WO2017049680A1 - 液体填充式led灯 - Google Patents

液体填充式led灯 Download PDF

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Publication number
WO2017049680A1
WO2017049680A1 PCT/CN2015/091992 CN2015091992W WO2017049680A1 WO 2017049680 A1 WO2017049680 A1 WO 2017049680A1 CN 2015091992 W CN2015091992 W CN 2015091992W WO 2017049680 A1 WO2017049680 A1 WO 2017049680A1
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WO
WIPO (PCT)
Prior art keywords
liquid
led lamp
rear cover
filled
sealed space
Prior art date
Application number
PCT/CN2015/091992
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English (en)
French (fr)
Inventor
李峰
Original Assignee
李峰
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 李峰 filed Critical 李峰
Priority to EP15895860.3A priority Critical patent/EP3355371A4/en
Priority to KR1020167027455A priority patent/KR20170057169A/ko
Priority to JP2016559999A priority patent/JP6452054B2/ja
Priority to US15/310,792 priority patent/US10222045B2/en
Publication of WO2017049680A1 publication Critical patent/WO2017049680A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • the present invention relates to the field of illuminating illumination technologies, and in particular, to a liquid-filled LED package structure.
  • LED as a new illumination source, as a high-efficiency, low-energy illumination source, LED is a kind of light-emitting device that can directly convert electrical energy into visible light semiconductor.
  • the photoelectric conversion efficiency of LED is very high. Low, most of the electrical energy is converted into heat. If the heat generated by the illumination is accumulated in a large amount, the LED chip may be damaged.
  • One of the main directions of LED lights has always been to study how to dissipate heat. If the heat generated by photoelectric conversion is not discharged in time, the luminous performance of the LED will be greatly reduced, so how to package and effectively dissipate heat becomes the key to further development of the LED.
  • the invention proposes an LED lamp which is filled and packaged with a heat-conducting liquid for the above situation.
  • the chip is distributed on a whole substrate and directly filled with a heat-conducting liquid, so that the heat generated by the light-emitting process passes through the front side, the side surface and the back side.
  • a liquid-filled LED lamp mainly comprises a rear cover, a PCB light board, a liquid for packaging, a transparent window and a mesh body, and a rear cover, a transparent window and a mesh body are packaged from the rear and the side surface Forming a sealed space, installing a PCB light board in the sealed space, processing a filling hole on the surface of the mesh body, the filling hole is in communication with the sealed space, the package is filled with liquid into the entire sealed space, and the filling hole is sealed from the outside .
  • the mesh body includes a rim portion and a partition portion, wherein the rim portion serves as an outer body of the carrier body and the sealed space, and the partition portion includes a plurality of reflective refracting spaces, and the reflective refracting space is an outwardly diffusing cone space.
  • a form mounting position is provided corresponding to the entire partition area above the mesh body partition, and the size of the form mounting position is suitable for the embedded installation of the transparent form.
  • a PCB light board is mounted under the grid partition, and a plurality of LED chips are bound on the PCB light board, and each LED chip corresponds to a reflective refractive space.
  • the PCB light board is a ceramic board or an aluminum substrate.
  • a recessed rear cover mounting position is provided at the bottom of the mesh body, and the rear cover is snap-fitted to the bottom of the mesh body through the recessed rear cover mounting position, and the PCB light board is clamped and fixed.
  • the rear cover mounting position of the rear cover is a through-groove structure, that is, a rectangular groove extends to the side of the mesh to form a structure in which the rear cover can be inserted from the side.
  • a layer of fluorescent film is formed on the transparent window, and one side of the fluorescent film faces the sealed space.
  • the package liquid is a liquid which has good thermal conductivity, is not volatile, and has a high ignition point.
  • the encapsulating liquid is heat transfer oil, silicone oil, ultrapure water, distilled water, and deionized water.
  • the liquid-filled LED lamp combines the grid, the rear cover, the transparent window, the fluorescent film, and the PCB light board.
  • the glass of the fluorescent film is placed on the front side of the grid, and then the liquid is injected into the inside of the grid through the two filling holes on the front side of the grid, and the liquid is filled, and the filling hole is blocked by the rubber plug to complete the entire assembly process.
  • the invention relates to an LED lamp which is filled and packaged by a heat-conducting liquid.
  • the chip is distributed on a whole substrate and directly potted with a heat-conducting liquid, so that the heat generated by the light-emitting process passes through the front, side and back multi-channels through multiple channels.
  • the heat dissipation can conduct heat in a shorter time, effectively dissipate heat, avoid heat accumulation and damage the high temperature of the LED chip; improve the luminous performance of the LED chip and improve the luminous efficiency, and the LED lamp has the characteristics of simple process and high reliability.
  • FIG. 1 is a schematic structural view of a liquid filled LED lamp of the present invention
  • Fig. 2 is a simplified schematic view showing the side structure of the embodiment 1 of the present invention.
  • liquid filled LED lamp of the present invention will be further described in detail below in conjunction with the drawings and specific embodiments of the present invention.
  • FIG. 1 shows a fixed component of the liquid filled LED lamp, including a rear cover 40, a PCB light board 30, a transparent window 10 and a mesh body 20, wherein the rear cover 40 is transparent.
  • the window 10 and the mesh body 20 are packaged into a sealed space from the rear and the side surface.
  • a PCB light board 30 is installed in the sealed space, and a filling hole is formed on the surface of the mesh body 20, and the filling hole communicates with the sealed space.
  • the encapsulation liquid is poured into the entire sealed space through the perfusion hole, and after the completion of the perfusion, the perfusion hole is sealed from the outside.
  • the mesh body 20 serves as a main structure of the entire package portion, and the mesh body 20 includes a rim portion 21 and a partition portion 22, wherein the rim portion 21 serves as an outer body of the carrier body and the sealed space.
  • the partition 22 includes a plurality of reflective refracting spaces which are outwardly diffusing cone spaces.
  • the transparent window 10 is packaged on the partition 22 at the center of the mesh body, and the rear cover is closedly mounted under the mesh body.
  • the partition 22 of the mesh body is covered by the transparent form and the lower rear.
  • the cover seal forms a sealed space.
  • the reflective refracting space comprises four side walls and a hollow receiving space, and the space surrounded by the four side walls is an LED chip accommodating space, and is sized to fit a single LED chip arrangement.
  • the patent "LED reflecting structure" applied by the applicant is involved. How to separate a single chip with a tapered reflective structure and maximize the use of illumination sources for efficient illumination.
  • a PCB light board 30 is mounted under the grid partition, and a plurality of LED chips 31 are bound on the PCB light board 30, and each LED chip 31 corresponds to a reflective refracting space.
  • a form mounting position 23 is provided above the partition portion 22 of the mesh body 20 corresponding to the entire partition portion, and the form mounting position 23 is sized to fit the flush mounting of the transparent window.
  • the PCB light panel 30 is a ceramic board or an aluminum substrate.
  • a recessed rear cover mounting position 24 is provided at the bottom of the mesh body 20, and the rear cover is snap-fitted to the bottom of the mesh body through the recessed rear cover mounting position 24, and the PCB light board 30 is clamped and fixed.
  • the rear cover mounting position 24 adapted to the rear cover is a through-groove, that is, the rectangular groove extends to the side of the mesh to form a structure in which the rear cover can be inserted from the side. This has the advantage of improving assembly accuracy and directly inserting and installing the rear cover on one side.
  • a layer of fluorescent film 11 is formed on the transparent window 10, and one side of the fluorescent film 11 faces the sealed space.
  • the fluorescent film 11 is prefabricated on the side of the transparent window corresponding to the encapsulating liquid.
  • the transparent form material may be sapphire, acrylic, glass, or the like.
  • a single chip emits light in the reflective refraction space, and not only the illumination above the LED chip can be utilized, but also the illumination on the side can be concentrated and utilized, thereby improving the utilization of illumination.
  • the reflective refraction space is also the main space for accommodating the encapsulating liquid.
  • the encapsulating liquid is filled in the partition of the mesh body, directly contacting the LED chip 31 and the fluorescent film 11, and the light emitted by the LED chip 31 passes through the encapsulating liquid to activate the fluorescent film 11 Forming visible light.
  • the package liquid is a liquid which has good thermal conductivity, is not volatile, and has a high ignition point.
  • the encapsulating liquid is heat transfer oil, silicone oil, ultrapure water, distilled water, and deionized water.
  • the PCB light board 30 is embedded in the bottom surface of the mesh body 20, and the back cover 40 is attached to the mesh body, and the transparent window 10 of the prefabricated fluorescent film 11 is attached to the front surface of the mesh body.
  • the invention can solve the problem that the current light-emitting chip has difficulty in heat dissipation, because the package in the LED industry is a single chip package, the chip has pins at both ends, and the whole chip is encapsulated with epoxy resin, and the packaging process of this form is complicated and installed. Difficulties make the LED finished lamp structure complicated, and the heat generated by the operation of the chip in this package form is usually radiated from the back of the chip, and the heat sink of the area needs to be enlarged on the lamp, and the heat dissipation is not ideal.
  • the patented technology adopts the form of liquid encapsulation, so that the heat generated by the operation of the light-emitting chip is not limited to the heat dissipation of the back, and the overall heat is dissipated by the heat-conducting liquid around the chip. Now, the heat is radiated from the front, side and back of the lamp body, and the heat is dissipated more effectively.
  • the process is simple and the assembly is easy. It is not necessary to increase the area of the radiator, which is beneficial to the ultra-thin, simplified and miniaturized products. Design, more widely used.
  • the invention relates to an LED lamp which is filled and packaged by a heat-conducting liquid.
  • the chip is distributed on a whole substrate and directly potted with a heat-conducting liquid, so that the heat generated by the light-emitting process passes through the front, side and back multi-channels through multiple channels.
  • the heat dissipation can conduct heat in a shorter time, effectively dissipate heat, avoid heat accumulation and damage the high temperature of the LED chip; improve the luminous performance of the LED chip and improve the luminous efficiency, and the LED lamp has the characteristics of simple process and high reliability.

Abstract

一种液体填充式LED灯，其特征在于，该LED灯主要包括后盖板（40）、PCB灯板（30）、封装用液体、透明窗体（10）和网格体（20），后盖板（40）、透明窗体（10）和网格体（20）从后面、侧面上面封装成一个密封空间，在该密封空间内安装PCB灯板（30），在网格体（20）的表面加工灌注孔，该灌注孔与密封空间相连通，封装用液体灌注到整个密封空间内，灌注孔从外部封堵。一种采用导热液体进行灌注和封装的LED灯，芯片（31）分布在一整块基板上，用导热液体直接灌封后，让发光过程产生的热量通过正面、侧面和背面多方向多渠道散热，能够在更短的时间内传导热量，有效散热，避免热量累积带来损伤LED芯片（31）的高温；改善LED芯片（31）的发光性能，提高发光效率，该LED灯具有工艺简单、可靠性高的特点。

Description

液体填充式LED灯 【技术领域】
本发明涉及发光照明技术领域，尤其涉及一种液体填充式LED封装结构。
【背景技术】
随着照明技术的不断发展，LED作为新的照明光源，作为一种高效、能耗低的照明光源，LED是一类可直接将电能转化为可见光半导体的发光器件，目前LED的光电转化效率很低，大部分电能都被转化为热能。而由于照明而产生的热量如果大量累积，会对LED芯片造成损坏。一直以来，LED灯的其中一个重点方向就是研究如何进行散热。由于光电转化而产生的热量如果不及时排出，LED的发光性能将会大大降低，因此如何封装，有效的将热量散出，成为LED进一步发展的关键。
【发明内容】
本发明针对以上情况提出了一种采用导热液体进行灌注和封装的LED灯，芯片分布在一整块基板上，用导热液体直接灌封后，让发光过程产生的热量通过正面、侧面和背面多方向多渠道散热，有效散热导热，工艺简单、可靠性高。
一种液体填充式LED灯，该LED灯主要包括后盖板、PCB灯板、封装用液体、透明窗体和网格体，后盖板、透明窗体和网格体从后面、侧面上面封装成一个密封空间，在该密封空间内安装PCB灯板，在网格体的表面加工灌注孔，该灌注孔与密封空间相连通，封装用液体灌注到整个密封空间内，灌注孔从外部封堵。
网格体包括围边部和分隔部，其中围边部作为承载主体和密封空间的外部主体，而分隔部包含若干反光折射空间，该反光折射空间为朝外扩散状锥形体 空间。
在网格体分隔部上方对应整个分隔部区域设有窗体安装位，该窗体安装位的大小适合透明窗体的嵌入式安装。
在网格分隔部下方安装有PCB灯板，在该PCB灯板上绑定了若干LED芯片，每个LED芯片对应一个反光折射空间。
该PCB灯板为陶瓷板或者铝基板。
在网格体的底部设有凹陷的后盖板安装位，后盖板通过凹陷的后盖板安装位卡入式安装到网格体底部，并卡紧固定住PCB灯板。
后盖板相适配的后盖板安装位为通口槽结构，即矩形槽一边延伸贯通到网格的围边部，形成一个可以从侧面插入后盖板的结构。
在透明窗体上自生成一层荧光胶膜，荧光胶膜的一面朝向密封空间。
该封装用液体为导热性能好、不易挥发、燃点高的液体。
该封装用液体为导热油、硅油、超纯水、蒸馏水以及去离子水。
液体填充式LED灯，将网格、后盖板、透明窗体、荧光胶膜、PCB灯板组合到一起，装配顺序：PCB灯板嵌入到网格背部，装上后盖板，将预制好荧光胶膜的玻璃装到网格正面，然后通过网格正面的两个灌注孔往网格内部注入液体，注满液体，用胶塞堵住灌注孔即可，完成整个装配过程。
本发明涉及的一种采用导热液体进行灌注和封装的LED灯，芯片分布在一整块基板上，用导热液体直接灌封后，让发光过程产生的热量通过正面、侧面和背面多方向多渠道散热，能够在更短的时间内传导热量，有效散热，避免热量累积带来损伤LED芯片的高温；改善LED芯片的发光性能，提高发光效率，该LED灯具有工艺简单、可靠性高的特点。
【附图说明】
图1是本发明液体填充式LED灯的结构示意图；
图2是本发明实施例1中侧面结构简化示意图。
其中：10、透明窗体；11、荧光胶膜；20、网格体；21、围边部；22、分隔 部；23、窗体安装位；24、后盖板安装位；30、PCB灯板；31、LED芯片；40、后盖板。
【具体实施方式】
下面将结合本发明附图和具体实施方式对本发明液体填充式LED灯进行进一步的详细说明。
请参考附图1：其中示出了该液体式填充LED灯的固定组成部分，其中包括后盖板40、PCB灯板30、透明窗体10和网格体20，其中后盖板40、透明窗体10和网格体20从后面、侧面上面封装成一个密封空间，在该密封空间内安装PCB灯板30，在网格体20的表面加工灌注孔，该灌注孔与密封空间相连通，通过该灌注孔将封装用液体灌注到整个密封空间内，并在完成灌注后，将灌注孔从外部封堵起来。
从附图1中可以看出，网格体20作为整个封装部分的主体结构，网格体20包括围边部21和分隔部22，其中围边部21作为承载主体和密封空间的外部主体，而分隔部22包含若干反光折射空间，该反光折射空间为朝外扩散状锥形体空间。
在网格体中央的分隔部22上配合透明窗体10进行封装，而在网格体下方又配合后盖板进行封闭安装，网格体的分隔部22被上方的透明窗体和下方的后盖板密封构成一个密封空间。
该反光折射空间包含四个侧壁和中空的容纳空间，四个侧壁围成的空间是LED芯片容纳空间，大小适合单颗LED芯片布置，此处涉及本人申请的专利“LED反射结构”。如何利用锥形反射结构分隔单颗芯片并最大程度利用发光源进行高效率照明。
在网格分隔部下方安装有PCB灯板30，在该PCB灯板30上绑定了若干LED芯片31，每个LED芯片31对应一个反光折射空间。
在网格体20分隔部22上方对应整个分隔部区域设有窗体安装位23，该窗体安装位23的大小适合透明窗体的嵌入式安装。
该PCB灯板30为陶瓷板或者铝基板。
在网格体20的底部设有凹陷的后盖板安装位24，后盖板通过凹陷的后盖板安装位24卡入式安装到网格体底部，并卡紧固定住PCB灯板30。
更进一步地，与后盖板相适配的后盖板安装位24为通口槽，即矩形槽一边延伸贯通到网格的围边部，形成一个可以从侧面插入后盖板的结构。这样的好处是可以提高装配精度，以一侧为基准直接插入并安装好后盖板。
在透明窗体10上自生成一层荧光胶膜11，具有荧光胶膜11的一面朝向密封空间。在该透明窗体对应封装液体的一面先预制好荧光胶膜11，具体工艺见本人发明专利：玻璃覆膜工艺，此处透明窗体的材料可为蓝宝石、亚克力、玻璃等。
单个芯片在反光折射空间内发光，不仅LED芯片上方发光能够被利用，同时其侧面的发光可以被集中并利用，提高了发光利用率。其次反光折射空间也是容纳封装液体的主要空间，封装液体填充在网格体的分隔部内，直接与LED芯片31、荧光胶膜11接触，LED芯片31发出的光通过封装液体，激活荧光胶膜11，形成可见光。
该封装用液体为导热性能好、不易挥发、燃点高的液体。
该封装用液体为导热油、硅油、超纯水、蒸馏水以及去离子水。
装配过程是将PCB灯板30嵌入到网格体20的底面，并对应网格体上装上后盖板40，将预制好荧光胶膜11的透明窗体10装到网格体正面的窗体安装位23上，然后通过网格体正面的两个灌注孔往密封空间内注入封装用液体，注满封装用液体，用胶塞堵住灌注孔即可，完成整个装配过程。
本发明能够解决目前发光芯片散热困难的问题，因为目前LED行业内的封装是单颗芯片封装，芯片两端有引脚，并用环氧树脂灌封整个芯片，这种形式的封装工艺复杂，安装困难，使得LED成品灯结构复杂，且这种封装形式芯片工作产生的热量，通常是从芯片背部散出，需在灯上加大面积的散热器，而且散热不理想。而本专利技术采用液体封装的形式，让发光芯片工作产生的热量不仅仅局限于背部散热，整体发热都通过充满芯片周围的导热液体来散热，实 现了从灯体正面、侧面和背面多方位散热，更有效的将热量散出，且工艺简单，装配容易，无需外加大面积的散热器，有利于产品的超薄化、精简化、微型化设计，用处更加广泛。
本发明涉及的一种采用导热液体进行灌注和封装的LED灯，芯片分布在一整块基板上，用导热液体直接灌封后，让发光过程产生的热量通过正面、侧面和背面多方向多渠道散热，能够在更短的时间内传导热量，有效散热，避免热量累积带来损伤LED芯片的高温；改善LED芯片的发光性能，提高发光效率，该LED灯具有工艺简单、可靠性高的特点。
以上所述，仅是本发明较佳实施例而已，并非对本发明作任何形式上的限制，虽然本发明以较佳实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容做出些许变更或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明技术是指对以上实施例所作的任何简单修改、等同变化与修饰，均属于本发明技术方案的范围内。

Claims (10)

  1. 一种液体填充式LED灯，其特征在于，该LED灯主要包括后盖板、PCB灯板、封装用液体、透明窗体和网格体，后盖板、透明窗体和网格体从后面、侧面上面封装成一个密封空间，在该密封空间内安装PCB灯板，在网格体的表面加工灌注孔，该灌注孔与密封空间相连通，封装用液体灌注到整个密封空间内，灌注孔从外部封堵。
  2. 根据权利要求1所述液体填充式LED灯，其特征在于，网格体包括围边部和分隔部，其中围边部作为承载主体和密封空间的外部主体，而分隔部包含若干反光折射空间，该反光折射空间为朝外扩散状锥形体空间。
  3. 根据权利要求2所述液体填充式LED灯，其特征在于，在网格体分隔部上方对应整个分隔部区域设有窗体安装位，该窗体安装位的大小适合透明窗体的嵌入式安装。
  4. 根据权利要求2所述液体填充式LED灯，其特征在于，在网格分隔部下方安装有PCB灯板，在该PCB灯板上绑定了若干LED芯片，每个LED芯片对应一个反光折射空间。
  5. 根据权利要求4所述液体填充式LED灯，其特征在于，该PCB灯板为陶瓷板或者铝基板。
  6. 根据权利要求1所述液体填充式LED灯，其特征在于，在网格体的底部设有凹陷的后盖板安装位，后盖板通过凹陷的后盖板安装位卡入式安装到网格体底部，并卡紧固定住PCB灯板。
  7. 根据权利要求6所述液体填充式LED灯，其特征在于，后盖板相适配的后盖板安装位为通口槽结构，即矩形槽一边延伸贯通到网格的围边部，形成一个可以从侧面插入后盖板的结构。
  8. 根据权利要求1所述液体填充式LED灯，其特征在于，在透明窗体上自生成一层荧光胶膜，荧光胶膜的一面朝向密封空间。
  9. 根据权利要求1所述液体填充式LED灯，其特征在于，该封装用液体为导热性能好、不易挥发、燃点高的液体。
  10. 根据权利要求9所述液体填充式LED灯，其特征在于，该封装用液体为导热油、硅油、超纯水、蒸馏水以及去离子水。
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