CN104701269B - 叠层封装件结构中的翘曲控制 - Google Patents

叠层封装件结构中的翘曲控制 Download PDF

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CN104701269B
CN104701269B CN201410733604.7A CN201410733604A CN104701269B CN 104701269 B CN104701269 B CN 104701269B CN 201410733604 A CN201410733604 A CN 201410733604A CN 104701269 B CN104701269 B CN 104701269B
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metal
package
device die
composite material
paste
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CN104701269A (zh
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陈威宇
胡毓祥
林威宏
郑明达
刘重希
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

本发明提供了一种封装件，该封装件包括底部衬底和位于底部衬底上方并且接合至底部衬底的底部管芯。含金属粒子复合物材料位于底部管芯的顶面的上面，其中，含金属粒子复合物材料包括金属粒子。模制材料将底部管芯的至少下部模制在其中，其中，模制材料位于底部衬底的上面。

Description

叠层封装件结构中的翘曲控制
技术领域
本发明涉及集成电路器件，更具体地，涉及叠层封装件结构中的翘曲控制。
背景技术
在传统的叠层封装件(PoP)工艺中，顶部封装件(第一器件管芯接合在顶部封装件中)进一步通过焊料球接合至底部封装件。底部封装件也可以包括接合在其中的第二器件管芯。第二器件管芯可以与焊料球位于底部封装件的同一侧上。
在将顶部封装件接合至底部封装件之前，将模塑料施加到底部封装件上，其中模塑料覆盖第二器件管芯和焊料球。由于焊料球埋入模塑料中，所以实施激光烧蚀或钻孔以在模塑料中形成孔，从而暴露焊料球。然后可以通过底部封装件中的焊料球接合顶部封装件和底部封装件。
PoP封装件中的材料的热膨胀系数(CTE)之间存在明显的失配。例如，封装衬底和模塑料的CTE远高于器件管芯的CTE。因此，在产生的封装件中，存在明显的翘曲。
发明内容
为了解决现有技术中存在的问题，本发明提供了一种封装件，包括：衬底；底部管芯，位于所述衬底上方并且接合至所述衬底；含金属粒子复合物材料，位于所述底部管芯的顶面上方，其中，所述含金属粒子复合物材料包括金属粒子；以及模制材料，将所述底部管芯的至少下部模制在所述模制材料中，其中，所述模制材料位于所述衬底的上面。
在上述封装件中，其中，所述含金属粒子复合物材料包括铜膏，并且其中，所述铜膏包括铜粒子。
在上述封装件中，其中，所述含金属粒子复合物材料的第一热膨胀系数(CTE)大于所述底部管芯的第二CTE。
在上述封装件中，其中，所述封装件还包括：额外的封装件，位于所述衬底的上面并且接合至所述衬底。
在上述封装件中，其中，所述模制材料包括与所述含金属粒子复合物材料重叠的部分。
在上述封装件中，其中，所述封装件还包括刚性金属板，其中，所述刚性金属板位于所述含金属粒子复合物材料的上面并且与所述含金属粒子复合物材料接触，并且其中，所述刚性金属板的CTE大于所述底部管芯的CTE。
在上述封装件中，其中，所述含金属粒子复合物材料的下部具有比所述含金属粒子复合物材料的上部更大的顶视图面积。
根据本发明的另一方面，提供了一种封装件，包括：底部封装件，包括：封装衬底；和器件管芯，位于所述封装衬底上方并且接合至所述封装衬底；含金属粒子复合物材料，位于所述器件管芯的顶面上方；模塑料，位于所述封装衬底上方，其中，所述模塑料将所述器件管芯模制在所述模塑料中；以及顶部封装件，通过穿透所述模塑料的焊料区接合至所述底部封装件。
在上述封装件中，其中，所述含金属粒子复合物材料的顶视图面积小于所述器件管芯的顶视图面积，并且其中，所述含金属粒子复合物材料的下部的顶视图面积大于所述含金属粒子复合物材料的上部的顶视图面积。
在上述封装件中，其中，所述模塑料的顶面高于所述含金属粒子复合物材料的顶面，并且其中，所述模塑料与所述含金属粒子复合物材料的侧壁接触。
在上述封装件中，其中，所述模塑料的顶面低于所述含金属粒子复合物材料的顶面。
在上述封装件中，其中，所述封装件还包括：金属板，位于所述含金属粒子复合物材料上方并且与所述含金属粒子复合物材料接触。
在上述封装件中，其中，所述含金属粒子复合物材料圆形顶部拐角。
在上述封装件中，其中，所述含金属粒子复合物材料和所述模塑料包括不同的材料。
根据本发明的又一方面，提供了一种方法，包括：将器件管芯接合在封装衬底上方；将含金属膏施加到所述器件管芯的顶面上方；固化所述含金属膏；以及在固化所述含金属膏之后，将所述器件管芯模制在模塑料中，其中，所述模塑料包括位于所述封装衬底的上面的部分。
在上述方法中，其中，施加所述含金属膏包括：将丝网放置在所述器件管芯上方，其中，所述丝网的通孔与所述器件管芯对准；将所述含金属膏放置在所述丝网上方；以及清除所述含金属膏的过量部分，所述过量部分位于所述通孔的外部，其中，所述含金属膏的保留在所述通孔中的部分形成位于所述器件管芯的顶面上方的所述含金属膏。
在上述方法中，其中，所述方法还包括：去除所述模塑料的位于焊料球上方的部分，所述焊料球位于所述封装衬底的顶面上，其中，所述模塑料的与所述含金属膏重叠的部分保持未去除。
在上述方法中，其中，所述方法还包括：在模制所述器件管芯之后，将顶部封装件接合至底部封装件，其中，所述底部封装件包括所述封装衬底、所述器件管芯、所述含金属膏和所述模塑料。
在上述方法中，其中，所述方法还包括：在固化所述含金属膏和将所述器件管芯模制在所述模塑料中之前，将刚性板放置在所述含金属膏上方，其中，在固化所述含金属膏之后，将所述刚性板粘附至所述含金属膏。
在上述方法中，其中，施加所述含金属膏包括施加铜膏，其中，所述铜膏包括位于所述铜膏中的铜粒子。
附图说明
为了更完全地理解实施例及其优势，现在将结合附图进行的以下描述作为参考，其中：
图1至图9是根据一些示例性实施例的叠层封装件(PoP)结构在制造中的中间阶段的截面图。
具体实施方式
下面详细地讨论了本发明的实施例的制造和使用。然而，应该理解，实施例提供了许多可以体现在各种具体上下文中的适用的概念。讨论的具体实施例是说明性的，并且不限制本发明的范围。
根据各个实施例，提供了封装件及其形成方法。根据一些实施例，示出了形成封装件的中间阶段。讨论了实施例的变化。贯穿各个视图和说明性实施例，相同的参考标号用于标示相同的元件。
图1至图9是根据一些示例性实施例的叠层封装件(PoP)结构在制造中的中间阶段的截面图。参照图1，提供了封装组件10。在一些实施例中，封装组件10是封装衬底，并且因此下文中称为封装衬底10，但是封装组件10可以是诸如中介板或封装件的其他类型的封装组件。封装衬底10可以是封装衬底条(未示出)的一部分。例如，封装衬底条可以包括具有与封装衬底10相同的结构的多个封装衬底。封装衬底条中的封装衬底可以布置为阵列。
封装衬底10可以是堆积衬底或层压衬底。例如，作为堆积衬底，封装衬底10包括由介电材料形成的衬底11，其中，导电通孔15穿透衬底11。封装衬底10也包括位于衬底11的相对两侧上的金属线/通孔14。封装衬底10也可以是层压衬底，其包括层压介电膜和内置于介电膜中的导电迹线。封装衬底10配置为将封装衬底10的顶侧上的连接件12电连接至封装衬底10的底侧上的导电部件16。例如，导电部件12和16可以是金属焊盘。
电连接件24形成在封装衬底10的顶面10A上。电连接件24电连接至电连接件12并且可以与电连接件12物理接触。在一些实施例中，电连接件24是焊料球。在可选实施例中，电连接件24包括金属焊盘、金属柱、形成在金属柱上的焊料盖等。电连接件24的焊料区(诸如焊料球或回流的焊料盖)可以具有圆形顶面，但是焊料区的顶面也可以是平坦的。
参照图2，器件管芯20通过电连接件12接合至封装衬底10。贯穿说明书，由于器件管芯20位于底部封装件中，所以器件管芯20也称为底部器件管芯。器件管芯20可以是包括诸如晶体管、电容器、电感器、电阻器等的集成电路器件(未示出)的电路管芯。器件管芯20可以是诸如中央计算单元(CPU)管芯的逻辑管芯。器件管芯20也可以表示管芯堆叠件，管芯堆叠件包括堆叠在一起的多个管芯。器件管芯20与电连接件12的接合可以通过焊料接合或直接金属至金属接合(诸如铜至铜接合)。在一些实施例中，电连接件24的顶端24A与器件管芯20的顶面20A基本齐平或低于器件管芯20的顶面20A。在可选实施例中，电连接件24的顶端24A高于管芯20的顶面20A。
参照图3，将含金属膏26施加到器件管芯20的顶面20A上。在一些实施例中，通过丝网印刷实施含金属膏26的施加，其包括将丝网28放置在器件管芯20上方，其中，丝网28的通孔30与顶面20A的中心区对准。然后将含金属膏26施加到丝网28上。然后使用刮板31清除过量的含金属膏26。刮板31具有平坦的底面，并且因此含金属膏26的留在通孔30中的部分具有平坦的顶面。在提起丝网28之后，含金属膏26的部分留在孔30中。
含金属膏26可以包括与粘合剂混合的金属粒子。金属粒子可以包括纯金属、金属合金等的粒子。在一些实施例中，含金属膏26是包括铜粒子的铜膏。含金属膏26中的金属粒子可以具有大于约20％的重量百分比，其中，在后续固化含金属膏26之前或之后测量重量百分比。含金属膏26中的粘合剂可以包括酚醛树脂、环氧树脂等。含金属膏26可以是导电的，并且因此可以采用与电连接件上所使用的膏相同的膏。在这些实施例中，含金属膏26可以是焊膏。含金属膏26作为半流体施加，从而使得可以丝网印刷含金属膏26，在固化之前还可以保持其形状。例如，含金属膏26具有介于约800Pa-S和约1300Pa-S的范围内的粘度。在一些实施例中，含金属膏26中的金属粒子(填充物)的直径介于约3μm和约10μm之间，或者介于约5μm和约6μm之间。含金属膏26的玻璃化温度Tg可以高于约100℃。在一些示例性实施例中，含金属膏26的玻璃化温度为约110℃。
图4A示出了含金属膏26的固化。贯穿说明书，含金属膏26可选地称为含金属粒子复合物材料。也去除了如图3所示的丝网28。在一些实施例中，含金属膏26包括热固化，例如，通过将含金属膏26加热至高于含金属膏26的玻璃化温度的温度。例如，固化温度可以介于约150℃和约200℃之间。取决于含金属膏26的类型，实施固化的持续时间可以介于约60分钟和约120分钟之间。在固化含金属膏26之后，固化的含金属膏26的热膨胀系数(CTE)大于器件管芯20的CTE。例如，器件管芯20可以包括硅衬底，其具有约3.2ppm/℃的CTE。因此，(固化的)含金属膏26具有大于3.2ppm/℃的CTE。此外，含金属膏26的CTE和器件管芯20的CTE之间的差可以大于约10ppm/℃、大于约20ppm/℃或更高。含金属膏26的杨氏模量优选地较高，例如，高于约5×109Pa。含金属膏26的厚度T1可以大于约50μm，从而使得含金属膏26可以提供足够的支撑以平衡产生的封装件中的应力。
含金属膏26的较高的CTE(比器件管芯20)和高杨氏模量帮助平衡产生的封装件中的应力。封装衬底10可以具有高CTE，例如，高于约15ppm/℃。由于器件管芯20具有低CTE，因此产生的封装件可以具有翘曲，其中，产生的封装件的中心部分可以高于拐角部分和边缘部分。由于含金属膏26和封装衬底10(均具有高于器件管芯20的CTE的CTE)设置在器件管芯20的相对两侧上，所以平衡了产生的封装件中的应力(诸如器件管芯20的相对两侧上的应力)，并且减小了产生的封装件中的翘曲。
如图4A所示，由于含金属膏26的重量及其粘度，在固化工艺之前和期间，含金属膏26的形状可以稍微改变。产生的固化的含金属膏26可以具有底部大于上部的轮廓。含金属膏26的边缘也是倾斜的。因此，含金属膏26可以具有截面图中的梯形形状。此外，含金属膏26的顶部拐角可以是圆形的。
图4B示出了根据可选实施例的封装件。在这些实施例中，将刚性板27放置在含金属膏26上方。在放置之前可以预形成刚性板27，并且刚性板27的CTE可以大于大于器件管芯20的CTE。刚性板27的杨氏模量优选地较高，例如，高于约5×109Pa。刚性板27的杨氏模量也可以高于含金属膏26、硅和随后施加的模塑料32(图5A)的杨氏模量。在一些实施例中，刚性板27可以具有大于约30μm的厚度T2。在一些实施例中，刚性板27包括铜板。在可选实施例中，刚性板27可以是其他类型的金属板，包括但不限于不锈钢板、Al板、Cu板等。在又可选实施例中，刚性板27包括非金属板，例如，非金属板可以包括陶瓷。在包括刚性板27的实施例中，含金属膏26可以用作用于将刚性板27粘附至器件管芯20上的粘合剂。
图4B中的封装件的形成可以包括将含金属膏26施加在器件管芯20的顶面上以及将刚性板27放置在含金属膏26上方。在将刚性板27放置在含金属膏26上方之后，实施固化工艺以固化含金属膏26。因此含金属膏26用作用于将刚性板27粘附至下面的器件管芯20的粘合剂。
图4C示出了封装衬底10、器件管芯20和焊料球24的顶视图，其中，顶视图可以是图4A或图4B的顶视图。在一些实施例中，焊料球24设置为围绕器件管芯20。含金属膏26覆盖器件管芯20的中心部分。含金属膏26的边缘26A与器件管芯20的边缘20B间隔开边距D1，从而使得施加的含金属膏26不在器件管芯20的边缘上方流动。在一些实施例中，边距D1介于约300μm和约1000μm之间。在一些实施例中，当器件管芯20的宽度表示为W1时，比率D1/W1也可以介于约0.02和约0.08之间，但是可以使用不同的比率。
参照图5A，将模制材料32模制在管芯20和封装衬底10上，并且然后固化模制材料32。模制材料32可以与含金属膏中的粘合剂不同。在一些示例性实施例中，模制材料32包括聚合物，该聚合物可以是模塑料、底部填充物、模制底部填充物(MUF)等。在一些实施例中，焊料球24埋入模制材料32中。在可选实施例中，焊料球24的下部位于模制材料32中，而焊料球24的上部突出于模制材料32之上。
在一些实施例中，模制材料32将含金属膏26和刚性板27(如果存在，图4B)模制在其中。在可选实施例中，模制材料32模制器件管芯20的下部，并且模制材料32的顶面可以在位于含金属膏26(或刚性板27，当存在刚性板27时)的顶面下面的任何水平面处。例如，模制材料32的顶面可以处于如由虚线标记33所示的水平面处。在一些实施例中，模制材料32的顶面与刚性板27的顶面齐平。在可选实施例中，模制材料32的顶面位于刚性板27的顶面和底面之间。在又可选实施例中，模制材料32的顶面与刚性板27和含金属膏26的界面齐平。在又可选实施例中，模制材料32的顶面位于含金属膏26的顶面和底面之间。模制材料32的顶面也可以与含金属膏26的底面齐平或低于含金属膏26的底面。
图5B和图5C示出了图5A中的封装件的部分29的放大图。如图5B和图5C所示，含金属膏26包括顶面26B、边缘26A以及与器件管芯20的顶面接触的底面26C。顶面26B包括基本平坦的部分。边缘26A也可以包括与顶面26B的平坦部分形成圆形拐角26D的基本直线的部分。在一些示例性实施例中，圆形拐角26D的半径r1可以介于约20μm和约40μm的范围内。含金属膏26的基本直线的边缘26A和底面26C形成角α，角α可以介于约45度和约75度之间。
如图5B所示，在一些实施例中，使用刚性板27，并且因此平坦的顶面26B与刚性板27的底面接触。如图5C所示，在可选实施例中，不使用刚性板27，并且因此边缘26A与模制材料32接触。在各个实施例中，取决于模制材料32的顶面的位置，边缘26A和圆形拐角26D可以或可以不与模制材料32接触。
图6示出了焊料球24的暴露。在一些实施例中，暴露包括激光修整步骤以去除模制材料32的覆盖焊料球24的部分。调整在激光修整步骤中使用的激光的能量，从而使得当模制材料32暴露于激光时，模制材料32被修整，而焊料球24即使暴露于激光也不被去除。如图6所示，由于激光修整，形成了开口34，其中焊料球24暴露于开口34。
图7示出了在金属焊盘16上形成焊料球36。贯穿说明书，如图7所示的包括封装衬底10、器件管芯20、模制材料32和含金属膏26等的结构组合地称为底部封装件100。
参照图8，将顶部封装件200放置到底部封装件100上。顶部封装件200的焊料球210与焊料球24对准并且放置在焊料球24上。在一些实施例中，顶部封装件200包括器件管芯204和封装衬底206，器件管芯204接合在封装衬底206上。此外，模制材料208可以模制在器件管芯204上以形成顶部封装件200。
接下来，如图9所示，实施回流，并且因此将顶部封装件200接合至底部封装件100。在回流之后，焊料球24和210(图8)熔融并且接合，并且产生的焊料区称为图9中的焊料区50。在回流之后，底部填充物(未示出)可以设置在顶部封装件200和底部封装件100之间。可以实施锯切步骤以将顶部封装件200和底部封装件100锯切为离开其他部分(例如，相应的封装衬底条)。产生的封装件称为PoP封装件300。
在本发明的实施例中，通过施加CTE大于相应的下面的器件管芯的CTE的含金属膏，器件管芯的相对两侧上的材料的CTE的差减小，并且产生的PoP封装件中的应力减小。产生的PoP封装件中的翘曲也减小。
根据一些实施例，一种封装件包括底部衬底和位于底部衬底上方并且接合至底部衬底的底部管芯。含金属粒子复合物材料位于底部管芯的顶面的上面，其中，含金属粒子复合物材料包括金属粒子。模制材料将底部管芯的至少下部模制在其中，其中，模制材料位于底部衬底的上面。
根据其他实施例，一种封装件包括接合至底部封装件的顶部封装件。底部封装件包括封装衬底以及位于封装衬底上方并且接合至封装衬底的器件管芯。含金属粒子复合物材料位于器件管芯的顶面的上面，其中，含金属粒子复合物材料包括金属粒子。模塑料位于封装衬底的上面，其中，模塑料将器件管芯模制在其中。顶部封装件通过穿透模塑料的焊料区接合至底部封装件。
根据又其他实施例，一种方法包括：将器件管芯接合在封装衬底上方，将含金属膏施加到器件管芯的顶面上方，以及固化含金属膏。在固化含金属膏之后，将器件管芯模制在模塑料中，其中，模塑料包括位于封装衬底的上面的部分。
尽管已经详细地描述了实施例及其优势，但是应该理解，在不背离由所附权利要求限定的实施例的精神和范围的情况下，本文中可以做出各种改变、替代和变化。此外，本申请的范围不旨在限于说明书中描述的工艺、机器装置、制造、物质组成、工具、方法和步骤的特定实施例。本领域的普通技术人员将容易从本发明理解，根据本发明，可以利用现有的或今后开发的实施与本文所描述的相应实施例基本相同的功能或者实现基本相同的结果的工艺、机器装置、制造、物质组成、工具、方法或步骤。因此，所附权利要求旨在将这些工艺、机器装置、制造、物质组成、工具、方法或步骤包括在它们的范围内。此外，每个权利要求构成单独的实施例，并且各个权利要求和实施例的组合在本发明的范围内。

Claims (17)

1.一种封装件，包括：
衬底；
底部管芯，位于所述衬底上方并且接合至所述衬底；
含金属粒子复合物材料，位于所述底部管芯的顶面上方，其中，所述含金属粒子复合物材料包括金属粒子并且是导电的；
模制材料，将所述底部管芯的至少下部模制在所述模制材料中，其中，所述模制材料位于所述衬底的上面，所述模制材料的顶面低于所述底部管芯的顶面，所述含金属粒子复合物材料的顶视图面积小于所述底部管芯的顶视图面积；以及
刚性金属板，位于所述含金属粒子复合物材料的上面并且与所述含金属粒子复合物材料接触，其中，所述刚性金属板的横向宽度小于所述底部管芯的横向宽度。
2.根据权利要求1所述的封装件，其中，所述含金属粒子复合物材料包括铜膏，并且其中，所述铜膏包括铜粒子。
3.根据权利要求1所述的封装件，其中，所述含金属粒子复合物材料的热膨胀系数大于所述底部管芯的热膨胀系数。
4.根据权利要求1所述的封装件，还包括：
额外的封装件，位于所述衬底的上面并且接合至所述衬底。
5.根据权利要求1所述的封装件，其中，所述刚性金属板的热膨胀系数大于所述底部管芯的热膨胀系数。
6.根据权利要求1所述的封装件，其中，所述含金属粒子复合物材料的下部具有比所述含金属粒子复合物材料的上部更大的顶视图面积。
7.一种封装件，包括：
底部封装件，包括：
封装衬底；和
器件管芯，位于所述封装衬底上方并且接合至所述封装衬底；
含金属粒子复合物材料，位于所述器件管芯的顶面上方；
金属板，位于所述含金属粒子复合物材料的上面并且与所述含金属粒子复合物材料接触，其中，所述金属板的横向宽度小于所述器件管芯的横向宽度；
模塑料，位于所述封装衬底上方，其中，所述模塑料将所述器件管芯模制在所述模塑料中，所述模塑料的顶面低于所述器件管芯的顶面；以及
顶部封装件，通过穿透所述模塑料的焊料区接合至所述底部封装件；
其中，所述含金属粒子复合物材料的顶视图面积小于所述器件管芯的顶视图面积，并且所述含金属粒子复合物材料是导电的。
8.根据权利要求7所述的封装件，其中，所述含金属粒子复合物材料的下部的顶视图面积大于所述含金属粒子复合物材料的上部的顶视图面积。
9.根据权利要求7所述的封装件，其中，所述模塑料的顶面低于所述含金属粒子复合物材料的顶面。
10.根据权利要求7所述的封装件，其中，所述含金属粒子复合物材料包括圆形顶部拐角。
11.根据权利要求7所述的封装件，其中，所述含金属粒子复合物材料和所述模塑料包括不同的材料。
12.一种形成封装件的方法，包括：
将器件管芯接合在封装衬底上方；
将含金属膏施加到所述器件管芯的顶面上方；
将刚性金属板放置在所述含金属膏上方，其中，所述刚性金属板的横向宽度小于所述器件管芯的横向宽度；
固化所述含金属膏；以及
在固化所述含金属膏之后，将所述器件管芯模制在模塑料中，其中，所述模塑料包括位于所述封装衬底的上面的部分，所述模塑料的顶面低于所述器件管芯的顶面，所述含金属膏的顶视图面积小于所述器件管芯的顶视图面积，所述含金属膏是导电的。
13.根据权利要求12所述的方法，其中，施加所述含金属膏包括：
将丝网放置在所述器件管芯上方，其中，所述丝网的通孔与所述器件管芯对准；
将所述含金属膏放置在所述丝网上方；以及
清除所述含金属膏的过量部分，所述过量部分位于所述通孔的外部，其中，所述含金属膏的保留在所述通孔中的部分形成位于所述器件管芯的顶面上方的所述含金属膏。
14.根据权利要求12所述的方法，还包括：
去除所述模塑料的位于焊料球上方的部分，所述焊料球位于所述封装衬底的顶面上，其中，所述模塑料的与所述含金属膏重叠的部分保持未去除。
15.根据权利要求12所述的方法，还包括：
在模制所述器件管芯之后，将顶部封装件接合至底部封装件，其中，所述底部封装件包括所述封装衬底、所述器件管芯、所述含金属膏和所述模塑料。
16.根据权利要求12所述的方法，还包括：
在固化所述含金属膏之后，将所述刚性板粘附至所述含金属膏。
17.根据权利要求12所述的方法，其中，施加所述含金属膏包括施加铜膏，其中，所述铜膏包括位于所述铜膏中的铜粒子。
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