CN104423180B - Exposure device - Google Patents

Exposure device Download PDF

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Publication number
CN104423180B
CN104423180B CN201410425472.1A CN201410425472A CN104423180B CN 104423180 B CN104423180 B CN 104423180B CN 201410425472 A CN201410425472 A CN 201410425472A CN 104423180 B CN104423180 B CN 104423180B
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CN
China
Prior art keywords
mask
dust removal
removal unit
mask plate
substrate
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Active
Application number
CN201410425472.1A
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Chinese (zh)
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CN104423180A (en
Inventor
河东和彦
羽生慎
羽生慎一
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Beac Co Ltd
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Beac Co Ltd
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Publication of CN104423180A publication Critical patent/CN104423180A/en
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Abstract

The present invention provides the exposure device of a kind of volume to volume mode, can automatically be masked the dedusting of the pattern plane of plate, and, exposure actions is not impacted the dedusting of the pattern plane that just can be masked plate.It is specifically, possess: exposure object stage (240), has the exposure worktable (241) of holding substrate (W), can be along z-axis and substrate (W) lifting；Mask dust removal unit (230), the 1st position (x1) leaving predetermined distance from the rear side end (210a) of mask plate (210) along x-axis and the front side end (210b) from mask plate (210) are left along x-axis between the 2nd position (x4) of predetermined distance as the action carrying out pattern plane (M) dedusting to mask plate (210) in movable range when moving back and forth, this movable range of an edge；Mask dust removal unit controls device (400), controls moving back and forth of mask dust removal unit (230)；And exposure object stage controls device (500), control the lifting of exposure object stage (240).

Description

Exposure device
Technical field
The present invention relates to a kind of exposure device, make the photosurface of substrate and the pattern plane of mask plate practise physiognomy Right, on substrate, transfer pattern by making the photosurface of substrate expose.
Background technology
The most known have various exposure device, makes the photosurface of substrate and the pattern plane of mask plate practise physiognomy Right, on substrate, transfer pattern by making the photosurface of substrate expose.In this exposure device, not only It is that the photosurface to substrate carries out dedusting, opposite face (the referred to as pattern of mask plate with substrate to mask plate Face) to carry out dedusting the most critically important.During this is because there is dust in the pattern plane of mask plate, then when exposing Dust can be transferred together with the pattern being formed on mask, occurs this substrate to become the bad phenomenon of substandard products.
But, in this exposure device, it is not only by one by one in the base of short size flakes Plate as the exposure device of exposure object, also has long size flakes substrate as the exposure device of exposure object.
It is respectively by ormal weight using long size flakes substrate as the exposure device of exposure object During the long size flakes substrate that barrow is located between delivery section and winder, make the photosurface of substrate Facing with the pattern plane of mask plate, and make the device that the photosurface of substrate exposes, as so-called volume to volume The exposure device of (Roll to Roll) mode and at the most known (referring for example to patent documentation 1).
Fig. 8 illustrates that the exposure device 900 described in patent documentation 1 and the figure that illustrates.Such as figure Shown in 8, the exposure device 900 disclosed in patent documentation 1 is in the conveying carrying long size flakes substrate 910 Exposure portion 940 is configured, at carrying substrate between portion 920 and the winder 930 having wound the substrate exposed During 910, the pattern plane making the photosurface of substrate 910 and mask plate 950 is facing, and makes substrate " exposure device of volume to volume mode " of the photosurface exposure of 910.
Further, since the exposure device 900 described in patent documentation 1 is following device, i.e. substrate 910 Two sides be photosurface, it is possible to making the two sides of substrate 910 expose, therefore mask plate 950 is divided up and down simultaneously It is not set to clip substrate 910.It addition, in the following description, using the mask plate 950 of upside as upside Mask plate 951, illustrates the mask plate 950 of downside as downside mask plate 952.
In the exposure device of this volume to volume mode, to mask plate 950 (upside mask plate 951 and Downside mask plate 952) each pattern plane to carry out dedusting the most critically important.Fill in the exposure described in patent documentation 1 Putting in 900, the dedusting of each pattern plane in upside mask plate 951 and downside mask plate 952 is carried out as follows.
In the exposure device 900 described in patent documentation 1, carry out the dedusting of upside mask plate 951 Time, utilize the height adjustable rollers 960 that substrate 910 can be made to lift along z-axis, make substrate 910 increase along z-axis, Substrate 910 is thus made to leave downside mask plate 952, and by making upside mask plate 951 rise along z-axis, And make upside mask plate 951 leave substrate 910, in this condition, the pattern plane of upside mask plate 951 is entered Row dedusting.
On the other hand, when carrying out the dedusting of downside mask plate 952, make upside mask plate 951 along z-axis Rise and and form wider interval between downside mask plate 952, and utilize height adjustable rollers 960 to make base Plate 910 leaves downside mask plate 952, in this condition, downside mask plate 952 is carried out dedusting.
Patent documentation 1: Japanese Laid-Open 2001-125274 publication
As it has been described above, in the exposure device 900 described in patent documentation 1 to mask plate 950 (on Side mask plate 951 and downside mask plate 952) each pattern plane when carrying out dedusting, for the ease of upside mask plate Pattern plane and the dedusting of pattern plane of downside mask plate, carry out the operation making substrate and upside mask plate move, Making each pattern plane and substrate interval, on this basis, the pattern plane and the downside that carry out upside mask plate are covered The dedusting of the pattern plane of template.It addition, in the exposure device 900 described in patent documentation 1, due to also It is provided for the pattern plane to mask plate the most especially and carries out the dust arrester of dedusting, it can be considered that mask plate The dedusting of pattern plane be that operating personnel is carried out by manual work.Therefore, the pattern of plate it is masked A lot of energy and times is spent during the dedusting in face.
It addition, in the exposure device 900 described in patent documentation 1, be masked the pattern plane of plate Dedusting time, need to make exposure actions stop.Therefore, the most effective exposure should be able to be realized originally Volume to volume mode exposure device in, damage high speed and high efficiency significantly for the dedusting of mask. Especially when the exposure of higher quality to be carried out, owing to requiring the dedusting being frequently masked, the most every time The dedusting being masked, is required for carrying out operation as above every time, become damaging larger high speed and Efficient.
It addition, in this manual, " exposure actions " refers to " respectively carrying by ormal weight During long size flakes substrate, the pattern plane making the photosurface of substrate and mask plate is facing, and makes base The action of the photosurface exposure of plate ".
Summary of the invention
The present invention is carried out in view of the foregoing, its object is to provide a kind of exposure device, In the exposure device of volume to volume mode, can automatically be masked the dedusting of the pattern plane of plate, and, the most right The exposure actions that the exposure device of this volume to volume mode is carried out impacts the pattern plane that just can be masked plate Dedusting.
[1] exposure device of the present invention is respectively to be located at delivery section and volume by ormal weight barrow During long size flakes substrate between portion, make the photosurface of described substrate and the pattern plane of mask plate Facing, and make the exposure device that the photosurface of described substrate exposes, it is characterised in that make described substrate edge X-axis in the x/y plane formed by x-axis and y-axis is front side towards the side of described winder, makes and this front When side opposite side is rear side, then have: exposure object stage, be arranged in clip described substrate and with described On the position that mask plate is relative, can be along the z-axis orthogonal with x/y plane and the lifting of described substrate one；Mask dedusting Portion, can realize moving back and forth and can lift along z-axis together with described exposure object stage along x-axis, and be set Put on described exposure object stage, to be positioned at described mask from the photosurface of described substrate along the state that z-axis is left Plate side, leaves between regulation along x-axis to major general the most rearward from the described rear side end of described mask plate Every the 1st position and described front side end from described mask plate leave regulation in side, side further along along x-axis Scope between 2nd position at interval is as movable range during described moving back and forth, this movable range of an edge Interior advance is while carrying out the action of the pattern plane dedusting to described mask plate；Mask dust removal unit drive mechanism portion, For make described mask dust removal unit carry out described in move back and forth；Mask dust removal unit controls device, by controlling institute State mask dust removal unit drive mechanism portion and control to move back and forth described in described mask dust removal unit；Exposure object stage Drive mechanism portion, for making described exposure object stage lift along z-axis；And exposure object stage controls device, logical Crossing and control described exposure object stage drive mechanism portion and control the lifting of described exposure object stage, described mask removes Dirt portion has the roll of adhesion at least surface, and the pattern plane of described mask plate is entered by described mask dust removal unit The action of row dedusting is the action carrying out when contacting with the pattern plane of described mask plate being rotationally advancing, From described mask dust removal unit relative to described mask plate along x-axis and z-axis respectively away from position make described mask remove When dirt portion contacts with the pattern plane of described mask plate, described mask dust removal unit controls the device described mask of control and removes Drive mechanism portion of dirt portion, makes described mask dust removal unit arrive and the end along x-axis in the pattern plane of described mask plate Near portion relative to position, described exposure object stage control device control described exposure object stage drive mechanism portion , when described mask dust removal unit arrive with near the end along x-axis in the pattern plane of described mask plate relative to position When putting, make described mask dust removal unit contact near the end along x-axis in the pattern plane of described mask plate, make When the photosurface of described substrate exposes, described mask dust removal unit controls device and controls the driving of described mask dust removal unit Mechanism part, makes described mask dust removal unit be in described 1st position of arrival or the state of described 2nd position, described Exposure object stage controls device and controls described exposure object stage drive mechanism portion, arrives in described mask dust removal unit Under the state of described 1st position or described 2nd position, described exposure object stage is made to be moved along the z-axis and make described base The photosurface of plate is in the pattern plane of described mask plate and contacts or close state.
The exposure device of the present invention is constituted in following, and ratio is being covered along the direction of x-axis by mask dust removal unit The wide scope (scope between the 1st position and the 2nd position) of template is as movable range, by movable along this Dedusting is carried out before scope and then to the pattern plane of mask plate.And, when making the photosurface exposure of substrate, covering Under the state that mould dust removal unit arrives the 1st position or described 2nd position, exposure object stage is made to be moved along the z-axis and make base The photosurface of plate is in the pattern plane of mask plate and contacts or close state, thus is exposed.Thus, According to the exposure device of the present invention, in the exposure device of volume to volume mode, it is also possible to be automatically masked plate The dedusting of pattern plane, and, the exposure actions not carried out the exposure device of this volume to volume mode causes shadow Ring, just can be masked the dedusting of the pattern plane of plate.
It addition, according to the exposure device of the present invention, mask dust removal unit has adhesion at least surface Roll, is at the pattern with mask plate owing to mask dust removal unit carries out the action of dedusting to the pattern plane of mask plate The action that is rotationally advancing is carried out under the state of face contact, therefore can efficiently and effectively pattern to mask plate Face carries out dedusting.
It addition, according to the exposure device of the present invention, mask dust removal unit controls device and exposure object stage control Device processed controls mask dust removal unit drive mechanism portion and exposure object stage drive mechanism portion respectively, when mask dedusting Portion arrive with near the end along x-axis in the pattern plane of mask plate relative to position time, make mask dust removal unit and Contact near the end along x-axis in the pattern plane of mask plate.Therefore, mask dust removal unit along x-axis advance time, Mask dust removal unit does not produce the action pushing mask plate end to the direction of advance of the mask dust removal unit along x-axis. Thus, it is possible to prevent the position of mask plate from offseting, furthermore it is also possible to prevent the corner etc. in mask plate end Damaged.
[2] in the exposure device of the present invention, the most described mask dust removal unit is respectively pressing ormal weight The action of the pattern plane dedusting to described mask plate is carried out in carrying the period of described substrate.
So, owing to carrying out the action of the pattern plane dedusting to mask plate within the period of carrying substrate, The exposure actions of the script that the exposure device of volume to volume mode is carried out is not impacted, just can be to mask The pattern plane of plate carries out dedusting.Thereby, it is possible to keep the exposure that the exposure device of volume to volume mode has originally Speed of action.
[3] in the exposure device of the present invention, preferably by described mask dust removal unit along described movable range The action advanced to described front side is as front forward motion, by described mask dust removal unit along described movable model Enclose introversive described rear side advance action as rear forward motion time, described mask dust removal unit is respectively in institute State the action carrying out the pattern plane dedusting to described mask plate in front forward motion and described rear forward motion , in described front forward motion and described rear forward motion, the pattern plane of described mask plate is carried out respectively The action of dedusting is carried out within the period respectively carrying described substrate by ormal weight alternately.
So, mask dust removal unit along the movable range of this mask dust removal unit carry out front forward motion and after During side's forward motion, in front forward motion and rear forward motion, carry out the pattern plane to mask plate respectively The action of dedusting.It addition, pattern plane to mask plate in front forward motion and rear forward motion respectively The action carrying out dedusting is carried out between respectively by the action of ormal weight carrying substrate alternately.Accordingly, it is capable to Enough succinctly effectively carry out the carrying action of substrate and the dedusting action of mask dust removal unit.Further, since interval When being exposed action, the pattern plane to mask plate that is bound between exposure actions and exposure actions is carried out Dedusting, therefore can be exposed when the pattern plane of mask plate has been carried out dedusting all the time.
[4] in the exposure device of the present invention, the most described mask dust removal unit is arranged on described exposure loading On platform, when the state that the pattern plane being in described mask plate contacts, acted on by the elastic force of spring Push the power of described pattern plane.
Therefore, it can make mask dust removal unit contact with pattern plane with suitable pushing force, it is not necessary to high-precision The control etc. of pushing force when degree ground contacts.It addition, the interval of mask dust removal unit and pattern plane is (along z-axis Interval) also without being adjusted accurately, can alleviate mask dust removal unit and pattern plane interval ( Interval along z-axis) adjustment operation.
[5] in the exposure device of the present invention, the most described mask dust removal unit has along described mask plate The suction port in the y-axis direction in pattern plane, is, by attraction, the pattern plane of described mask plate is carried out dedusting Aspiration-type mask dust removal unit, described aspiration-type mask dust removal unit carries out dedusting to the pattern plane of described mask plate Captivation is played and along institute action is to have void between the pattern plane of described mask plate The pattern plane stating mask plate and the action advanced along the x-axis direction.
As mask dust removal unit, by using this aspiration-type mask dust removal unit, it is also possible to obtain and by above-mentioned [1] The effect that the effect that obtains to the invention of [3] is identical.
[6] in the exposure device of the present invention, preferably there is substrate dust removal unit, to described substrate at least Described photosurface carries out dedusting.
Thus, the dedusting of the more than pattern plane of mask plate, it is also possible to carry out the removing of at least photosurface of substrate Dirt.
[7] in the exposure device of the present invention, the most described substrate dust removal unit has adhesion at least surface The roll of power, it is set with the state that contacts with at least photosurface of described substrate, with the most each Rotate by the carrying of described substrate during ormal weight described substrate of carrying.
Thus, it is possible to efficiently and effectively to the pattern plane of mask plate carry out dedusting.Further, since The action of at least photosurface dedusting to substrate is carried out, the most not to volume to volume mode in the period of carrying substrate The exposure actions of script that carries out of exposure device impact, just at least photosurface of substrate can be removed Dirt.Thereby, it is possible to keep the exposure actions speed that the exposure device of volume to volume mode has originally.It addition, Can also be the composition clipping substrate with 2 rollers with dedusting function, by becoming this composition, Ke Yitong Time the two sides of substrate is carried out dedusting.
Accompanying drawing explanation
Fig. 1 illustrates that the exposure device 10 involved by embodiment and illustrate be monolithically fabricated figure.
Fig. 2 illustrates that the composition of the exposure portion 200 in the exposure device 10 involved by embodiment is shown The figure gone out.
Fig. 3 be illustrate mask dust removal unit in the exposure device 10 involved by embodiment control device 400 and Exposure object stage controls the figure of the composition of device 500.
Fig. 4 illustrates that the action of the exposure device 10 involved by embodiment and the figure that illustrates.
Fig. 5 illustrates that the action of the exposure device 10 involved by embodiment and the figure that illustrates.
Fig. 6 illustrates that the action of the exposure device 10 involved by embodiment and the figure that illustrates.
Fig. 7 illustrates that the action of the exposure device 10 involved by embodiment and the figure that illustrates.
Fig. 8 illustrates that the exposure device 900 described in patent documentation 1 and the figure that illustrates.
Symbol description
10-exposure device；100-carrying mechanism；130-intermittent feeding mechanism portion；140-substrate cleaning roller (substrate Dust removal unit)；200-exposure portion；210-mask plate；220-mask plate maintaining part；230-mask cleaning roller (mask Dust removal unit)；240-exposes object stage；241-exposure worktable；250-mask dust removal unit drive mechanism portion；251 L, 251R-guide rail；252L, 252R-slide block；253L, 253R-mask dust removal unit ball screw；257- Spring；260-exposes object stage drive mechanism portion；261-lifting platform；263-exposes object stage ball screw； 300-exposure device framework；400-mask dust removal unit controls device；500-exposure object stage controls device；A-feels Bright finish；A1, A2-photosensitive region.
Detailed description of the invention
Hereinafter, embodiments of the present invention are illustrated.
(embodiment 1)
Fig. 1 illustrates that the exposure device 10 involved by embodiment and illustrate be monolithically fabricated figure.It addition, Fig. 1 is the figure that medelling illustrates the exposure device 10 involved by embodiment 1, in order to embodiment party is described Exposure device 10 rather than especially necessary component parts involved by formula then omit diagram.Further, since figure 1 is ideograph, is not therefore the size of actual component parts to be reduced with same ratio, but overstates Draw or draw component parts with more reducing with opening.
As it is shown in figure 1, the exposure device 10 involved by embodiment has: carrying mechanism portion 100, X-axis along the x/y plane formed by x-axis and y-axis respectively carries long size flakes substrate by ormal weight W；Exposure portion 200, makes by carrying mechanism portion 100 respectively by substrate W photosensitive of ormal weight carrying Face A exposes；Exposure device framework 300, is accommodated with above-mentioned carrying mechanism portion 100 and exposure portion 200；Mask Dust removal unit controls device 400, controls the mask dust removal unit 230 (explained below) in exposure portion 200；And Exposure object stage controls device 500, controls the exposure object stage 240 (explained below) in exposure portion 200. Although the exposure device 10 involved by embodiment omits diagram in addition to these component parts, but also sets up Have an eliminostatic portion etc., eliminate mask plate 210 and substrate W etc. with electrostatic.
Carrying mechanism portion 100 has: delivery section 110, carries long size flakes substrate W；Winder 120, wind the substrate W completing exposure exposed by exposure portion 200；Intermittent feeding mechanism portion 130, along x Axle respectively presses ormal weight carrying substrate W；Substrate dust removal unit 140, is arranged in compared with exposure portion 200 Delivery section 110 side, carries out dedusting to the photosurface A of substrate W；And feed rolls 151,152, it is arranged on and removes On fortune path.Further, since delivery section 110 and winder 120 are respectively in roll, the most defeated Send roller 110, take-up roll 120.
So, the exposure device 10 involved by embodiment is respectively by ormal weight carrying volume During the substrate W being wound on conveying roller 110, at the photosurface A being made substrate W by exposure portion 200 After exposure, wind the exposure of " volume to volume (Roll to Roll) " mode of the substrate W of exposure by take-up roll Electro-optical device.It addition, in this manual, substrate W is removed the side to winder 120 along x-axis and is made For front side, will illustrate as rear side with this front side opposite side.
Intermittent feeding mechanism portion 130 in carrying mechanism portion 100 is repeated following dynamic the most successively Make, make fixation clamp holder 131 unclamp, by feeding clamper 132 chucking substrate W and only carry ormal weight, By fixation clamp holder chucking substrate W after only carrying ormal weight, thereafter, fixation clamp holder 131 pine is again made Open, by feeding clamper 132 chucking substrate W and only carry ormal weight, by fixing after only carrying ormal weight Clamper chucking substrate W.Thus, it is possible to press ormal weight conveying substrate W off and on.It addition, index(ing) feed The composition of mechanism part 130 is not limited to this composition, can use the intermittent feeding mechanism portion of various composition.
It addition, substrate dust removal unit 140 is that the substrate W carried from conveying roller 110 is carried out dedusting Parts, in having the roll of adhesion on surface, use order in the exposure device 10 involved by embodiment The component (such as having the rubber etc. of adhesion) with adhesion is formed as the parts of roll.
So, owing to substrate dust removal unit 140 is in roll, thus also substrate dust removal unit 140 is referred to as " base Plate cleaning roller 140 ".Although it addition, substrate cleaning roller 140 is the parts with adhesion, but it adheres to Power in can the degree of dust present on the photosurface A of ad-hesion removal rate substrate W, it is will not be to substrate W Photosurface A have undesirable effect the adhesion of degree.It addition, the photosurface A of substrate W refers at substrate Being coated with the face of photoresist etc. on W, photoresist is in the state of drying.
Substrate cleaning roller 140 is made up of 2 rollers 141,142 in the way of clipping substrate W.It addition, If the main dedusting considering to carry out the photosurface A of substrate W, then it can also be the roller 141 of only photosurface side There is substrate dedusting function, but by making 2 rollers 141,142 possess substrate dedusting function, be then more than The photosurface A of substrate W, moreover it is possible to the dedusting in the face of realization and photosurface A opposite side.It is therefore preferable that roller 142 also have substrate dedusting function, its be positioned at on the face of the photosurface A opposite side of substrate W.
Fig. 2 illustrates that the structure of the exposure portion 200 in the exposure device 10 involved by embodiment The figure become and illustrate.Fig. 2 (a) be from conveying roller 110 side along X-axis observe the exposure portion 200 Fig. 1 time Side view, Fig. 2 (b) is that the a-a in Fig. 2 (a) is to regarding top view.With reference to Fig. 2 to exposure portion 200 Illustrate.
Exposure portion 200 has: not shown light source；Mask plate 210, by the printing opacity of clear glass etc. Property component constitute, there is the thickness of regulation；Mask plate maintaining part 220, makes pattern plane M state down Lower holding mask plate 210；Mask dust removal unit 230, carries out the action to the dedusting of pattern plane M；Exposure object stage 240, it is arranged in and clips substrate W and on the position relative with mask plate 210, can be along orthogonal with x/y plane Z-axis lifts；Mask dust removal unit drive mechanism portion 250, is used for making mask dust removal unit 230 move back and forth along x-axis； And exposure object stage drive mechanism portion 260, it is used for making exposure object stage 240 lift along z-axis.
It addition, in the exposure device 10 involved by embodiment 1, mask plate 210 along x-axis length with Mask plate maintaining part 220 is along a length of identical length L1 (with reference to Fig. 1) of x-axis.It addition, mask plate is protected Holding portion 220 is the parts along z-axis with specific thickness.
Mask dust removal unit 230 is in the roll on surface with adhesion.In the exposure involved by embodiment The component (such as having the rubber etc. of adhesion) using order to have adhesion in electro-optical device 10 is formed as roll Parts.
So, owing to mask dust removal unit 230 is in roll, thus also it is referred to as " covering by mask dust removal unit 230 Mould cleaning roller 230 ".Although it addition, mask cleaning roller 230 is the parts with adhesion, but it adheres to Power in can the degree of dust present on pattern plane M of ad-hesion removal rate mask plate 210, it is for will not be to covering Pattern plane M of template 210 has undesirable effect the adhesion of degree.
Exposure object stage 240 has exposure worktable 241.Exposure worktable 241 be configured to across Substrate W is relative with pattern plane M of mask plate 210, plays the effect keeping substrate W from downside.
It addition, be formed with stand portion 242L, 242R in the left and right sides of exposure object stage 240 along x-axis, It is prominent to the direction along y-axis.Stand portion 242L, 242R are provided with mask dust removal unit drive mechanism portion 250, it is used for making mask cleaning roller 230 move back and forth along x-axis.
Mask dust removal unit drive mechanism portion 250 has: guide rail 251L, 251R, is laid on platform respectively On frame portion 242L, 242R；Slide block 252L, 252R, can slide along above-mentioned guide rail 251L, 251R are upper； Ball screw 253L, 253R, be used for making slide block 252L, 252R move back and forth along x-axis；Mask cleaning roller Supporting part 254L, 254R, be fixed on slide block 252L, 252R, in the left and right sides by mask cleaning roller 230 Rotary shaft 231 be supported for rotatable；And motor (not shown), for ball screw 253L, 253R Carry out rotating and drive.It addition, motor can use servo motor.
Owing to mask dust removal unit drive mechanism portion 250 is in this structure, therefore ball screw 253L, 253R rotates clockwise or counterclockwise when synchronizing respectively, thus slide block 252L, 252R moves back and forth along x-axis, and accordingly, mask cleaning roller 230 also moves back and forth along x-axis.It addition, mask Cleaning roller 230 by exposure object stage 240 an end 240a and another end 240b along x-axis it Interior prescribed limit is as movable range (explained below), by mask dust removal unit drive mechanism portion 250 And move back and forth along this movable range.
Such as, by ball screw 253L, 253R counterclockwise (observe front side time inverse Clockwise) rotate, thus slide block 252L, 252R advance along x-axis forwards side, and thus, mask dedusting Roller 230 also advances along x-axis forwards side.
Such as, by ball screw 253L, 253R clockwise (observe front side time suitable Clockwise) rotate, thus slide block 252L, 252R advance rearward along x-axis, and thus, mask dedusting Roller 230 also advances rearward along x-axis.
The mask dust removal unit drive mechanism portion 250 so constituted is quilt by mask dust removal unit control device 400 Control, thus, mask cleaning roller 230 is controlled.
And then, mask cleaning roller supporting part 254L, 254R are respectively formed with U-shaped bearing groove 255 (with reference to Fig. 1), for being supported for rotatable by mask cleaning roller 230.The upper end of this bearing groove 255 Side opening, mask cleaning roller 230 is by making rotary shaft 231 fall into from the opening of bearing groove 255, thus locates In being supported for rotatable state by bearing groove 255.
Owing to being this structure, therefore mask cleaning roller 230 is easily at mask cleaning roller supporting part The upper free mounting or dismounting of 254L, 254R, can easily be masked the maintenance of the cleaning of cleaning roller 230, exchange etc.. It addition, mask cleaning roller 230 rotates not by power, but it is supported in idling manner and covers On mould cleaning roller supporting part 254L, 254R.
It addition, mask cleaning roller supporting part 254L, 254R are by guide finger 256 and spring 257 It is supported on slide block 252L, 252R, downward along z-axis on mask cleaning roller supporting part 254L, 254R When side applies pushing force, then relative to this pushing force, resistance produced by the elastic force of spring 257 occurs Effect.Therefore, make the mask cleaning roller 230 being supported on mask cleaning roller supporting part 254L, 254R and cover When pattern plane M of template 210 abuts, then mask cleaning roller 230 by the elastic force of spring 257 to advise Fixed pushing force contacts with pattern plane M of mask plate 210.
On the other hand, exposure object stage 240 can be by exposure object stage drive mechanism portion 260 along z Axle lifts.Exposure object stage drive mechanism portion 260 has: lifting platform 261, is fixed on exposure object stage 240 On；Exposure object stage ball screw 263, is used for making lifting platform 261 lift along z-axis；And motor (do not schemes Show), drive for carrying out ball screw 263 rotating.It addition, motor can use servo motor.
The exposure object stage drive mechanism portion 260 so constituted is by making ball screw 263 to clockwise Direction or counterclockwise rotation, such that it is able to make exposure object stage 240 lift along z-axis.It addition, pass through When exposure object stage drive mechanism portion 260 makes exposure object stage 240 lift, then it is more than exposure object stage 240, Carrying mechanism portion 100 entirety is also carried out lifting.
Thus, ball screw 263 (inverse time time above z-axis observation counterclockwise is such as made Pin direction) rotate time, then exposure object stage 240 along z-axis rise, and carrying mechanism portion 100 also with exposure Light object stage 240 rises together.It addition, " carrying mechanism portion 100 also rises together with exposure object stage 240 " Refer to, conveying roller 110, take-up roll 120, intermittent feeding mechanism portion 130, substrate cleaning roller 140 and substrate W rises together with exposure object stage 240.
On the other hand, ball screw 263 (up time time above z-axis observation clockwise is made Pin direction) rotate time, then exposure object stage 240 along z-axis decline, and carrying mechanism portion 100 also with exposure Light object stage 240 declines together.It addition, " carrying mechanism portion 100 also declines together with exposure object stage 240 " Refer to, conveying roller 110, take-up roll 120, intermittent feeding mechanism portion 130, substrate cleaning roller 140 and substrate W declines together with exposure object stage 240.
The exposure object stage drive mechanism portion 260 so constituted is quilt by exposure object stage control device 500 Drive and control.
Further, since the ball screw 253L being arranged in mask dust removal unit drive mechanism portion 250, 253R is the ball screw for driving mask dust removal unit 230 (mask cleaning roller 230), is therefore sometimes referred to as For mask dust removal unit ball screw 253L, 253R.Further, since be arranged on exposure object stage drive mechanism Ball screw 263 in portion 260 is the ball screw for driving exposure object stage 240, the most also It is referred to as exposure object stage ball screw 263.
Fig. 3 is to illustrate that the mask dust removal unit in the exposure device 10 involved by embodiment controls device 400 and exposure object stage control the figure of composition of device 500.Fig. 3 (a) illustrates that mask dust removal unit controls dress Putting the composition of 400, Fig. 3 (b) illustrates that exposure object stage controls the composition of device 500.
As shown in Fig. 3 (a), mask dust removal unit controls device 400 to be had: mask dust removal unit ball Screw drive portion (servo motor etc.) 410, drives mask dust removal unit ball screw 253L, 253R respectively； Storage part 420, stores for controlling control program and the set information etc. of user that mask cleaning roller 230 advances； And advance control portion 430, drive according to the storage content-control mask dust removal unit ball screw of storage part 420 Portion 410, thus controls mask cleaning roller 230 forwards side or rear side advances.
As shown in Fig. 3 (b), exposure object stage controls device 500 to be had: exposure object stage ball Threaded shank (servo motor etc.) 510, drives exposure object stage ball screw 263；Storage part 520, Store control program and the set information etc. of user for controlling to expose object stage 240 lifting；And lifting control Portion 530 processed, exposes object stage ball screw portion 510 according to the storage content-control of storage part 520, Thus control rising or falling of exposure object stage 240.
Although it addition, in figure 3, controlling device 400 and exposure object stage in mask dust removal unit respectively Control device 500 arranges storage part (storage part 420 and storage part 520), but 1 can also be shared Storage part.
Fig. 4 to Fig. 7 illustrates that the action of the exposure device 10 involved by embodiment illustrates Figure.Fig. 4 (a) to Fig. 4 (d), Fig. 5 (a) are to Fig. 5 (c), Fig. 6 (a) to Fig. 6 (d) and figure 7 (a) is the figure illustrating respective operation to Fig. 7 (c).It addition, Fig. 4 to Fig. 7 is to mainly illustrate The figure of the action of the mask cleaning roller 230 in exposure portion 200.Therefore, in the component parts shown in Fig. 1 Carrying mechanism portion 100 omits diagram, it addition, in exposure portion 200, expose object stage drive mechanism portion 260 Deng also omitting diagram.It addition, the symbol of mark also has omission in Fig. 1 and Fig. 2 of exposure portion 200 Symbol.
It addition, in Fig. 4 to Fig. 7, pass through Fig. 3 for the control making mask cleaning roller 230 advance A the mask dust removal unit shown in () controls device 400 and carries out, for the control making exposure object stage 240 lift Make and control device 500 by the exposure object stage shown in Fig. 3 (b) and carry out.
In the exposure device 10 involved by embodiment, substrate W is by carrying mechanism portion 100 Respectively carried by ormal weight, after carrying out 1 carrying, the photosurface A of substrate W is become exposure right Some photosensitive region (example in multiple photosensitive regions (representing this photosensitive region with A1, A2) of elephant As for photosensitive region A1) be on exposure worktable 241 facing with pattern plane M of mask plate 210 Position.And, the position upper substrate W that pattern plane M at photosensitive region A1 Yu mask plate 210 is facing Carrying be in the state temporarily ceased, by being exposed in this condition, thus on photosensitive region A1 Transfer pattern.
And, after the end exposure of photosensitive region A1, substrate W is only carried ormal weight again, In the photosurface A of substrate W, next photosensitive region (for example, photosensitive region A2) is at exposure worktable 241 On be in the position facing with pattern plane M of mask plate 210.And, at photosensitive region A2 and mask The carrying of the position upper substrate W that pattern plane M of plate 210 is facing is in the state temporarily ceased, by It is exposed under this state, thus on photosensitive region A2, transfers pattern.This action is repeated.
During carrying out this action, substrate W carries out dedusting by substrate cleaning roller 140, Pattern plane M of mask plate 210 carries out dedusting by mask cleaning roller 230.Entered by substrate cleaning roller 140 The dedusting of substrate W of row and the dedusting of pattern plane M of mask plate 210 carried out by mask cleaning roller 230 Carry out within the period that substrate W is handled upside down.It addition, the dedusting of the substrate W carried out by substrate cleaning roller 140 Can be rotated by substrate cleaning roller 140 when each carrying substrate W and carry out, therefore, at this to mask The dedusting action of cleaning roller 230 illustrates.
Fig. 4 (a) is the state that mask cleaning roller 230 starts before dedusting action, will be in this shape The position of the mask cleaning roller 230 during state is referred to as initial position.Now, substrate W has begun to carrying action.
When mask cleaning roller 230 is in the initial position shown in Fig. 4 (a), this mask cleaning roller 230 Position (rotary shaft 231 is along the position of x-axis) x1 along x-axis is in the end from mask plate 210 rear side (referred to as rear side end) 210a the most only leaves the position of predetermined distance (also referred to as along x-axis It is the 1st position x1).
It addition, mask cleaning roller 230 is along the position of z-axis (on the circumference in mask cleaning roller 230 Upper side summit P1 is along the position of z-axis) z2 is in compared with the position z1 of pattern plane M of mask plate 210 The most only leave the position of predetermined distance.
When mask cleaning roller 230 is in this initial position, this mask cleaning roller 230 and mask plate 210 Pattern plane M is in non-contacting state.
Mask cleaning roller 230 is from being in the state of the initial position shown in Fig. 4 (a) along x-axis forwards Only advance ormal weight in side, the planar portions near the rear side end 210a of arrival and mask plate 210, i.e. pattern Near the rear side end e1 of face M relative to position x2 time (with reference to Fig. 4 (b)), expose object stage 240 Ormal weight, the rear side end e1 of pattern plane M of mask cleaning roller 230 and mask plate 210 is risen along z-axis Neighbouring contact (with reference to Fig. 4 (c)).Thereafter, mask cleaning roller 230 is in pattern plane M with mask plate 210 Advance along x-axis forwards (arrow x direction) under the state of contact.
Now, mask cleaning roller 230 is when the elastic force of spring 257 is had an effect, such as figure Shown in 4 (c), rotate when contacting with pattern plane M of mask plate 210 and advance.Thus, may be used So that dust present on pattern plane M of mask plate 210 is attached to mask cleaning roller 230 side, accordingly, Pattern plane M of mask plate 210 can be carried out dedusting.
So, when pattern plane M of mask cleaning roller 230 with mask plate 210 contacts, This mask cleaning roller 230 is in the elastic force by spring 257 and pushes pattern plane M of mask plate 210 State.Therefore, there is no need to be masked especially cleaning roller 230 when contacting with pattern plane M of mask plate 210 The control of the pushing force etc. relative to mask plate 210.
It addition, although mask cleaning roller 230 is the parts with adhesion, but due to its adhesion Be ad-hesion removal rate mask plate 210 pattern plane M present on the degree of dust, cover thus without to being formed at Pattern etc. in pattern plane M of template 210 has undesirable effect.
So, mask cleaning roller 230 is at the state backspin contacted with pattern plane M of mask plate 210 Turn and forwards advance in side, as end (the referred to as front side end) 210b of arrival mask plate 210 front side, (with reference to Fig. 4 (d)) time near the i.e. front side end e2 of pattern plane M of mask plate 210, then expose load Thing platform 240 declines (with reference to Fig. 5 (a)) from the state of Fig. 4 (d) along z-axis.Mask cleaning roller 230 now Position (the upper side summit P1 on circumference is along the position of z-axis) along z-axis is the position identical with Fig. 4 (a) Put z2.It addition, exposure object stage 240 is when only declining ormal weight, then with the decline of this exposure object stage 240 Together, carrying mechanism portion 100 entirety the most only declines ormal weight.
And, mask cleaning roller 230 side further along advances, and arrives from the front of mask plate 210 Side end 210b (the front side end e2 of pattern plane M) leaves the position of predetermined distance along x-axis forwards side X4 (the also referred to as the 2nd position x4) (with reference to Fig. 5 (b)).
Mask cleaning roller 230 advances to Fig. 5 (b) along x-axis from the 1st position x1 shown in Fig. 4 (a) The action of the 2nd shown position x4 was carried out within the period that substrate W is handled upside down.Therefore, not to off and on Respectively carry long size flakes substrate W by ormal weight and be exposed that such exposure device 10 carried out former This exposure actions impacts, and just pattern plane M of mask plate 210 can be carried out dedusting.Further, since The dedusting of the substrate W that substrate cleaning roller 140 is carried out also is able to carry out in the carrying of substrate W, thus without Produce by the loss of time caused by the dedusting of pattern plane M carrying out substrate W and mask plate 210.
So, the position x4 (the 2nd position x4) shown in Fig. 5 (b) is arrived when mask cleaning roller 230 Time, exposure object stage 240 only rises ormal weight (with reference to Fig. 5 (c)).Exposure object stage 240 only rises rule Time quantitatively, then, together with the rising of this exposure object stage 240, carrying mechanism portion 100 entirety the most only rises rule Quantitatively.
During further, since exposure object stage 240 only rises ormal weight, mask cleaning roller 230 arrives From the front side end 210b (the front side e2 of pattern plane M) of mask plate 210 along x-axis forwards side from Opening the position x4 (the 2nd position x4) of predetermined distance, therefore mask cleaning roller 230 will not be with mask plate 210 And mask plate maintaining part 220 abuts.It addition, mask cleaning roller 230 the most not with other not shown constituting portion Part abuts.Thus, exposure object stage 240 can rise as shown in Fig. 5 (c).
The ascending amount of exposure object stage 240 is the photosurface A (now for photosensitive region A1) of substrate With pattern plane M of mask plate 210 near to or in contact with the ascending amount of degree.As shown in Fig. 5 (c), when being in The photosensitive region A1 of substrate W and pattern plane M of mask plate 210 near to or in contact with state time, then at this It is exposed under state.Thus, the photosensitive region A1 of substrate W transfers pattern.
Although it addition, the photosurface of substrate W when being exposed and mask plate 210 can also be made Touch between pattern plane M, there is slight void (such as 1/100mm to 4/100mm it is also possible to arrange Left and right) interval of degree.
So, micro-by arranging between pattern plane M of the photosurface of substrate W and mask plate 210 , even if thus there is pettiness in little space (such as about 1/100mm to 4/100mm) in substrate W side remaining Dust, it is also possible to prevent the dust of remaining to be attached to pattern plane M of mask plate 210.
And, after end exposure, starting again at the carrying action of the interval of substrate W, substrate W is only It is handled upside down ormal weight.So, during the carrying action of the interval starting again at substrate W, as shown in Fig. 6 (a), Exposure object stage 240 declines along z-axis from the state of Fig. 5 (c).It addition, exposure object stage 240 only declines During ormal weight, then together with the decline of this exposure object stage 240, carrying mechanism portion 100 entirety the most only declines Ormal weight.It addition, mask cleaning roller 230 now is the position identical with Fig. 5 (b) along the position of x-axis (the 2nd position x2).
Thereafter, mask cleaning roller 230 the most only advances along x-axis from the position shown in Fig. 6 (a) Ormal weight, the planar portions near the front side end 210b of arrival and mask plate 210, i.e. mask plate 210 Near the front side end e2 of pattern plane M relative to position x2 time (with reference to Fig. 6 (b)), expose object stage 240 rise ormal weight, the front side of pattern plane M of mask cleaning roller 230 and mask plate 210 along z-axis Contact near portion e2 (with reference to Fig. 6 (c)).Thereafter, mask cleaning roller 230 is at the pattern with mask plate 210 Advance along x-axis (arrow x ' direction) rearward under the state of face M contact.
Now, mask cleaning roller 230 when the elastic force of spring 257 is had an effect, with Rotate under the state of the pattern plane M contact of mask plate 210 and advance.Thus, it is possible to make mask plate 210 Dust present on pattern plane M is attached to mask cleaning roller 230 side, accordingly, and can be to mask plate 210 Pattern plane M carry out dedusting.
So, mask cleaning roller 230 is at the state backspin contacted with pattern plane M of mask plate 210 Turn and advance rearward, (ginseng near the rear side end e1 of pattern plane M eventually arriving at mask plate 210 According to Fig. 6 (d)).Then, exposure object stage 240 declines (with reference to Fig. 7 (a)) from Fig. 6 (d) state.This Time mask cleaning roller 230 along the position (the upper side summit P1 on circumference is along the position of z-axis) of z-axis be The position z2 identical with Fig. 4 (a).During it addition, exposure object stage 240 only declines ormal weight, then with this exposure Together, carrying mechanism portion 100 entirety the most only declines ormal weight in the decline of light object stage 240.
And, mask cleaning roller 230 advances the most rearward, arrives after mask plate 210 Side side end 210a (the rear side end e1 of pattern plane M) leaves the position of predetermined distance rearward along x-axis Put x1 (the 1st position x1) (with reference to Fig. 7 (b)).
Mask cleaning roller 230 advances to shown in Fig. 7 (b) from the 2nd position x4 shown in Fig. 5 (b) The action of the 1st position x1 carry out within the period that substrate W is handled upside down.Therefore, not to respectively pressing Ormal weight is carried long size flakes substrate W and is exposed the script that such exposure device 10 carried out Exposure actions impacts, and just pattern plane M of mask plate 210 can be carried out dedusting.
So, as shown in Fig. 7 (b), when mask cleaning roller 230 in-position x1 (the 1st position X1), time, exposure object stage 240 only rises ormal weight (with reference to Fig. 7 (c)).This is as Fig. 5 (c) Action.Now, with the rising of exposure object stage 240, carrying mechanism portion 100 entirety the most only rises rule Quantitatively.As shown in Fig. 7 (c), when the photosurface (it is photosensitive region A2) and the mask that are in substrate W Pattern plane M of plate 210 near to or in contact with state time, be exposed the most in this condition.Thus, at base Pattern is transferred on the photosensitive region A2 of plate W.
Now, owing to, also when exposing object stage 240 and only rising ormal weight, mask cleaning roller 230 arrives Reach the rear side end 210a (the rear side end e1 of pattern plane M) from mask plate 210 along x-axis rearward The position x1 (the 1st position x1) of predetermined distance is left in side, and therefore mask cleaning roller 230 will not be with mask plate 210 and mask plate maintaining part 220 abut.It addition, mask cleaning roller 230 is not constituted with not shown other Parts abut.Thus, exposure object stage 240 can rise as shown in Fig. 7 (c).
And, after end exposure, exposure object stage 240 declines from the state of Fig. 7 (c).Now, Also starting again at the carrying action of the interval of substrate W, substrate W is only handled upside down ormal weight.It addition, exposure knot Shu Hou, the exposure object stage 240 state when the state of Fig. 7 (c) declines becomes identical with Fig. 4 (a) State.Following action is again repeated from this state, carries out Fig. 4 (b) to Fig. 4 (d), Fig. 5 the most successively A () returns Fig. 4 (a) to Fig. 5 (c), Fig. 6 (a) to Fig. 6 (d) and Fig. 7 (a) to Fig. 7 (c) Action.
So, in the exposure device 10 involved by embodiment, mask cleaning roller 230 is by the 1st As movable range when moving back and forth between position x1 and the 2nd position x4, in this movable range of an edge Advance while carrying out the action of the pattern plane M dedusting to mask plate 210.And, by mask cleaning roller 230 To the action of front side advance as front forward motion along movable range, and by mask cleaning roller 230 edge When the action advanced rearward in movable range is as rear forward motion, mask cleaning roller 230 exists respectively Front forward motion and rear forward motion carry out the action of the pattern plane M dedusting to mask plate 210.Separately Outward, in front forward motion and rear forward motion, pattern plane M of mask plate 210 is carried out dedusting respectively Action carry out alternately between respectively by the action of ormal weight carrying substrate W.Therefore, it can effectively Be masked dedusting action.
But, from mask cleaning roller 230 relative to mask plate 210 be in along x-axis and z-axis respectively from The state (with reference to Fig. 4 (a)) of the position opened becomes pattern plane M of mask cleaning roller 230 and mask plate 210 During state (with reference to Fig. 4 (c)) contacted, as shown in Fig. 4 (a) to Fig. 4 (c), mask cleaning roller 230 Directly contact with pattern plane M of mask plate 210.
Therefore, do not have mask cleaning roller 230 forwards side and push the rear side of mask plate 210 The situation of portion 210a, is possible to prevent the position of mask plate 210 to offset, and is possible to prevent mask plate 210 The breakages such as the corner in the 210a of rear side end.
Although it addition, the edge in Fig. 4 (c), when mask cleaning roller 230 contacts with pattern plane M The position x2 of x-axis is the rear side end 210a (the rear side end e1 of pattern plane M) with mask plate 210 Consistent position, but need not be the rear side end 210a with mask plate 210 (after pattern plane M Side side end e1) consistent position, it is also possible to it is the plane near the rear side end 210a of mask plate 210 Near the rear side end e1 in portion, i.e. pattern plane M (such as, pattern plane M is actually formed figuratum Pattern forms the rear side end in region).It is essential that push mask plate 210 so long as not forwards side The damaged positions such as rear side end 210a or the corner in making the rear side end 210a of mask plate 210, And it is the pattern in pattern plane M of mask plate 210 can be formed region to carry out the position of dedusting effectively ?.
It addition, when mask cleaning roller 230 advances rearward from the 2nd position x4, also from mask Cleaning roller 230 relative to mask plate 210 be in along x-axis and z-axis respectively away from the state (reference of position Fig. 6 (a)) when becoming state (with reference to Fig. 6 (c)) that mask cleaning roller 230 contacts with mask plate 210, As shown in Fig. 6 (a) to Fig. 6 (c), direct pattern plane M with mask plate 210 of mask cleaning roller 230 connects Touch.
Therefore, do not have mask cleaning roller 230 and push the front side of mask plate 210 rearward The situation of portion 210b, is possible to prevent the position of mask plate 210 to offset, and is possible to prevent mask plate 210 The breakages such as the corner in the 210b of front side end.
Although it addition, the edge in Fig. 6 (c), when mask cleaning roller 230 contacts with pattern plane M The position x3 of x-axis is the front side end 210b (the front side end e2 of pattern plane M) with mask plate 210 Consistent position, but the most also need not to be the front side end 210b with mask plate 210 (pattern plane M Front side end e2) consistent position, it is also possible to it is flat near the front side end 210b of mask plate 210 (such as, pattern plane M is actually formed pattern near the front side end e2 of face, i.e. pattern plane M Pattern formed region front side end).It is essential that so long as not pushing mask plate 210 rearward Damaged position such as front side end 210b or corner in making the front side end 210b of mask plate 210 etc. Put, and be the pattern in pattern plane M of mask plate 210 can be formed region to carry out dedusting effectively Position.
As described above, according to the exposure device 10 involved by embodiment, removed by mask Dirt roller 230 pattern plane M of mask plate 210 is carried out the action of dedusting within the period that substrate W is handled upside down from Move and carry out.It addition, be not only simply masked the removing of pattern plane M of plate 210 by mask cleaning roller 230 Dirt, it is also possible to carried out the dedusting of substrate W by substrate cleaning roller 140.It addition, substrate cleaning roller 140 is right Substrate W carries out the action of dedusting and also automatically carries out within the period that substrate W is handled upside down.Therefore, not right to volume Originally the exposure actions carried out in the exposure device of volume mode impacts, and just can be masked the figure of plate 210 Case face M and the dedusting of substrate W.Thus, it is possible to keep exposure actions speed originally.
It addition, in the exposure device 10 involved by embodiment, mask cleaning roller 230 is in as follows Structure, by the elastic force of spring 257 when giving regulation pushing force figure with mask plate 210 Case face M contacts.Therefore, it can make mask cleaning roller 230 contact with pattern plane M with suitable pushing force, Need not the control etc. of pushing force when contacting accurately.It addition, mask cleaning roller 230 and pattern The interval (along the interval of z-axis) of face M, also without being adjusted accurately, can alleviate mask dedusting The adjustment operation at the interval (along the interval of z-axis) of roller 230 and pattern plane M.Thus, according to embodiment Involved exposure device 10, can simplify the mechanism for pattern plane M of mask plate 210 carries out dedusting Overall.
It addition, the invention is not restricted to above-mentioned embodiment, can be at the model without departing from present subject matter Enclose the various deformation of interior enforcement.For example, it is also possible to implement deformation as follows.
(1) in the above-described embodiment, although ball screw 253L, 253R are arranged on left and right On slide block 252L, 252R of both sides, by making both rotate when synchronizing, so that mask Cleaning roller 230 moves back and forth along x-axis, but ball screw may also be only any one of left and right.Such as, When on the only right side slide block 252R in Fig. 2 (a), ball screw 253R is set, then left slider 252L Advance with right side slide block 252R interlocks and advances along guide rail 251L.As this structure, it is also possible to make Mask cleaning roller 230 moves back and forth along x-axis.
During it addition, driven slide block 252L, 252R of the left and right sides by 1 ball screw, then 1 Individual ball screw can also be arranged on the centre position of left slider 252L and right side slide block 252R along x-axis. Accordingly, slide block 252L, 252R of the left and right sides can be driven well by 1 ball screw balance.
(2) in the above-described embodiment, although mask dust removal unit drive mechanism portion 250 is to use rolling Lunella coronata bar and make the mechanism that mask cleaning roller 230 moves back and forth along x-axis, but make mask cleaning roller along x-axis The mechanism moved back and forth can use mechanism miscellaneous.Although it addition, exposure object stage drive mechanism portion 260 is to use ball screw and the mechanism that makes exposure object stage 240 lift too, but makes exposure object stage 240 can use mechanism miscellaneous along the mechanism of z-axis lifting moving.
(3) in the above-described embodiment, although illustrate that mask cleaning roller 230 is by mask dedusting Roller 230 entirety has the parts that the component of adhesion is constituted, and but be not restricted to that this, it is also possible to be only mask Cleaning roller 230 surface has the parts of adhesion.Such as, both can be at the circle formed by synthetic resin etc. The surface wrap of cylinder has the form of the component of adhesion, alternatively, it is also possible to be the surface shape at cylinder Become to have the form of adhesion layer.Substrate cleaning roller 140 is also the same.
(4) in the above-described embodiment, although the photosurface A exemplified with substrate W configure upward and The exposure device that pattern plane M of mask plate 210 is down configured, but be not restricted to that this, it is also possible to be contrary Configuration.I.e., it is also possible to be that the photosurface A of substrate W is down configured and pattern plane M of mask plate 210 The exposure device configured upward.
(5) in the above-described embodiment, although exemplified with the sense making substrate W in exposure portion 200 During bright finish A exposure, arrange small between the photosurface A and pattern plane M of mask plate 210 of substrate W Situation about being exposed under the state in space, but the most necessarily at photosurface A and the mask plate 210 of substrate W Pattern plane M between small space is set, it is also possible to make photosurface A and the mask plate 210 of substrate W Pattern plane M contiguity state under be exposed.
(6) in the above-described embodiment, although mask dust removal unit respectively front forward motion and after Side's forward motion carries out the action of the pattern plane M dedusting to mask plate 210, but can also be only in front Any one of forward motion and rear forward motion carries out dedusting.
(7) in the above-described embodiment, although exemplified with as mask dust removal unit, use by having The roller (mask cleaning roller 230) that the component of adhesion is constituted, by the adhesion of mask cleaning roller 230 to covering Present on pattern plane M of template 210, dust carries out the situation of dedusting, but is not limited to this.Such as, cover Mould dust removal unit can also be to utilize vacuum attraction to carry out the form of dedusting.So, mask dust removal unit is utilized Exposure device when vacuum attraction carries out dedusting illustrates as the variation of the exposure device of the present invention.
The variation of the exposure device of the present invention is configured to, and mask dust removal unit 230 has along mask plate The suction port in the y-axis direction in pattern plane M of 210, is to utilize pattern plane M attracted mask plate 210 Carrying out the aspiration-type mask dust removal unit of dedusting, pattern plane M of mask plate 210 is entered by aspiration-type mask dust removal unit Play the action of row dedusting is to have void between pattern plane M of mask plate 210 and inhale Gravitation and along mask plate 210 pattern plane M and along the x-axis direction before so that carry out the form of action.
Even if it addition, mask dust removal unit utilizes vacuum attraction to carry out dedusting, the overall structure of exposure device One-tenth can also be the composition identical with the exposure device of explanation in above-mentioned embodiment.It addition, in the description below In, carry out the mask dust removal unit of dedusting as aspiration-type mask dust removal unit using utilizing vacuum attraction.
In the case of this aspiration-type mask dust removal unit is such as applied to the exposure device shown in Fig. 1 Illustrate the most simply.Aspiration-type mask dust removal unit at the width of mask plate 210 (along y in Fig. 1 The direction of axle) on there is elongated suction port.This aspiration-type mask dust removal unit and mask cleaning roller 230 1 Sample, may be mounted on mask cleaning roller supporting part 254L, 254R.Now, aspiration-type mask dust removal unit Suction hole upward, with can be relative with pattern plane M of mask plate 210.
And, when carrying out dedusting, as long as carrying out the action substantially same with Fig. 4 to Fig. 7.But It is, owing to aspiration-type mask dust removal unit and aspiration-type substrate dust removal unit are relative to pattern plane M of mask plate 210 Under non-contacting state, carry out dedusting respectively, therefore need not make aspiration-type mask dust removal unit and mask plate 210 Pattern plane M contact.Thus, if at the initial position shown in Fig. 4 (a), suitably set aspiration-type and cover The suction port of mould dust removal unit and the interval along z-axis of pattern plane M of mask plate 210, as long as then along z-axis Position makes aspiration-type mask cleaning roller move back and forth along x-axis when keeping constant.
Further, since aspiration-type mask dust removal unit connects non-relative to pattern plane M of mask plate 210 Carry out dedusting under the state touched, therefore need not as mask cleaning roller 230 by the elasticity of spring 257 Power and the structure that contacts with pattern plane M of mask plate 210.
By use this aspiration-type mask dust removal unit, it is also possible to as above-mentioned embodiment, Have a rest respectively in period by ormal weight carrying substrate W, pattern plane M of mask plate 210 is carried out dedusting.Separately Outward, substrate dust removal unit 140 can also use aspiration-type substrate dust removal unit equally.
(8) in the above-described embodiment, although as shown in Figure 1, it is shown that mask dust removal unit controls Device 400 and exposure object stage control device 500 and are incorporated in the example within exposure device framework 300, But the outside of exposure device framework 300 can also be arranged on.
(9) in the above-described embodiment, although as it is shown in figure 1, mask plate 210 is along the length of x-axis Degree and mask plate maintaining part 220 are along a length of identical length L1 of x-axis, but need not be identical Length, when in the rising with exposure object stage 240, mask cleaning roller 230 rises, covers as long as not hindering The rising of mould cleaning roller 230, then mask plate maintaining part 220 can also be than mask plate 210 along the length of x-axis Long.

Claims (7)

1. an exposure device, is respectively to be located between delivery section and winder by ormal weight barrow Long size flakes substrate during, the pattern plane making the photosurface of described substrate and mask plate is facing, And make the exposure device that the photosurface of described substrate exposes, it is characterised in that
The described substrate x-axis along the x/y plane that formed by x-axis and y-axis is made towards the side of described winder to be Front side, makes when being rear side with this front side opposite side, then to have:
Exposure object stage, be arranged in clip described substrate and on the position relative with described mask plate, can along with The orthogonal z-axis of x/y plane and the lifting of described substrate one；
Mask dust removal unit, can realize along x-axis move back and forth and can be along z-axis liter together with described exposure object stage Fall, and be arranged on described exposure object stage, with the state left along z-axis from the photosurface of described substrate It is positioned at described mask plate side, to major general from the described rear side end of described mask plate along x-axis the most rearward The 1st position of predetermined distance and described front side end from described mask plate are left along x-axis further along in side The scope between the 2nd position of predetermined distance is left side as movable range during described moving back and forth by side, Advance while carrying out the action of the pattern plane dedusting to described mask plate along this movable range；
Mask dust removal unit drive mechanism portion, be used for making described mask dust removal unit carry out described in move back and forth；
Mask dust removal unit controls device, covers described in controlling by controlling described mask dust removal unit drive mechanism portion Move back and forth described in mould dust removal unit；
Exposure object stage drive mechanism portion, for making described exposure object stage lift along z-axis；
And exposure object stage controls device, control described by controlling described exposure object stage drive mechanism portion The lifting of exposure object stage,
Described mask dust removal unit has the roll of adhesion at least surface,
Described mask dust removal unit the pattern plane of described mask plate is carried out the action of dedusting be with described mask plate Pattern plane contact state under carry out the action that is rotationally advancing,
From described mask dust removal unit relative to described mask plate along x-axis and z-axis respectively away from position make described in cover When mould dust removal unit contacts with the pattern plane of described mask plate,
Described mask dust removal unit controls device and controls described mask dust removal unit drive mechanism portion,
Described mask dust removal unit is made to arrive relative with near the end along x-axis in the pattern plane of described mask plate Position,
Described exposure object stage controls device and controls described exposure object stage drive mechanism portion,
When described mask dust removal unit arrives relative with near the end along x-axis in the pattern plane of described mask plate Position time, make described mask dust removal unit connect near the end along x-axis in the pattern plane of described mask plate Touch,
When making the photosurface exposure of described substrate,
Described mask dust removal unit controls device and controls described mask dust removal unit drive mechanism portion, makes described mask remove Dirt portion is in described 1st position of arrival or the state of described 2nd position,
Described exposure object stage controls device and controls described exposure object stage drive mechanism portion, removes at described mask Under the state that dirt portion arrives described 1st position or described 2nd position, make described exposure object stage be moved along the z-axis and The photosurface making described substrate is in the pattern plane of described mask plate and contacts or close state.
Exposure device the most according to claim 1, it is characterised in that
Described mask dust removal unit carried out covering described within the period respectively carrying described substrate by ormal weight The action of the pattern plane dedusting of template.
Exposure device the most according to claim 1 and 2, it is characterised in that
The action described mask dust removal unit advanced to described front side along described movable range is as before front Precession is made, and the action described mask dust removal unit advanced to described rear side along described movable range is as rear During side's forward motion,
Described mask dust removal unit is carried out institute respectively in described front forward motion and described rear forward motion State the action of the pattern plane dedusting of mask plate,
In described front forward motion and described rear forward motion, the pattern plane of described mask plate is entered respectively The action of row dedusting is carried out within the period respectively carrying described substrate by ormal weight alternately.
Exposure device the most according to claim 1 and 2, it is characterised in that
Described mask dust removal unit is arranged on described exposure object stage, when being in and the pattern plane of described mask plate During the state contacted, acted on the power pushing described pattern plane by the elastic force of spring.
Exposure device the most according to claim 1 and 2, it is characterised in that
Described mask dust removal unit has the suction port in the y-axis direction along the pattern plane of described mask plate, is to pass through Attract and the pattern plane of described mask plate carried out the aspiration-type mask dust removal unit of dedusting,
It is with described that described aspiration-type mask dust removal unit carries out the action of dedusting to the pattern plane of described mask plate Captivation the pattern along described mask plate is played under the state between the pattern plane of mask plate with void Face and the action advanced along the x-axis direction.
Exposure device the most according to claim 1 and 2, it is characterised in that
There is substrate dust removal unit, the most described photosurface of described substrate is carried out dedusting.
Exposure device the most according to claim 6, it is characterised in that
Described substrate dust removal unit has the roll of adhesion at least surface, and it is with at least sense with described substrate The state of bright finish contact and be set, with described substrate when respectively press the ormal weight described substrate of carrying Carrying and rotate.
CN201410425472.1A 2013-08-30 2014-08-26 Exposure device Active CN104423180B (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6811015B2 (en) * 2016-02-02 2021-01-13 株式会社アドテックエンジニアリング Roll-to-roll double-sided exposure device
JP6865609B2 (en) * 2017-03-26 2021-04-28 株式会社アドテックエンジニアリング Exposure device
CN107734867A (en) * 2017-09-06 2018-02-23 江门市泽天达科技有限公司 A kind of exposure mechanism
JP6729954B1 (en) * 2019-10-18 2020-07-29 株式会社 ベアック Exposure equipment
JP6832412B2 (en) * 2019-11-25 2021-02-24 株式会社アドテックエンジニアリング Roll-to-roll double-sided exposure device
JP6762640B1 (en) * 2020-07-06 2020-09-30 株式会社 ベアック Exposure device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0651525A (en) * 1992-07-31 1994-02-25 Fuji Photo Film Co Ltd Dust removing mechanism for original plate
JPH1065310A (en) * 1996-07-08 1998-03-06 Uen Gen Continuous exposure device of circuit pattern for flexible printed wiring board
JP3417313B2 (en) * 1998-09-28 2003-06-16 ウシオ電機株式会社 Exposure equipment for strip-shaped workpieces
JP2001125274A (en) 1999-10-26 2001-05-11 Matsushita Electric Works Ltd Exposure device for manufacturing circuit board
JP3533380B2 (en) * 2000-09-12 2004-05-31 誠一郎 豊田 Dust removal device and method for exposure machine
JP2002182372A (en) * 2000-12-15 2002-06-26 Nikon Corp Projection alignment method and apparatus as well as method of manufacturing device
JP2002344110A (en) * 2001-05-17 2002-11-29 Canon Inc Dust removing mat and method of cleaning printed board manufacturing apparatus
JP2007212765A (en) * 2006-02-09 2007-08-23 Nsk Ltd Manual cleaner and cleaner device of proximity exposure apparatus
JP2008040287A (en) * 2006-08-09 2008-02-21 Adtec Engineeng Co Ltd Exposure apparatus
JP2008216433A (en) * 2007-03-01 2008-09-18 Adtec Engineeng Co Ltd Exposure device
JP2009157247A (en) * 2007-12-27 2009-07-16 Orc Mfg Co Ltd Exposure apparatus
US9376267B2 (en) * 2011-05-02 2016-06-28 Murata Machinery, Ltd. Orientation adjustment device and orientation adjustment method
JP5821397B2 (en) * 2011-08-16 2015-11-24 富士通セミコンダクター株式会社 Dustproof device for extreme ultraviolet exposure mask and exposure method
CN202649668U (en) * 2012-06-19 2013-01-02 京东方科技集团股份有限公司 Automatic mask cleaning system and exposure equipment

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JP5631464B1 (en) 2014-11-26
JP2015049356A (en) 2015-03-16
KR20150026963A (en) 2015-03-11
CN104423180A (en) 2015-03-18

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