CN104779225B - 配线基板及其制造方法、以及半导体封装 - Google Patents

配线基板及其制造方法、以及半导体封装 Download PDF

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Publication number
CN104779225B
CN104779225B CN201510013051.2A CN201510013051A CN104779225B CN 104779225 B CN104779225 B CN 104779225B CN 201510013051 A CN201510013051 A CN 201510013051A CN 104779225 B CN104779225 B CN 104779225B
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CN
China
Prior art keywords
wiring
substrate
notch
face
adhesive layer
Prior art date
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CN201510013051.2A
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English (en)
Chinese (zh)
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CN104779225A (zh
Inventor
传田达明
小林敏男
堀川泰爱
清水浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication date
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Publication of CN104779225A publication Critical patent/CN104779225A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN201510013051.2A 2014-01-14 2015-01-09 配线基板及其制造方法、以及半导体封装 Active CN104779225B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014004629 2014-01-14
JP2014-004629 2014-01-14
JP2014-228199 2014-11-10
JP2014228199A JP6316731B2 (ja) 2014-01-14 2014-11-10 配線基板及びその製造方法、並びに半導体パッケージ

Publications (2)

Publication Number Publication Date
CN104779225A CN104779225A (zh) 2015-07-15
CN104779225B true CN104779225B (zh) 2018-12-11

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Application Number Title Priority Date Filing Date
CN201510013051.2A Active CN104779225B (zh) 2014-01-14 2015-01-09 配线基板及其制造方法、以及半导体封装

Country Status (3)

Country Link
US (1) US9603253B2 (https=)
JP (1) JP6316731B2 (https=)
CN (1) CN104779225B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10283688B2 (en) * 2016-08-22 2019-05-07 Nichia Corporation Light emitting device
JP6699535B2 (ja) * 2016-12-14 2020-05-27 株式会社デンソー 回路基板
JP6881409B2 (ja) * 2018-09-27 2021-06-02 日亜化学工業株式会社 照明装置およびその製造方法
TWI672711B (zh) * 2019-01-10 2019-09-21 健策精密工業股份有限公司 絕緣金屬基板及其製造方法
JP7676887B2 (ja) * 2021-04-02 2025-05-15 株式会社レゾナック 冷却装置
WO2023054094A1 (ja) * 2021-09-30 2023-04-06 日亜化学工業株式会社 配線基板、面状発光装置及びそれらの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101252114A (zh) * 2007-02-21 2008-08-27 三洋电机株式会社 半导体装置
CN103227263A (zh) * 2012-01-30 2013-07-31 新光电气工业株式会社 配线基板及配线基板的制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
JP2789563B2 (ja) * 1993-05-28 1998-08-20 いわき電子株式会社 集積回路装置
US5808872A (en) * 1994-11-15 1998-09-15 Nippon Steel Corporation Semiconductor package and method of mounting the same on circuit board
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
US6064114A (en) * 1997-12-01 2000-05-16 Motorola, Inc. Semiconductor device having a sub-chip-scale package structure and method for forming same
US6920046B2 (en) * 2003-06-25 2005-07-19 Eaton Corporation Dissipating heat in an array of circuit components
US7148554B2 (en) * 2004-12-16 2006-12-12 Delphi Technologies, Inc. Discrete electronic component arrangement including anchoring, thermally conductive pad
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
CN101645478A (zh) * 2008-08-08 2010-02-10 鸿富锦精密工业（深圳）有限公司 发光二极管散热结构
JP2011103353A (ja) * 2009-11-10 2011-05-26 Koito Mfg Co Ltd 発光モジュール
JP2012033855A (ja) * 2010-07-01 2012-02-16 Hitachi Cable Ltd Ｌｅｄモジュール、ｌｅｄパッケージ、並びに配線基板およびその製造方法
KR20140012650A (ko) * 2011-02-24 2014-02-03 데쿠세리아루즈 가부시키가이샤 열전도성 접착제
JP5844101B2 (ja) 2011-09-15 2016-01-13 新光電気工業株式会社 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法
JP5848976B2 (ja) * 2012-01-25 2016-01-27 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101252114A (zh) * 2007-02-21 2008-08-27 三洋电机株式会社 半导体装置
CN103227263A (zh) * 2012-01-30 2013-07-31 新光电气工业株式会社 配线基板及配线基板的制造方法

Also Published As

Publication number Publication date
JP6316731B2 (ja) 2018-04-25
JP2015156471A (ja) 2015-08-27
CN104779225A (zh) 2015-07-15
US9603253B2 (en) 2017-03-21
US20150201485A1 (en) 2015-07-16

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