CN104519663A - 一种混压线路板除胶方法 - Google Patents
一种混压线路板除胶方法 Download PDFInfo
- Publication number
- CN104519663A CN104519663A CN201310447360.1A CN201310447360A CN104519663A CN 104519663 A CN104519663 A CN 104519663A CN 201310447360 A CN201310447360 A CN 201310447360A CN 104519663 A CN104519663 A CN 104519663A
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- CN
- China
- Prior art keywords
- except
- mixed
- wiring board
- laser drilling
- gluing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310447360.1A CN104519663B (zh) | 2013-09-27 | 2013-09-27 | 一种混压线路板除胶方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310447360.1A CN104519663B (zh) | 2013-09-27 | 2013-09-27 | 一种混压线路板除胶方法 |
Publications (2)
Publication Number | Publication Date |
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CN104519663A true CN104519663A (zh) | 2015-04-15 |
CN104519663B CN104519663B (zh) | 2017-07-07 |
Family
ID=52794205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310447360.1A Active CN104519663B (zh) | 2013-09-27 | 2013-09-27 | 一种混压线路板除胶方法 |
Country Status (1)
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CN (1) | CN104519663B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108377612A (zh) * | 2018-01-29 | 2018-08-07 | 奥士康精密电路(惠州)有限公司 | 一种pcb盲槽底部线路加工工艺 |
CN112188738A (zh) * | 2020-09-30 | 2021-01-05 | 生益电子股份有限公司 | 一种混压pcb的除胶方法 |
TWI741249B (zh) * | 2019-01-10 | 2021-10-01 | 健鼎科技股份有限公司 | 決定無雙氰胺材料除膠次數的方法 |
CN114101224A (zh) * | 2020-08-28 | 2022-03-01 | 碁鼎科技秦皇岛有限公司 | 用于电路板的溢胶清除方法及设备 |
CN114765923A (zh) * | 2021-05-20 | 2022-07-19 | 上海贺鸿电子科技股份有限公司 | 一种5g基站隔离器三层线路板及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060211158A1 (en) * | 2005-03-04 | 2006-09-21 | Hitachi Via Mechanics, Ltd. | Method and apparatus for perforating printed circuit board |
US20110017711A1 (en) * | 2008-03-24 | 2011-01-27 | Satoki Nakada | Beam processing apparatus, beam processing method, and beam processed substrate |
CN102489882A (zh) * | 2011-11-30 | 2012-06-13 | 深圳市木森科技有限公司 | 一种激光除胶方法、装置和设备 |
-
2013
- 2013-09-27 CN CN201310447360.1A patent/CN104519663B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060211158A1 (en) * | 2005-03-04 | 2006-09-21 | Hitachi Via Mechanics, Ltd. | Method and apparatus for perforating printed circuit board |
US20110017711A1 (en) * | 2008-03-24 | 2011-01-27 | Satoki Nakada | Beam processing apparatus, beam processing method, and beam processed substrate |
CN102489882A (zh) * | 2011-11-30 | 2012-06-13 | 深圳市木森科技有限公司 | 一种激光除胶方法、装置和设备 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108377612A (zh) * | 2018-01-29 | 2018-08-07 | 奥士康精密电路(惠州)有限公司 | 一种pcb盲槽底部线路加工工艺 |
TWI741249B (zh) * | 2019-01-10 | 2021-10-01 | 健鼎科技股份有限公司 | 決定無雙氰胺材料除膠次數的方法 |
CN114101224A (zh) * | 2020-08-28 | 2022-03-01 | 碁鼎科技秦皇岛有限公司 | 用于电路板的溢胶清除方法及设备 |
CN112188738A (zh) * | 2020-09-30 | 2021-01-05 | 生益电子股份有限公司 | 一种混压pcb的除胶方法 |
CN114765923A (zh) * | 2021-05-20 | 2022-07-19 | 上海贺鸿电子科技股份有限公司 | 一种5g基站隔离器三层线路板及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104519663B (zh) | 2017-07-07 |
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Effective date of registration: 20220615 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. |
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