WO2014186994A1 - 一种led模组及其制造工艺 - Google Patents

一种led模组及其制造工艺 Download PDF

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Publication number
WO2014186994A1
WO2014186994A1 PCT/CN2013/077333 CN2013077333W WO2014186994A1 WO 2014186994 A1 WO2014186994 A1 WO 2014186994A1 CN 2013077333 W CN2013077333 W CN 2013077333W WO 2014186994 A1 WO2014186994 A1 WO 2014186994A1
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WO
WIPO (PCT)
Prior art keywords
led
lens group
led module
heat dissipation
led chip
Prior art date
Application number
PCT/CN2013/077333
Other languages
English (en)
French (fr)
Inventor
陈凯
黄建明
Original Assignee
杭州华普永明光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN 201320284482 external-priority patent/CN203277499U/zh
Priority claimed from CN201310193583.XA external-priority patent/CN104183581A/zh
Application filed by 杭州华普永明光电股份有限公司 filed Critical 杭州华普永明光电股份有限公司
Priority to US14/893,432 priority Critical patent/US9960323B2/en
Priority to JP2016513196A priority patent/JP2016518724A/ja
Priority to DE112013006965.2T priority patent/DE112013006965T5/de
Publication of WO2014186994A1 publication Critical patent/WO2014186994A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the invention relates to the technical field of illumination lamps, and in particular to an LED module and a manufacturing process thereof.
  • LED chip technology and packaging technology With the development of LED chip technology and packaging technology, more and more LED products are used in the field of lighting, especially high-power white LEDs. Due to its high luminous efficiency, long life, energy saving and environmental protection, suitable dimming control, and no mercury, it is a new generation of illumination source after traditional light sources such as incandescent lamps and fluorescent lamps.
  • the light emitted by the LED chip of the existing LED module needs to pass through the air medium during the propagation process, which will cause interface loss, resulting in low light output efficiency of the LED chip;
  • the LED illuminator of the existing LED module transmits heat only through the bottom of the heat dissipation bracket to the circuit board, and the heat dissipation effect is poor.
  • the object of the present invention is to provide an LED module, which solves the technical problem that the light emitted by the LED chip of the existing LED module in the prior art needs to pass through the air medium during the propagation process, which causes interface loss and leads to low light-emitting efficiency of the LED chip. problem.
  • Another object of the present invention is to provide a manufacturing process for the above LED module, so as to solve the problem that the light emitted by the LED chip of the existing LED module in the prior art needs to pass through the air medium during the propagation process, which may cause interface loss, resulting in the LED chip.
  • Technical problems with low light extraction efficiency are to solve the problem that the light emitted by the LED chip of the existing LED module in the prior art needs to pass through the air medium during the propagation process, which may cause interface loss, resulting in the LED chip.
  • An LED module includes a lens group, a sealing ring, an LED illuminator, a circuit board and a heat sink, wherein the LED illuminator comprises an LED chip and a heat dissipating bracket, and the LED chip is disposed on the heat dissipating bracket.
  • the heat dissipating bracket is disposed on the circuit board by a patching process, the lens group is disposed on the heat sink, the lens group is located above the LED chip, and the heat sink is provided with a wire hole.
  • the through hole is sealed by a sealant, and the sealed space formed by the lens group, the sealing ring, the sealing gel and the heat sink is filled with an encapsulant, and the encapsulant is filled by a process of injection molding.
  • the refractive index of the encapsulant is slightly higher than the refractive index of the lens on the lens group, which is slightly lower than the refractive index of the LED chip, and the encapsulant is transparent and has a refractive index of 1.4 to 3.
  • the bottom of the heat sink is provided with a glue injection hole and a vent hole; and the circuit board is provided with a through hole corresponding to the glue injection hole and the air discharge hole.
  • the LED chip is fixed on the heat dissipation bracket by means of a die bonding method, and the LED chip is provided with a phosphor.
  • the heat dissipation bracket is made of a material that is insulated and has high thermal conductivity.
  • the insulating high thermal conductivity material comprises a highly thermally conductive ceramic material such as A1N.
  • the LED illuminator further comprises a silicone cap, the silicone cap is disposed on the heat dissipation bracket, and the silicone cap is located above the LED chip.
  • the LED chip is fixed on the heat dissipation bracket by means of a die bonding method, and the LED chip is further provided with an encapsulant colloid which mixes the phosphor.
  • the heat dissipating bracket is made of a mixture of a metal material and a resin material, and the metal material functions as a heat sink and a conductive pad; the resin material functions as a mirror and functions to fix the encapsulant in the package.
  • the gel When the gel is not cured, it can prevent the package glue from leaking out.
  • the upper surface of the lens group is provided with a plurality of reinforcing ribs.
  • a plurality of channels are disposed on the inner surface of the lens group for making the injection of the encapsulant more smooth.
  • a manufacturing process of an LED module comprising the following steps:
  • the circuit board is closely attached to the heat sink, a sealing ring is placed along the periphery of the heat sink, and the lens group is disposed on the heat sink, and the lens group is located above the LED chip;
  • the step (3) further comprises: injecting the encapsulant into the channel of the inner surface of the lens group through the injection hole at the bottom of the heat sink.
  • the encapsulant is transparent and has a refractive index of 1.4 to 3.
  • An LED module includes an LED illuminator and an aluminum substrate, the LED illuminator includes an LED chip and a heat dissipation pedestal, the LED chip is disposed on the heat dissipation pedestal, and the heat dissipation pedestal passes through the patch A process fit is disposed on the aluminum substrate.
  • the LED module further includes a lens group and a heat sink, the aluminum substrate is disposed on the heat dissipation base, the lens group is disposed on the heat sink, the lens group and the The space formed by the heat sink is filled with an encapsulant, and the encapsulant has a refractive index of 1.4 to 3.
  • the present invention has the following beneficial effects:
  • the light emitted by the LED chip replaces the original air medium during the propagation process, and the refractive index of the encapsulant matches the lens on the lens group. , in this way, the light extraction rate is maximized, and the light efficiency is improved by 10 to 15% compared with the prior art;
  • the sealed space of the heat sink and the lens group in the LED module of the present invention is filled with a package colloid, and the circuit board and each of the LED illuminants are covered by the encapsulant, so that the waterproof performance is good;
  • the heat generated by the LED illuminator in the present invention can be transmitted not only through the bottom of the heat dissipating bracket to the circuit board, but also can be transmitted outward through the encapsulant, so that the heat dissipating effect is better.
  • FIG. 1 is a schematic structural view of an LED module of the present invention
  • FIG. 3 is a schematic structural view of a circuit board of the present invention.
  • FIG. 4 is a schematic structural view of a heat sink of the present invention.
  • 5 and 6 are schematic structural views of an embodiment of an LED illuminator of the present invention.
  • FIG. 7 is a schematic structural view of another embodiment of an LED illuminator of the present invention.
  • FIG. 8 is a schematic structural view of still another embodiment of the LED illuminator of the present invention.
  • Figure 9 is a schematic structural view of the outer side of the lens group of the present invention.
  • Figure 10 is a schematic structural view of the inner side of the lens group of the present invention.
  • FIG. 11 is a schematic structural view of another embodiment of the LED module of the present invention.
  • the LED module of the present invention includes a lens group 1, a sealing ring 4, an LED illuminator 21, a circuit board 2, and a heat sink 3.
  • the lens group is provided with a snap structure 13
  • the sealing ring 4 includes The solid sealing ring and the liquid sealing ring or both may be included, and the circuit board and the heat sink are provided with the wire holes 24, 33, and the wire holes are sealed by the sealing gel
  • the LED illuminator 21 includes the LED chip 211 and The heat dissipating bracket 212, the LED chip is disposed on the heat dissipating bracket, the heat dissipating bracket is disposed on the circuit board 2 through the patching process, and the lens group 1 is disposed on the heat sink 3 through the buckle structure, the lens The group 1 is located above the LED chip, and the lens group 1, the sealing ring 4 and the heat sink 3, the sealed space formed by the sealing gel at the through hole is filled with the encapsulant, and the encapsulant is filled in the sealed space by the process of injection molding.
  • Lens group 1 sealing ring 4 and heat sink 3.
  • the sealed space formed by the sealing gel at the line hole is filled with the encapsulant, and the encapsulant is filled in the sealed space by the process of injection molding. In this way, the air is discharged from the injection hole while the air is discharged from the vent hole, so that the air is completely discharged into the sealed space, and air bubbles are prevented from remaining in the package encapsulant.
  • the encapsulant is transparent, and the encapsulating colloid has a refractive index slightly higher than the refractive index of the lens on the lens group.
  • the encapsulating colloid has a refractive index slightly higher than that of the lens on the lens group.
  • the refractive index is slightly lower than the refractive index of the LED chip.
  • the refractive index of the LED chip is about 1.7 ⁇ 4, and the refractive index of the lens on the lens group is about 1.4-1.6.
  • the refractive index of the encapsulant should be between the refractive index of the lens and the refractive index of the LED chip, which is 1.4-3.
  • the refractive index of the package material is increased to be between the refractive index of the LED chip and the lens, thereby reducing the occurrence of total reflection. Thereby improving the light extraction efficiency of the LED chip.
  • the light emitted by the LED chip replaces the original air medium during the propagation process, and the refractive index of the encapsulant matches the lens on the lens group, thereby maximizing the light extraction rate.
  • the selected encapsulant colloid has a refractive index of 1.4 to 3.
  • the experimental data shows that the luminous efficiency is improved by 10 to 15% compared with the prior art.
  • the bottom of the heat sink 3 is provided with a glue injection hole 31 and a vent hole 32, and a wire hole 33.
  • the circuit board 2 is provided with a glue hole 31 and a vent hole 32.
  • the through holes 22, 23 corresponding to the through holes 24.
  • the injection hole may be one or more; the vent hole may also be one or more; the shape of the injection hole and the vent hole is not limited.
  • the glue injection hole 31 and the vent hole 32 are each disposed at the bottom of the heat sink 3.
  • the LED chip is fixed on the heat dissipation bracket by means of die bonding, and the LED chip is provided with phosphor.
  • the heat dissipating bracket is made of a material with high thermal conductivity and is preferably a high thermal conductive ceramic material A1N to ensure its heat dissipation as much as possible.
  • the LED illuminator further includes a silicone cap 213, the silicone cap 213 is disposed on the heat dissipation bracket 212, and the silicone cap 213 is located above the LED chip 211.
  • the LED chip 211 is fixed on the heat dissipation bracket 212 by means of a die bonding method, and the LED chip is further provided with an encapsulant 214 mixed with phosphor.
  • the heat dissipation bracket 212 is mixed with a metal material and a resin material.
  • the metal material has the function of acting as a heat sink and a conductive pad; the resin material functions as a mirror and functions to fix the encapsulant, and prevents the package glue from leaking out when the encapsulant is not cured.
  • the upper surface of the lens group 1 is provided with a plurality of reinforcing ribs 11, and the reinforcing ribs 11 enhance the firmness of the lens group.
  • a plurality of channels 12 are provided on the inner surface of the lens group for smoother injection of the encapsulant.
  • the invention also provides a manufacturing process of an LED module, comprising the following steps:
  • the circuit board is closely attached to the heat sink, the sealing ring is placed on the periphery of the heat sink, the lens group cover is placed on the heat sink, and the lens group is located above the LED chip;
  • the step (3) further includes: the encapsulant is first injected into the channel of the inner surface of the lens group through the injection hole at the bottom of the heat sink, and then enters the gap between the heat sink and the lens group.
  • the encapsulant is transparent and has a refractive index of 1.4 to 3.
  • the difference between this embodiment and the foregoing embodiment is that, in this embodiment, the lens group and the heat sink are no longer buckled by means of a snap, but are screwed.
  • the sealed space of the heat sink and the lens group is filled with the encapsulant, and the circuit board and each of the LED illuminators are covered by the encapsulant, so that the waterproof performance is excellent.
  • the heat generated by the LED light-emitting body can be transmitted not only through the bottom of the heat-dissipating bracket to the circuit board, but also can be transmitted outward through the encapsulant, so that the heat-dissipating effect is better.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED模组及其制造工艺，属于照明灯技术领域。该LED模组包括透镜组（1）、LED发光体（21）、电路板（2）和散热器（3），所述LED发光体（21）包括LED芯片（211）和散热支架（212），所述LED芯片（211）贴合设置在所述散热支架（212）上，所述散热支架（212）通过贴片工艺设置在所述电路板（2）上，所述透镜组（1）盖设在所述散热器（3）上，所述透镜组（1）位于所述LED芯片（211）上方，所述透镜组（1）和所述散热器（3）形成的密闭空间内填充封装胶体，所述封装胶体通过注胶的工艺充入所述的密闭空间。与现有技术相比，该LED模组中，LED芯片（211）发出的光在传播过程中封装胶体替代了原有的空气介质，并且封装胶体的折射率与透镜组（1）上的透镜匹配，这样在最大程度上提高了出光率，与现有技术相比，光效提高了10〜15%。

Description

一种 LED模组及其制造工艺 技术领域
本发明涉及照明灯的技术领域， 特别涉及一种 LED模组及其制造工艺。
背景技术
随着 LED芯片技术与封装技术的发展， 越来越多的 LED产品应用于照明领域， 尤其是 大功率白光 LED。 由于 LED具有高光效、 长寿命、 节能环保、 合适调光控制、 不含汞等污染 物质的特点， 成为继白炽灯、 荧光灯等传统光源之后的新一代照明光源。
但是， 目前的 LED模组存在以下缺陷：
1、 现有 LED模组的 LED芯片发出的光在传播过程中需经过空气介质， 会造成界面损 失， 导致 LED芯片出光效率低；
2、 现有 LED模组中， 透镜组和散热器之间无填充物， 一旦进入水汽将损坏 LED发光 体；
3、 现有 LED模组的 LED发光体仅通过散热支架的底面向电路板传递热量， 散热效果 较差。
发明内容
本发明目的在于提供一种 LED模组， 以解决现有技术中现有 LED模组的 LED芯片发 出的光在传播过程中需经过空气介质， 会造成界面损失， 导致 LED芯片出光效率低的技术性 问题。
本发明的另一目的在于提供上述 LED模组的制造工艺， 以解决现有技术中现有 LED模 组的 LED芯片发出的光在传播过程中需经过空气介质， 会造成界面损失， 导致 LED芯片出 光效率低的技术性问题。
本发明目的通过以下技术方案实现：
一种 LED模组， 包括透镜组、 密封圈、 LED发光体、 电路板和散热器， 所述 LED发光 体包括 LED芯片和散热支架， 所述 LED芯片贴合设置在所述散热支架上， 所述散热支架通 过贴片工艺设置在所述电路板上，所述透镜组盖设在所述散热器上，所述透镜组位于所述 LED 芯片上方， 所述散热器上设置有过线孔， 所述过线孔通过密封胶体密封， 所述透镜组、 所述 密封圈、 所述密封胶体和所述散热器形成的密闭空间内填充封装胶体， 所述封装胶体通过注 胶的工艺充入所述的密闭空间。 优选地， 其封装胶体的折射率略高于透镜组上的透镜的折射率， 略低于 LED芯片的折射 率， 所述封装胶体为透明状， 其折射率为 1.4〜3。
优选地， 所述散热器的底部设有注胶孔和排气孔； 所述电路板上设有与所述注胶孔和排 气孔相对应的通孔。
优选地， 所述 LED芯片通过固晶方式固定在散热支架上， 所述 LED芯片上设有荧光粉。 优选地， 所述散热支架由绝缘高导热的材料制成。
优选地， 所述绝缘高导热的材料包括高导热陶瓷材料， 如 A1N。
优选地， 所述 LED发光体还包括硅胶帽， 所述硅胶帽设置在所述散热支架上， 所述硅胶 帽位于所述 LED芯片上方。
优选地， 所述 LED芯片通过固晶方式固定在散热支架上， 所述 LED芯片上还设置有混 合荧光粉的封装胶体。
优选地， 所述散热支架由金属材料和树脂材料混合而成， 金属材料具有充当热沉和导电 焊盘的作用； 树脂材料具有充当反射镜的作用， 并起到固定封装胶体的作用， 在封装胶体没 有固化时可阻止封装胶体外泄。
优选地， 所述透镜组上表面设置有若干加强筋。
优选地， 所述透镜组内表面上设置有若干沟道， 用于使封装胶体的注入更加顺畅。
一种 LED模组的制造工艺， 包括以下步骤：
( 1 )将 LED芯片贴合设置在散热支架上， 将所述散热支架通过贴片工艺贴合设置在电路 板上；
(2) 将所述电路板与散热器紧密贴合， 散热器四周边沿放置有密封圈， 将透镜组盖设在 所述散热器上， 所述透镜组位于所述 LED芯片上方；
(3 ) 将封装胶体通过散热器底部的注胶孔注入散热器和透镜组之间的间隙， 封装胶体填 满透镜组与散热器之间的间隙， 多余的空气从排气孔排出；
(4) 用螺丝拧紧的方式和 /或者用胶水封口的方式密封注胶孔和排气孔。
优选地， 所述步骤（3 )还包括： 将封装胶体通过散热器底部的注胶孔注入透镜组内表面 的沟道内。
优选地， 所述封装胶体为透明状， 其折射率为 1.4〜3。
一种 LED模组， 包括 LED发光体和铝基板， 所述 LED发光体包括 LED芯片和散热基 座， 所述 LED芯片贴合设置在所述散热基座上， 所述散热基座通过贴片工艺贴合设置在所述 铝基板上。 优选地，上述 LED模组还包括透镜组和散热器，所述铝基板贴合设置在所述散热基座上， 所述透镜组盖设在所述散热器上， 所述透镜组和所述散热器构成的空间内填充有封装胶体， 所述封装胶体的折射率为 1.4〜3。
与现有的技术相比， 本发明有以下有益效果：
1、 与现有的技术相比， 本发明的 LED模组中， LED芯片发出的光在传播过程中封装 胶体替代了原有的空气介质， 并且封装胶体的折射率与透镜组上的透镜匹配， 这样在最大程 度上提高了出光率， 与现有技术相比， 光效提高了 10〜15%；
2、 本发明的 LED模组中散热器和透镜组的密闭空间内填充有封装胶体， 电路板和每个 LED发光体都被封装胶体包覆， 因此具有很好的防水性能；
3、 本发明中 LED发光体产生的热量不仅可以通过散热支架的底面向电路板传递， 而且 可以通过封装胶体向外传递， 使得散热效果更好。
附图说明
图 1为本发明的 LED模组的结构示意图；
图 2为本发明的 LED模组的分解示意图；
图 3为本发明的电路板的结构示意图；
图 4为本发明的散热器的结构示意图；
图 5、 6为本发明的 LED发光体的一种实施例的结构示意图；
图 7为本发明的 LED发光体的另一种实施例的结构示意图；
图 8为本发明的 LED发光体的再一种实施例的结构示意图；
图 9为本发明的透镜组外侧的结构示意图；
图 10为本发明的透镜组内侧的结构示意图；
图 11为本发明的 LED模组的另一种实施例的结构示意图。
具体实施方式
以下结合附图， 详细说明本发明。
实施例 1
请参阅图 1-10， 本发明的 LED模组， 包括透镜组 1、 密封圈 4、 LED发光体 21、 电路板 2和散热器 3， 透镜组上设置有卡扣结构 13， 密封圈 4包括可以包括固体密封圈和液体密封 圈或两者的其中之一， 电路板和散热器上设置有过线孔 24、 33, 过线孔通过密封胶体进行密 封， LED发光体 21包括 LED芯片 211和散热支架 212， LED芯片贴合设置在散热支架上， 散热支架通过贴片工艺设置在电路板 2上， 透镜组 1通过卡扣结构盖设在散热器 3上， 透镜 组 1位于 LED芯片上方， 透镜组 1、 密封圈 4和散热器 3、 过线孔处密封胶体形成的密闭空 间内填充封装胶体， 封装胶体通过注胶的工艺充入的密闭空间。 以上 LED模组的结构仅是举 例说明， 并非用来局限于本发明， LED模组还可以采用其它的结构。
透镜组 1、密封圈 4和散热器 3、 过线孔处密封胶体形成的密闭空间内填充封装胶体， 封 装胶体通过注胶的工艺充入的密闭空间。这样， 胶体从注胶孔注入的同时空气从排气孔排出， 从而使得空气完全排出密闭空间， 防止填充封装胶体内留有气泡。
在本实例中， 封装胶体为透明状， 采用的封装胶体的折射率略高于透镜组上的透镜的折 射率， 最好的是， 其封装胶体的折射率略高于透镜组上的透镜的折射率， 略低于 LED芯片的 折射率。 LED芯片折射率约为 1.7〜4， 透镜组上的透镜的折射率约为 1.4-1.6， 封装胶体的折 射率宜介于透镜的折射率与 LED芯片的折射率， 选取 1.4-3。
这样， 折射率差异过大导致全反射发生， 将光线反射回芯片内部而无法有效导出， 因此 提高封装材料的折射率， 使其介于 LED芯片和透镜的折射率， 可减少全反射的发生， 从而提 高 LED芯片的出光效率。
本发明的 LED模组中， LED芯片发出的光在传播过程中封装胶体替代了原有的空气介 质， 并且封装胶体的折射率与透镜组上的透镜匹配， 这样在最大程度上提高了出光率， 在本 实例中， 选用的封装胶体折射率可为 1.4〜3， 经实验数据表明， 与现有技术相比， 光效提高了 10〜15%。
请参阅图 2-4， 在本实例中， 散热器 3的底部设有注胶孔 31和排气孔 32、 过线孔 33; 电 路板 2上设有与注胶孔 31和排气孔 32、 过线孔 24相对应的通孔 22、 23。注胶孔可以为一个 或者多个； 排气孔也可以为一个或者多个； 注胶孔和排气孔的形状不限定。 在本实例中， 注 胶孔 31和排气孔 32各为一个设置在散热器 3的底部， 当散热器 3和透镜组 1扣合连接后， 将封装胶体通过散热器底部的注胶孔注入散热器、 密封圈、 透镜组和过线孔密封结构之间的 间隙， 多余的空气从排气孔排出， 以尽最大可能保证其密封性。
请参阅图 5、 6， 在本实例中， LED芯片通过固晶方式固定在散热支架上， LED芯片上 设有荧光粉。 其中， 散热支架由绝缘高导热的材料制成， 优选为高导热陶瓷材料 A1N， 以尽 最大可能保证其散热性。
请参阅图 7， 在本实例中， LED发光体还包括硅胶帽 213， 硅胶帽 213设置在散热支架 212上， 硅胶帽 213位于 LED芯片 211上方。
请参阅图 8， 在本实例中， LED芯片 211通过固晶方式固定在散热支架 212上， LED芯 片上还设置有混合荧光粉的封装胶体 214。 其中， 散热支架 212由金属材料和树脂材料混合 而成， 金属材料具有充当热沉和导电焊盘的作用； 树脂材料具有充当反射镜的作用， 并起到 固定封装胶体的作用， 在封装胶体没有固化时可阻止封装胶体外泄。
请参阅图 9、 10， 在本实例中， 透镜组 1上表面设置有若干加强筋 11， 加强筋 11可增强 透镜组的牢固性。 透镜组内表面上设置有若干沟道 12， 用于使封装胶体的注入更加顺畅。
本发明还提供一种 LED模组的制造工艺， 包括以下步骤：
( 1 )将 LED芯片贴合设置在散热支架上，将散热支架通过贴片工艺贴合设置在电路板上;
(2) 将电路板与散热器紧密贴合， 密封圈放置在散热器四周边沿， 将透镜组盖设在散热 器上， 透镜组位于 LED芯片上方；
(3 ) 将封装胶体通过散热器底部的注胶孔注入散热器和透镜组之间的间隙， 封装胶体填 满透镜组与散热器之间的间隙， 多余的空气从排气孔排出；
(4) 用螺丝拧紧的方式和 /或者用胶水封口的方式密封注胶孔和排气孔。
为了使封装胶体的注入更加顺畅， 步骤（3 )还包括： 封装胶体先通过散热器底部的注胶 孔注入透镜组内表面的沟道内， 再进入散热器和透镜组之间的间隙。 其中， 封装胶体为透明 状， 其折射率为 1.4〜3。
实施例 2
请参阅图 11， 本实施例与前面所述的实施例的区别在于， 本实施例中透镜组和散热器之 间不再采用卡扣的方式扣接， 而是采用螺丝拧紧。
本发明的 LED模组中， 散热器和透镜组的密闭空间内填充有封装胶体， 电路板和每个 LED发光体都被封装胶体包覆， 因此具有很好的防水性能。 本发明的 LED模组中， LED发 光体产生的热量不仅可以通过散热支架的底面向电路板传递， 而且可以通过封装胶体向外传 递， 使得散热效果更好。 以上公开的仅为本申请的几个具体实施例， 但本申请并非局限于此， 任何本领域的技术 人员能思之的变化， 都应落在本申请的保护范围内。

Claims

权 利 要 求 书
1、 一种 LED模组， 其特征在于， 包括透镜组、 密封圈、 LED发光体、 电路板和散热器， 所述 LED发光体包括 LED芯片和散热支架， 所述 LED芯片贴合设置在所述散热支架上， 所 述散热支架通过贴片工艺设置在所述电路板上， 所述透镜组盖设在所述散热器上， 所述透镜 组位于所述 LED芯片上方， 所述散热器上设置有过线孔， 所述过线孔通过密封胶体密封， 所 述透镜组、 所述密封圈、 所述密封胶体和所述散热器形成的密闭空间内填充封装胶体， 所述 封装胶体通过注胶的工艺充入所述的密闭空间。
2、 如权利要求 1所述的 LED模组， 其特征在于， 所述封装胶体为透明状， 其封装胶体 的折射率略高于透镜组上的透镜的折射率， 略低于 LED芯片的折射率。
3、 如权利要求 2所述的 LED模组， 其特征在于， 采用的封装胶体折射率为 1.4〜3。
4、 如权利要求 1所述的 LED模组， 其特征在于， 所述散热器的底部设有注胶孔和排气 孔； 所述电路板上设有与所述注胶孔和排气孔相对应的通孔。
5、 如权利要求 1所述的 LED模组， 其特征在于， 所述 LED芯片通过固晶方式固定在散 热支架上， 所述 LED芯片上设有荧光粉。
6、 如权利要求 5所述的 LED模组， 其特征在于， 所述散热支架由绝缘高导热的材料制 成。
7、 如权利要求 6所述的 LED模组， 其特征在于， 所述绝缘高导热的材料包括高导热陶 瓷材料。
8、 如权利要求 1所述的 LED模组， 其特征在于， 所述 LED发光体还包括硅胶帽， 所述 硅胶帽设置在所述散热支架上， 所述硅胶帽位于所述 LED芯片上方。
9、 如权利要求 1所述的 LED模组， 其特征在于， 所述 LED芯片通过固晶方式固定在散 热支架上， 所述 LED芯片上还设置有混合荧光粉的封装胶体。
10、 如权利要求 9所述的 LED模组， 其特征在于， 所述散热支架由金属材料和树脂材料 混合而成。
11、如权利要求 1所述的 LED模组，其特征在于，所述透镜组上表面设置有若干加强筋。
12、如权利要求 1所述的 LED模组，其特征在于，所述透镜组内表面上设置有若干沟道， 用于使封装胶体的注入更加顺畅。
13、 一种 LED模组的制造工艺， 其特征在于， 包括以下步骤：
( 1 )将 LED芯片贴合设置在散热支架上， 将所述散热支架通过贴片工艺贴合设置在电路 板上； (2) 将所述电路板与散热器紧密贴合， 散热器四周边沿放置有密封圈， 将透镜组盖设在 所述散热器上， 所述透镜组位于所述 LED芯片上方；
(3 ) 将封装胶体通过散热器底部的注胶孔注入散热器和透镜组之间的间隙， 封装胶体填 满透镜组与散热器之间的间隙， 多余的空气从排气孔排出；
(4) 用螺丝拧紧的方式和 /或者用胶水封口的方式密封注胶孔和排气孔。
14、 如权利要求 13所述的 LED模组的制造工艺， 其特征在于， 所述步骤 （3 ) 还包括： 将封装胶体通过散热器底部的注胶孔注入透镜组内表面的沟道内。
15、 如权利要求 13所述的 LED模组的制造工艺， 其特征在于， 所述封装胶体为透明状， 其折射率为 1.4〜3。
16、 一种 LED模组， 其特征在于， 包括 LED发光体和铝基板， 所述 LED发光体包括 LED芯片和散热基座，所述 LED芯片贴合设置在所述散热基座上，所述散热基座通过贴片工 艺贴合设置在所述铝基板上。
17、 如权利要求 16所述的 LED模组， 其特征在于， 还包括透镜组和散热器， 所述铝基 板贴合设置在所述散热基座上， 所述透镜组盖设在所述散热器上， 所述透镜组和所述散热器 构成的空间内填充有封装胶体， 所述封装胶体的折射率为 1.4〜3。
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