JP6261581B2 - 超音波内視鏡及びその製造方法 - Google Patents

超音波内視鏡及びその製造方法 Download PDF

Info

Publication number
JP6261581B2
JP6261581B2 JP2015525701A JP2015525701A JP6261581B2 JP 6261581 B2 JP6261581 B2 JP 6261581B2 JP 2015525701 A JP2015525701 A JP 2015525701A JP 2015525701 A JP2015525701 A JP 2015525701A JP 6261581 B2 JP6261581 B2 JP 6261581B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
ultrasonic
tip
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015525701A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015524318A (ja
JP2015524318A5 (enExample
Inventor
ビー． ベザンソン，アンドレ
ビー． ベザンソン，アンドレ
ビー．エー． アダムソン，ロバート
ビー．エー． アダムソン，ロバート
エー． ブラウン，ジェレミー
エー． ブラウン，ジェレミー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dalhousie University
Original Assignee
Dalhousie University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dalhousie University filed Critical Dalhousie University
Publication of JP2015524318A publication Critical patent/JP2015524318A/ja
Publication of JP2015524318A5 publication Critical patent/JP2015524318A5/ja
Application granted granted Critical
Publication of JP6261581B2 publication Critical patent/JP6261581B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Public Health (AREA)
  • Biophysics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Veterinary Medicine (AREA)
  • Animal Behavior & Ethology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gynecology & Obstetrics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Endoscopes (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
JP2015525701A 2012-08-09 2013-08-09 超音波内視鏡及びその製造方法 Active JP6261581B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261681320P 2012-08-09 2012-08-09
US61/681,320 2012-08-09
US201261710696P 2012-10-06 2012-10-06
US61/710,696 2012-10-06
PCT/CA2013/050613 WO2014022938A1 (en) 2012-08-09 2013-08-09 Ultrasound endoscope and methods of manufacture thereof

Publications (3)

Publication Number Publication Date
JP2015524318A JP2015524318A (ja) 2015-08-24
JP2015524318A5 JP2015524318A5 (enExample) 2016-11-04
JP6261581B2 true JP6261581B2 (ja) 2018-01-17

Family

ID=50067341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015525701A Active JP6261581B2 (ja) 2012-08-09 2013-08-09 超音波内視鏡及びその製造方法

Country Status (6)

Country Link
US (2) US10149660B2 (enExample)
EP (1) EP2883429B1 (enExample)
JP (1) JP6261581B2 (enExample)
CN (1) CN104663006B (enExample)
CA (1) CA2880652C (enExample)
WO (1) WO2014022938A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11717140B2 (en) 2015-06-24 2023-08-08 The Regents Of The University Of Colorado, A Body Corporate Multi-use endoscope with integrated device-patient monitoring and patient-provider positioning and disassociation system
US11114603B2 (en) * 2015-11-25 2021-09-07 Fujifilm Sonosite, Inc. Medical instrument including high frequency ultrasound transducer array
US11806553B2 (en) 2017-09-01 2023-11-07 Dalhousie University Transducer assembly for generating focused ultrasound
CA3078930A1 (en) 2017-10-13 2019-04-18 J. Brasch Co., Llc Assistive technology for operating nursing homes and other health care facilities
USD1047142S1 (en) 2021-08-31 2024-10-15 Evoendo, Inc. Endoscope
USD1046119S1 (en) 2021-08-31 2024-10-08 Evoendo, Inc. Endoscope distal end
USD1071216S1 (en) 2021-08-31 2025-04-15 Evoendo, Inc. Handle assembly

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543770Y2 (enExample) * 1986-03-14 1993-11-05
JPH06105842A (ja) * 1992-05-22 1994-04-19 Toshiba Corp 超音波トランスデューサ
US5465724A (en) * 1993-05-28 1995-11-14 Acuson Corporation Compact rotationally steerable ultrasound transducer
DE4325028B4 (de) * 1993-07-26 2005-05-19 Siemens Ag Ultraschall-Wandlereinrichtung mit einem ein- oder zweidimensionalen Array von Wandlerelementen
JP3526486B2 (ja) * 1995-04-28 2004-05-17 株式会社東芝 超音波探触子，この探触子を備えた超音波プローブ，およびこれらの製造方法
US5810009A (en) * 1994-09-27 1998-09-22 Kabushiki Kaisha Toshiba Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe
US5559388A (en) * 1995-03-03 1996-09-24 General Electric Company High density interconnect for an ultrasonic phased array and method for making
US5857974A (en) * 1997-01-08 1999-01-12 Endosonics Corporation High resolution intravascular ultrasound transducer assembly having a flexible substrate
US6043590A (en) * 1997-04-18 2000-03-28 Atl Ultrasound Composite transducer with connective backing block
JPH11155859A (ja) * 1997-09-24 1999-06-15 Toshiba Corp 超音波プローブ及びこれを用いた超音波診断装置
US6541896B1 (en) * 1997-12-29 2003-04-01 General Electric Company Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array
JP4468599B2 (ja) * 2001-02-20 2010-05-26 オリンパス株式会社 超音波探触子
US6822376B2 (en) * 2002-11-19 2004-11-23 General Electric Company Method for making electrical connection to ultrasonic transducer
US20070222339A1 (en) 2004-04-20 2007-09-27 Mark Lukacs Arrayed ultrasonic transducer
WO2006075283A2 (en) * 2005-01-11 2006-07-20 Koninklijke Philips Electronics, N.V. Redistribution interconnect for microbeamformer(s) and a medical ultrasound system
ATE490731T1 (de) * 2005-01-18 2010-12-15 Esaote Spa Ultraschallsonde, insbesondere zur diagnostischen bilderzeugung
JP4289304B2 (ja) * 2005-02-07 2009-07-01 ブラザー工業株式会社 圧電アクチュエータ、インクジェットプリンタヘッド、及びそれらの製造方法
KR100771862B1 (ko) 2005-08-12 2007-11-01 삼성전자주식회사 메모리 모듈을 위한 인쇄회로기판, 그 제조 방법 및 메모리모듈-소켓 어셈블리
JP4351229B2 (ja) * 2006-06-28 2009-10-28 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー 超音波探触子の製造方法
US7834522B2 (en) * 2007-08-03 2010-11-16 Mr Holdings (Hk) Limited Diagnostic ultrasound transducer
AU2009212438A1 (en) * 2008-02-05 2009-08-13 Cook Medical Technologies Llc Adaptor for endoscopic orientation of an elongate medical device
KR20110053922A (ko) * 2008-04-21 2011-05-24 스미토모 베이클리트 컴퍼니 리미티드 플렉시블 배선 유닛 및 전자 기기
KR101397100B1 (ko) * 2010-06-28 2014-05-20 삼성전자주식회사 초음파 프로브 및 그 제조방법
EP2646173A2 (en) * 2010-12-03 2013-10-09 Research Triangle Institute Ultrasound device, and associated cable assembly
US8841931B2 (en) * 2011-01-27 2014-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card wiring structure
US20130100775A1 (en) * 2011-10-25 2013-04-25 Matthew Todd Spigelmyer System and method for providing discrete ground connections for individual elements in an ultrasonic array transducer
TWI617293B (zh) * 2013-05-24 2018-03-11 富士膠片索諾聲公司 高頻超音波探針

Also Published As

Publication number Publication date
CA2880652A1 (en) 2014-02-13
WO2014022938A1 (en) 2014-02-13
US20190110773A1 (en) 2019-04-18
CN104663006B (zh) 2019-01-15
EP2883429A4 (en) 2016-07-20
EP2883429B1 (en) 2019-05-15
CN104663006A (zh) 2015-05-27
HK1211778A1 (en) 2016-05-27
EP2883429A1 (en) 2015-06-17
US20150209005A1 (en) 2015-07-30
JP2015524318A (ja) 2015-08-24
US10149660B2 (en) 2018-12-11
CA2880652C (en) 2021-10-26

Similar Documents

Publication Publication Date Title
JP6261581B2 (ja) 超音波内視鏡及びその製造方法
JP5954773B2 (ja) 超音波プローブおよび超音波プローブの製造方法
JP6124897B2 (ja) 超音波トランスデューサ及びその製造方法
US9184370B2 (en) Ultrasonic transducer device, ultrasonic measurement apparatus, head unit, probe, and ultrasonic imaging apparatus
US6640634B2 (en) Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus
CN102218394B (zh) 超声波换能器、超声波探头以及超声波换能器的制造方法
CN103284755B (zh) 超声波换能器装置、探测器、电子设备及超声波诊断装置
CN103371850B (zh) 超声换能器、超声探头和超声波图像诊断设备
KR101137262B1 (ko) 초음파 진단장치용 프로브 및 그 제조방법
US7288069B2 (en) Ultrasonic probe and method of manufacturing the same
JP6252280B2 (ja) 超音波デバイスユニットおよびプローブ並びに電子機器および超音波画像装置
CN103518385B (zh) 超声波转换器、超声波探头及超声波转换器的制造方法
EP2266712B1 (en) Transducer for ultrasonic diagnosis device and method for manufacturing the same
CN101103927A (zh) 两维阵列型超声波探头
KR20140004667A (ko) 초음파 장치 및 관련 케이블 어셈블리
JP2013255692A (ja) 超音波トランスデューサー素子ユニットおよびプローブおよびプローブヘッド並びに電子機器および超音波診断装置
JP5454890B2 (ja) 超音波プローブ及び超音波プローブの製造方法
JP2008048276A (ja) 超音波トランスデューサ及び超音波トランスデューサアレイ
HK1211778B (en) Ultrasound endoscope and methods of manufacture thereof
JP5349141B2 (ja) 超音波プローブ

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7426

Effective date: 20150828

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20150828

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160527

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160913

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170322

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170425

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20170719

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171024

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20171205

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20171212

R150 Certificate of patent or registration of utility model

Ref document number: 6261581

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250