JP5631464B1 - Exposure equipment - Google Patents

Abstract

In a roll-to-roll exposure apparatus, dust removal on a mask plate pattern surface can be performed automatically and without affecting the exposure operation. To. An exposure stage having an exposure table for holding a substrate, and capable of moving up and down along with the substrate along the z-axis, and a predetermined distance apart from the rear end of the mask plate along the x-axis. As a movable range when reciprocating between the first position (rear side) and the second position (front side) spaced apart from the front end of the mask plate 210 along the x axis by a predetermined distance, A mask dust removing unit 230 that performs an operation of removing dust on the pattern surface M of the mask plate 210 while proceeding within the movable range, a mask dust removing unit control device 400 that controls the reciprocating motion of the mask dust removing unit 230, and raising and lowering the exposure stage 240 And an exposure stage control device 500 for controlling. [Selection] Figure 1

Description

  The present invention relates to an exposure apparatus that transfers a pattern onto a substrate by exposing the photosensitive surface of the substrate with the photosensitive surface of the substrate facing the pattern surface of the mask plate.

  Various exposure apparatuses that transfer a pattern onto a substrate by exposing the photosensitive surface of the substrate by exposing the photosensitive surface of the substrate and the pattern surface of the mask plate are conventionally known. In this type of exposure apparatus, it is important not only to remove the photosensitive surface of the substrate, but also to remove the surface of the mask plate facing the substrate (referred to as the pattern surface of the mask plate). This is because if there is dust on the pattern surface of the mask plate, the dust is transferred along with the pattern formed on the mask when exposed, and the substrate becomes defective. Because it does.

  By the way, in such an exposure apparatus, there is an exposure apparatus for exposing a long sheet-shaped substrate as an exposure object as well as an exposure apparatus for exposing a substrate in which each sheet is a short sheet.

  An exposure apparatus that targets a long sheet-shaped substrate as an exposure target is a process of intermittently transporting a long sheet-shaped substrate that is stretched between a feeding unit and a winding unit by a predetermined amount, The photosensitive surface of the substrate is exposed by making the photosensitive surface of the substrate and the pattern surface of the mask plate face each other, and is conventionally known as a so-called roll-to-roll exposure apparatus ( For example, see Patent Document 1.)

  FIG. 8 is a view shown for explaining the exposure apparatus 900 described in Patent Document 1. In FIG. As shown in FIG. 8, an exposure apparatus 900 disclosed in Patent Document 1 includes an exposure unit 940 between a delivery unit 920 that feeds a long sheet-like substrate 910 and a take-up unit 930 that winds up an exposed substrate. In the process of transporting the substrate 910, a “roll-to-roll exposure apparatus” that exposes the photosensitive surface of the substrate 910 with the photosensitive surface of the substrate 910 facing the pattern surface of the mask plate 950. It is.

  In the exposure apparatus 900 described in Patent Document 1, since both surfaces of the substrate 910 are photosensitive surfaces, and both surfaces of the substrate 910 can be exposed simultaneously, the mask plate 950 sandwiches the substrate 910. Are provided on the top and bottom respectively. In the following description, the upper mask plate 950 is described as the upper mask plate 951, and the lower mask plate 950 is described as the lower mask plate 952.

  Even in such a roll-to-roll type exposure apparatus, it is important to remove dust from each pattern surface of the mask plate 950 (the upper mask plate 951 and the lower mask plate 952). In the exposure apparatus 900 described in Patent Document 1, dust removal of each pattern surface on the upper mask plate 951 and the lower mask plate 952 is performed as follows.

  In the exposure apparatus 900 described in Patent Document 1, when dust removal is performed on the upper mask plate 951, the substrate 910 is moved to the z axis by the height adjusting roller 960 that can move the substrate 910 up and down along the z axis. The substrate 910 is separated from the lower mask plate 952 by being raised along, and the upper mask plate 951 is separated from the substrate 910 by raising the upper mask plate 951 along the z axis. The pattern surface of the mask plate 951 is removed.

  On the other hand, when dust is removed from the lower mask 952, the upper mask plate 951 is raised along the z axis so that a wide space is formed between the lower mask plate 952 and the height. The lower mask plate 952 is dedusted with the adjustment roller 960 separating the substrate 910 from the lower mask plate 952.

JP 2001-125274 A

  As described above, when dust is removed from each pattern surface of the mask plate 950 (the upper mask plate 951 and the lower mask plate 952) in the exposure apparatus 900 described in Patent Document 1, the pattern surface and the lower surface of the upper mask plate are removed. In order to facilitate the dust removal of the pattern surface of the side mask plate, after performing an operation of moving the substrate and the upper mask plate so as to leave a space between each pattern surface and the substrate, the pattern surface of the upper mask plate and Dust removal is performed on the pattern surface of the lower mask plate. In addition, in the exposure apparatus 900 described in Patent Document 1, since a dust removing device for removing dust on the pattern surface of the mask plate is not particularly provided, dust removal on the pattern surface of the mask plate is performed manually by an operator. It is considered a thing. For this reason, much trouble is required when performing dust removal on the pattern surface of the mask plate.

  Moreover, in the exposure apparatus 900 described in Patent Document 1, it is necessary to stop the exposure operation when performing dust removal on the pattern surface of the mask plate. For this reason, in a roll-to-roll exposure apparatus that should be capable of high-speed and efficient exposure, the speed and efficiency are greatly impaired due to dust removal from the mask. In particular, when a higher quality exposure is to be performed, the dust removal of the mask is required to be performed frequently. Therefore, it is necessary to perform the above-described process each time the mask dust is removed. Speeding up and efficiency are greatly impaired.

  In this specification, “exposure operation” means “in the process of intermittently transporting a long sheet-like substrate by a predetermined amount, the photosensitive surface of the substrate and the pattern surface of the mask plate face each other”. The operation of exposing the photosensitive surface of the substrate.

  The present invention has been made in view of the above circumstances, and in a roll-to-roll exposure apparatus, the pattern surface of the mask plate can be automatically removed, and the roll-to-roll method. It is an object of the present invention to provide an exposure apparatus capable of removing dust from the pattern surface of a mask plate without affecting the exposure operation performed by the exposure apparatus.

  [1] The exposure apparatus of the present invention is a process in which a long sheet-like substrate stretched between a sending-out portion and a winding-up portion is intermittently conveyed by a predetermined amount, and the photosensitive surface of the substrate is exposed. An exposure apparatus that exposes the photosensitive surface of the substrate by facing the pattern surface of the mask plate and the winding portion along the x axis in an xy plane formed by the x axis and the y axis of the substrate When the front side is the front side and the side opposite to the front side is the rear side, the substrate is disposed at a position facing the mask plate across the substrate and along the z axis perpendicular to the xy plane. And an exposure stage that can be moved up and down along with the exposure stage, can be moved up and down along the z axis together with the exposure stage, and is spaced from the photosensitive surface of the substrate along the z axis. Front to be on the mask plate side A first position provided at an exposure stage, and at least a predetermined distance apart from the rear end portion of the mask plate along the x axis and further to the rear side; and from the front end portion of the mask plate to the x axis. A range between the second position and a second position that is further spaced apart by a predetermined distance along the front is used as a movable range when the reciprocating operation is performed, and the pattern surface of the mask plate is dedusted while proceeding within the movable range. A mask dust remover, a mask dust remover drive mechanism for reciprocating the mask dust remover, and a mask dust remover for controlling the reciprocation of the mask dust remover by controlling the mask dust remover drive mechanism A control device, an exposure stage drive mechanism for enabling the exposure stage to move up and down along the z-axis, and the exposure stage drive mechanism by controlling the exposure stage drive mechanism. An exposure stage control device for controlling the mask, and when the photosensitive surface of the substrate is exposed, the mask dust removal unit control device is configured such that the mask dust removal unit reaches the first position or the second position. The mask dust removing unit drive mechanism is controlled so that the mask is removed, and the exposure stage control unit moves the exposure stage to z while the mask dust removing unit has reached the first position or the second position. The exposure stage drive mechanism is controlled so that the photosensitive surface of the substrate and the pattern surface of the mask plate are brought into contact or close to each other along the axis.

  In the exposure apparatus of the present invention, the mask dust removing unit advances in the movable range with a range wider than the mask plate in the direction along the x-axis (a range between the first position and the second position) as the movable range. In this way, the pattern surface of the mask plate is removed. When the photosensitive surface of the substrate is exposed, the exposure stage is moved along the z-axis while the mask dust removing unit has reached the first position or the second position, so that the photosensitive surface of the substrate and the mask plate are exposed. The exposure is performed so as to be in contact with or close to the pattern surface. Thus, according to the exposure apparatus of the present invention, even in a roll-to-roll exposure apparatus, the pattern surface of the mask plate can be automatically removed, and the roll-to-roll The dust removal of the pattern surface of the mask plate can be performed without affecting the exposure operation performed by the exposure apparatus of the type.

  [2] In the exposure apparatus of the present invention, it is preferable that the mask dust removing unit performs an operation of removing dust from the pattern surface of the mask plate while the substrate is being conveyed intermittently by a predetermined amount.

  In this way, the dust removal of the pattern surface of the mask plate is performed while the substrate is being transported, so that the original exposure operation performed by the roll-to-roll exposure apparatus is not affected, and the mask plate The pattern surface can be dedusted. Thereby, the exposure operation speed originally possessed by the roll-to-roll type exposure apparatus can be maintained.

  [3] In the exposure apparatus of the present invention, an operation in which the mask dust removing portion advances forward in the movable range is referred to as a forward advance operation, and the mask dust removing portion advances forward in the movable range. When the operation is a backward traveling operation, the mask dust removing unit performs an operation of removing dust on the pattern surface of the mask plate in each of the forward traveling operation and the backward traveling operation, and in each of the forward traveling operation and the backward traveling operation. The operation of removing dust from the pattern surface of the mask plate is preferably performed alternately while the substrate is being conveyed intermittently by a predetermined amount.

  As described above, the mask dust removing unit performs an operation of removing dust from the pattern surface of the mask plate in each of the forward traveling operation and the backward traveling operation when performing the forward traveling operation and the backward traveling operation of the movable range of the mask dust removing unit. In addition, the operation of removing dust from the pattern surface of the mask plate in each of the forward traveling operation and the backward traveling operation is alternately performed during the operation in which the substrate is intermittently conveyed by a predetermined amount. For this reason, the substrate transfer operation and the dust removal operation of the mask dust removal unit can be efficiently performed without waste. In addition, when performing the exposure operation intermittently, the pattern surface of the mask plate is always removed between the exposure operation and the exposure operation. Can be exposed.

[4] In the exposure apparatus of the present invention, the mask dust removing portion is formed in a roll shape having an adhesive force on at least the surface, and the operation of the mask dust removing portion removing dust from the pattern surface of the mask plate It is preferable to rotate the plate while contacting the pattern surface of the plate.
Thereby, the pattern surface of a mask board can be efficiently and reliably dust-removed.

  [5] In the exposure apparatus of the present invention, when the mask dust removing unit comes into contact with the pattern surface of the mask plate, the exposure stage is configured so that a force that presses the pattern surface is exerted by an extension force of a spring. It is preferable to be provided.

  For this reason, the mask dust removing portion can be brought into contact with the pattern surface with an appropriate pressing force, and it is not necessary to control the pressing force at the time of contacting with high accuracy. In addition, it is not necessary to adjust the distance between the mask dust removal portion and the pattern surface (interval along the z-axis) with high accuracy, and adjustment work for the interval between the mask dust removal portion and the pattern surface (interval along the z-axis) Can be reduced.

  [6] In the exposure apparatus of the present invention, the mask dust removing unit is brought into contact with the pattern surface of the mask plate from a position where the mask dust removing unit is separated from the mask plate along the x axis and the z axis. In this case, the mask dust removing unit control device controls the mask dust removing unit drive mechanism so that the mask dust removing unit reaches a position facing the vicinity of the end portion along the x axis on the pattern surface of the mask plate. The exposure stage control unit moves the mask dust removal unit to the x axis on the pattern surface of the mask plate when the mask dust removal unit reaches a position facing the vicinity of the end portion along the x axis on the pattern surface of the mask plate. It is preferable that the exposure stage drive mechanism is controlled so as to be in contact with the vicinity of the end along the line.

  In this way, the mask dust removal control device and the exposure stage control device allow the mask dust removal unit to move the mask dust removal unit to the mask plate when the mask dust removal unit reaches a position facing the vicinity of the end portion along the x axis on the pattern surface of the mask plate. The mask dust removing unit driving mechanism and the exposure stage driving mechanism are controlled so as to be in contact with the vicinity of the end along the x-axis on the pattern surface. For this reason, when a mask dust removal part advances along an x-axis, the operation | movement that a mask dust removal part pushes the edge part of a mask board in the advancing direction of the mask dust removal part along an x-axis does not arise. Thereby, the position shift of the mask plate can be prevented, and the corners and the like at the end of the mask plate can be prevented from being damaged.

[7] In the exposure apparatus of the present invention, the mask dust removing unit has a suction port along the y-axis direction on the pattern surface of the mask plate, and is a suction type that dusts the pattern surface of the mask plate by suction. The operation of removing dust from the pattern surface of the mask plate by the suction-type mask dust removal portion exhibits a suction force with a predetermined gap between the mask plate and the pattern surface of the mask plate. However, it is preferable that the operation proceeds along the x-axis direction along the pattern surface of the mask plate.
The same effects as those obtained by the above inventions [1] to [3] can also be obtained by using the dust removing part of the suction type mask as the mask dust removing part.

[8] In the exposure apparatus of the present invention, it is preferable to have a substrate dust removing unit that dusts at least the photosensitive surface of the substrate.
Thereby, not only the dust removal of the pattern surface of the mask plate but also the dust removal of at least the photosensitive surface of the substrate can be performed.

  [9] In the exposure apparatus of the present invention, the substrate dust removing unit is formed in a roll shape having an adhesive force on at least the surface, and is provided in contact with at least the photosensitive surface of the substrate. It is preferable that the substrate is rotated as the substrate is conveyed by a predetermined amount.

  Thereby, the pattern surface of a mask board can be efficiently and reliably dust-removed. In addition, since at least the photosensitive surface of the substrate is removed while the substrate is being transported, at least the photosensitive surface of the substrate can be obtained without affecting the original exposure operation performed by the roll-to-roll type exposure apparatus. Can be dedusted. Thereby, the exposure operation speed originally possessed by the roll-to-roll type exposure apparatus can be maintained. In addition, it is good also as a structure which pinches | interposes a board | substrate with two rolls which have a dust removal function, By carrying out such a structure, both surfaces of a board | substrate can be removed simultaneously.

1 is an overall configuration diagram illustrating an exposure apparatus 10 according to an embodiment. It is a figure shown in order to demonstrate the structure of the exposure part 200 in the exposure apparatus 10 which concerns on embodiment. It is a figure which shows the structure of the mask dust removal part control apparatus 400 and the exposure stage control apparatus 500 in the exposure apparatus 10 which concerns on embodiment. It is a figure shown in order to demonstrate operation | movement of the exposure apparatus 10 which concerns on embodiment. It is a figure shown in order to demonstrate operation | movement of the exposure apparatus 10 which concerns on embodiment. It is a figure shown in order to demonstrate operation | movement of the exposure apparatus 10 which concerns on embodiment. It is a figure shown in order to demonstrate operation | movement of the exposure apparatus 10 which concerns on embodiment. It is a figure shown in order to demonstrate the exposure apparatus 900 described in patent document 1. FIG.

  Hereinafter, embodiments of the present invention will be described.

[Embodiment 1]
FIG. 1 is an overall configuration diagram for explaining an exposure apparatus 10 according to the embodiment. FIG. 1 schematically shows the exposure apparatus 10 according to the first embodiment, and illustration of components that are not particularly necessary for describing the exposure apparatus 10 according to the embodiment is omitted. Further, since FIG. 1 is a schematic diagram, the dimensions of the actual components are not reduced at the same ratio, and the components are exaggerated or drawn more reduced. doing.

  As shown in FIG. 1, the exposure apparatus 10 according to the embodiment transports a long sheet-like substrate W intermittently by a predetermined amount along the x-axis in the xy plane formed by the x-axis and the y-axis. A mechanism unit 100; an exposure unit 200 that exposes the photosensitive surface A of the substrate W that is intermittently transported by a predetermined amount by the transport mechanism unit 100; and an exposure apparatus housing that houses the transport mechanism unit 100 and the exposure unit 200. A body 300, a mask dust removing unit control device 400 that controls a mask dust removing unit 230 (described later) in the exposure unit 200, and an exposure stage control device 500 that controls an exposure stage 240 (described later) in the exposure unit 200. Have. In addition to these components, the exposure apparatus 10 according to the embodiment is provided with a static elimination unit that neutralizes static electricity charged on the mask plate 210 and the substrate W, although not shown.

  The transport mechanism unit 100 includes a delivery unit 110 that sends out a long sheet-like substrate W, a take-up unit 120 that winds up the exposed substrate W exposed by the exposure unit 200, and the substrate W intermittently along the x-axis. An intermittent feed mechanism unit 130 that transports a predetermined amount each time, a substrate dust removal unit 140 that is disposed closer to the delivery unit 110 than the exposure unit 200 and removes the photosensitive surface A of the substrate W, and a feed roller provided on the transport path 151, 152. In addition, since the delivery part 110 and the winding-up part 120 have each formed the roll shape, they are called the delivery roller 110 and the take-up roller 120 hereafter.

  As described above, the exposure apparatus 10 according to the embodiment exposes the photosensitive surface A of the substrate W by the exposure unit 200 in the process of intermittently transporting the substrate W wound around the delivery roller 110 by a predetermined amount. Then, the exposure apparatus is a “Roll to Roll” type exposure apparatus in which the exposed substrate W is taken up by a take-up roller. In this specification, the side on which the substrate W is transported to the winding unit 120 along the x axis is referred to as a front side, and the side opposite to the front side is referred to as a rear side.

  The intermittent feeding mechanism unit 130 in the transport mechanism unit 100 opens the fixed clamper 131, clamps the substrate W by the feeding clamper 132 and feeds it by a predetermined amount. The substrate W is clamped, and then the fixed clamper 131 is opened again, and the substrate W is clamped by the feed clamper 132 and conveyed by a predetermined amount. After the predetermined amount is conveyed, the substrate W is moved by the fixed clamper. The operation of clamping is repeated sequentially. Thereby, the substrate W can be intermittently sent by a predetermined amount. Note that the configuration of the intermittent feed mechanism unit 130 is not limited to the above configuration, and various configurations of the intermittent feed mechanism unit can be employed.

  The substrate dust removing unit 140 removes the substrate W sent from the delivery roller 110 and has a roll shape having adhesive strength on the surface. The exposure apparatus 10 according to the embodiment has adhesive strength. A member in which a member (for example, rubber having adhesive force) is formed in a roll shape is used.

  Thus, since the substrate dust removing unit 140 has a roll shape, the substrate dust removing unit 140 is also referred to as a “substrate dust removing roller 140”. The substrate dust removing roller 140 has an adhesive force, but the adhesive force is such that dust existing on the photosensitive surface A of the substrate W can be attached and removed, which adversely affects the photosensitive surface A of the substrate W. It is assumed that the adhesive strength does not affect the surface. The photosensitive surface A of the substrate W is a surface on which a photoresist or the like is applied to the substrate W, and the photoresist is already in a dry state.

  The substrate dust removing roller 140 is composed of two rollers 141 and 142 so as to sandwich the substrate W. In consideration of the dust removal on the photosensitive surface A of the substrate W, only the roller 141 on the photosensitive surface side may have the substrate dust removal function. Therefore, not only the photosensitive surface A of the substrate W but also the dust on the surface opposite to the photosensitive surface A can be removed. For this reason, it is preferable that the roller 142 located on the surface opposite to the photosensitive surface A of the substrate W also has a substrate dust removing function.

  FIG. 2 is a view shown for explaining the configuration of the exposure unit 200 in the exposure apparatus 10 according to the embodiment. 2A is a side view when the exposure unit 200 in FIG. 1 is viewed from the delivery roller 110 side along the x-axis, and FIG. 2B is a view taken along the line aa in FIG. It is a top view. The exposure unit 200 will be described with reference to FIG.

The exposure unit 200 includes a light source (not shown), a mask plate 210 made of a transparent member such as transparent glass and having a predetermined thickness, and a mask plate holding unit 220 that holds the mask plate 210 with the pattern surface M facing downward. A mask dust removing unit 230 that performs an operation of removing dust from the pattern surface M, and an exposure stage 240 that is disposed at a position facing the mask plate 210 across the substrate W and can be moved up and down along the z axis orthogonal to the xy plane. And a mask dust removing unit driving mechanism 250 for reciprocating the mask dust removing unit 230 along the x axis, and an exposure stage driving mechanism 260 for moving the exposure stage 240 up and down along the z axis. .
In the exposure apparatus 10 according to the first embodiment, the length along the x-axis of the mask plate 210 and the length along the x-axis of the mask plate holding unit 220 are the same length L1 (see FIG. 1). And In addition, the mask plate holding unit 220 has a predetermined thickness along the z-axis.

  The mask dust removing unit 230 has a roll shape having an adhesive force on the surface. In the exposure apparatus 10 according to the embodiment, a member having adhesive force (for example, rubber having adhesive force) formed in a roll shape is used.

  Thus, since the mask dust removal part 230 is carrying out the roll shape, the mask dust removal part 230 is also called "mask dust removal roller 230." The mask dust removing roller 230 has adhesive force, but the adhesive force is such that dust existing on the pattern surface M of the mask plate 210 can be attached and removed, and the pattern surface M of the mask plate 210 is removed. It is assumed that the adhesive strength does not adversely affect

  The exposure stage 240 has an exposure table 241. The exposure table 241 is disposed so as to face the pattern surface M of the mask plate 210 via the substrate W, and serves to hold the substrate W from below.

  Further, shelf parts 242L and 242R projecting in the direction along the y-axis are formed on the left and right sides along the x-axis on the exposure stage 240. The shelves 242L and 242R are provided with a mask dust removal unit drive mechanism 250 for reciprocating the mask dust removal roller 230 along the x-axis.

  The mask dust removing unit drive mechanism unit 250 includes the shelf 242L. Guide rails 251L and 251R respectively laid on 242R, sliders 252L and 252R that can slide on the guide rails 251L and 251R, and ball screws 253L and 253R for reciprocating the sliders 252L and 252R along the x-axis And a motor for rotationally driving the mask dust removal roller support portions 254L and 254R, which are fixed to the sliders 252L and 252R and rotatably support the rotation shaft 231 of the mask dust removal roller 230 on both right and left sides, and the ball screws 253L and 253R (see FIG. Not shown.) A servo motor can be used as the motor.

  Since the mask dust removing unit drive mechanism 250 has such a structure, the ball screws 253L and 253R rotate clockwise or counterclockwise in synchronization with each other, so that the sliders 252L and 252R move to the x axis. And the mask dust removing roller 230 is also reciprocated along the x-axis. The mask dust removing roller 230 has a movable range (described later) within the predetermined range between the one end 240a and the other end 240b along the x axis of the exposure stage 240 by the mask dust removing unit driving mechanism 250. And reciprocating within the movable range.

  For example, when the ball screws 253L and 253R rotate counterclockwise (counterclockwise when the front side is viewed), the sliders 252L and 252R advance forward along the x-axis, and thereby the mask The dust removing roller 230 also moves forward along the x axis.

Further, when the ball screws 253L and 253R rotate in the clockwise direction (clockwise when viewed from the front side), the sliders 252L and 252R advance toward the rear side along the x-axis, thereby the mask dust removing roller. 230 also travels backward along the x-axis.
The mask dust removing unit drive mechanism 250 configured as described above is controlled by the mask dust removing unit control device 400, and thereby the mask dust removing roller 230 is controlled.

  Incidentally, U-shaped bearing grooves 255 (see FIG. 1) for rotatably supporting the mask dust removing roller 230 are formed in the mask dust removing roller support portions 254L and 254R, respectively. The bearing groove 255 has an opening on the upper end side, and the mask dust removing roller 230 is rotatably supported by the bearing groove 255 by dropping the rotating shaft 231 from the opening of the bearing groove 255.

  Because of this structure, the mask dust removal roller 230 can be easily attached to and detached from the mask dust removal roller support portions 254L and 254R, and maintenance such as cleaning and replacement of the mask dust removal roller 230 can be easily performed. Note that the mask dust removing roller 230 is not rotated by power, but is supported by the mask dust removing roller support portions 254L and 254R so as to rotate idly.

  The mask dust removal roller support portions 254L and 254R are supported on the sliders 252L and 252R by guide pins 256 and springs 257, and the mask dust removal roller support portions 254L and 254R are pressed downward along the z axis. When applied, a drag force due to the extension force of the spring 257 acts on the pressing force. For this reason, when the mask dust removing roller 230 supported by the mask dust removing roller support portions 254L and 254R is brought into contact with the pattern surface M of the mask plate 210, the mask dust removing roller 230 has a predetermined pressing force by the extension force of the spring 257. It comes into contact with the pattern surface M of the mask plate 210.

  On the other hand, the exposure stage 240 can be moved up and down along the z-axis by the exposure stage drive mechanism 260. The exposure stage drive mechanism 260 is a lift 261 fixed to the exposure stage 240, an exposure stage ball screw 263 for raising and lowering the lift 261 along the z-axis, and a rotational drive for the ball screw 263. And a motor (not shown). A servo motor can be used as the motor.

  The exposure stage drive mechanism 260 configured in this way can move the exposure stage 240 up and down along the z-axis by rotating the ball screw 263 clockwise or counterclockwise. When the exposure stage 240 is moved up and down by the exposure stage drive mechanism 260, not only the exposure stage 240 but also the entire transport mechanism 100 is moved up and down.

  Thus, for example, when the ball screw 263 is rotated counterclockwise (counterclockwise when viewed upward along the z axis), the exposure stage 240 is raised along the z axis, and the transport mechanism unit 100 is also moved. It rises with the exposure stage 240. Note that “the transport mechanism unit 100 also rises with the exposure stage 240” means that the feed roller 110, the take-up roller 120, the intermittent feed mechanism unit 130, the substrate dust removal roller 140, and the substrate W rise with the exposure stage 240. It is.

On the other hand, when the ball screw 263 is rotated clockwise (clockwise when viewed upward along the z axis), the exposure stage 240 is lowered along the z axis and the transport mechanism unit 100 is also lowered along with the exposure stage 240. Note that “the transport mechanism unit 100 is also lowered with the exposure stage 240” means that the delivery roller 110, the take-up roller 120, the intermittent feed mechanism unit 130, the substrate dust removing roller 140, and the substrate W are lowered with the exposure stage 240. It is.
The exposure stage drive mechanism 260 configured in this way is driven and controlled by the exposure stage control device 500.

  In addition, since the ball screws 253L and 253R provided in the mask dust removing unit driving mechanism unit 250 are ball screws for driving the mask dust removing unit 230 (mask dust removing roller 230), they are referred to as mask dust removing unit ball screws 253L and 253R. There is also. Further, since the ball screw 263 provided in the exposure stage driving mechanism 260 is a ball screw for driving the exposure stage 240, it may be referred to as an exposure stage ball screw 263.

  FIG. 3 is a view showing a configuration of the mask dust removing unit control device 400 and the exposure stage control device 500 in the exposure apparatus 10 according to the embodiment. FIG. 3A shows the configuration of the mask dust removing unit control device 400, and FIG. 3B shows the configuration of the exposure stage control device 500.

  As shown in FIG. 3A, the mask dust removing unit control device 400 includes a mask dust removing unit ball screw driving unit (servo motor or the like) 410 that drives the mask dust removing unit ball screws 253L and 253R, and a mask dust removing roller 230, respectively. A mask dust removal roller by controlling a ball screw driving unit 410 for a mask dust removal unit based on the storage contents of the storage unit 420 and the storage content of the storage unit 420, and a control program for controlling the progress and user setting information And a progress control unit 430 that controls the progress of 230 toward the front side or the rear side.

  As shown in FIG. 3B, the exposure stage control device 500 controls the exposure stage ball screw drive unit (servo motor, etc.) 510 for driving the exposure stage ball screw 263, and control for raising and lowering the exposure stage 240. A storage unit 520 that stores a program, user setting information, and the like, and an elevation stage that controls the rising or lowering of the exposure stage 240 by controlling the exposure stage ball screw driving unit 510 based on the storage contents of the storage unit 520 And a control unit 530.

  In FIG. 3, the storage unit (storage unit 420 and storage unit 520) is provided in each of the mask dust removing unit control device 400 and the exposure stage control device 500, but one storage unit may be shared. Good.

  4-7 is a figure shown in order to demonstrate operation | movement of the exposure apparatus 10 which concerns on embodiment. 4A to FIG. 4D, FIG. 5A to FIG. 5C, FIG. 6A to FIG. 6D, and FIG. 7A to FIG. FIG. 4 to 7 are diagrams mainly illustrating the operation of the mask dust removing roller 230 in the exposure unit 200. FIG. For this reason, among the components shown in FIG. 1, the transport mechanism 100 is not shown, and the exposure stage drive mechanism 260 and the like are also omitted in the exposure unit 200. In addition, in the exposure unit 200, there are also symbols omitted from the symbols given in FIGS.

  4-7, the control for advancing the mask dust removal roller 230 is performed by the mask dust removal unit controller 400 shown in FIG. 3A, and the control for moving the exposure stage 240 up and down is as follows. This is performed by the exposure stage controller 500 shown in FIG.

  In the exposure apparatus 10 according to the embodiment, the substrate W is intermittently transported by a predetermined amount by the transport mechanism unit 100, and a plurality of targets to be exposed on the photosensitive surface A of the substrate W are transported once. A photosensitive area (for example, photosensitive area A1) of the photosensitive area (this is represented by A1, A2,...) Is a pattern surface M of the mask plate 210 on the exposure table 241. It becomes a facing position. Then, the conveyance of the substrate W is temporarily stopped at the position where the photosensitive area A1 faces the pattern surface M of the mask plate 210, and the pattern is transferred to the photosensitive area A1 by performing exposure in this state.

  When the exposure of the photosensitive area A1 is completed, the substrate W is transported again by a predetermined amount, and the next photosensitive area (for example, the photosensitive area A2) on the photosensitive surface A of the substrate W is masked on the exposure table 241. This is the position facing the pattern surface M of the plate 210. Then, the conveyance of the substrate W is temporarily stopped at a position where the photosensitive area A2 faces the pattern surface M of the mask plate 210. By performing exposure in this state, the pattern is transferred to the photosensitive area A2. Such an operation is repeated.

  In the process of performing such an operation, the substrate W is dedusted by the substrate dedusting roller 140, and the pattern surface M of the mask plate 210 is dedusted by the mask dedusting roller 230. The dust removal of the substrate W by the substrate dust removal roller 140 and the dust removal of the pattern surface M of the mask plate 210 by the mask dust removal roller 230 are performed while the substrate W is being transported. Note that dust removal operation by the mask dust removal roller 230 will be described here because dust removal of the substrate W by the substrate dust removal roller 140 can be performed by rotating the substrate dust removal roller 140 each time the substrate W is transported.

  FIG. 4A shows a state before the mask dust removing roller 230 starts the dust removing operation, and the position of the mask dust removing roller 230 in such a state is referred to as an initial position. At this time, it is assumed that the substrate W has already started the transfer operation.

  When the mask dust removing roller 230 is in the initial position shown in FIG. 4A, the position along the x axis of the mask dust removing roller 230 (the position along the x axis of the rotating shaft 231) x1 is the mask plate 210. This is a position (also referred to as a first position x1) that is separated from the rear end (referred to as a rear end) 210a by a predetermined distance further along the x-axis.

The position along the z-axis of the mask dust removal roller 230 (the position along the z-axis of the upper vertex P1 on the circumference of the mask dust removal roller 230) z2 is more than the position z1 of the pattern surface M of the mask plate 210. It is assumed that the position is a predetermined distance apart downward.
When the mask dust removal roller 230 is in such an initial position, the mask dust removal roller 230 is not in contact with the pattern surface M of the mask plate 210.

  From the state in which the mask dust removing roller 230 is in the initial position shown in FIG. 4A, it advances by a predetermined amount along the x axis to the front side, and is a plane portion in the vicinity of the rear side end portion 210a of the mask plate 210, that is, a pattern. When the position x2 facing the vicinity of the rear end e1 in the surface M is reached (see FIG. 4B), the exposure stage 240 is raised by a predetermined amount along the z axis, and the mask dust removing roller 230 is moved to the mask plate 210. It contacts the vicinity of the rear end e1 on the pattern surface M (see FIG. 4C). Thereafter, the mask dust removal roller 230 advances forward (in the direction of the arrow x) along the x-axis while being in contact with the pattern surface M of the mask plate 210.

  At this time, the mask dust removing roller 230 advances while rotating while being in contact with the pattern surface M of the mask plate 210 as shown in FIG. Thereby, the dust which exists in the pattern surface M of the mask board 210 can be made to adhere to the mask dust removal roller 230 side, and, thereby, the pattern surface M of the mask board 210 can be removed.

  Thus, in a state where the mask dust removal roller 230 is in contact with the pattern surface M of the mask plate 210, the mask dust removal roller 230 is in a state of pressing the pattern surface M of the mask plate 210 with the extension force of the spring 257. Yes. For this reason, it is not necessary to control the pressing force or the like on the mask plate 210 when the mask dust removing roller 230 contacts the pattern surface M of the mask plate 210.

  Although the mask dust removing roller 230 has adhesive force, the adhesive force is such that the dust existing on the pattern surface M of the mask plate 210 is attached and removed, so that the pattern surface M of the mask plate 210 is removed. It does not adversely affect the pattern that is formed.

  In this way, the mask dust removing roller 230 advances forward while rotating in contact with the pattern surface M of the mask plate 210, and the front end of the mask plate 210 (referred to as the front end). When reaching 210b, that is, near the front end e2 in the pattern surface M of the mask plate 210 (see FIG. 4D), the exposure stage 240 descends from the state of FIG. 4D along the z-axis. (See FIG. 5 (a)). The position along the z-axis of the mask dust removing roller 230 at this time (the position along the z-axis of the upper apex P1 on the circumference) is the same position z2 as in FIG. When the exposure stage 240 is lowered by a predetermined amount, the entire transport mechanism unit 100 is also lowered by a predetermined amount as the exposure stage 240 is lowered.

  Then, the mask dust removing roller 230 further advances forward, and a position x4 (first position) spaced from the front end 210b (front end e2 of the pattern surface M) of the mask plate 210 to the front side along the x axis by a predetermined distance. 2 (also referred to as 2 position x4) (see FIG. 5B).

  The operation until the mask dust removing roller 230 moves along the x axis from the first position x1 shown in FIG. 4A to the second position x4 shown in FIG. 5B is performed while the substrate W is being transported. Done. For this reason, the pattern surface M of the mask plate 210 is not affected without affecting the original exposure operation performed by the exposure apparatus 10 in which the long sheet-like substrate W is exposed by carrying a predetermined amount intermittently by a predetermined amount. Can be dedusted. Note that dust removal of the substrate W by the substrate dust removal roller 140 can also be performed while the substrate W is being transported, so that no time loss is caused by dust removal of the substrate W and the pattern surface M of the mask plate 210.

  Thus, when the mask dust removing roller 230 reaches the position x4 (second position x4) shown in FIG. 5B, the exposure stage 240 is raised by a predetermined amount (see FIG. 5C). When the exposure stage 240 rises by a predetermined amount, the entire transport mechanism unit 100 also rises by a predetermined amount as the exposure stage 240 rises.

  When the exposure stage 240 is raised by a predetermined amount, the mask dust removing roller 230 is spaced from the front end 210b of the mask plate 210 (the front end e2 of the pattern surface M) to the front side along the x axis. Since the position has reached the separated position x4 (second position x4), the mask dust removing roller 230 does not come into contact with the mask plate 210 and the mask plate holding portion 220. Further, it is assumed that the mask dust removing roller 230 does not come into contact with other components not shown. Thereby, the exposure stage 240 can be raised as shown in FIG.

  The rising amount of the exposure stage 240 is a rising amount such that the photosensitive surface A of the substrate (referred to as the photosensitive region A1 at this time) comes close to or contacts the pattern surface M of the mask plate 210. As shown in FIG. 5C, when the photosensitive area A1 of the substrate W comes close to or contacts the pattern surface M of the mask plate 210, exposure is performed in this state. As a result, the pattern is transferred to the photosensitive area A1 of the substrate W.

  In addition, although it may be made to adhere between the photosensitive surface of the board | substrate W and the pattern surface M of the mask board 210 at the time of performing exposure, there exists a slight space | gap (for example, about 1/100 mm-about 4/100 mm). You may make it provide the space | interval of the grade to do.

  Thus, by providing a slight gap (for example, about 1/100 mm to 4/100 mm) between the photosensitive surface of the substrate W and the 210 pattern surface M of the mask plate, a slight amount of dust is generated on the substrate W side. Even if it remains, it is possible to prevent the remaining dust from adhering to the pattern surface M of the mask plate 210.

  Then, after the exposure is completed, the intermittent transfer operation of the substrate W is resumed, and the substrate W is transferred by a predetermined amount. As described above, when the intermittent transfer operation of the substrate W is resumed, the exposure stage 240 moves down from the state of FIG. 5C along the z-axis as shown in FIG. 6A. When the exposure stage 240 is lowered by a predetermined amount, the entire transport mechanism unit 100 is also lowered by a predetermined amount as the exposure stage 240 is lowered. In addition, the position along the x-axis of the mask dust removal roller 230 at this time is the same position (second position x2) as FIG.

  Thereafter, from the position shown in FIG. 6A, the mask dust removing roller 230 advances by a predetermined amount along the x-axis to the rear side, and is a plane portion near the front end 210b of the mask plate 210, that is, the mask plate 210. When the position x2 facing the vicinity of the front end e2 in the pattern surface M is reached (see FIG. 6B), the exposure stage 240 rises by a predetermined amount along the z axis, and the mask dust removing roller 230 moves to the mask plate. It contacts the vicinity of the front end e2 on the pattern surface M of 210 (see FIG. 6C). Thereafter, the mask dust removing roller 230 advances rearward (in the direction of the arrow x ′) along the x-axis while being in contact with the pattern surface M of the mask plate 210.

  At this time, the mask dust removing roller 230 advances while rotating while being in contact with the pattern surface M of the mask plate 210 while the extension force of the spring 257 is applied. Thereby, the dust which exists in the pattern surface M of the mask board 210 can be made to adhere to the mask dust removal roller 230 side, and, thereby, the pattern surface M of the mask board 210 can be removed.

  In this way, the mask dust removing roller 230 advances to the rear side while rotating while being in contact with the pattern surface M of the mask plate 210, and eventually reaches the vicinity of the rear end e1 on the pattern surface M of the mask plate 210. (See FIG. 6D.) Then, the exposure stage 240 is lowered from the state shown in FIG. 6D (see FIG. 7A). The position along the z-axis of the mask dust removing roller 230 at this time (the position along the z-axis of the upper apex P1 on the circumference) is the same position z2 as in FIG. When the exposure stage 240 is lowered by a predetermined amount, the entire transport mechanism unit 100 is also lowered by a predetermined amount as the exposure stage 240 is lowered.

  The mask dust removing roller 230 further advances to the rear side, and a position x1 (a predetermined distance apart from the rear end 210a (the rear end e1 of the pattern surface M) of the mask plate 210 to the rear along the x axis. The first position x1) is reached (see FIG. 7B).

  The operation from the second position x4 shown in FIG. 5B to the first position x1 shown in FIG. 7B is performed while the substrate W is being transported. For this reason, the pattern surface M of the mask plate 210 is not affected without affecting the original exposure operation performed by the exposure apparatus 10 in which the long sheet-like substrate W is exposed by carrying a predetermined amount intermittently by a predetermined amount. Can be dedusted.

  As described above, when the mask dust removing roller 230 reaches the position x1 (first position x1) as shown in FIG. 7B, the exposure stage 240 is raised by a predetermined amount (see FIG. 7C). . This is the same operation as in FIG. At this time, as the exposure stage 240 is raised, the entire transport mechanism unit 100 is also raised by a predetermined amount. As shown in FIG. 7C, when the photosensitive surface of the substrate W (referred to as photosensitive region A2) comes close to or contacts the pattern surface M of the mask plate 210, exposure is performed in this state. As a result, the pattern is transferred to the photosensitive area A2 of the substrate W.

  Also in this case, when the exposure stage 240 is raised by a predetermined amount, the mask dust removing roller 230 moves rearward along the x-axis from the rear end 210a (the rear end e1 of the pattern surface M) of the mask plate 210. The mask dust removal roller 230 does not come into contact with the mask plate 210 and the mask plate holding part 220 because the position reaches the position x1 (first position x1) that is spaced apart by a predetermined distance. Further, it is assumed that the mask dust removing roller 230 does not come into contact with other components not shown. Thereby, the exposure stage 240 can be raised as shown in FIG.

  Then, after the exposure is completed, the exposure stage 240 is lowered from the state of FIG. At this time, the intermittent transfer operation of the substrate W is also resumed, and the substrate W is transferred by a predetermined amount. After the exposure is completed, the state when the exposure stage 240 is lowered from the state of FIG. 7C is the same state as FIG. From this state, FIG. 4 (b) to FIG. 4 (d), FIG. 5 (a) to FIG. 5 (c), FIG. 6 (a) to FIG. 6 (d) and FIG. The operation of sequentially performing (c) and returning to FIG. 4 (a) is repeated.

  As described above, in the exposure apparatus 10 according to the embodiment, the mask dust removing roller 230 travels within the movable range as a movable range when reciprocating between the first position x1 and the second position x4. The operation of removing the pattern surface M of the mask plate 210 is performed. When the mask dust removing roller 230 moves forward in the movable range as the forward moving operation, and the mask dust removing roller 230 moves backward in the movable range as the backward moving operation, the mask dust removing roller 230 Performs an operation of removing dust from the pattern surface M of the mask plate 210 in each of the forward traveling operation and the backward traveling operation. Further, in each of the forward traveling operation and the backward traveling operation, the operation of removing the pattern surface M of the mask plate 210 is alternately performed during the operation in which the substrate W is intermittently transported by a predetermined amount. For this reason, mask dust removal operation | movement can be performed efficiently.

  By the way, from the state (refer FIG. 4 (a)) where the mask dust removal roller 230 is the position respectively spaced along the x-axis and the z-axis with respect to the mask plate 210, the mask dust removal roller 230 is When the state comes into contact with the pattern surface M of the mask plate 210 (see FIG. 4C), as shown in FIGS. 4A to 4C, the mask dust removing roller 230 is directly It contacts the pattern surface M of the mask plate 210.

  For this reason, the mask dust removing roller 230 does not push the rear side end portion 210a of the mask plate 210 forward, so that the displacement of the mask plate 210 can be prevented and the rear side end portion 210a of the mask plate 210 can be prevented. It is possible to prevent breakage of corners and the like.

  In FIG. 4C, the position x2 along the x-axis when the mask dust removing roller 230 contacts the pattern surface M is the rear end 210a of the mask plate 210 (the rear end of the pattern surface M). The position coincides with e1), but does not necessarily need to coincide with the rear end 210a of the mask plate 210 (the rear end e1 of the pattern surface M). It may be a flat portion in the vicinity of the end portion 210a, that is, in the vicinity of the rear end portion e1 of the pattern surface M (for example, the rear end portion of the pattern formation region in which the pattern is actually formed on the pattern surface M). The point is that the rear side end 210a of the mask plate 210 is not pushed forward or the corners and the like at the rear side end 210a of the mask plate 210 are not damaged, and the mask plate 210 Any position where the pattern forming area on the pattern surface M can be reliably dust-removed may be used.

  In addition, even when the mask dust removal roller 230 travels rearward from the second position x4, the mask dust removal roller 230 is in a position separated from the mask plate 210 along the x axis and the z axis, respectively. When the state (see FIG. 6A) is changed to the state in which the mask dust removing roller 230 is in contact with the mask plate 210 (see FIG. 6C), FIG. 6A to FIG. As shown in FIG. 2, the mask dust removing roller 230 directly contacts the pattern surface M of the mask plate 210.

  For this reason, the mask dust removing roller 230 does not push the front side end 210b of the mask plate 210 to the rear side, so that the displacement of the mask plate 210 can be prevented and the front side end 210b of the mask plate 210 can be prevented. It is possible to prevent breakage of corners and the like.

  In FIG. 6C, the position x3 along the x axis when the mask dust removing roller 230 contacts the pattern surface M is the front end 210b of the mask plate 210 (the front end of the pattern surface M). Although the position coincides with e2), the position does not need to coincide with the front end 210b of the mask plate 210 (the front end e2 of the pattern surface M). It may be a flat portion near the front end 210b, that is, near the front end e2 of the pattern surface M (for example, the front end of the pattern formation region where the pattern is actually formed on the pattern surface M). The point is that the front side end 210b of the mask plate 210 is not pushed rearward and the corners and the like at the front side end 210b of the mask plate 210 are not damaged, and the mask plate 210 Any position where the pattern forming area on the pattern surface M can be reliably dust-removed may be used.

  As described above, according to the exposure apparatus 10 according to the embodiment, the operation of removing the pattern surface M of the mask plate 210 by the mask dust removing roller 230 is automatically performed while the substrate W is being transported. Further, not only the dust removal on the pattern surface M of the mask plate 210 by the mask dust removal roller 230, but also the substrate W can be removed by the substrate dust removal roller 140. Note that the operation of removing the substrate W by the substrate dust removing roller 140 is also automatically performed while the substrate W is being transported. For this reason, the exposure operation originally performed in the roll-to-roll type exposure apparatus is not affected, and the pattern surface M of the mask plate 210 and the substrate W can be removed. Thereby, the original exposure operation speed can be maintained.

  In the exposure apparatus 10 according to the embodiment, the mask dust removing roller 230 is configured to contact the pattern surface M of the mask plate 210 with a predetermined pressing force by the extension force of the spring 257. For this reason, the mask dust removal roller 230 can be brought into contact with the pattern surface M with an appropriate pressing force, and it is not necessary to control the pressing force at the time of contact with high accuracy. Further, it is not necessary to adjust the interval between the mask dust removal roller 230 and the pattern surface M (interval along the z axis) with high accuracy, and the interval between the mask dust removal roller 230 and the pattern surface M (interval along the z axis). The adjustment work can be reduced. Thereby, according to the exposure apparatus 10 which concerns on embodiment, the whole mechanism for dedusting the pattern surface M of the mask board 210 can be simplified.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, the following modifications are possible.

  (1) In the above embodiment, the ball screw 253L. The mask dust removing roller 230 is reciprocated along the x-axis by providing 253R on the sliders 252L and 252R on the left and right sides and rotating them in a synchronized state. Also good. For example, when the ball screw 253R is provided only on the right slider 252R in FIG. 2A, the left slider 252L moves on the guide rail 251L in conjunction with the movement of the right slider 252R. Even with such a structure, the mask dust removing roller 230 can be reciprocated along the x-axis.

  When driving the left and right sliders 252L and 252R with one ball screw, one ball screw may be arranged along the x-axis at an intermediate position between the left slider 252L and the right slider 252R. In this way, the sliders 252L and 252R on both the left and right sides can be driven with a good balance by one ball screw.

  (2) In the above embodiment, the mask dust removal unit drive mechanism unit 250 is configured to reciprocate the mask dust removal roller 230 along the x axis using a ball screw. Various mechanisms can be adopted as the mechanism that reciprocates along. Similarly, the exposure stage drive mechanism 260 is a mechanism that moves the exposure stage 240 up and down using a ball screw, but there are various mechanisms that move the exposure stage 240 up and down along the z-axis. Can be adopted.

  (3) In the said embodiment, although the mask dust removal roller 230 demonstrated as what the mask dust removal roller 230 whole consists of a member which has adhesive force, it is not restricted to this, Only the surface of the mask dust removal roller 230 is It may have an adhesive strength. For example, a member having adhesive force may be wound around the surface of a cylindrical body from a synthetic resin or the like, or an adhesive layer may be formed on the surface of the cylindrical body. The substrate dust removing roller 140 is the same.

  (4) In the above embodiment, the exposure apparatus in which the photosensitive surface A of the substrate W is disposed upward and the pattern surface M of the mask plate 210 is disposed downward is exemplified, but the present invention is not limited to this. The reverse arrangement may be used. That is, it may be an exposure apparatus in which the photosensitive surface A of the substrate W is disposed downward and the pattern surface M of the mask plate 210 is disposed upward.

  (5) In the above embodiment, when the exposure unit 200 exposes the photosensitive surface A of the substrate W, a slight gap is provided between the photosensitive surface A of the substrate W and the pattern surface M of the mask plate 210. However, it is not always necessary to provide a small gap between the photosensitive surface A of the substrate W and the pattern surface M of the mask plate 210. The photosensitive surface A of the substrate W and the mask plate are not necessarily provided. You may make it expose in the state which closely contacted the pattern surface M of 210. FIG.

  (6) In the above embodiment, the mask dust removing unit performs the operation of removing the pattern surface M of the mask plate 210 in each of the forward traveling operation and the backward traveling operation. Dust removal may be performed only in one of them.

  (7) In the above embodiment, the mask dust removing unit uses a roller (mask dust removing roller 230) made of a member having adhesive force to remove dust existing on the pattern surface M of the mask plate 210 from the mask dust removing roller 230. Although the case where dust was removed by the adhesive force of was illustrated, it is not limited to this. For example, the mask dust removing unit may remove dust by vacuum suction. As described above, an exposure apparatus in the case where the mask dust removing unit is designed to remove dust by vacuum suction will be described as a modification of the exposure apparatus of the present invention.

  In a modification of the exposure apparatus of the present invention, the mask dust removing unit 230 has a suction port along the y-axis direction on the pattern surface M of the mask plate 210, and suction type that dusts the pattern surface M of the mask plate 210 by suction. The operation of the suction-type mask dust removing unit removing dust from the pattern surface M of the mask plate 210 is to apply a suction force with a predetermined gap between the mask plate 210 and the pattern surface M. While exhibiting, the operation of proceeding along the x-axis direction along the pattern surface M of the mask plate 210 is performed.

  Even if the mask dust removing unit removes dust by vacuum suction, the overall configuration of the exposure apparatus can be the same as that of the exposure apparatus described in the above embodiment. In the following description, the mask dust removing unit that removes dust by vacuum suction is referred to as a suction mask dust removing unit.

  Such a suction-type mask dust removing unit will be briefly described when it is applied to the exposure apparatus shown in FIG. The suction-type mask dust removing unit has a suction port that is elongated in the width direction of the mask plate 210 (the direction along the y-axis in FIG. 1). Such a suction-type mask dust removal unit can be attached to the mask dust removal roller support portions 254L and 254R in the same manner as the mask dust removal roller 230. At this time, the suction hole of the suction type mask dust removing portion is directed upward so as to be able to face the pattern surface M of the mask plate 210.

  And when performing dust removal, what is necessary is just to perform the operation | movement substantially the same as FIGS. However, the suction-type mask dust removal unit and the suction-type substrate dust removal unit remove dust in a non-contact state with respect to the pattern surface M of the mask plate 210, so that the suction-type mask dust removal unit contacts the pattern surface M of the mask plate 210. There is no need to let them. Therefore, at the initial position shown in FIG. 4A, if the distance along the z-axis between the suction port of the suction-type mask dust removing unit and the pattern surface M of the mask plate 210 is set appropriately, the z-axis is aligned. The suction mask dust removal roller may be reciprocated along the x-axis while the position is kept as it is.

  Further, since the suction-type mask dust removing unit removes dust in a non-contact state with respect to the pattern surface M of the mask plate 210, the pattern of the mask plate 210 is applied by the extension force of the spring 257 like the mask dust removal roller 230. A structure for contacting the surface M is not necessary.

  By using such a suction-type mask dust removing unit, it is possible to remove the pattern surface M of the mask plate 210 while the substrate W is intermittently transported by a predetermined amount as in the above embodiment. In the substrate dust removing unit 140, a suction-type substrate dust removing unit can be similarly used.

  (8) In the above embodiment, as shown in FIG. 1, an example in which the mask dust removing unit control device 400 and the exposure stage control device 500 are housed inside the exposure device housing 300 is shown. It may be provided outside the exposure apparatus housing 300.

  (9) In the above embodiment, as shown in FIG. 1, the length along the x-axis of the mask plate 210 and the length along the x-axis of the mask plate holding portion 220 are the same length L1. The lengths of the mask dust removal rollers 230 do not have to be obstructed when the mask dust removal rollers 230 are raised when the exposure stage 240 is raised. The length may be longer than the mask plate 210.

  DESCRIPTION OF SYMBOLS 10 ... Exposure apparatus, 100 ... Conveyance mechanism, 130 ... Intermittent feed mechanism part, 140 ... Substrate dust removal roller (substrate dust removal part), 200 ... Exposure part, 210 ... Mask plate, 220 ... Mask plate holding part, 230 ... Mask dust removal roller (mask dust removal part), 240 ... Exposure stage, 241 ... Exposure table, 250 ... Mask dust removal part drive mechanism part, 251L, 251R ... Guide rail, 252L, 252R ... Slider, 253L, 253R ... Ball screw for mask dust removal part, 257 ... Spring, 260 ... Exposure stage drive mechanism part, 261 ... Elevator base, 263 ... Exposure stage ball screw, 300 ... Exposure device casing, 400 ... Mask dust removal unit control device, 500 ... Exposure stage control device, A ... Photosensitive surface, 1, A2 ··· photosensitive area,

Claims (7)

In the process of intermittently transporting a predetermined amount of a long sheet-shaped substrate spanned between the sending-out portion and the take-up portion, the photosensitive surface of the substrate and the pattern surface of the mask plate face each other. An exposure apparatus for exposing the photosensitive surface of the substrate,
When the side toward the winding unit along the x axis in the xy plane formed by the x axis and the y axis is the front side, and the side opposite to the front side is the rear side,
An exposure stage that is disposed at a position facing the mask plate across the substrate and is capable of moving up and down with the substrate along a z-axis orthogonal to the xy plane;
It can reciprocate along the x-axis, can move up and down along the z-axis together with the exposure stage, and is positioned on the mask plate side in a state separated from the photosensitive surface of the substrate along the z-axis. At least a first position spaced apart from the rear end of the mask plate by a predetermined distance along the x-axis and a front end of the mask plate x An operation for removing dust from the pattern surface of the mask plate while proceeding within the movable range, with the range between the second position spaced apart by a predetermined distance further forward along the axis as the movable range when reciprocating. A mask dust removing unit for performing
A mask dust remover drive mechanism for reciprocating the mask dust remover; and
A mask dust remover control device for controlling the reciprocation of the mask dust remover by controlling the mask dust remover drive mechanism;
An exposure stage drive mechanism for allowing the exposure stage to move up and down along the z-axis;
An exposure stage controller that controls the raising and lowering of the exposure stage by controlling the exposure stage drive mechanism;
Have
The mask dust removing portion has a roll shape having an adhesive force on at least the surface,
The operation in which the mask dust removing unit removes the pattern surface of the mask plate is an operation of rotating while in contact with the pattern surface of the mask plate,
In bringing the mask dust removing portion into contact with the pattern surface of the mask plate from a position where the mask dust removing portion is separated from the mask plate along the x axis and the z axis, respectively.
Mask dust removal part control device
Controlling the mask dust remover drive mechanism so that the mask dust remover reaches a position facing the vicinity of the end portion along the x-axis in the pattern surface of the mask plate;
The exposure stage controller is
When the mask dust remover reaches a position facing the vicinity of the end portion along the x axis on the pattern surface of the mask plate, the mask dust removal portion contacts the vicinity of the end portion along the x axis on the pattern surface of the mask plate. Controlling the exposure stage drive mechanism so as to
When exposing the photosensitive surface of the substrate,
The mask dust removing unit control device controls the mask dust removing unit drive mechanism so that the mask dust removing unit reaches the first position or the second position,
The exposure stage control device moves the exposure stage along the z axis in a state where the mask dust removing unit has reached the first position or the second position, so that the photosensitive surface of the substrate and the mask plate An exposure apparatus that controls the exposure stage drive mechanism so that the pattern surface is in contact with or close to the pattern surface. The exposure apparatus according to claim 1,
The exposure apparatus according to claim 1, wherein the mask dust removing unit performs an operation of dusting the pattern surface of the mask plate while the substrate is being conveyed intermittently by a predetermined amount. In the exposure apparatus according to claim 1 or 2,
When the mask dust portion is a forward traveling operation an operation for traveling within the movable range in the front side, and the operation of the mask dust portion traveling within the movable range in the rear side in the rear travel operation,
The mask dust removing unit performs an operation of removing dust from the pattern surface of the mask plate in each of the forward traveling operation and the backward traveling operation,
An exposure apparatus characterized in that an operation of removing dust on the pattern surface of the mask plate in each of the forward traveling operation and the backward traveling operation is alternately performed while the substrate is intermittently conveyed by a predetermined amount. In the exposure apparatus according to any one of claims 1 to 3 ,
The exposure apparatus is characterized in that the mask dust removing unit is provided on the exposure stage so that when it comes into contact with the pattern surface of the mask plate, a force that presses the pattern surface by the extension force of a spring acts. . In the exposure apparatus according to any one of claims 1 to 3,
The mask dust removing unit has a suction port along the y-axis direction in the pattern surface of the mask plate, and is a suction type mask dust removing unit that dusts the pattern surface of the mask plate by suction,
The operation of the suction-type mask dust removing unit removing dust from the pattern surface of the mask plate is performed while exhibiting a suction force with a predetermined gap between the pattern surface of the mask plate and the pattern surface of the mask plate. The exposure apparatus is an operation that proceeds along the x-axis direction along the X-axis. In the exposure apparatus according to any one of claims 1 to 5 ,
An exposure apparatus comprising a substrate dust removing unit that dusts at least the photosensitive surface of the substrate. The exposure apparatus according to claim 6 , wherein
The substrate dust removing unit is formed in a roll shape having adhesive force on at least the surface, and is provided in contact with at least the photosensitive surface of the substrate, and the substrate dust removal unit is configured to intermittently convey the substrate by a predetermined amount. An exposure apparatus that rotates with conveyance.

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