11-13 キヤノン株式会社 インプリント装置および物品製造方法
DE102016202198A1 (de) * 2016-02-12 2017-08-17 Carl Zeiss Smt Gmbh Vorrichtung zur Moiré-Vermessung eines optischen Prüflings
JP6685821B2 (ja) 2016-04-25 2020-04-22 キヤノン株式会社 計測装置、インプリント装置、物品の製造方法、光量決定方法、及び、光量調整方法
JP6884515B2 (ja) * 2016-05-10 2021-06-09 キヤノン株式会社 位置検出方法、インプリント装置及び物品の製造方法
JP6971567B2 (ja) * 2016-12-16 2021-11-24 キヤノン株式会社 位置合わせ装置、位置合わせ方法、リソグラフィ装置、および物品製造方法
EP3572881A1 (en) * 2018-05-24 2019-11-27 ASML Netherlands B.V. Bandwidth calculation system and method for determining a desired wavelength bandwidth for a measurement beam in a mark detection system
JP7182904B2 (ja) * 2018-05-31 2022-12-05 キヤノン株式会社 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法
JP7257853B2 (ja) * 2019-04-02 2023-04-14 キヤノン株式会社 位置検出装置、露光装置および物品製造方法
JP7328806B2 (ja) 2019-06-25 2023-08-17 キヤノン株式会社 計測装置、リソグラフィ装置、および物品の製造方法
JP7510280B2 (ja) * 2020-06-02 2024-07-03 キヤノン株式会社 検出器、インプリント装置および物品製造方法
CN113192930B (zh) * 2021-04-27 2024-03-29 上海华虹宏力半导体制造有限公司 偏移检测结构及基板偏移的检测方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101941353A (zh) * 2009-07-10 2011-01-12 颖台科技股份有限公司 光固化复合树脂的膜片制作方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172203A (ja) * 1986-01-27 1987-07-29 Agency Of Ind Science & Technol 相対変位測定方法
EP0498006A1 (en) 1991-02-06 1992-08-12 International Business Machines Corporation Superheterodyning technique in the spatial frequency domain and structure for pattern registration measurement
JPH07130614A (ja) 1993-06-30 1995-05-19 Toshiba Corp 位置合せ装置
JP3327781B2 (ja) 1995-10-13 2002-09-24 キヤノン株式会社 位置検出装置及びその検定方法と調整方法
JPH09189520A (ja) * 1996-01-12 1997-07-22 Nikon Corp 位置検出装置
US6654128B2 (en) * 1997-06-30 2003-11-25 Canon Kabushiki Kaisha Displacement information detecting apparatus
JPH11211415A (ja) 1998-01-29 1999-08-06 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
JP4616983B2 (ja) 2000-11-22 2011-01-19 キヤノン株式会社 位置検出装置、該検出装置を用いた投影露光装置及びデバイス製造方法
JP2003068613A (ja) * 2001-08-27 2003-03-07 Nikon Corp 位置合わせ装置
JP4046961B2 (ja) 2001-09-03 2008-02-13 キヤノン株式会社 位置検出方法、位置検出装置、露光装置及び露光方法
JP4366031B2 (ja) 2001-09-17 2009-11-18 キヤノン株式会社 位置検出装置及び方法並びに露光装置、デバイスの製造方法
JP2003092248A (ja) 2001-09-17 2003-03-28 Canon Inc 位置検出装置、位置決め装置及びそれらの方法並びに露光装置及びデバイスの製造方法
JP2005166785A (ja) 2003-12-01 2005-06-23 Canon Inc 位置検出装置及び方法、並びに、露光装置
JP2005315649A (ja) * 2004-04-27 2005-11-10 Sumitomo Heavy Ind Ltd 検出装置及びステージ装置
JP2006010645A (ja) * 2004-06-29 2006-01-12 Tohoku Univ 検出装置及びステージ装置
US7298496B2 (en) * 2004-05-21 2007-11-20 Zetetic Institute Apparatus and methods for overlay, alignment mark, and critical dimension metrologies based on optical interferometry
JP4691922B2 (ja) * 2004-07-29 2011-06-01 株式会社ニコン 結像光学系の調整方法
JP4389668B2 (ja) * 2004-05-28 2009-12-24 株式会社ニコン 位置検出方法および位置検出装置
WO2005116577A1 (ja) * 2004-05-28 2005-12-08 Nikon Corporation 結像光学系の調整方法、結像装置、位置ずれ検出装置、マ－ク識別装置及びエッジ位置検出装置
US20070231421A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Enhanced Multi Channel Alignment
US7630067B2 (en) 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
US7292326B2 (en) 2004-11-30 2007-11-06 Molecular Imprints, Inc. Interferometric analysis for the manufacture of nano-scale devices
JP4926881B2 (ja) * 2006-09-22 2012-05-09 キヤノン株式会社 インプリント装置およびアライメント方法
DE102007025306B9 (de) * 2007-05-30 2012-10-31 Vistec Semiconductor Systems Gmbh Koordinatenmess-Maschine und Verfahren zur Vermessung von Strukturen auf einem Substrat mittels einer Koordinaten-Messmaschine
US20090147237A1 (en) 2007-12-05 2009-06-11 Molecular Imprints, Inc. Spatial Phase Feature Location
US8842294B2 (en) * 2011-06-21 2014-09-23 Canon Kabushiki Kaisha Position detection apparatus, imprint apparatus, and position detection method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101941353A (zh) * 2009-07-10 2011-01-12 颖台科技股份有限公司 光固化复合树脂的膜片制作方法

Also Published As

Publication number Publication date
KR101597387B1 (ko) 2016-02-24
JP2013102139A (ja) 2013-05-23
KR20130044149A (ko) 2013-05-02
US8922786B2 (en) 2014-12-30
CN103105127A (zh) 2013-05-15
CN104792344A (zh) 2015-07-22
US20130100459A1 (en) 2013-04-25
JP5706861B2 (ja) 2015-04-22

Similar Documents

Publication Publication Date Title
CN104792344B (zh) 检测器、压印装置以及物品制造方法
JP5713961B2 (ja) 位置検出装置、インプリント装置及び位置検出方法
JP5943717B2 (ja) 位置検出システム、インプリント装置、デバイス製造方法、および位置検出方法
KR101788371B1 (ko) 검출 장치, 임프린트 장치 및 물품의 제조 방법
JP6097704B2 (ja) インプリント装置、インプリント方法及び物品の製造方法
US10777440B2 (en) Detection device, imprint apparatus, planarization device, detection method, and article manufacturing method
US20130221556A1 (en) Detector, imprint apparatus and method of manufacturing article
JP7414576B2 (ja) 位置計測装置、重ね合わせ検査装置、位置計測方法、インプリント装置および物品の製造方法
KR101573572B1 (ko) 임프린트 장치, 물품 제조 방법 및 패턴 전사 방법
KR20180041736A (ko) 검출 장치, 임프린트 장치, 물품 제조 방법, 조명 광학계 및 검출 방법
JP6285666B2 (ja) 検出装置、リソグラフィ装置、物品の製造方法及び検出方法
JP2024037437A (ja) マークの相対位置の計測方法、計測装置及び物品の製造方法
JP2017092294A (ja) インプリント装置、型、および物品の製造方法
TW202411769A (zh) 檢測裝置、微影蝕刻設備及物品製造方法
US20240027926A1 (en) Detection device, lithography apparatus, and article manufacturing method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant