CN104663006B - 超声内窥镜及其制造方法 - Google Patents

超声内窥镜及其制造方法 Download PDF

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Publication number
CN104663006B
CN104663006B CN201380042291.4A CN201380042291A CN104663006B CN 104663006 B CN104663006 B CN 104663006B CN 201380042291 A CN201380042291 A CN 201380042291A CN 104663006 B CN104663006 B CN 104663006B
Authority
CN
China
Prior art keywords
circuit board
printed circuit
via hole
edge
conjoint disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380042291.4A
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English (en)
Chinese (zh)
Other versions
CN104663006A (zh
Inventor
安德列·B·贝赞森
罗伯特·B·A·艾德森
杰雷米·A·布朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daksoni Ultrasound Co ltd
Original Assignee
Dalhousie University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dalhousie University filed Critical Dalhousie University
Publication of CN104663006A publication Critical patent/CN104663006A/zh
Application granted granted Critical
Publication of CN104663006B publication Critical patent/CN104663006B/zh
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Anticipated expiration legal-status Critical

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Animal Behavior & Ethology (AREA)
  • Veterinary Medicine (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Biophysics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Public Health (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gynecology & Obstetrics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Endoscopes (AREA)
CN201380042291.4A 2012-08-09 2013-08-09 超声内窥镜及其制造方法 Active CN104663006B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261681320P 2012-08-09 2012-08-09
US61/681,320 2012-08-09
US201261710696P 2012-10-06 2012-10-06
US61/710,696 2012-10-06
PCT/CA2013/050613 WO2014022938A1 (en) 2012-08-09 2013-08-09 Ultrasound endoscope and methods of manufacture thereof

Publications (2)

Publication Number Publication Date
CN104663006A CN104663006A (zh) 2015-05-27
CN104663006B true CN104663006B (zh) 2019-01-15

Family

ID=50067341

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380042291.4A Active CN104663006B (zh) 2012-08-09 2013-08-09 超声内窥镜及其制造方法

Country Status (6)

Country Link
US (2) US10149660B2 (enExample)
EP (1) EP2883429B1 (enExample)
JP (1) JP6261581B2 (enExample)
CN (1) CN104663006B (enExample)
CA (1) CA2880652C (enExample)
WO (1) WO2014022938A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11717140B2 (en) 2015-06-24 2023-08-08 The Regents Of The University Of Colorado, A Body Corporate Multi-use endoscope with integrated device-patient monitoring and patient-provider positioning and disassociation system
KR102666748B1 (ko) * 2015-11-25 2024-05-16 후지필름 소노사이트, 인크. 고주파 초음파 트랜스듀서 어레이를 포함하는 의료 기기
US11806553B2 (en) 2017-09-01 2023-11-07 Dalhousie University Transducer assembly for generating focused ultrasound
JP7256181B2 (ja) 2017-10-13 2023-04-11 ジェー． ブラッシュ シーオー．， エルエルシー 養護施設及び他の医療施設を運営するための支援技術
USD1046119S1 (en) 2021-08-31 2024-10-08 Evoendo, Inc. Endoscope distal end
USD1071216S1 (en) 2021-08-31 2025-04-15 Evoendo, Inc. Handle assembly
USD1047142S1 (en) 2021-08-31 2024-10-15 Evoendo, Inc. Endoscope

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6541896B1 (en) * 1997-12-29 2003-04-01 General Electric Company Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array
CN102007824A (zh) * 2008-04-21 2011-04-06 住友电木株式会社 挠性布线单元及电子设备
WO2012075153A2 (en) * 2010-12-03 2012-06-07 Research Triangle Institute Ultrasound device, and associated cable assembly
CN102621360A (zh) * 2011-01-27 2012-08-01 台湾积体电路制造股份有限公司 探针板布线结构

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543770Y2 (enExample) * 1986-03-14 1993-11-05
JPH06105842A (ja) * 1992-05-22 1994-04-19 Toshiba Corp 超音波トランスデューサ
US5465724A (en) * 1993-05-28 1995-11-14 Acuson Corporation Compact rotationally steerable ultrasound transducer
DE4325028B4 (de) * 1993-07-26 2005-05-19 Siemens Ag Ultraschall-Wandlereinrichtung mit einem ein- oder zweidimensionalen Array von Wandlerelementen
US5810009A (en) * 1994-09-27 1998-09-22 Kabushiki Kaisha Toshiba Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe
JP3526486B2 (ja) * 1995-04-28 2004-05-17 株式会社東芝 超音波探触子，この探触子を備えた超音波プローブ，およびこれらの製造方法
US5559388A (en) * 1995-03-03 1996-09-24 General Electric Company High density interconnect for an ultrasonic phased array and method for making
US5857974A (en) * 1997-01-08 1999-01-12 Endosonics Corporation High resolution intravascular ultrasound transducer assembly having a flexible substrate
US6043590A (en) * 1997-04-18 2000-03-28 Atl Ultrasound Composite transducer with connective backing block
JPH11155859A (ja) * 1997-09-24 1999-06-15 Toshiba Corp 超音波プローブ及びこれを用いた超音波診断装置
JP4468599B2 (ja) 2001-02-20 2010-05-26 オリンパス株式会社 超音波探触子
US6822376B2 (en) 2002-11-19 2004-11-23 General Electric Company Method for making electrical connection to ultrasonic transducer
US20070222339A1 (en) 2004-04-20 2007-09-27 Mark Lukacs Arrayed ultrasonic transducer
CN101102853B (zh) * 2005-01-11 2010-12-08 皇家飞利浦电子股份有限公司 用于(多个)微束形成器的重分布互连和医学超声系统
DE602005021604D1 (de) * 2005-01-18 2010-07-15 Esaote Spa Ultraschallsonde, insbesondere zur diagnostischen Bilderzeugung
JP4289304B2 (ja) * 2005-02-07 2009-07-01 ブラザー工業株式会社 圧電アクチュエータ、インクジェットプリンタヘッド、及びそれらの製造方法
KR100771862B1 (ko) 2005-08-12 2007-11-01 삼성전자주식회사 메모리 모듈을 위한 인쇄회로기판, 그 제조 방법 및 메모리모듈-소켓 어셈블리
JP4351229B2 (ja) * 2006-06-28 2009-10-28 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー 超音波探触子の製造方法
US7834522B2 (en) * 2007-08-03 2010-11-16 Mr Holdings (Hk) Limited Diagnostic ultrasound transducer
WO2009100106A1 (en) * 2008-02-05 2009-08-13 Wilson-Cook Medical, Inc. Adaptor for endoscopic orientation of an elongate medical device
KR101397100B1 (ko) * 2010-06-28 2014-05-20 삼성전자주식회사 초음파 프로브 및 그 제조방법
US20130100775A1 (en) * 2011-10-25 2013-04-25 Matthew Todd Spigelmyer System and method for providing discrete ground connections for individual elements in an ultrasonic array transducer
JP6170242B2 (ja) * 2013-05-24 2017-07-26 フジフィルム ソノサイト インコーポレイテッド 高周波超音波プローブ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6541896B1 (en) * 1997-12-29 2003-04-01 General Electric Company Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array
CN102007824A (zh) * 2008-04-21 2011-04-06 住友电木株式会社 挠性布线单元及电子设备
WO2012075153A2 (en) * 2010-12-03 2012-06-07 Research Triangle Institute Ultrasound device, and associated cable assembly
CN102621360A (zh) * 2011-01-27 2012-08-01 台湾积体电路制造股份有限公司 探针板布线结构

Also Published As

Publication number Publication date
CA2880652A1 (en) 2014-02-13
EP2883429B1 (en) 2019-05-15
EP2883429A1 (en) 2015-06-17
EP2883429A4 (en) 2016-07-20
WO2014022938A1 (en) 2014-02-13
JP6261581B2 (ja) 2018-01-17
HK1211778A1 (en) 2016-05-27
JP2015524318A (ja) 2015-08-24
CA2880652C (en) 2021-10-26
US10149660B2 (en) 2018-12-11
CN104663006A (zh) 2015-05-27
US20150209005A1 (en) 2015-07-30
US20190110773A1 (en) 2019-04-18

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Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20250828

Address after: 5743 Halifax University Road, Room 100, B3H 0A2, Nova Scotia, Canada

Patentee after: Daksoni Ultrasound Co.,Ltd.

Country or region after: Canada

Address before: Nova Scotia, Canada

Patentee before: DALHOUSIE University

Country or region before: Canada

TR01 Transfer of patent right