JP6303372B2 - 振動素子、振動子、電子デバイス、電子機器、及び移動体 - Google Patents

振動素子、振動子、電子デバイス、電子機器、及び移動体 Download PDF

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Publication number
JP6303372B2
JP6303372B2 JP2013206162A JP2013206162A JP6303372B2 JP 6303372 B2 JP6303372 B2 JP 6303372B2 JP 2013206162 A JP2013206162 A JP 2013206162A JP 2013206162 A JP2013206162 A JP 2013206162A JP 6303372 B2 JP6303372 B2 JP 6303372B2
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Japan
Prior art keywords
vibration
excitation electrode
vibration element
frequency
substrate
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JP2013206162A
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English (en)
Japanese (ja)
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JP2015070588A5 (enExample
JP2015070588A (ja
Inventor
雄介 山本
雄介 山本
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Seiko Epson Corp
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Seiko Epson Corp
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2013206162A priority Critical patent/JP6303372B2/ja
Priority to CN201410514098.2A priority patent/CN104518749B/zh
Priority to US14/501,500 priority patent/US9866198B2/en
Publication of JP2015070588A publication Critical patent/JP2015070588A/ja
Publication of JP2015070588A5 publication Critical patent/JP2015070588A5/ja
Priority to US15/830,867 priority patent/US10153749B2/en
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Publication of JP6303372B2 publication Critical patent/JP6303372B2/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2013206162A 2013-10-01 2013-10-01 振動素子、振動子、電子デバイス、電子機器、及び移動体 Active JP6303372B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013206162A JP6303372B2 (ja) 2013-10-01 2013-10-01 振動素子、振動子、電子デバイス、電子機器、及び移動体
CN201410514098.2A CN104518749B (zh) 2013-10-01 2014-09-29 振动元件、振子、电子器件、电子设备以及移动体
US14/501,500 US9866198B2 (en) 2013-10-01 2014-09-30 Resonator element, resonator, electronic device, electronic apparatus, and moving object
US15/830,867 US10153749B2 (en) 2013-10-01 2017-12-04 Resonator element, resonator, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013206162A JP6303372B2 (ja) 2013-10-01 2013-10-01 振動素子、振動子、電子デバイス、電子機器、及び移動体

Related Child Applications (1)

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JP2018037271A Division JP6562101B2 (ja) 2018-03-02 2018-03-02 振動素子、振動子、電子デバイス、電子機器、及び移動体

Publications (3)

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JP2015070588A JP2015070588A (ja) 2015-04-13
JP2015070588A5 JP2015070588A5 (enExample) 2016-10-20
JP6303372B2 true JP6303372B2 (ja) 2018-04-04

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US (2) US9866198B2 (enExample)
JP (1) JP6303372B2 (enExample)
CN (1) CN104518749B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6303372B2 (ja) * 2013-10-01 2018-04-04 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、電子機器、及び移動体
JP6589982B2 (ja) * 2015-06-12 2019-10-16 株式会社大真空 圧電振動デバイス
CN116248068B (zh) * 2022-09-28 2024-03-08 泰晶科技股份有限公司 一种超高频at切石英晶片及制造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246903A (ja) 1996-03-13 1997-09-19 Matsushita Electric Ind Co Ltd 振動子
JP2000106517A (ja) * 1998-09-29 2000-04-11 Tdk Corp 圧電共振子
JP2000134060A (ja) * 1998-10-26 2000-05-12 Murata Mfg Co Ltd エネルギー閉じ込め型圧電共振子及びエネルギー閉じ込め型圧電共振部品
JP3881503B2 (ja) 2000-09-29 2007-02-14 京セラ株式会社 圧電振動子及びそれを搭載した圧電デバイス
JP2002190717A (ja) 2000-12-21 2002-07-05 Toyo Commun Equip Co Ltd 高周波圧電デバイス
JP2002368573A (ja) 2001-06-08 2002-12-20 Toyo Commun Equip Co Ltd 超薄板圧電振動子及びその製造方法
JP4196641B2 (ja) 2002-10-23 2008-12-17 エプソントヨコム株式会社 超薄板圧電デバイスとその製造方法
JP4325178B2 (ja) 2002-11-26 2009-09-02 エプソントヨコム株式会社 圧電振動素子、圧電振動子及び圧電発振器
CN101248579B (zh) * 2005-08-30 2010-11-17 京瓷株式会社 压电谐振元件以及采用该元件的压电谐振装置
JP2007158486A (ja) * 2005-12-01 2007-06-21 Epson Toyocom Corp 水晶振動素子、水晶振動子、及び水晶発振器
JP2007214941A (ja) * 2006-02-10 2007-08-23 Epson Toyocom Corp 圧電振動片及び圧電デバイス
JP5104867B2 (ja) 2007-08-03 2012-12-19 株式会社大真空 圧電振動子
JP4412506B2 (ja) * 2007-09-07 2010-02-10 エプソントヨコム株式会社 圧電デバイスおよびその製造方法
JP4640511B2 (ja) 2009-01-15 2011-03-02 エプソントヨコム株式会社 圧電振動素子、圧電振動子、及び圧電発振器
JP2011147053A (ja) 2010-01-18 2011-07-28 Seiko Epson Corp 圧電振動片、圧電発振器
JP5446941B2 (ja) 2010-01-29 2014-03-19 株式会社大真空 圧電振動片
JP4926261B2 (ja) * 2010-04-05 2012-05-09 京セラ株式会社 水晶振動子及び水晶デバイス
JP5699809B2 (ja) * 2011-05-27 2015-04-15 株式会社大真空 圧電振動片
TW201251157A (en) * 2011-06-03 2012-12-16 Seiko Epson Corp Piezoelectric vibration element, manufacturing method for piezoelectric vibration element, piezoelectric vibrator, electronic device, and electronic apparatus
CN102957394B (zh) * 2011-08-18 2016-12-21 精工爱普生株式会社 振动元件、振子、电子装置、电子设备、移动体及振动元件的制造方法
US8970316B2 (en) * 2011-08-19 2015-03-03 Seiko Epson Corporation Resonating element, resonator, electronic device, electronic apparatus, and mobile object
JP2013046085A (ja) * 2011-08-22 2013-03-04 Seiko Epson Corp 圧電振動素子、圧電振動子、電子デバイス、及び電子機器
JP5982898B2 (ja) * 2012-03-14 2016-08-31 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、発振器、及び電子機器
JP6191152B2 (ja) 2013-02-15 2017-09-06 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、電子機器、及び移動体
TWI578585B (zh) 2012-03-27 2017-04-11 精工愛普生股份有限公司 振動元件、振動器、電子裝置、電子機器及移動體
JP6035808B2 (ja) 2012-03-27 2016-11-30 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、及び電子機器
JP6303372B2 (ja) * 2013-10-01 2018-04-04 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、電子機器、及び移動体
JP2016029762A (ja) * 2014-07-25 2016-03-03 セイコーエプソン株式会社 振動素子、振動子、発振器、電子機器、および移動体

Also Published As

Publication number Publication date
US20180091117A1 (en) 2018-03-29
CN104518749B (zh) 2019-01-08
US10153749B2 (en) 2018-12-11
CN104518749A (zh) 2015-04-15
JP2015070588A (ja) 2015-04-13
US20150091665A1 (en) 2015-04-02
US9866198B2 (en) 2018-01-09

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