JP2017533573A - 流体充填型led灯 - Google Patents
流体充填型led灯 Download PDFInfo
- Publication number
- JP2017533573A JP2017533573A JP2016559999A JP2016559999A JP2017533573A JP 2017533573 A JP2017533573 A JP 2017533573A JP 2016559999 A JP2016559999 A JP 2016559999A JP 2016559999 A JP2016559999 A JP 2016559999A JP 2017533573 A JP2017533573 A JP 2017533573A
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- led lamp
- mounting
- cover plate
- rear cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 43
- 238000002347 injection Methods 0.000 claims abstract description 18
- 239000007924 injection Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 239000002313 adhesive film Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 3
- 239000012498 ultrapure water Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 16
- 239000013529 heat transfer fluid Substances 0.000 abstract description 9
- 238000004382 potting Methods 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/66—Details of globes or covers forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
- F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Packaging Frangible Articles (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
11 蛍光接着フィルム
20 格子体
21 周辺部
22 セパレート部
23 パネル取付位置
24 後面カバー取付位置
30 プリント基板
31 LEDチップ
40 後面カバープレート
Claims (10)
- 流体充填型LED灯であって、該LED灯が、主に後面カバープレート、プリント基板、実装用流体、透明パネルおよび格子体を含み、後面カバープレート、透明パネルおよび格子体が、後面、側面、上面から実装して1つの密封空間を形成し、該密封空間内にプリント基板を取り付け、格子体の表面に密封空間とつながる注入孔を加工し、実装用流体を密封空間内全体に注入し、注入孔を外部から塞ぐことを特徴とするLED灯。
- 格子体が周辺部およびセパレート部を含み、このうち周辺部を本体および密封空間を支える外部本体とし、セパレート部がいくつかの反射屈折空間を含み、該反射屈折空間が外側に広がるテーパ状の空間であることを特徴とする、請求項1に記載の流体充填型LED灯。
- 格子体のセパレート部の上方に、セパレート部の領域全体に対応して、パネル取付位置が設けられ、該パネル取付位置の大きさが、透明パネルを嵌め込んで取り付けるのに適していることを特徴とする、請求項2に記載の流体充填型LED灯。
- 格子のセパレート部の下方に、プリント基板を取り付け、該プリント基板にいくつかのLEDチップが取り付けられ、各LEDチップが1つの反射屈折空間に対応することを特徴とする、請求項2に記載の流体充填型LED灯。
- 該プリント基板が、セラミックプレートまたはアルミニウム基板であることを特徴とする、請求項4に記載の流体充填型LED灯。
- 格子体の底部にくぼんだ後面カバープレート取付位置が設けられ、くぼんだ後面カバープレート取付位置により、後面カバープレートを格子体底部に係入して取り付け、プリント基板を係止、固定することを特徴とする、請求項1に記載の流体充填型LED灯。
- 後面カバープレートと適合する後面カバープレート取付位置が、開口溝構造であり、すなわち矩形溝の一辺が延伸して、格子の周辺部を貫通し、側面から後面カバープレートを挿入することができる1つの構造が形成されることを特徴とする、請求項6に記載の流体充填型LED灯。
- 透明パネル上に1層の蛍光接着フィルムを作製し、蛍光接着フィルムの一面が密封空間に面することを特徴とする、請求項1に記載の流体充填型LED灯。
- 該実装用流体が、伝熱性能が良好で、揮発しにくく、発火点が高い流体であることを特徴とする、請求項1に記載の流体充填型LED灯。
- 該実装用流体が、熱媒油、シリコーンオイル、超純水、蒸留水および脱イオン水であることを特徴とする、請求項9に記載の流体充填型LED灯。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510618505.9A CN105336831A (zh) | 2015-09-24 | 2015-09-24 | 一种液体填充式led灯 |
CN201510618505.9 | 2015-09-24 | ||
PCT/CN2015/091992 WO2017049680A1 (zh) | 2015-09-24 | 2015-10-15 | 液体填充式led灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017533573A true JP2017533573A (ja) | 2017-11-09 |
JP6452054B2 JP6452054B2 (ja) | 2019-01-16 |
Family
ID=55287245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016559999A Expired - Fee Related JP6452054B2 (ja) | 2015-09-24 | 2015-10-15 | 流体充填型led灯 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10222045B2 (ja) |
EP (1) | EP3355371A4 (ja) |
JP (1) | JP6452054B2 (ja) |
KR (1) | KR20170057169A (ja) |
CN (1) | CN105336831A (ja) |
WO (1) | WO2017049680A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105953117B (zh) * | 2016-06-06 | 2019-02-19 | 李峰 | 具有内置式压力补偿器的led灯 |
CN106287451B (zh) * | 2016-11-14 | 2019-12-03 | 李峰 | 一种超薄led路灯 |
US20200370744A1 (en) * | 2017-08-11 | 2020-11-26 | Crystal Fountains Holdings Inc. | Fully encapsulating lighting technology |
CN116520650B (zh) * | 2023-06-21 | 2023-09-15 | 张家港奇点光电科技有限公司 | 一种光刻机光源头组件 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3112794U (ja) * | 2005-05-24 | 2005-08-25 | 黄顕榮 | 発光ダイオードランプ用放熱装置 |
US20060138621A1 (en) * | 2002-09-30 | 2006-06-29 | Osram Opto Semiconductors Gmbh | Optoelectronic component and a module based thereon |
JP2010109368A (ja) * | 2008-11-03 | 2010-05-13 | Wen-Chiang Chou | 電子パーツの絶縁散熱構造 |
CN102130111A (zh) * | 2010-12-24 | 2011-07-20 | 郑伟 | 液体封装的大功率led装置以及led装置的封装方法 |
CN102297351A (zh) * | 2011-06-20 | 2011-12-28 | 中山大学 | 一种led光源模组及其制造方法 |
JP2012099726A (ja) * | 2010-11-04 | 2012-05-24 | Stanley Electric Co Ltd | Ledモジュール及びledランプ |
CN103016995A (zh) * | 2012-12-26 | 2013-04-03 | 冉旭 | 一种开放式led光源 |
CN103325934A (zh) * | 2012-03-19 | 2013-09-25 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN104763903A (zh) * | 2015-04-10 | 2015-07-08 | 李峰 | 一体式散热结构的led照明灯 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0332080Y2 (ja) * | 1988-04-27 | 1991-07-08 | ||
JPH07105271B2 (ja) * | 1989-05-08 | 1995-11-13 | シャープ株式会社 | 薄膜elパネルの保護液封止方法 |
US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
TW200825529A (en) * | 2006-12-06 | 2008-06-16 | Chi Lin Technology Co Ltd | Light mixer and backlight module having it |
JP5327601B2 (ja) * | 2008-12-12 | 2013-10-30 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
US8322884B2 (en) * | 2010-03-31 | 2012-12-04 | Abl Ip Holding Llc | Solid state lighting with selective matching of index of refraction |
CN202118634U (zh) * | 2011-07-05 | 2012-01-18 | 汪绍芬 | 一种低热阻高光效led模组光源 |
US20150062873A1 (en) * | 2013-09-05 | 2015-03-05 | John S. Berg | Lighting fixture |
KR20150078042A (ko) * | 2013-12-30 | 2015-07-08 | 엘지전자 주식회사 | 조명장치 |
CN104916760A (zh) * | 2015-05-08 | 2015-09-16 | 李峰 | 一种胶膜模腔式制作方法及其制成的胶膜 |
-
2015
- 2015-09-24 CN CN201510618505.9A patent/CN105336831A/zh active Pending
- 2015-10-15 EP EP15895860.3A patent/EP3355371A4/en not_active Withdrawn
- 2015-10-15 KR KR1020167027455A patent/KR20170057169A/ko not_active Application Discontinuation
- 2015-10-15 WO PCT/CN2015/091992 patent/WO2017049680A1/zh active Application Filing
- 2015-10-15 US US15/310,792 patent/US10222045B2/en not_active Expired - Fee Related
- 2015-10-15 JP JP2016559999A patent/JP6452054B2/ja not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060138621A1 (en) * | 2002-09-30 | 2006-06-29 | Osram Opto Semiconductors Gmbh | Optoelectronic component and a module based thereon |
JP3112794U (ja) * | 2005-05-24 | 2005-08-25 | 黄顕榮 | 発光ダイオードランプ用放熱装置 |
JP2010109368A (ja) * | 2008-11-03 | 2010-05-13 | Wen-Chiang Chou | 電子パーツの絶縁散熱構造 |
JP2012099726A (ja) * | 2010-11-04 | 2012-05-24 | Stanley Electric Co Ltd | Ledモジュール及びledランプ |
CN102130111A (zh) * | 2010-12-24 | 2011-07-20 | 郑伟 | 液体封装的大功率led装置以及led装置的封装方法 |
CN102297351A (zh) * | 2011-06-20 | 2011-12-28 | 中山大学 | 一种led光源模组及其制造方法 |
CN103325934A (zh) * | 2012-03-19 | 2013-09-25 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN103016995A (zh) * | 2012-12-26 | 2013-04-03 | 冉旭 | 一种开放式led光源 |
CN104763903A (zh) * | 2015-04-10 | 2015-07-08 | 李峰 | 一体式散热结构的led照明灯 |
Also Published As
Publication number | Publication date |
---|---|
EP3355371A1 (en) | 2018-08-01 |
JP6452054B2 (ja) | 2019-01-16 |
US10222045B2 (en) | 2019-03-05 |
KR20170057169A (ko) | 2017-05-24 |
EP3355371A4 (en) | 2019-07-24 |
CN105336831A (zh) | 2016-02-17 |
WO2017049680A1 (zh) | 2017-03-30 |
US20180209631A1 (en) | 2018-07-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010004702A1 (ja) | 電球形照明用光源 | |
JP6452054B2 (ja) | 流体充填型led灯 | |
JP2013175465A (ja) | 発光素子ランプ及び照明器具 | |
JP2010045030A (ja) | 発光ダイオード照明装置 | |
JP2007324547A (ja) | 発光ダイオード光源装置、照明装置、表示装置及び交通信号機 | |
JP6200654B2 (ja) | 発光モジュール、発光装置および照明装置 | |
JP2013038215A (ja) | 波長変換部材 | |
US20120092873A1 (en) | Led lamp having waterproof structures | |
KR20100126063A (ko) | 엘이디 조명장치 | |
KR101276326B1 (ko) | 비아홀을 갖는 인쇄회로기판, 이를 구비한 엘이디 모듈 및 led 조명장치 | |
US8710721B1 (en) | Light emitting device | |
KR101194254B1 (ko) | 발광다이오드 모듈 | |
KR101244854B1 (ko) | Led 전구에서 발생하는 열을 효율적으로 방출하기 위한 led 전구 방열 조립체 | |
JP2016072263A (ja) | 発光モジュールおよび照明装置 | |
CN101676630B (zh) | 发光二极管灯泡 | |
KR100983252B1 (ko) | 방열판이 구비된 엘이디 패널 | |
JP2015162395A (ja) | 電球型照明装置 | |
TWI512235B (zh) | 發光裝置 | |
JP3168127U (ja) | 光源装置 | |
KR20100025630A (ko) | 엘이디 고효율 램프용 조명등의 구조 | |
CN203036431U (zh) | 高效散热的超薄led投光灯 | |
KR100940985B1 (ko) | 발광 다이오드 조명 모듈 | |
CN211040905U (zh) | 一种散热结构及led灯 | |
JP3185809U (ja) | 発光ダイオードの封入構造 | |
CN202868412U (zh) | 一种易散热的led灯具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161130 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171024 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20180124 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180323 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180508 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180730 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20181106 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20181129 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6452054 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |