CN104559898A - 粘接剂组合物和连接体 - Google Patents

粘接剂组合物和连接体 Download PDF

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Publication number
CN104559898A
CN104559898A CN201410546529.3A CN201410546529A CN104559898A CN 104559898 A CN104559898 A CN 104559898A CN 201410546529 A CN201410546529 A CN 201410546529A CN 104559898 A CN104559898 A CN 104559898A
Authority
CN
China
Prior art keywords
circuit
adhesive
film
adhesive composition
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410546529.3A
Other languages
English (en)
Chinese (zh)
Inventor
工藤直
藤绳贡
伊藤彰浩
森尻智树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201811479821.2A priority Critical patent/CN109609073A/zh
Publication of CN104559898A publication Critical patent/CN104559898A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201410546529.3A 2013-10-16 2014-10-15 粘接剂组合物和连接体 Pending CN104559898A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811479821.2A CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013215763 2013-10-16
JP2013-215763 2013-10-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811479821.2A Division CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Publications (1)

Publication Number Publication Date
CN104559898A true CN104559898A (zh) 2015-04-29

Family

ID=53036679

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201410546529.3A Pending CN104559898A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体
CN201811479821.2A Pending CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201811479821.2A Pending CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Country Status (4)

Country Link
JP (3) JP2015098575A (https=)
KR (2) KR102321167B1 (https=)
CN (2) CN104559898A (https=)
TW (1) TW201525096A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111286005A (zh) * 2020-04-13 2020-06-16 江苏和和新材料股份有限公司 一种功能性热塑性聚氨酯及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118291047A (zh) * 2015-11-25 2024-07-05 株式会社力森诺科 电路连接用粘接剂组合物和结构体
TWI761477B (zh) * 2017-03-30 2022-04-21 日商太陽油墨製造股份有限公司 導電性接著劑、硬化物、電子零件及電子零件之製造方法
CN111334198B (zh) * 2020-03-27 2021-10-15 顺德职业技术学院 Uv双组份双固化型结构胶
JP7537218B2 (ja) * 2020-10-08 2024-08-21 株式会社レゾナック 回路接続用接着剤フィルム、回路接続構造体及びその製造方法
JP7771733B2 (ja) * 2021-12-23 2025-11-18 ａｒｔｉｅｎｃｅ株式会社 配線シート
WO2025089237A1 (ja) * 2023-10-24 2025-05-01 株式会社レゾナック 接着剤組成物、接続構造体、及び接続構造体の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008081713A (ja) * 2006-08-29 2008-04-10 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP2008195852A (ja) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体
WO2008139996A1 (ja) * 2007-05-09 2008-11-20 Hitachi Chemical Company, Ltd. フィルム状回路接続材料及び回路部材の接続構造
JP2011057870A (ja) * 2009-09-10 2011-03-24 Aica Kogyo Co Ltd 樹脂組成物
CN102763283A (zh) * 2010-11-09 2012-10-31 索尼化学&信息部件株式会社 各向异性导电膜
CN102803417A (zh) * 2009-04-20 2012-11-28 株式会社普利司通 含硫羟基粘合性树脂组合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
DE69836078T2 (de) 1997-03-31 2007-05-10 Hitachi Chemical Co., Ltd. Material zur verbindung von leiterplatten und verfahren zur verbindung von schaltungsanschlüssen
WO2009057376A1 (ja) 2007-10-29 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料、接続構造体及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008081713A (ja) * 2006-08-29 2008-04-10 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP2008195852A (ja) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体
WO2008139996A1 (ja) * 2007-05-09 2008-11-20 Hitachi Chemical Company, Ltd. フィルム状回路接続材料及び回路部材の接続構造
CN102803417A (zh) * 2009-04-20 2012-11-28 株式会社普利司通 含硫羟基粘合性树脂组合物
JP2011057870A (ja) * 2009-09-10 2011-03-24 Aica Kogyo Co Ltd 樹脂組成物
CN102763283A (zh) * 2010-11-09 2012-10-31 索尼化学&信息部件株式会社 各向异性导电膜

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
贾红兵等: "《高分子材料》", 30 November 2009 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111286005A (zh) * 2020-04-13 2020-06-16 江苏和和新材料股份有限公司 一种功能性热塑性聚氨酯及其制备方法

Also Published As

Publication number Publication date
KR102478959B1 (ko) 2022-12-16
KR20210134875A (ko) 2021-11-11
JP7014236B2 (ja) 2022-02-01
KR20150044403A (ko) 2015-04-24
JP2020109173A (ja) 2020-07-16
JP2019019333A (ja) 2019-02-07
KR102321167B1 (ko) 2021-11-02
JP2015098575A (ja) 2015-05-28
TW201525096A (zh) 2015-07-01
CN109609073A (zh) 2019-04-12

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PB01 Publication
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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150429

WD01 Invention patent application deemed withdrawn after publication