FI20105539L - Menetelmä substraattien tiivistämiseksi ja kontaktoimiseksi laservalon avulla ja elektroniikkamoduli - Google Patents

Menetelmä substraattien tiivistämiseksi ja kontaktoimiseksi laservalon avulla ja elektroniikkamoduli Download PDF

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Publication number
FI20105539L
FI20105539L FI20105539A FI20105539A FI20105539L FI 20105539 L FI20105539 L FI 20105539L FI 20105539 A FI20105539 A FI 20105539A FI 20105539 A FI20105539 A FI 20105539A FI 20105539 L FI20105539 L FI 20105539L
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Finland
Prior art keywords
substrates
region
pulses
substrate
conductive layer
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FI20105539A
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English (en)
Swedish (sv)
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FI123860B (fi
FI20105539A0 (fi
FI20105539A (fi
Inventor
Jarno Kangastupa
Tiina Amberla
Kazuo Yamada
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Corelase Oy
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Application filed by Corelase Oy filed Critical Corelase Oy
Publication of FI20105539A0 publication Critical patent/FI20105539A0/fi
Priority to FI20105539A priority Critical patent/FI123860B/fi
Priority to TW100117037A priority patent/TWI545662B/zh
Priority to SG2012082822A priority patent/SG185509A1/en
Priority to EP20110729434 priority patent/EP2572373B1/en
Priority to JP2013505512A priority patent/JP5487358B2/ja
Priority to US13/643,306 priority patent/US9171822B2/en
Priority to CN201180024487.1A priority patent/CN102893384B/zh
Priority to KR1020127032436A priority patent/KR101710462B1/ko
Priority to PCT/FI2011/050453 priority patent/WO2011144813A2/en
Priority to ES11729434.8T priority patent/ES2539860T3/es
Publication of FI20105539A publication Critical patent/FI20105539A/fi
Publication of FI20105539L publication Critical patent/FI20105539L/fi
Application granted granted Critical
Publication of FI123860B publication Critical patent/FI123860B/fi

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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  • Physics & Mathematics (AREA)
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  • Nonlinear Science (AREA)
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  • Power Engineering (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture Of Switches (AREA)
  • Joining Of Glass To Other Materials (AREA)
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  • Wire Bonding (AREA)

Abstract

Keksintö koskee menetelmää ensimmäisen eristävän substraatin (28A), jolla on vähintään yksi ensimmäinen johtava kerros (29A), sulauttamiseksi ja kontaktoimiseksi sähköisesti vähintään yhteen toiseen eristävään substraattiin (28B), jolla on vähintään yksi toinen johtava kerros (29B), siten, että menetelmä käsittää: ensimmäisen ja toisen substraatin (28A, 28B) pinoamisen siten, että niiden väliin muodostuu rajapinta-alue, joka käsittää sähköisen kontaktointialueen, jossa vähintään yksi ensimmäisistä johtavista kerroksista (29A) on kohti ja ainakin osittain kohdakkain vähintään yhden toisen johtavan kerroksen (29B) kanssa, sekä substraattien sulautumisalueen, jossa eristävät substraatit ovat suoraan toisiaan kohti; joukon peräkkäisiä kohdistettuja laserpulsseja kohdistamisen substraattien rajapinta-alueeseen yhden substraateista (28A, 28B) läpi siten, että laservalon pulssien kesto, pulssien taajuus ja pulssien teho valitaan saamaan aikaan substraattimateriaalien ja johtavien kerrosten paikallinen sulaminen; sekä laserlähteen ja substraatin liikuttamisen suhteessa toisiinsa ennalta määrätyllä nopeudella ja polulla siten, että rajapinta-alueelle muodostuu rakenteellisesti muokattu alue (27, 29), joka on limittäin mainitun sähköisen kontaktointialueen ja mainitun substraattien sulautumisalueen kanssa. Keksintö tarjoaa käytännöllisen keinon valmistaa hyvin tiivistettyjä liitoksia ja sähköisiä kontakteja esimerkiksi monitoimisille elektroniikkalaitteille.
FI20105539A 2010-05-18 2010-05-18 Menetelmä substraattien tiivistämiseksi ja kontaktoimiseksi laservalon avulla ja elektroniikkamoduli FI123860B (fi)

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FI20105539A FI123860B (fi) 2010-05-18 2010-05-18 Menetelmä substraattien tiivistämiseksi ja kontaktoimiseksi laservalon avulla ja elektroniikkamoduli
TW100117037A TWI545662B (zh) 2010-05-18 2011-05-16 使用雷射光密封與接觸基板的方法以及電子模組
SG2012082822A SG185509A1 (en) 2010-05-18 2011-05-17 Method of sealing and contacting substrates using laser light and electronics module
EP20110729434 EP2572373B1 (en) 2010-05-18 2011-05-17 Method of sealing and contacting substrates using laser light and electronics module
JP2013505512A JP5487358B2 (ja) 2010-05-18 2011-05-17 レーザ光を用いた基板の封止および接触の方法
US13/643,306 US9171822B2 (en) 2010-05-18 2011-05-17 Method of sealing and contacting substrates using laser light and electronics module
CN201180024487.1A CN102893384B (zh) 2010-05-18 2011-05-17 使用激光来密封和接触基板的方法以及电子模块
KR1020127032436A KR101710462B1 (ko) 2010-05-18 2011-05-17 레이저 광을 이용한 기판의 시일 및 접촉 방법 및 전자 모듈
PCT/FI2011/050453 WO2011144813A2 (en) 2010-05-18 2011-05-17 Method of sealing and contacting substrates using laser light and electronics module
ES11729434.8T ES2539860T3 (es) 2010-05-18 2011-05-17 Método para sellar y poner en contacto sustratos utilizando luz láser y módulo electrónico

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FI20105539A FI123860B (fi) 2010-05-18 2010-05-18 Menetelmä substraattien tiivistämiseksi ja kontaktoimiseksi laservalon avulla ja elektroniikkamoduli
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FI20105539A0 (fi) 2010-05-18
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