CN104763903A - 一体式散热结构的led照明灯 - Google Patents

一体式散热结构的led照明灯 Download PDF

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CN104763903A
CN104763903A CN201510169705.0A CN201510169705A CN104763903A CN 104763903 A CN104763903 A CN 104763903A CN 201510169705 A CN201510169705 A CN 201510169705A CN 104763903 A CN104763903 A CN 104763903A
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led
pcb board
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李峰
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Priority to KR1020167027445A priority patent/KR20160132898A/ko
Priority to US15/310,763 priority patent/US20180031210A1/en
Priority to EP15888096.3A priority patent/EP3282173A4/en
Priority to PCT/CN2015/000285 priority patent/WO2016161539A1/zh
Priority to JP2016559990A priority patent/JP6531956B2/ja
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Abstract

本发明所述涉及一体式散热结构的LED照明灯，将灯体外壳和散热的功能融为一体，在上盖板上采用对应单颗LED发光芯片的芯片分隔单元，减少芯片散热的热阻，让芯片进行正面散热，用整个外壳作为芯片的散热结构，简化了LED照明灯的组装结构，精简了所需要的配件，安装简单易于自动化组装。整个上盖板整体作为一个大型的整体的散热结构，实现了从未有过的正面散热体系。而且由于结构设计的特殊结构，在LED发光芯片和金属上盖板之间没有任何绝缘阻热结构，LED发光芯片和上盖板之间是真空环境。所有的热量能够直接由LED发光芯片散发出去。而整个上盖板都能够成为整个LED照明灯的散热器，热量迅速传导出去，温度不会累积，能够有效延长LED照明灯的使用寿命。

Description

一体式散热结构的LED照明灯
【技术领域】
本发明涉及LED照明结构，尤其涉及适用于LED照明灯的散热结构以及具备该散热结构的LED照明灯。
【背景技术】
现有的LED灯结构复杂，组装繁琐，需要多个部件组装在一起，需要人工手工安装装配，效率低，无法实现自动化升级。
一般LED灯包含被银胶封装的灯珠，灯珠焊接在PCB板上，PCB板通过导热胶黏贴到铝基板上进行散热，铝基板之下通常还需要加设散热器，辅助进行散热，而在灯珠之上还需要配置一个配光透镜，配光透镜通过外壳固定安装在灯珠上。这样的结构需要的配件非常多而零碎，而且灯珠内发光芯片产生的热量通过层层包裹非常难以传导出来，原有的基于LED发光芯片的SMD封装、直插封装以及COB封装，LED发光芯片的散热途径只能是：LED发光芯片→固晶胶体→PCB铜箔→绝缘层→铝基板→导热硅胶→散热器的传导散热模式，整灯体积大且热阻过大，有时会使得整灯温度达到80℃或更高。这样会导致内部元件热量累积，温度升高，长此以往，严重影响了LED芯片的寿命，导致LED使用年限短，过早报废。
【发明内容】
本发明针对以上问题提出了简化结构、一体式散热的LED照明灯，该LED照明灯包括PCB板、上盖板、下底板，该上盖板、PCB板和下底板层叠粘合组装在一起，其中：
在PCB板上固晶并搭线若干颗LED发光芯片；
上盖板包括周边区域和镂空区域，其中镂空区域对应PCB板上的LED发光芯片布置区域，该镂空区域包含多个芯片分隔单元，每个芯片分隔单元对应一颗LED发光芯片。
在该PCB板上，该LED发光芯片的周边喷涂有绝缘反光漆层。
该芯片分隔单元为镂空的小格子，包括上表面、下底面和侧壁面，侧壁面连接上表面和下底面。
该上表面的高度低于周边区域的表面高度，而下底面贴合在PCB板的绝缘反光漆层上，该侧壁面构成一个容纳单颗LED发光芯片的空间。
该侧壁面为倾斜侧面，下底面的开口小，而上表面开口大。
在该PCB板上矩形阵列了多个LED发光芯片，而对应的上盖板上设有矩形阵列的芯片分隔单元。
在该PCB板上扇形阵列了多个LED发光芯片，而对应的上盖板上设有扇形阵列的芯片分隔单元。
本发明所述涉及一体式散热结构，将灯体外壳和散热的功能融为一体，在上盖板上采用对应单颗LED发光芯片的芯片分隔单元，减少芯片散热的热阻，让芯片进行正面散热，用整个外壳作为芯片的散热结构，简化了LED灯的组装结构，精简了所需要的配件，安装简单易于自动化组装。
而本发明所采用的一体散热结构，在PCB铜箔线路面放置LED发光芯片位置就开始散热处理，LED发光芯片发出的热量，以最短路径扩散到上盖板的镂空区域上。该镂空区域与周边区域是一个整体，从而灯体的六面都是散热面，灯体可以制作成6mm厚，极限可以2mm左右。温度控制在室温25°时最低在45°左右。
【附图说明】
图1是本发明一体式散热结构的LED照明灯的整体结构示意图；
图2是本发明一体式散热结构的LED照明灯的上盖板结构示意图；
图3是本发明一体式散热结构的LED照明灯上盖板发光区域的结构示意图；
图4是本发明一体式散热结构的LED照明灯实施例2的结构示意图；
其中： 10、上盖板；11、周边区域；12、镂空区域；121、芯片分隔单元；1211、上表面；1212、下底面；1213、侧壁面；20、PCB板；21、LED发光芯片；30、下底板。
【具体实施方式】
下面将结合附图及实施例对本发明进行详细说明。
请参考附图1：其中示出了一体式散热的LED照明灯，该LED照明灯主要包括PCB板20、上盖板10、下底板30，该上盖板10、PCB板20和下底板30层叠粘合组装在一起，PCB板被上盖板10和下底板30封装在其中。
在该PCB板20上固晶并搭线若干颗LED发光芯片21；LED发光芯片21通过固晶并搭线装设在PCB板20上，在PCB板20上LED发光芯片所固定的位置周边喷涂有绝缘反光漆层，只是在PCB板20上预留出安装LED发光芯片21的位置，且在PCB板20上预制了连接LED发光芯片和电路的金线。
请参考附图2：该上盖板10包括周边区域11和镂空区域12，其中镂空区域12对应PCB板20上的LED发光芯片布置区域，该镂空区域12包含多个芯片分隔单元121，每个芯片分隔单元121对应一颗LED发光芯片21。
请参考附图3：该芯片分隔单元121为镂空的小格子，包括上表面1211、下底面1212和侧壁面1213，侧壁面1213连接上表面1211和下底面1212。
该上表面1211的高度低于周边区域11的表面高度，而下底面1212贴合在PCB板20的绝缘反光漆层上，该侧壁面1213构成一个容纳单颗LED发光芯片21的空间。
该侧壁面1213为倾斜侧面，下底面的开口小，而上表面开口大。
在该PCB板20上矩形阵列了多个LED发光芯21，而对应的上盖板10上设有矩形阵列的芯片分隔单元121，芯片分隔单元121对应每一颗LED发光芯片，分别将不同的LED发光芯片纳入到不同的芯片分隔单元121中。
请参考附图4：在该PCB板20上扇形阵列了多个LED发光芯片21，而对应的上盖板10上设有扇形阵列的芯片分隔单元，芯片分隔单元对应每一颗LED发光芯片21，分别将不同的LED发光芯片21纳入到不同的芯片分隔单元121中。
由于单颗LED发光芯片21直接纳入到分隔单元121中，LED发光芯片21在工作时产生的热量可以直接根据热量上升原理从芯片上方散热，而金属的上盖板则成为最佳的散热导热结构，由于在镂空区域有若干个芯片分隔单元，每个单元结构都直接负责单颗LED发光芯片散热。整个上盖板10整体成为一个大型的整体的散热结构，实现了从未有过的正面散热体系。而且由于结构设计的特殊结构，在LED发光芯片和金属上盖板之间没有任何绝缘阻热结构，LED发光芯片和上盖板之间是真空环境。所有的热量能够直接由LED发光芯片散发出去。而整个上盖板都能够成为整个LED照明灯的散热器，热量迅速传导出去，温度不会累积，能够有效延长LED照明灯的使用寿命。
而本发明所采用的一体散热结构，在PCB铜箔线路面放置LED发光芯片位置就开始散热处理，LED发光芯片发出的热量，以最短路径扩散到上盖板的镂空区域上。该镂空区域与周边区域是一个整体，从而灯体的六面都是散热面，灯体可以制作成6mm厚，极限可以2mm左右。温度控制在室温25°时最低在45°左右。
以上所述，仅是本发明较佳实施例而已，并非对本发明作任何形式上的限制，虽然本发明以较佳实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当利用上述揭示的技术内容作出些许变更或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明技术是指对以上实施例所作的任何简单修改、等同变化与修饰，均属于本发明技术方案的范围内。

Claims (7)

1.一种一体式散热结构的LED照明灯，其特征在于，该LED照明灯包括PCB板、上盖板、下底板，该上盖板、PCB板和下底板层叠粘合组装在一起，其中：
在PCB板上固晶并搭线若干颗LED发光芯片；
上盖板包括一体的周边区域和镂空区域，其中镂空区域对应PCB板上的LED发光芯片布置区域，该镂空区域包含多个芯片分隔单元，每个芯片分隔单元对应一颗LED发光芯片。
2.根据权利要求1所述一体式散热结构的LED照明灯，其特征在于，在该PCB板上，该LED发光芯片的周边喷涂有绝缘反光漆层。
3.根据权利要求2所述一体式散热结构的LED照明灯，其特征在于，该芯片分隔单元为镂空的小格子，包括上表面、下底面和侧壁面，侧壁面连接上表面和下底面。
4.根据权利要求3所述一体式散热结构的LED照明灯，其特征在于，该上表面的高度低于周边区域的表面高度，而下底面贴合在PCB板的绝缘反光漆层上，该侧壁面构成一个容纳单颗LED发光芯片的空间。
5.根据权利要求4所述一体式散热结构的LED照明灯，其特征在于，该侧壁面为倾斜侧面，下底面的开口小，而上表面开口大。
6.根据权利要求1所述一体式散热结构的LED照明灯，其特征在于，在该PCB板上矩形阵列了多个LED发光芯片，而对应的上盖板上设有矩形阵列的芯片分隔单元。
7.根据权利要求1所述一体式散热结构的LED照明灯，其特征在于，在该PCB板上扇形阵列了多个LED发光芯片，而对应的上盖板上设有扇形阵列的芯片分隔单元。
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