CN104641299B - 曝光描绘装置、曝光描绘系统、程序及曝光描绘方法 - Google Patents

曝光描绘装置、曝光描绘系统、程序及曝光描绘方法 Download PDF

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Publication number
CN104641299B
CN104641299B CN201380049191.4A CN201380049191A CN104641299B CN 104641299 B CN104641299 B CN 104641299B CN 201380049191 A CN201380049191 A CN 201380049191A CN 104641299 B CN104641299 B CN 104641299B
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China
Prior art keywords
exposure
information
job information
component
image
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CN201380049191.4A
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English (en)
Chinese (zh)
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CN104641299A (zh
Inventor
尾崎幸久
佐藤淳
佐藤淳一
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ADITECH ENGINEERING Co Ltd
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ADITECH ENGINEERING Co Ltd
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032—Simultaneous exposure of the front side and the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
CN201380049191.4A 2012-09-27 2013-08-23 曝光描绘装置、曝光描绘系统、程序及曝光描绘方法 Active CN104641299B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012215121A JP6096453B2 (ja) 2012-09-27 2012-09-27 露光描画装置、露光描画システム、プログラム及び露光描画方法
JP2012-215121 2012-09-27
PCT/JP2013/072502 WO2014050384A1 (ja) 2012-09-27 2013-08-23 露光描画装置、露光描画システム、プログラム及び露光描画方法

Publications (2)

Publication Number Publication Date
CN104641299A CN104641299A (zh) 2015-05-20
CN104641299B true CN104641299B (zh) 2016-12-14

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ID=50387793

Family Applications (1)

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CN201380049191.4A Active CN104641299B (zh) 2012-09-27 2013-08-23 曝光描绘装置、曝光描绘系统、程序及曝光描绘方法

Country Status (5)

Country Link
JP (1) JP6096453B2 (ko)
KR (1) KR102119430B1 (ko)
CN (1) CN104641299B (ko)
TW (1) TWI603160B (ko)
WO (1) WO2014050384A1 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1690863A (zh) * 2004-04-23 2005-11-02 Asml荷兰有限公司 器件制造方法
CN101283312A (zh) * 2005-10-07 2008-10-08 富士胶片株式会社 数字曝光装置
JP2008292915A (ja) * 2007-05-28 2008-12-04 Orc Mfg Co Ltd 露光描画装置
JP2009223262A (ja) * 2008-03-19 2009-10-01 Orc Mfg Co Ltd 露光システムおよび露光方法
WO2013145987A1 (ja) * 2012-03-30 2013-10-03 富士フイルム株式会社 露光描画装置、プログラムを記録した記録媒体、及び露光描画方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307424A (ja) * 1998-04-22 1999-11-05 Hitachi Ltd 半導体製造方法および製造装置、ならびにそれにより製造された半導体デバイス
JP2001284231A (ja) * 2000-03-31 2001-10-12 Canon Inc 露光装置及びエラー発生時のパターンで処理を振り分ける方法
JP2002341550A (ja) 2001-05-17 2002-11-27 Dainippon Screen Mfg Co Ltd レーザー露光装置
JP4381009B2 (ja) * 2003-03-12 2009-12-09 新光電気工業株式会社 パターン描画装置、パターン描画方法、および検査装置
JP2005014012A (ja) * 2003-06-24 2005-01-20 Pentax Corp 描画装置および描画方法
JP2010181519A (ja) * 2009-02-04 2010-08-19 Adtec Engineeng Co Ltd 露光装置
JP5961429B2 (ja) * 2012-03-30 2016-08-02 株式会社アドテックエンジニアリング 露光描画装置及び露光描画方法
JP6198378B2 (ja) * 2012-09-27 2017-09-20 株式会社アドテックエンジニアリング 露光描画装置、露光描画システム、プログラム及び露光描画方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1690863A (zh) * 2004-04-23 2005-11-02 Asml荷兰有限公司 器件制造方法
CN101283312A (zh) * 2005-10-07 2008-10-08 富士胶片株式会社 数字曝光装置
JP2008292915A (ja) * 2007-05-28 2008-12-04 Orc Mfg Co Ltd 露光描画装置
JP2009223262A (ja) * 2008-03-19 2009-10-01 Orc Mfg Co Ltd 露光システムおよび露光方法
WO2013145987A1 (ja) * 2012-03-30 2013-10-03 富士フイルム株式会社 露光描画装置、プログラムを記録した記録媒体、及び露光描画方法

Also Published As

Publication number Publication date
JP2014071157A (ja) 2014-04-21
TW201413399A (zh) 2014-04-01
KR102119430B1 (ko) 2020-06-05
JP6096453B2 (ja) 2017-03-15
KR20150060693A (ko) 2015-06-03
TWI603160B (zh) 2017-10-21
CN104641299A (zh) 2015-05-20
WO2014050384A1 (ja) 2014-04-03

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