CN104518749B - 振动元件、振子、电子器件、电子设备以及移动体 - Google Patents
振动元件、振子、电子器件、电子设备以及移动体 Download PDFInfo
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- CN104518749B CN104518749B CN201410514098.2A CN201410514098A CN104518749B CN 104518749 B CN104518749 B CN 104518749B CN 201410514098 A CN201410514098 A CN 201410514098A CN 104518749 B CN104518749 B CN 104518749B
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- excitation electrode
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-206162 | 2013-10-01 | ||
| JP2013206162A JP6303372B2 (ja) | 2013-10-01 | 2013-10-01 | 振動素子、振動子、電子デバイス、電子機器、及び移動体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104518749A CN104518749A (zh) | 2015-04-15 |
| CN104518749B true CN104518749B (zh) | 2019-01-08 |
Family
ID=52739547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410514098.2A Active CN104518749B (zh) | 2013-10-01 | 2014-09-29 | 振动元件、振子、电子器件、电子设备以及移动体 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9866198B2 (enExample) |
| JP (1) | JP6303372B2 (enExample) |
| CN (1) | CN104518749B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6303372B2 (ja) * | 2013-10-01 | 2018-04-04 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、電子機器、及び移動体 |
| US11165390B2 (en) * | 2015-06-12 | 2021-11-02 | Daishinku Corporation | Piezoelectric resonator device |
| CN116248068B (zh) * | 2022-09-28 | 2024-03-08 | 泰晶科技股份有限公司 | 一种超高频at切石英晶片及制造方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106517A (ja) * | 1998-09-29 | 2000-04-11 | Tdk Corp | 圧電共振子 |
| JP2007158486A (ja) * | 2005-12-01 | 2007-06-21 | Epson Toyocom Corp | 水晶振動素子、水晶振動子、及び水晶発振器 |
| CN101383599A (zh) * | 2007-09-07 | 2009-03-11 | 爱普生拓优科梦株式会社 | 压电器件及其制造方法 |
| JP2010193496A (ja) * | 2010-04-05 | 2010-09-02 | Kyocera Corp | 水晶振動子及び水晶デバイス |
| JP2012249099A (ja) * | 2011-05-27 | 2012-12-13 | Daishinku Corp | 圧電振動片 |
| JP2013046085A (ja) * | 2011-08-22 | 2013-03-04 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| CN102957394A (zh) * | 2011-08-18 | 2013-03-06 | 精工爱普生株式会社 | 振动元件、振子、电子装置、电子设备、移动体及振动元件的制造方法 |
| JP2013192044A (ja) * | 2012-03-14 | 2013-09-26 | Seiko Epson Corp | 振動素子、振動子、電子デバイス、発振器、及び電子機器 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09246903A (ja) | 1996-03-13 | 1997-09-19 | Matsushita Electric Ind Co Ltd | 振動子 |
| JP2000134060A (ja) * | 1998-10-26 | 2000-05-12 | Murata Mfg Co Ltd | エネルギー閉じ込め型圧電共振子及びエネルギー閉じ込め型圧電共振部品 |
| JP3881503B2 (ja) | 2000-09-29 | 2007-02-14 | 京セラ株式会社 | 圧電振動子及びそれを搭載した圧電デバイス |
| JP2002190717A (ja) | 2000-12-21 | 2002-07-05 | Toyo Commun Equip Co Ltd | 高周波圧電デバイス |
| JP2002368573A (ja) | 2001-06-08 | 2002-12-20 | Toyo Commun Equip Co Ltd | 超薄板圧電振動子及びその製造方法 |
| JP4196641B2 (ja) | 2002-10-23 | 2008-12-17 | エプソントヨコム株式会社 | 超薄板圧電デバイスとその製造方法 |
| JP4325178B2 (ja) | 2002-11-26 | 2009-09-02 | エプソントヨコム株式会社 | 圧電振動素子、圧電振動子及び圧電発振器 |
| JP4567742B2 (ja) * | 2005-08-30 | 2010-10-20 | 京セラ株式会社 | 圧電共振素子及びそれを用いた圧電共振装置 |
| JP2007214941A (ja) * | 2006-02-10 | 2007-08-23 | Epson Toyocom Corp | 圧電振動片及び圧電デバイス |
| CN101772889B (zh) * | 2007-08-03 | 2013-01-09 | 株式会社大真空 | 压电振子 |
| JP4640511B2 (ja) | 2009-01-15 | 2011-03-02 | エプソントヨコム株式会社 | 圧電振動素子、圧電振動子、及び圧電発振器 |
| JP2011147053A (ja) | 2010-01-18 | 2011-07-28 | Seiko Epson Corp | 圧電振動片、圧電発振器 |
| JP5446941B2 (ja) | 2010-01-29 | 2014-03-19 | 株式会社大真空 | 圧電振動片 |
| TW201251157A (en) * | 2011-06-03 | 2012-12-16 | Seiko Epson Corp | Piezoelectric vibration element, manufacturing method for piezoelectric vibration element, piezoelectric vibrator, electronic device, and electronic apparatus |
| US8970316B2 (en) * | 2011-08-19 | 2015-03-03 | Seiko Epson Corporation | Resonating element, resonator, electronic device, electronic apparatus, and mobile object |
| JP6035808B2 (ja) | 2012-03-27 | 2016-11-30 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、及び電子機器 |
| TWI578585B (zh) * | 2012-03-27 | 2017-04-11 | 精工愛普生股份有限公司 | 振動元件、振動器、電子裝置、電子機器及移動體 |
| JP6191152B2 (ja) | 2013-02-15 | 2017-09-06 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、電子機器、及び移動体 |
| JP6303372B2 (ja) * | 2013-10-01 | 2018-04-04 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、電子機器、及び移動体 |
| JP2016029762A (ja) * | 2014-07-25 | 2016-03-03 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器、および移動体 |
-
2013
- 2013-10-01 JP JP2013206162A patent/JP6303372B2/ja active Active
-
2014
- 2014-09-29 CN CN201410514098.2A patent/CN104518749B/zh active Active
- 2014-09-30 US US14/501,500 patent/US9866198B2/en active Active
-
2017
- 2017-12-04 US US15/830,867 patent/US10153749B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106517A (ja) * | 1998-09-29 | 2000-04-11 | Tdk Corp | 圧電共振子 |
| JP2007158486A (ja) * | 2005-12-01 | 2007-06-21 | Epson Toyocom Corp | 水晶振動素子、水晶振動子、及び水晶発振器 |
| CN101383599A (zh) * | 2007-09-07 | 2009-03-11 | 爱普生拓优科梦株式会社 | 压电器件及其制造方法 |
| JP2010193496A (ja) * | 2010-04-05 | 2010-09-02 | Kyocera Corp | 水晶振動子及び水晶デバイス |
| JP2012249099A (ja) * | 2011-05-27 | 2012-12-13 | Daishinku Corp | 圧電振動片 |
| CN102957394A (zh) * | 2011-08-18 | 2013-03-06 | 精工爱普生株式会社 | 振动元件、振子、电子装置、电子设备、移动体及振动元件的制造方法 |
| JP2013046085A (ja) * | 2011-08-22 | 2013-03-04 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013192044A (ja) * | 2012-03-14 | 2013-09-26 | Seiko Epson Corp | 振動素子、振動子、電子デバイス、発振器、及び電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180091117A1 (en) | 2018-03-29 |
| JP2015070588A (ja) | 2015-04-13 |
| CN104518749A (zh) | 2015-04-15 |
| JP6303372B2 (ja) | 2018-04-04 |
| US9866198B2 (en) | 2018-01-09 |
| US10153749B2 (en) | 2018-12-11 |
| US20150091665A1 (en) | 2015-04-02 |
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