CN104441060A - 粘合体的切断方法和粘合体的切断装置 - Google Patents

粘合体的切断方法和粘合体的切断装置 Download PDF

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Publication number
CN104441060A
CN104441060A CN201410484645.7A CN201410484645A CN104441060A CN 104441060 A CN104441060 A CN 104441060A CN 201410484645 A CN201410484645 A CN 201410484645A CN 104441060 A CN104441060 A CN 104441060A
Authority
CN
China
Prior art keywords
metal wire
adherend
cutting
substrate
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410484645.7A
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English (en)
Chinese (zh)
Inventor
松下孝夫
桥本淳
森伸一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN104441060A publication Critical patent/CN104441060A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/06—Severing by using heat
    • B26F3/08—Severing by using heat with heated members
    • B26F3/12—Severing by using heat with heated members with heated wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
CN201410484645.7A 2013-09-20 2014-09-19 粘合体的切断方法和粘合体的切断装置 Pending CN104441060A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013195470A JP2015058522A (ja) 2013-09-20 2013-09-20 粘着体の切断方法および粘着体の切断装置
JP2013-195470 2013-09-20

Publications (1)

Publication Number Publication Date
CN104441060A true CN104441060A (zh) 2015-03-25

Family

ID=52816475

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410484645.7A Pending CN104441060A (zh) 2013-09-20 2014-09-19 粘合体的切断方法和粘合体的切断装置

Country Status (4)

Country Link
JP (1) JP2015058522A (ja)
KR (1) KR20150032788A (ja)
CN (1) CN104441060A (ja)
TW (1) TW201521098A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116352797B (zh) * 2023-04-19 2023-09-26 盐城立德塑业有限公司 一种洗衣机绝缘框架裁切拼接装置及其加工方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1148539A (zh) * 1995-07-28 1997-04-30 新东工业株式会社 在粘接并修整薄膜的模具上的可电加热体结构
US5890481A (en) * 1996-04-01 1999-04-06 Saint-Gobain/Norton Industrial Ceramics Corporation Method and apparatus for cutting diamond
US6283111B1 (en) * 1999-06-18 2001-09-04 Sumitomo Metal Industries, Ltd. Wire saw cutting method and apparatus therefor
CN101200076A (zh) * 2006-12-17 2008-06-18 青岛高校软控股份有限公司 超声波裁断装置及其调整方法
CN101412227A (zh) * 2007-10-16 2009-04-22 鸿富锦精密工业（深圳）有限公司 剪切机和剪切方法
CN102962867A (zh) * 2012-11-30 2013-03-13 大连隆星新材料有限公司 一种电热丝石蜡切刀

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03170292A (ja) * 1989-11-28 1991-07-23 Bando Chem Ind Ltd 軟質材料の切断装置
JPH1034639A (ja) * 1996-07-25 1998-02-10 Babcock Hitachi Kk 押出成形体の切断方法および装置
KR100249313B1 (ko) * 1997-07-25 2000-03-15 윤종용 반도체 웨이퍼 테이프 라미네이팅시스템 및 이를 이용한 라미네이팅방법
JP2010194689A (ja) * 2009-02-26 2010-09-09 Daicho Kikai:Kk フィルムの切断方法およびその切断装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1148539A (zh) * 1995-07-28 1997-04-30 新东工业株式会社 在粘接并修整薄膜的模具上的可电加热体结构
US5890481A (en) * 1996-04-01 1999-04-06 Saint-Gobain/Norton Industrial Ceramics Corporation Method and apparatus for cutting diamond
US6283111B1 (en) * 1999-06-18 2001-09-04 Sumitomo Metal Industries, Ltd. Wire saw cutting method and apparatus therefor
CN101200076A (zh) * 2006-12-17 2008-06-18 青岛高校软控股份有限公司 超声波裁断装置及其调整方法
CN101412227A (zh) * 2007-10-16 2009-04-22 鸿富锦精密工业（深圳）有限公司 剪切机和剪切方法
CN102962867A (zh) * 2012-11-30 2013-03-13 大连隆星新材料有限公司 一种电热丝石蜡切刀

Also Published As

Publication number Publication date
JP2015058522A (ja) 2015-03-30
KR20150032788A (ko) 2015-03-30
TW201521098A (zh) 2015-06-01

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Application publication date: 20150325