CN202948968U - 一种白光led器件 - Google Patents

一种白光led器件 Download PDF

Info

Publication number
CN202948968U
CN202948968U CN2012205859041U CN201220585904U CN202948968U CN 202948968 U CN202948968 U CN 202948968U CN 2012205859041 U CN2012205859041 U CN 2012205859041U CN 201220585904 U CN201220585904 U CN 201220585904U CN 202948968 U CN202948968 U CN 202948968U
Authority
CN
China
Prior art keywords
led
nitride film
boron nitride
cubic boron
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012205859041U
Other languages
English (en)
Inventor
杨杭生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Tianzhu Science & Technology Co Ltd
Original Assignee
Hangzhou Tianzhu Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Tianzhu Science & Technology Co Ltd filed Critical Hangzhou Tianzhu Science & Technology Co Ltd
Priority to CN2012205859041U priority Critical patent/CN202948968U/zh
Application granted granted Critical
Publication of CN202948968U publication Critical patent/CN202948968U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

本实用新型公开的白光LED器件包括石英衬底，在石英衬底的一面有荧光粉胶，石英衬底的另一面有立方氮化硼薄膜，立方氮化硼薄膜上罩反射碗形成密闭腔，腔内有n个并联或串联的LED芯片固定在立方氮化硼薄膜上，n≥1，LED芯片的两个电极用导线引出腔外，腔外设有与立方氮化硼薄膜连接的散热器。该LED器件结构简单，利用石英和立方氮化硼的透光性，使芯片双面出光，并且采用反射碗将背面的出光和从荧光粉胶表面反射回来的反射光，重新反射到荧光粉胶层，降低光损耗，提高了LED的发光效率。且利用立方氮化硼薄膜的高热导率和石英片的低热导率，可防止荧光粉胶加热劣化，延长使用寿命。

Description

一种白光LED器件
技术领域
本实用新型涉及一种LED光源器件，尤其是一种利用生长有立方氮化硼薄膜的石英衬底将荧光粉胶和芯片分离的白光LED器件。 
背景技术
发光二级管（LED），被认为是继白炽灯、荧光灯、高强度气体放电灯之后的第四代光源。 
传统的LED将芯片安装在一个具有散热辅助设计的电路板上，然后，将荧光粉胶直接覆盖在LED芯片上。因为电路板不透光，LED只能单面出光，直接降低了LED的出光效率。与此同时，从芯片单面发出的光，有接近一半的光，被荧光粉胶反射回来，进一步减弱了LED的光输出。并且反射光被吸收，引发芯片等的进一步发热升温的副作用。 
发明内容
鉴于现有技术存在的不足，本实用新型的目的是提供一种有利于提高发光效率的白光LED器件。 
本实用新型的白光LED器件包括石英衬底，在石英衬底的一面有荧光粉胶，石英衬底的另一面有立方氮化硼薄膜，立方氮化硼薄膜上罩反射碗形成密闭腔，腔内有n个并联或串联的LED芯片固定在立方氮化硼薄膜上，n≥1，LED芯片的两个电极用导线引出腔外，腔外设有与立方氮化硼薄膜连接的散热器。 
本实用新型中，所述的LED芯片可以是蓝宝石基氮化镓二极管发光芯片、碳化硅基氮化镓二极管发光芯片或硅基氮化镓二极管发光芯片。所述的荧光粉胶可以是添加有荧光粉的环氧树脂、硅胶或聚碳酸酯。 
上述的石英衬底上的立方氮化硼薄膜可以采用CN1850589和CN101565822的方法生长获得。 
本实用新型的全空间LED器件结构简单，利用石英和立方氮化硼的透光性，使芯片双面出光，并且采用反射碗将背面的出光和从荧光粉胶表面反射回来的反射光，重新反射到荧光粉胶层，降低光损耗，提高了LED的发光效率。且利用立方氮化硼薄膜的高热导率和石英片的低热导率，可防止荧光粉胶加热劣化，延长使用寿命。 
附图说明
图1是LED器件的示意图； 
图中：1为LED芯片；2为立方氮化硼薄膜；3为石英衬底；4导线；5荧光粉胶；6为反射碗；7电极；8散热器。
具体实施方式
以下结合附图对本实用新型作进一步描述。 
参照图1，本实用新型的白光LED器件包括石英衬底3，在石英衬底3的一面涂覆有荧光粉胶5，荧光粉胶的厚度可以根据不同的需要调整，石英衬底3的另一面采用CN1850589或CN101565822的方法生长有立方氮化硼薄膜2，在立方氮化硼薄膜2上罩反射碗6形成密闭腔，腔内有n个并联或串联的LED芯片1采用透明导热胶固定在立方氮化硼薄膜2上，n≥1，图例为一个LED芯片，LED芯片可以正装、也可以倒装。LED芯片的两个电极7用导线4引出腔外，腔外设有与立方氮化硼薄膜2连接的散热器8。LED芯片工作时产生的热量，通过立方氮化硼薄膜将热量传到外部散热器上，并利用石英衬底绝热层，防止荧光粉胶的高温劣化，提升LED的发光效率，延长使用寿命。该全空间白光LED器件上的荧光粉胶和发光芯片分离，利用反射碗将背面的出光和从荧光粉胶表面反射回来的反射光，重新反射到荧光粉胶，降低光损耗，提升LED的发光效率。 
上述具体实施方式仅是本实用新型的具体实施例子，本实用新型不限于以上实施例子，在本实用新型的精神和权利要求的保护范围内，对本实用新型作出的任何修改和改变，均应认为是落入本实用新型的保护范围。 

Claims (2)

1.一种白光LED器件，其特征在于包括石英衬底（3），在石英衬底（3）的一面有荧光粉胶（5），石英衬底（3）的另一面有立方氮化硼薄膜（2），立方氮化硼薄膜（2）上罩反射碗（6）形成密闭腔，腔内有n个并联或串联的LED芯片（1）固定在立方氮化硼薄膜（2）上，n≥1，LED芯片（1）的两个电极（7）用导线（4）引出腔外，腔外设有与立方氮化硼薄膜（2）连接的散热器（8）。
2.根据权利要求1所述的白光LED器件，其特征在于所述的LED芯片（1）是蓝宝石基氮化镓二极管发光芯片、碳化硅基氮化镓二极管发光芯片或硅基氮化镓二极管发光芯片。
CN2012205859041U 2012-11-08 2012-11-08 一种白光led器件 Expired - Fee Related CN202948968U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012205859041U CN202948968U (zh) 2012-11-08 2012-11-08 一种白光led器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012205859041U CN202948968U (zh) 2012-11-08 2012-11-08 一种白光led器件

Publications (1)

Publication Number Publication Date
CN202948968U true CN202948968U (zh) 2013-05-22

Family

ID=48424653

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012205859041U Expired - Fee Related CN202948968U (zh) 2012-11-08 2012-11-08 一种白光led器件

Country Status (1)

Country Link
CN (1) CN202948968U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102945909A (zh) * 2012-11-08 2013-02-27 杭州天柱科技有限公司 一种全空间白光led器件

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102945909A (zh) * 2012-11-08 2013-02-27 杭州天柱科技有限公司 一种全空间白光led器件
CN102945909B (zh) * 2012-11-08 2015-05-20 杭州天柱科技有限公司 一种全空间白光led器件

Similar Documents

Publication Publication Date Title
Liu et al. Status and prospects for phosphor-based white LED packaging
WO2014201774A1 (zh) 一种全方向出光的led球泡灯
JP2016518724A (ja) Ｌｅｄモジュールとその製造方法
CN206163517U (zh) 一种透光面粗化的led器件
CN203517379U (zh) 一种基于倒装led芯片与透明陶瓷基板的灯泡
CN202839589U (zh) 一种均热板、基于均热板的led芯片封装结构及其芯片支架
CN202948968U (zh) 一种白光led器件
CN204943064U (zh) 曲面异型全周发光led灯泡
CN206943847U (zh) 一种可快速组装的led灯
CN204062595U (zh) 一种led灯具
CN203026552U (zh) Led发光元器件支架
CN201615379U (zh) 一种高效散热的led灯
CN102945909B (zh) 一种全空间白光led器件
CN101676630B (zh) 发光二极管灯泡
CN103606622A (zh) 一种led集成式光源
CN103346243A (zh) 承载散热板和远程荧光粉结构的led光源及其生产方法
WO2014086078A1 (zh) Led发光元器件
Chan Electronic packaging for solid-state lighting
CN102856476A (zh) 一种基于均热板的led芯片封装结构及其芯片支架
JP3163777U (ja) ヒートシンクおよびｌｅｄランプ
CN205231115U (zh) 一种双面封装led发光装置
CN202948978U (zh) 一种立方氮化硼薄膜促进芯片散热的白光led器件
CN105444036A (zh) 一种led光源发光散热结构及其发光散热方法
TW201138166A (en) LED light emitting diode with high brightness and fast heat absorption and manufacturing method thereof
CN102945912A (zh) Led发光元器件支架

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130522

Termination date: 20151108

EXPY Termination of patent right or utility model