CN104552625B - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
CN104552625B
CN104552625B CN201410573497.6A CN201410573497A CN104552625B CN 104552625 B CN104552625 B CN 104552625B CN 201410573497 A CN201410573497 A CN 201410573497A CN 104552625 B CN104552625 B CN 104552625B
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CN
China
Prior art keywords
processing
machined object
component
plant
processing unit
Prior art date
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Active
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CN201410573497.6A
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English (en)
Chinese (zh)
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CN104552625A (zh
Inventor
伊藤优作
大庭龙吾
九鬼润
九鬼润一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
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Publication date
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Publication of CN104552625A publication Critical patent/CN104552625A/zh
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Publication of CN104552625B publication Critical patent/CN104552625B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/2409—Arrangements for indirect observation of the working space using image recording means, e.g. a camera
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/2452—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
    • B23Q17/2471—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
CN201410573497.6A 2013-10-28 2014-10-23 加工装置 Active CN104552625B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2013-223213 2013-10-28
JP2013223213A JP6305013B2 (ja) 2013-10-28 2013-10-28 加工装置

Publications (2)

Publication Number Publication Date
CN104552625A CN104552625A (zh) 2015-04-29
CN104552625B true CN104552625B (zh) 2018-02-16

Family

ID=53048770

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410573497.6A Active CN104552625B (zh) 2013-10-28 2014-10-23 加工装置

Country Status (4)

Country Link
JP (1) JP6305013B2 (ko)
KR (1) KR102240331B1 (ko)
CN (1) CN104552625B (ko)
TW (1) TWI629130B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170034760A (ko) * 2015-09-21 2017-03-29 레이저닉스 주식회사 극초단 펄스 레이저를 이용하여 가공대상을 변성시키는 방법 및 장치
TWI641933B (zh) * 2016-01-15 2018-11-21 施教競 Processing method of processing machine
JP6696842B2 (ja) * 2016-06-22 2020-05-20 株式会社ディスコ ウェーハの加工方法
KR101867390B1 (ko) * 2016-08-01 2018-06-15 주식회사 이오테크닉스 레이저 가공장치 및 레이저 가공방법
CN109141275B (zh) * 2017-06-15 2020-12-04 欣兴电子股份有限公司 加工方法及其应用的加工机台与系统
CN107717633A (zh) * 2017-11-26 2018-02-23 清远市飞华设备有限公司 一种数控加工中心的加工方法
JP2020066038A (ja) * 2018-10-26 2020-04-30 カンタツ株式会社 レーザ加工装置、レーザ加工装置の制御方法およびレーザ加工装置の制御プログラム
CN111347157B (zh) 2018-12-21 2023-04-28 松下知识产权经营株式会社 激光焊接装置以及激光焊接方法
KR102125167B1 (ko) * 2019-01-21 2020-06-19 한양대학교 에리카산학협력단 자동화 용접 장치 및 그의 동작 방법
CN110186391A (zh) * 2019-05-22 2019-08-30 浙江大学 一种三维模型梯度扫描方法
CN112440203B (zh) * 2019-09-03 2022-04-05 芯恩（青岛）集成电路有限公司 一种晶圆研磨系统和晶圆研磨方法
JP7430872B2 (ja) 2019-10-11 2024-02-14 三益半導体工業株式会社 搬送方法および搬送装置
CN111223787B (zh) * 2020-01-02 2023-04-07 长江存储科技有限责任公司 三维存储器的沟槽结构测量方法、装置、设备及介质
CN112518423B (zh) * 2020-12-24 2022-07-19 华中科技大学 用于正交切削过程的变形场和温度场的同步测量装置

Citations (4)

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CN1799752A (zh) * 2005-01-05 2006-07-12 株式会社迪斯科 激光加工装置
CN101207058A (zh) * 2006-12-20 2008-06-25 株式会社迪思科 晶片测量装置及激光加工机
CN101804521A (zh) * 2010-04-15 2010-08-18 中国电子科技集团公司第四十五研究所 振镜系统校正装置及其校正方法
CN102601519A (zh) * 2011-01-18 2012-07-25 奥林巴斯株式会社 调整装置、激光加工装置和调整方法

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JP2628256B2 (ja) 1992-05-15 1997-07-09 株式会社ディスコ カーフチェックに基づく自動ダイシングシステム
JP3112056B2 (ja) * 1994-09-09 2000-11-27 株式会社デンソー 三次元形状測定方法とその装置
JP2000252240A (ja) * 1999-03-03 2000-09-14 Disco Abrasive Syst Ltd 切削装置
JP2003168655A (ja) * 2001-12-03 2003-06-13 Tokyo Seimitsu Co Ltd ダイシング装置
JP2005030813A (ja) * 2003-07-09 2005-02-03 Okamoto Machine Tool Works Ltd 非接触３次元測定装置およびそれを用いるｃｎｃ精密研削装置
KR101024266B1 (ko) * 2006-05-09 2011-03-29 도쿄엘렉트론가부시키가이샤 촬상 위치 보정 방법, 촬상 방법, 기판 촬상 장치 및, 컴퓨터 프로그램이 기록된 기록 매체
JP4937832B2 (ja) * 2007-05-23 2012-05-23 オリンパス株式会社 ３次元形状観察装置
US8120781B2 (en) * 2008-11-26 2012-02-21 Zygo Corporation Interferometric systems and methods featuring spectral analysis of unevenly sampled data
JP5484787B2 (ja) * 2009-05-22 2014-05-07 株式会社ディスコ 断面形状検出方法、加工装置および断面形状検出用プログラム
JP2013113650A (ja) * 2011-11-28 2013-06-10 Lasertec Corp トレンチ深さ測定装置及びトレンチ深さ測定方法並びに共焦点顕微鏡

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1799752A (zh) * 2005-01-05 2006-07-12 株式会社迪斯科 激光加工装置
CN101207058A (zh) * 2006-12-20 2008-06-25 株式会社迪思科 晶片测量装置及激光加工机
CN101804521A (zh) * 2010-04-15 2010-08-18 中国电子科技集团公司第四十五研究所 振镜系统校正装置及其校正方法
CN102601519A (zh) * 2011-01-18 2012-07-25 奥林巴斯株式会社 调整装置、激光加工装置和调整方法

Also Published As

Publication number Publication date
JP6305013B2 (ja) 2018-04-04
TW201518020A (zh) 2015-05-16
TWI629130B (zh) 2018-07-11
JP2015085397A (ja) 2015-05-07
KR20150048627A (ko) 2015-05-07
KR102240331B1 (ko) 2021-04-13
CN104552625A (zh) 2015-04-29

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