CN104626727A - 下料机构 - Google Patents
下料机构 Download PDFInfo
- Publication number
- CN104626727A CN104626727A CN201310569689.5A CN201310569689A CN104626727A CN 104626727 A CN104626727 A CN 104626727A CN 201310569689 A CN201310569689 A CN 201310569689A CN 104626727 A CN104626727 A CN 104626727A
- Authority
- CN
- China
- Prior art keywords
- actuator
- pedestal
- suction piece
- guide
- counterdie
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B69/00—Unpacking of articles or materials, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B69/00—Unpacking of articles or materials, not otherwise provided for
- B65B69/005—Unpacking of articles or materials, not otherwise provided for by expelling contents, e.g. by squeezing the container
- B65B69/0058—Solid contents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
- Y10T156/1983—Poking delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1994—Means for delaminating from release surface
Abstract
Description
下料机构 | 100 |
取料组件 | 30 |
基座 | 32 |
座体 | 321 |
第一导向孔 | 3211 |
第一导向件 | 323 |
凸缘部 | 3231 |
导向部 | 3233 |
弹性件 | 325 |
顶出件 | 327 |
第一驱动件 | 34 |
驱动本体 | 341 |
导轨 | 343 |
驱动部 | 345 |
吸取件 | 36 |
收容孔 | 361 |
气管接头 | 363 |
气孔 | 365 |
卸料组件 | 50 |
安装部 | 521 |
连接部 | 523 |
支撑部 | 525 |
第二导向孔 | 5251 |
第二驱动件 | 54 |
止挡件 | 56 |
装设部 | 561 |
凸伸端 | 5611 |
第二导向件 | 5613 |
止挡部 | 563 |
止挡端 | 5631 |
底膜 | 200 |
工件 | 300 |
治具 | 400 |
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310569689.5A CN104626727B (zh) | 2013-11-13 | 2013-11-13 | 下料机构 |
TW102143942A TWI564233B (zh) | 2013-11-13 | 2013-11-29 | 下料機構 |
US14/540,101 US9409667B2 (en) | 2013-11-13 | 2014-11-13 | Unloading mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310569689.5A CN104626727B (zh) | 2013-11-13 | 2013-11-13 | 下料机构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104626727A true CN104626727A (zh) | 2015-05-20 |
CN104626727B CN104626727B (zh) | 2016-10-05 |
Family
ID=53042670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310569689.5A Expired - Fee Related CN104626727B (zh) | 2013-11-13 | 2013-11-13 | 下料机构 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9409667B2 (zh) |
CN (1) | CN104626727B (zh) |
TW (1) | TWI564233B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107020558A (zh) * | 2017-04-19 | 2017-08-08 | 广东长盈精密技术有限公司 | 拆卸装置及其治具 |
CN108406405A (zh) * | 2018-04-26 | 2018-08-17 | 泉州华中科技大学智能制造研究院 | 一种圆柱状零件逐个落料装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105345576B (zh) * | 2015-11-05 | 2017-08-11 | 广东天机工业智能系统有限公司 | 自动落料装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1744294A (zh) * | 2004-09-03 | 2006-03-08 | 财团法人工业技术研究院 | 多针顶出装置 |
CN201449396U (zh) * | 2009-03-23 | 2010-05-05 | 常州新区爱立德电子有限公司 | 顶针升降台调节装置 |
CN101740451A (zh) * | 2009-12-23 | 2010-06-16 | 东莞华中科技大学制造工程研究院 | 芯片分拣设备的顶针机构 |
CN102074458A (zh) * | 2010-11-19 | 2011-05-25 | 华中科技大学 | 一种芯片剥离装置 |
CN103311159A (zh) * | 2013-05-08 | 2013-09-18 | 华中科技大学 | 一种ic芯片剥离装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4990051A (en) * | 1987-09-28 | 1991-02-05 | Kulicke And Soffa Industries, Inc. | Pre-peel die ejector apparatus |
KR100278137B1 (ko) * | 1997-09-04 | 2001-01-15 | 가나이 쓰도무 | 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법 |
US6173750B1 (en) * | 1998-02-18 | 2001-01-16 | Hover-Davis, Inc. | Method and apparatus for removing die from a wafer and conveying die to a pickup location |
US6202292B1 (en) * | 1998-08-26 | 2001-03-20 | Micron Technology, Inc. | Apparatus for removing carrier film from a semiconductor die |
US6896762B2 (en) * | 2002-12-18 | 2005-05-24 | Industrial Technology Research Institute | Separation method for object and glue membrane |
TWI268532B (en) * | 2004-09-03 | 2006-12-11 | Ind Tech Res Inst | Ejection device with multiple ejectors having two server driving devices to help carry out the function of ejection with multiple ejectors |
US7303647B2 (en) * | 2004-10-29 | 2007-12-04 | Asm Assembly Automation Ltd. | Driving mechanism for chip detachment apparatus |
JP5054949B2 (ja) * | 2006-09-06 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US7665204B2 (en) * | 2006-10-16 | 2010-02-23 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
DE102006058299A1 (de) * | 2006-12-11 | 2008-06-12 | Robert Bosch Gmbh | Handhabungswerkzeug für Bauelemente, insbesondere elektronische Bauelemente |
US8221583B2 (en) * | 2007-01-20 | 2012-07-17 | Stats Chippac Ltd. | System for peeling semiconductor chips from tape |
TWI406752B (zh) * | 2008-08-22 | 2013-09-01 | Hon Hai Prec Ind Co Ltd | 光學元件成型模具 |
TWI534938B (zh) * | 2010-02-25 | 2016-05-21 | 尼康股份有限公司 | Substrate separation device, manufacturing method of semiconductor device, load lock device, substrate bonding device and substrate separation method |
TWM420824U (en) * | 2011-09-06 | 2012-01-11 | Gallant Micro Machining Co Ltd | Ejection pin cover structure |
-
2013
- 2013-11-13 CN CN201310569689.5A patent/CN104626727B/zh not_active Expired - Fee Related
- 2013-11-29 TW TW102143942A patent/TWI564233B/zh active
-
2014
- 2014-11-13 US US14/540,101 patent/US9409667B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1744294A (zh) * | 2004-09-03 | 2006-03-08 | 财团法人工业技术研究院 | 多针顶出装置 |
CN201449396U (zh) * | 2009-03-23 | 2010-05-05 | 常州新区爱立德电子有限公司 | 顶针升降台调节装置 |
CN101740451A (zh) * | 2009-12-23 | 2010-06-16 | 东莞华中科技大学制造工程研究院 | 芯片分拣设备的顶针机构 |
CN102074458A (zh) * | 2010-11-19 | 2011-05-25 | 华中科技大学 | 一种芯片剥离装置 |
CN103311159A (zh) * | 2013-05-08 | 2013-09-18 | 华中科技大学 | 一种ic芯片剥离装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107020558A (zh) * | 2017-04-19 | 2017-08-08 | 广东长盈精密技术有限公司 | 拆卸装置及其治具 |
CN107020558B (zh) * | 2017-04-19 | 2019-06-07 | 广东长盈精密技术有限公司 | 拆卸装置及其治具 |
CN108406405A (zh) * | 2018-04-26 | 2018-08-17 | 泉州华中科技大学智能制造研究院 | 一种圆柱状零件逐个落料装置 |
CN108406405B (zh) * | 2018-04-26 | 2023-09-12 | 泉州华中科技大学智能制造研究院 | 一种圆柱状零件逐个落料装置 |
Also Published As
Publication number | Publication date |
---|---|
CN104626727B (zh) | 2016-10-05 |
TWI564233B (zh) | 2017-01-01 |
US20150129139A1 (en) | 2015-05-14 |
US9409667B2 (en) | 2016-08-09 |
TW201522190A (zh) | 2015-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170527 Address after: 048000 Jincheng economic and Technological Development Zone, Shanxi Patentee after: Fu Jin Precision Industry (Jincheng) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Hon Hai Precision Industry Co., Ltd. Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161005 Termination date: 20181113 |
|
CF01 | Termination of patent right due to non-payment of annual fee |