CN104423180A - Exposure apparatus - Google Patents
Exposure apparatus Download PDFInfo
- Publication number
- CN104423180A CN104423180A CN201410425472.1A CN201410425472A CN104423180A CN 104423180 A CN104423180 A CN 104423180A CN 201410425472 A CN201410425472 A CN 201410425472A CN 104423180 A CN104423180 A CN 104423180A
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- CN
- China
- Prior art keywords
- dust removal
- removal unit
- mask plate
- mask
- exposure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Abstract
The invention provides an exposure apparatus which automatically removes dust from the pattern surface of a blocking plate without causing influence to exposure. In particular, the exposure apparatus comprises an exposure object carrying desk (240) and an exposure functioning desk (240) with a retaining plate (W). The exposure functioning desk can rise and lower with the substrate (w) along axle Z. The dust removing part (240) of the blocking part enables the back side end part (210a) of the blocking plate (210) and the front side end part (210b) of the blocking plate (210) to do reciprocating movement along axle X.
Description
Technical field
The present invention relates to a kind of exposure device, make the pattern plane of the light-sensitive surface of substrate and mask plate facing, by make substrate light-sensitive surface exposure and on substrate pattern transferring.
Background technology
There will be a known various exposure device in the past, and made the pattern plane of the light-sensitive surface of substrate and mask plate facing, by make substrate light-sensitive surface exposure and on substrate pattern transferring.In this exposure device, just dedusting is not carried out to the light-sensitive surface of substrate, to mask plate and the opposite face (being called the pattern plane of mask plate) of substrate to carry out dedusting also very important.This is because when there is dust in the pattern plane of mask plate, then during exposure, dust can be transferred with being formed in together with the pattern on mask, and the bad phenomenon that this substrate becomes substandard products occurs.
But, in this exposure device, not only just using the exposure device of the substrate one by one in short size flakes as exposure object, also have the exposure device of long size flakes substrate as exposure object.
Respectively be located in the process of the long size flakes substrate between delivery section and winder off and on by ormal weight barrow using long size flakes substrate as the exposure device of exposure object, make the pattern plane of the light-sensitive surface of substrate and mask plate facing, and make the device that the light-sensitive surface of substrate exposes, as so-called volume to volume (Roll to Roll) mode exposure device and in the past known (such as with reference to patent documentation 1).
Fig. 8 is to exposure device 900 described in patent documentation 1 is described and the figure illustrated.As shown in Figure 8, exposure device 900 disclosed in patent documentation 1 configures exposure portion 940 between the conveying delivery section 920 of long size flakes substrate 910 and the winder 930 of the substrate of the exposure that reeled, in the process of carrying substrate 910, make the pattern plane of the light-sensitive surface of substrate 910 and mask plate 950 facing, and make " exposure device of volume to volume mode " that the light-sensitive surface of substrate 910 exposes.
In addition, the exposure device 900 described in patent documentation 1 is as lower device, and namely the two sides of substrate 910 is light-sensitive surface, and the two sides of substrate 910 can be made to expose simultaneously, and therefore mask plate 950 is set to clip substrate 910 up and down respectively.In addition, in the following description, using the mask plate 950 of upside as upside mask plate 951, the mask plate 950 of downside is described as downside mask plate 952.
In the exposure device of this volume to volume mode, dedusting is carried out to each pattern plane of mask plate 950 (upside mask plate 951 and downside mask plate 952) also very important.In the exposure device 900 described in patent documentation 1, the dedusting of each pattern plane in upside mask plate 951 and downside mask plate 952 is carried out as follows.
In the exposure device 900 described in patent documentation 1, when carrying out the dedusting of upside mask plate 951, the height adjustable rollers 960 that utilization can make substrate 910 be elevated along z-axis, substrate 910 is made to increase along z-axis, substrate 910 is made to leave downside mask plate 952 thus, and by making upside mask plate 951 rise along z-axis, and make upside mask plate 951 leave substrate 910, in this condition, dedusting is carried out to the pattern plane of upside mask plate 951.
On the other hand, when carrying out the dedusting of downside mask plate 952, make upside mask plate 951 along z-axis rising and between downside mask plate 952, form wider interval, and utilizing height adjustable rollers 960 to make substrate 910 leave downside mask plate 952, in this condition, dedusting is carried out to downside mask plate 952.
Patent documentation 1: Japanese Laid-Open 2001-125274 publication
As mentioned above, when dedusting being carried out to each pattern plane of mask plate 950 (upside mask plate 951 and downside mask plate 952) in the exposure device 900 described in patent documentation 1, for the ease of the dedusting of the pattern plane of upside mask plate and the pattern plane of downside mask plate, carry out the operation making substrate and upside mask plate movement, make each pattern plane and substrate spaced apart, on this basis, the dedusting of the upside pattern plane of mask plate and the pattern plane of downside mask plate is carried out.In addition, in the exposure device 900 described in patent documentation 1, the dust arrester being used for the pattern plane of mask plate being carried out to dedusting is set due to special, therefore can thinks that the dedusting of pattern plane of mask plate is that operating personnel is undertaken by manual work.Therefore, energy and time expensive when carrying out the dedusting of the pattern plane of mask plate.
In addition, in the exposure device 900 described in patent documentation 1, when carrying out the dedusting of the pattern plane of mask plate, need exposure actions is stopped.Therefore, in the exposure device of volume to volume mode that originally should be able to realize effective exposure at a high speed, high speed and high efficiency is damaged significantly in order to the dedusting of mask.Especially when the exposure of more high-quality will be carried out, owing to requiring the dedusting frequently carrying out mask, therefore carry out the dedusting of mask at every turn, all need to carry out operation as above at every turn, become and damage high speed and high efficiency larger.
In addition, in this manual, " exposure actions " refers to " respectively carrying by ormal weight in the process of long size flakes substrate off and on, making the pattern plane of the light-sensitive surface of substrate and mask plate facing, and making the action that the light-sensitive surface of substrate exposes ".
Summary of the invention
The present invention carries out in view of the foregoing, its object is to provide a kind of exposure device, in the exposure device of volume to volume mode, automatically the dedusting of the pattern plane of mask plate can be carried out, and the exposure actions of not carrying out the exposure device of this volume to volume mode impacts the dedusting just carrying out the pattern plane of mask plate.
[1] exposure device of the present invention is respectively being located in the process of the long size flakes substrate between delivery section and winder off and on, make the pattern plane of the light-sensitive surface of described substrate and mask plate facing, and make the exposure device that the light-sensitive surface of described substrate exposes, it is characterized in that, described substrate is made to be front side along the x-axis in the xy plane formed by x-axis and y-axis towards the side of described winder, when to make with this front side opposite side be rear side, then have: exposure objective table, be configured in and clip described substrate and on the position relative with described mask plate, can along the z-axis orthogonal with xy plane and described substrate one lifting, mask dust removal unit, moving back and forth and can be elevated along z-axis together with described exposure objective table along x-axis can be realized, and be arranged on described exposure objective table, described mask plate side is positioned at the state left from the light-sensitive surface of described substrate along z-axis, described rear side end to major general from described mask plate along x-axis leave rearward further predetermined distance the 1st position and from the described front side end of described mask plate along x-axis further forwards side leave predetermined distance the 2nd position between scope as movable range during described moving back and forth, advance while carry out the action of the pattern plane dedusting to described mask plate in this movable range of one edge, mask dust removal unit driving mechanism portion, for make described mask dust removal unit carry out described in move back and forth, mask dust removal unit control device, controls to move back and forth described in described mask dust removal unit by controlling described mask dust removal unit driving mechanism portion, exposure objective table driving mechanism portion, is elevated along z-axis for making described exposure objective table, and exposure objective table control device, the lifting of described exposure objective table is controlled by controlling described exposure objective table driving mechanism portion, described mask dust removal unit is at least surperficial roll with adhesion, the action that described mask dust removal unit carries out dedusting to the pattern plane of described mask plate carries out rotating the action of advancing under the state contacted with the pattern plane of described mask plate, when described mask dust removal unit being contacted relative to described mask plate along the position that x-axis and z-axis are left respectively from described mask dust removal unit with the pattern plane of described mask plate, described mask dust removal unit control device controls described mask dust removal unit driving mechanism portion, described mask dust removal unit is arrived and the position relative near the end of x-axis in the pattern plane of described mask plate, described exposure objective table control device controls described exposure objective table driving mechanism portion, when described mask dust removal unit arrives with relative near the end of x-axis position in the pattern plane of described mask plate, make described mask dust removal unit and contacting near the end of x-axis in the pattern plane of described mask plate, when making the light-sensitive surface exposure of described substrate, described mask dust removal unit control device controls described mask dust removal unit driving mechanism portion, described mask dust removal unit is made to be in the state arriving described 1st position or described 2nd position, described exposure objective table control device controls described exposure objective table driving mechanism portion, under the state that described mask dust removal unit arrives described 1st position or described 2nd position, make described exposure objective table move along z-axis and the light-sensitive surface of described substrate and the pattern plane of described mask plate are in contact or close state.
Exposure device of the present invention is formed in following, mask dust removal unit along on the direction of x-axis using the scope (scope 1st position and 2nd position between) wider than mask plate as movable range, by carrying out dedusting before this movable range and then to the pattern plane of mask plate.And, when making the light-sensitive surface exposure of substrate, under the state that mask dust removal unit arrives the 1st position or described 2nd position, make exposure objective table move along z-axis and the light-sensitive surface of substrate and the pattern plane of mask plate are in contact or close state, thus expose.Thus, according to exposure device of the present invention, in the exposure device of volume to volume mode, also the dedusting of the pattern plane of mask plate can automatically be carried out, and, the exposure actions that the exposure device of this volume to volume mode carries out is not impacted, just can carry out the dedusting of the pattern plane of mask plate.
In addition, according to exposure device of the present invention, mask dust removal unit is at least surperficial roll with adhesion, the action carrying out dedusting to the pattern plane of mask plate due to mask dust removal unit carries out rotating the action of advancing under the state contacted with the pattern plane of mask plate, therefore can efficiently and carry out dedusting to the pattern plane of mask plate effectively.
In addition, according to exposure device of the present invention, mask dust removal unit control device and exposure objective table control device control mask dust removal unit driving mechanism portion and exposure objective table driving mechanism portion respectively, when mask dust removal unit arrives with relative near the end of x-axis position in the pattern plane of mask plate, make mask dust removal unit and contacting near the end of x-axis in the pattern plane of mask plate.Therefore, when mask dust removal unit is advanced along x-axis, mask dust removal unit does not produce the action of the working direction pushing mask plate end to the mask dust removal unit along x-axis.Thus, can prevent the position of mask plate from offseting, in addition, the breakages such as the bight in mask plate end can also be prevented.
[2] in exposure device of the present invention, preferred described mask dust removal unit during respectively carrying described substrate by ormal weight off and in carry out the action of the pattern plane dedusting to described mask plate.
So, owing to carrying out the action of the pattern plane dedusting to mask plate in during carrying substrate, therefore the exposure actions of the script that the exposure device of volume to volume mode carries out is not impacted, just can carry out dedusting to the pattern plane of mask plate.Thereby, it is possible to keep the exposure actions speed that the exposure device of volume to volume mode has originally.
[3] in exposure device of the present invention, preferably using described mask dust removal unit along the action of advancing to described front side in described movable range as front forward motion, during using described mask dust removal unit along the action of advancing to described rear side in described movable range as rear forward motion, described mask dust removal unit carries out the action of the pattern plane dedusting to described mask plate respectively in described front forward motion and described rear forward motion, the action in described front forward motion and described rear forward motion, dedusting being carried out to the pattern plane of described mask plate respectively during respectively carrying described substrate by ormal weight off and in carry out alternately.
So, when mask dust removal unit carries out front forward motion and rear forward motion along the movable range of this mask dust removal unit, in front forward motion and rear forward motion, the action of the pattern plane dedusting to mask plate is carried out respectively.In addition, in front forward motion and rear forward motion, the action that the pattern plane of mask plate carries out dedusting is carried out alternately between off and on respectively by the action of ormal weight carrying substrate respectively.Therefore, it is possible to succinctly effectively carry out the carrying action of substrate and the dedusting action of mask dust removal unit.In addition, during owing to carrying out exposure actions off and on, be bound to carry out dedusting to the pattern plane of mask plate between exposure actions and exposure actions, therefore can expose under the state that dedusting has been carried out to the pattern plane of mask plate all the time.
[4] in exposure device of the present invention, preferred described mask dust removal unit is arranged on described exposure objective table, when being in the state contacted with the pattern plane of described mask plate, is acted on the power pushing described pattern plane by the elastic force of spring.
Therefore, mask dust removal unit can be made to contact with pattern plane with suitable pushing force, do not need the control etc. of pushing force when contacting accurately.In addition, the interval (interval along z-axis) of mask dust removal unit and pattern plane does not need to adjust accurately yet, can alleviate the adjustment operation at the interval (interval along z-axis) of mask dust removal unit and pattern plane.
[5] in exposure device of the present invention, preferred described mask dust removal unit has the suction port along the y-axis direction in the pattern plane of described mask plate, be the aspiration-type mask dust removal unit of by attraction, the pattern plane of described mask plate being carried out to dedusting, described aspiration-type mask dust removal unit is play attractive force under the state between the pattern plane of described mask plate with void and along the pattern plane of described mask plate and the action of advancing along the x-axis direction to the action that the pattern plane of described mask plate carries out dedusting.
As mask dust removal unit, by using this aspiration-type mask dust removal unit, the effect identical with the effect that the invention by above-mentioned [1] to [3] obtains also can be obtained.
[6] in exposure device of the present invention, preferably there is substrate dust removal unit, dedusting is carried out at least described light-sensitive surface of described substrate.
Thus, be not the dedusting of the pattern plane of mask plate, the dedusting of at least light-sensitive surface of substrate can also be carried out.
[7] in exposure device of the present invention, preferred described substrate dust removal unit is at least surperficial roll with adhesion, it is set up with the state contacted with at least light-sensitive surface of described substrate, rotates with the carrying of described substrate when respectively carrying described substrate by ormal weight off and on.
Thus, can efficiently and effectively dedusting is carried out to the pattern plane of mask plate.In addition, owing to carrying out the action of at least light-sensitive surface dedusting to substrate in during carrying substrate, therefore the exposure actions of the script that the exposure device of volume to volume mode carries out is not impacted, just can carry out dedusting at least light-sensitive surface of substrate.Thereby, it is possible to keep the exposure actions speed that the exposure device of volume to volume mode has originally.In addition, also can being the formation clipping substrate with 2 rollers with dedusting function, by becoming this formation, dedusting can being carried out to the two sides of substrate simultaneously.
Accompanying drawing explanation
Fig. 1 is to exposure device 10 involved by embodiment is described and the overall pie graph illustrated.
Fig. 2 is the formation in exposure portion 200 in the exposure device 10 in order to illustrate involved by embodiment and the figure illustrated.
Fig. 3 is the figure of the formation that mask dust removal unit control device 400 in the exposure device 10 involved by embodiment and exposure objective table control device 500 are shown.
Fig. 4 is action in order to the exposure device 10 involved by embodiment is described and the figure illustrated.
Fig. 5 is action in order to the exposure device 10 involved by embodiment is described and the figure illustrated.
Fig. 6 is action in order to the exposure device 10 involved by embodiment is described and the figure illustrated.
Fig. 7 is action in order to the exposure device 10 involved by embodiment is described and the figure illustrated.
Fig. 8 is to exposure device 900 described in patent documentation 1 is described and the figure illustrated.
Symbol description
10-exposure device; 100-carrying mechanism; 130-intermittent feeding mechanism portion; 140-substrate cleaning roller (substrate dust removal unit); 200-exposure portion; 210-mask plate; 220-mask plate maintaining part; 230-mask cleaning roller (mask dust removal unit); 240-exposes objective table; 241-exposure worktable; 250-mask dust removal unit driving mechanism portion; 251L, 251R-guide rail; 252L, 252R-slide block; 253L, 253R-mask dust removal unit ball screw; 257-spring; 260-exposes objective table driving mechanism portion; 261-lifting table; 263-exposes objective table ball screw; 300-exposure device framework; 400-mask dust removal unit control device; 500-exposes objective table control device; A-light-sensitive surface; A1, A2-photosensitive region.
Embodiment
Below, embodiments of the present invention are described.
(embodiment 1)
Fig. 1 is to exposure device 10 involved by embodiment is described and the overall pie graph illustrated.In addition, Fig. 1 is the figure that medelling illustrates the exposure device 10 involved by embodiment 1, in order to illustrate that exposure device 10 involved by embodiment instead of component parts necessary especially then omit diagram.In addition, because Fig. 1 is mode chart, be not therefore that the size of the component parts of reality is reduced with same ratio, but draw turgidly or draw component parts with more reducing.
As shown in Figure 1, the exposure device 10 involved by embodiment has: carrying mechanism portion 100, respectively carries long size flakes substrate W by ormal weight off and on along the x-axis in the xy plane formed by x-axis and y-axis; Exposure portion 200, makes respectively to be exposed by the light-sensitive surface A of the substrate W of ormal weight carrying off and on by carrying mechanism portion 100; Exposure device framework 300, is accommodated with above-mentioned carrying mechanism portion 100 and exposure portion 200; Mask dust removal unit control device 400, controls the mask dust removal unit 230 (illustrating) in exposure portion 200 below; And exposure objective table control device 500, control the exposure objective table 240 (illustrating) in exposure portion 200 below.Although the exposure device 10 involved by embodiment omits diagram except these component parts, be also provided with static elimination portion etc., eliminate mask plate 210 and substrate W etc. with electrostatic.
Carrying mechanism portion 100 has: delivery section 110, carries long size flakes substrate W; Winder 120, reel the substrate W completing exposure exposed by exposure portion 200; Intermittent feeding mechanism portion 130, respectively presses ormal weight carrying substrate W off and on along x-axis; Substrate dust removal unit 140, is configured in delivery section 110 side compared with exposure portion 200, carries out dedusting to the light-sensitive surface A of substrate W; And feed rolls 151,152, be arranged in transport path.In addition, because delivery section 110 and winder 120 are respectively in roll, therefore hereinafter referred to as conveying roller 110, take up roll 120.
So, exposure device 10 involved by embodiment is respectively being wound in the process of the substrate W on conveying roller 110 by ormal weight carrying off and on, after made the light-sensitive surface A of substrate W expose by exposure portion 200, the exposure device of " volume to volume (Roll to Roll) " mode of substrate W of the exposure that reeled with take up roll.In addition, in this manual, using substrate W along x-axis by the side of removing to winder 120 as front side, will be described as rear side with this front side opposite side.
Intermittent feeding mechanism portion 130 in carrying mechanism portion 100 such as carries out following action successively repeatedly, fixed clamp device 131 is unclamped, also only ormal weight is carried by feeding clamper 132 chucking substrate W, by fixed clamp device chucking substrate W after only carrying ormal weight, thereafter, again make fixed clamp device 131 unclamp, also only carry ormal weight, by fixed clamp device chucking substrate W after only carrying ormal weight by feeding clamper 132 chucking substrate W.Thus, ormal weight conveying substrate W can be pressed off and on.In addition, the formation in intermittent feeding mechanism portion 130 is not limited to this formation, can adopt the intermittent feeding mechanism portion of various formation.
In addition, substrate dust removal unit 140 is the parts substrate W carried from conveying roller 110 being carried out to dedusting, in the roll on surface with adhesion, the component (such as having the rubber etc. of adhesion) using order to have adhesion in the exposure device 10 involved by embodiment is formed as the parts of roll.
So, because substrate dust removal unit 140 is in roll, thus also substrate dust removal unit 140 is called " substrate cleaning roller 140 ".In addition, although substrate cleaning roller 140 is the parts with adhesion, its adhesion is in can the degree of dust of the upper existence of the light-sensitive surface A of ad-hesion removal rate substrate W, and it is the adhesion that can not cause harmful effect degree to the light-sensitive surface A of substrate W.In addition, the light-sensitive surface A of substrate W refers to the face being coated with photoresist etc. on substrate W, and photoresist is in the state of drying.
Substrate cleaning roller 140 is made up of 2 rollers 141,142 in the mode clipping substrate W.In addition, the dedusting carrying out the light-sensitive surface A of substrate W is considered if main, also can be then that the roller 141 of only light-sensitive surface side has substrate dedusting function, but possess substrate dedusting function by making 2 rollers 141,142, be not then the light-sensitive surface A of substrate W, the dedusting with the face of light-sensitive surface A opposite side can also be realized.Therefore, preferred roller 142 also has substrate dedusting function, and it is positioned at on the face of the light-sensitive surface A opposite side of substrate W.
Fig. 2 is the formation in exposure portion 200 in the exposure device 10 in order to illustrate involved by embodiment and the figure illustrated.Side view when Fig. 2 (a) is the exposure portion 200 observed from conveying roller 110 side along X-axis Fig. 1, Fig. 2 (b) is that a-a in Fig. 2 (a) is to looking vertical view.With reference to Fig. 2, exposure portion 200 is described.
Exposure portion 200 has: not shown light source; Mask plate 210, is made up of the light-transmitting member of clear glass etc., has the thickness of regulation; Mask plate maintaining part 220, makes to keep mask plate 210 under pattern plane M state down; Mask dust removal unit 230, carries out the action to pattern plane M dedusting; Exposure objective table 240, is configured in and clips substrate W and on the position relative with mask plate 210, can be elevated along the z-axis orthogonal with xy plane; Mask dust removal unit driving mechanism portion 250, moves back and forth along x-axis for making mask dust removal unit 230; And exposure objective table driving mechanism portion 260, be elevated along z-axis for making exposure objective table 240.
In addition, in the exposure device 10 involved by embodiment 1, mask plate 210 is identical length L1 (with reference to Fig. 1) along length and the mask plate maintaining part 220 of x-axis along the length of x-axis.In addition, mask plate maintaining part 220 is the parts along z-axis with specific thickness.
Mask dust removal unit 230 is in the roll on surface with adhesion.The component (such as having the rubber etc. of adhesion) using order to have adhesion in the exposure device 10 involved by embodiment is formed as the parts of roll.
So, because mask dust removal unit 230 is in roll, thus also mask dust removal unit 230 is called " mask cleaning roller 230 ".In addition, although mask cleaning roller 230 is the parts with adhesion, its adhesion is in can the degree of dust of the upper existence of the pattern plane M of ad-hesion removal rate mask plate 210, and it is the adhesion that can not cause harmful effect degree to the pattern plane M of mask plate 210.
Exposure objective table 240 has exposure worktable 241.Exposure worktable 241 is configured to across substrate W relative with the pattern plane M of mask plate 210, plays the effect keeping substrate W from downside.
In addition, be formed with stand portion 242L, 242R in the left and right sides of exposure objective table 240 along x-axis, it is outstanding to the direction along y-axis.Stand portion 242L, 242R being provided with mask dust removal unit driving mechanism portion 250, moving back and forth along x-axis for making mask cleaning roller 230.
Mask dust removal unit driving mechanism portion 250 has: guide rail 251L, 251R, is laid on stand portion 242L, 242R respectively; Slide block 252L, 252R, can along the upper slip of above-mentioned guide rail 251L, 251R; Ball screw 253L, 253R, move back and forth along x-axis for making slide block 252L, 252R; Mask cleaning roller support portion 254L, 254R, be fixed on slide block 252L, 252R, is supported for rotatable in the left and right sides by the turning axle 231 of mask cleaning roller 230; And motor (not shown), for carrying out rotary actuation to ball screw 253L, 253R.In addition, motor can use servo motor.
Because mask dust removal unit driving mechanism portion 250 is in this structure, therefore ball screw 253L, 253R rotates clockwise or counterclockwise respectively under synchronous state, slide block 252L, 252R moves back and forth along x-axis thus, and accordingly, mask cleaning roller 230 also moves back and forth along x-axis.In addition, specialized range interior between an end 240a along x-axis of exposure objective table 240 and another end 240b as movable range (illustrating below), is moved back and forth along in this movable range by mask dust removal unit driving mechanism portion 250 by mask cleaning roller 230.
Such as, (observe counter clockwise direction during front side) counterclockwise rotate by ball screw 253L, 253R, thus slide block 252L, 252R forwards advance side along x-axis, thus, mask cleaning roller 230 also forwards advances side along x-axis.
Such as, (observe clockwise direction during front side) clockwise by ball screw 253L, 253R and rotate, thus slide block 252L, 252R advance rearward along x-axis, thus, mask cleaning roller 230 also advances rearward along x-axis.
The mask dust removal unit driving mechanism portion 250 of formation like this is controlled by mask dust removal unit control device 400, thus, controls mask cleaning roller 230.
And then, mask cleaning roller support portion 254L, 254R are formed with U-shaped bearing groove 255 (with reference to Fig. 1) respectively, for being supported for rotatable by mask cleaning roller 230.The upper end side opening of this bearing groove 255, mask cleaning roller 230 falls into from the opening of bearing groove 255 by making turning axle 231, thus is in and is supported for rotatable state by bearing groove 255.
Owing to being this structure, therefore mask cleaning roller 230 is is easily freely installed and removed on mask cleaning roller support portion 254L, 254R, easily can carry out the maintenance of the cleaning, exchange etc. of mask cleaning roller 230.In addition, mask cleaning roller 230 is not rotated by power, but is supported on mask cleaning roller support portion 254L, 254R in the mode of idle running.
In addition, 254L, 254R are supported on slide block 252L, 252R by guide finger 256 and spring 257 in mask cleaning roller support portion, when mask cleaning roller support portion 254L, 254R apply pushing force downwards along z-axis, then relative to this pushing force, the resistibility that the elastic force of spring 257 produces is had an effect.Therefore, when the mask cleaning roller 230 be supported on mask cleaning roller support portion 254L, 254R is abutted with the pattern plane M of mask plate 210, then mask cleaning roller 230 is contacted with the pattern plane M of mask plate 210 with the pushing force of regulation by the elastic force of spring 257.
On the other hand, expose objective table 240 to be elevated along z-axis by exposure objective table driving mechanism portion 260.Exposure objective table driving mechanism portion 260 has: lifting table 261, is fixed on exposure objective table 240; Exposure objective table ball screw 263, is elevated along z-axis for making lifting table 261; And motor (not shown), for carrying out rotary actuation to ball screw 263.In addition, motor can use servo motor.
The exposure objective table driving mechanism portion 260 of formation like this rotates clockwise or counterclockwise by making ball screw 263, thus exposure objective table 240 can be made to be elevated along z-axis.In addition, when exposure objective table 240 being elevated by exposure objective table driving mechanism portion 260, then just do not expose objective table 240, carrying mechanism portion 100 entirety is also elevated.
Thus, such as make ball screw 263 counterclockwise (along z-axis observe top time counter clockwise direction) rotate time, then expose objective table 240 along z-axis rise, and carrying mechanism portion 100 also with exposure objective table 240 together with rise.In addition, " also rising in carrying mechanism portion 100 together with exposure objective table 240 " refers to, conveying roller 110, take up roll 120, intermittent feeding mechanism portion 130, substrate cleaning roller 140 and substrate W rise together with exposure objective table 240.
On the other hand, make ball screw 263 clockwise (along z-axis observe top time clockwise direction) rotate time, then expose objective table 240 along z-axis decline, and carrying mechanism portion 100 also with exposure objective table 240 together with decline.In addition, " carrying mechanism portion 100 also declines together with exposure objective table 240 " refers to, conveying roller 110, take up roll 120, intermittent feeding mechanism portion 130, substrate cleaning roller 140 and substrate W decline together with exposure objective table 240.
The exposure objective table driving mechanism portion 260 of formation like this by exposure objective table control device 500 by drived control.
In addition, due to the ball screw that ball screw 253L, the 253R be arranged in mask dust removal unit driving mechanism portion 250 is for driving mask dust removal unit 230 (mask cleaning roller 230), therefore sometimes also referred to as mask dust removal unit ball screw 253L, 253R.In addition, because the ball screw 263 be arranged in exposure objective table driving mechanism portion 260 is the ball screws for driving exposure objective table 240, therefore sometimes also referred to as exposure objective table ball screw 263.
Fig. 3 is the figure of the formation that mask dust removal unit control device 400 in the exposure device 10 involved by embodiment and exposure objective table control device 500 are shown.Fig. 3 (a) illustrates the formation of mask dust removal unit control device 400, and Fig. 3 (b) illustrates the formation of exposure objective table control device 500.
As shown in Fig. 3 (a), mask dust removal unit control device 400 has: mask dust removal unit ball screw drive division (servo motor etc.) 410, drives mask dust removal unit ball screw 253L, 253R respectively; Storage part 420, stores the set information etc. for the control program and user controlling mask cleaning roller 230 advance; And advance control part 430, according to the storage content-control mask dust removal unit ball screw drive division 410 of storage part 420, forwards side or rear side advance to control mask cleaning roller 230 thus.
As shown in Fig. 3 (b), exposure objective table control device 500 has: exposure objective table ball screw drives Move portion (servo motor etc.) 510, drives exposure objective table ball screw 263; Storage part 520, stores and exposes the control program of objective table 240 lifting and the set information etc. of user for controlling; And elevating control portion 530, the storage content-control exposure objective table ball screw according to storage part 520 drives Move portion 510, controls rising or the decline of exposure objective table 240 thus.
In addition, although in figure 3, respectively storage part (storage part 420 and storage part 520) is set in mask dust removal unit control device 400 and exposure objective table control device 500, also can shares 1 storage part.
Fig. 4 to Fig. 7 is action in order to the exposure device 10 involved by embodiment is described and the figure illustrated.Fig. 4 (a) to Fig. 4 (d), Fig. 5 (a) are the figure that respective operation is shown to Fig. 5 (c), Fig. 6 (a) to Fig. 6 (d) and Fig. 7 (a) to Fig. 7 (c).In addition, Fig. 4 to Fig. 7 is the figure of the action in order to the mask cleaning roller 230 in exposure portion 200 is mainly described.Therefore, the carrying mechanism portion 100 in the component parts shown in Fig. 1 omits diagram, and in addition, in exposure portion 200, exposure objective table driving mechanism portion 260 grade also omits diagram.In addition, abridged symbol is also had in the symbol marked in Fig. 1 and Fig. 2 in exposure portion 200.
In addition, in Fig. 4 to Fig. 7, the control of advancing for making mask cleaning roller 230 is undertaken by the mask dust removal unit control device 400 shown in Fig. 3 (a), and the control be elevated for making exposure objective table 240 is undertaken by the exposure objective table control device 500 shown in Fig. 3 (b).
In the exposure device 10 involved by embodiment, substrate W is respectively carried by ormal weight off and on by carrying mechanism portion 100, after carrying out 1 carrying, the some photosensitive regions (being such as photosensitive region A1) become in the light-sensitive surface A of substrate W in multiple photosensitive regions (representing this photosensitive region with A1, A2) of exposure object are in the position facing with the pattern plane M of mask plate 210 on exposure worktable 241.And, be in the carrying of the facing position upper substrate W of the pattern plane M of photosensitive region A1 and mask plate 210 state temporarily stopped, by exposing in this condition, thus on photosensitive region A1 pattern transferring.
And, after the end exposure of photosensitive region A1, substrate W is only carried ormal weight again, and in the light-sensitive surface A of substrate W, next photosensitive region (being such as photosensitive region A2) is in the position facing with the pattern plane M of mask plate 210 on exposure worktable 241.And, be in the carrying of the facing position upper substrate W of the pattern plane M of photosensitive region A2 and mask plate 210 state temporarily stopped, by exposing in this condition, thus on photosensitive region A2 pattern transferring.Repeatedly carry out this action.
In the process of carrying out this action, substrate W carries out dedusting by substrate cleaning roller 140, and the pattern plane M of mask plate 210 carries out dedusting by mask cleaning roller 230.The dedusting of the substrate W undertaken by substrate cleaning roller 140 and the dedusting of the pattern plane M of mask plate 210 undertaken by mask cleaning roller 230 during substrate W is handled upside down in carry out.In addition, the dedusting of the substrate W undertaken by substrate cleaning roller 140 can be rotated by substrate cleaning roller 140 when each carrying substrate W be carried out, and therefore, is described in this dedusting action to mask cleaning roller 230.
Fig. 4 (a) is the state that mask cleaning roller 230 starts before dedusting action, and the position of the mask cleaning roller 230 when being in this state is called initial position.Now, substrate W has started to carry action.
When mask cleaning roller 230 is in the initial position shown in Fig. 4 (a), this mask cleaning roller 230 is in along position (turning axle 231 is along the position of the x-axis) x1 of x-axis the position (also referred to as the 1st position x1) only leaving predetermined distance from end (the being called rear side end) 210a of mask plate 210 rear side along x-axis further rearward.
In addition, mask cleaning roller 230 is in along position (the upper side summit P1 circumferentially in mask cleaning roller 230 is along the position of the z-axis) z2 of z-axis the position only leaving predetermined distance compared with the position z1 of the pattern plane M of mask plate 210 to the lower side.
When mask cleaning roller 230 is in this initial position, this mask cleaning roller 230 is in non-contacting state with the pattern plane M of mask plate 210.
From the state being in the initial position shown in Fig. 4 (a) along x-axis, forwards only advance mask cleaning roller 230 ormal weight in side, planar portions near the rear side end 210a of arrival and mask plate 210, during relative near the rear side end e1 of i.e. pattern plane M position x2 (with reference to Fig. 4 (b)), exposure objective table 240 is along z-axis rising ormal weight, and mask cleaning roller 230 contacts (with reference to Fig. 4 (c)) with near the rear side end e1 of the pattern plane M of mask plate 210.Thereafter, mask cleaning roller 230 under the state contacted with the pattern plane M of mask plate 210 along x-axis forwards (arrow x direction) advance.
Now, under the state that mask cleaning roller 230 is had an effect in the elastic force of spring 257, as shown in Fig. 4 (c), rotate under the state contacted with the pattern plane M of mask plate 210 and advance.Thus, the dust that the pattern plane M of mask plate 210 exists can be made to be attached to mask cleaning roller 230 side, accordingly, dedusting can be carried out to the pattern plane M of mask plate 210.
So, under the state that mask cleaning roller 230 contacts with the pattern plane M of mask plate 210, this mask cleaning roller 230 is in the state being pushed the pattern plane M of mask plate 210 by the elastic force of spring 257.Therefore, the control carrying out the pushing force relative to mask plate 210 when mask cleaning roller 230 contacts with the pattern plane M of mask plate 210 etc. especially is not needed.
In addition, although mask cleaning roller 230 is the parts with adhesion, but due to the degree that its adhesion is the dust that the pattern plane M of ad-hesion removal rate mask plate 210 exists, therefore harmful effect can not be caused to the pattern etc. be formed on the pattern plane M of mask plate 210.
So, mask cleaning roller 230 rotates under the state contacted with the pattern plane M of mask plate 210 and forwards advance in side, when arriving end (the being called front side end) 210b of mask plate 210 front side, time near the front side end e2 of the i.e. pattern plane M of mask plate 210 (with reference to Fig. 4 (d)), then expose objective table 240 and declines (reference Fig. 5 (a)) from the state of Fig. 4 (d) along z-axis.Mask cleaning roller 230 is now the position z2 identical with Fig. 4 (a) along the position (upper side summit P1 is circumferentially along the position of z-axis) of z-axis.In addition, exposure objective table 240 only decline ormal weight time, then together with the decline of this exposure objective table 240, carrying mechanism portion 100 entirety also only declines ormal weight.
And, mask cleaning roller 230 forwards advances further, arrives and forwards leaves the position x4 (also referred to as the 2nd position x4) (with reference to Fig. 5 (b)) of predetermined distance in side from the front side end 210b (the front side end e2 of pattern plane M) of mask plate 210 along x-axis.
Mask cleaning roller 230 advances to the 2nd position x4 shown in Fig. 5 (b) action along x-axis from the 1st position x1 shown in Fig. 4 (a) during substrate W is handled upside down in carry out.Therefore, the exposure actions of not carrying out exposing the script that such exposure device 10 carries out to respectively carrying long size flakes substrate W by ormal weight off and on impacts, and just can carry out dedusting to the pattern plane M of mask plate 210.In addition, the dedusting of the substrate W carried out due to substrate cleaning roller 140 also can be carried out in the carrying of substrate W, therefore can not produce the loss of time caused by the dedusting of the pattern plane M carrying out substrate W and mask plate 210.
So, when mask cleaning roller 230 arrives position x4 (the 2nd position x4) shown in Fig. 5 (b), exposure objective table 240 only rise ormal weight (with reference to Fig. 5 (c)).Exposure objective table 240 only rising ormal weight time, then together with the rising of this exposure objective table 240, carrying mechanism portion 100 entirety also only rises ormal weight.
In addition, due to exposure objective table 240 only rising ormal weight time, mask cleaning roller 230 has arrived and has forwards left the position x4 (the 2nd position x4) of predetermined distance in side from the front side end 210b (the front side e2 of pattern plane M) of mask plate 210 along x-axis, and therefore mask cleaning roller 230 can not abut with mask plate 210 and mask plate maintaining part 220.In addition, mask cleaning roller 230 does not also abut with other not shown component parts.Thus, expose objective table 240 to rise as Suo Shi Fig. 5 (c).
The ascending amount of exposure objective table 240 is the light-sensitive surface A (being now photosensitive region A1) of substrate and the ascending amount of the pattern plane M of mask plate 210 near to or in contact with degree.As shown in Fig. 5 (c), when the photosensitive region A1 and mask plate 210 that are in substrate W pattern plane M near to or in contact with state time, then expose in this condition.Thus, pattern transferring on the photosensitive region A1 of substrate W.
In addition, although also can make to touch between the light-sensitive surface of substrate W when exposing and the pattern plane M of mask plate 210, the interval that there is slight void (such as about 1/100mm to 4/100mm) degree can also be set.
So, by arranging small space (such as about 1/100mm to 4/100mm) between the light-sensitive surface and the pattern plane M of mask plate 210 of substrate W, even if thus at the remaining dust having pettiness in substrate W side, remaining dust also can be prevented to be attached to the pattern plane M of mask plate 210.
And after end exposure, again start the carrying action of the interval of substrate W, substrate W is only handled upside down ormal weight.So, when again starting the carrying action of the interval of substrate W, as shown in Fig. 6 (a), exposure objective table 240 declines from the state of Fig. 5 (c) along z-axis.In addition, exposure objective table 240 only decline ormal weight time, then together with the decline of this exposure objective table 240, carrying mechanism portion 100 entirety also only declines ormal weight.In addition, mask cleaning roller 230 is now the position (2nd position x2) identical with Fig. 5 (b) along the position of x-axis.
Thereafter, mask cleaning roller 230 only to advance ormal weight rearward from the position shown in Fig. 6 (a) along x-axis, planar portions near the front side end 210b of arrival and mask plate 210, during relative near the front side end e2 of the i.e. pattern plane M of mask plate 210 position x2 (with reference to Fig. 6 (b)), exposure objective table 240 is along z-axis rising ormal weight, and mask cleaning roller 230 contacts (with reference to Fig. 6 (c)) with near the front side end e2 of the pattern plane M of mask plate 210.Thereafter, mask cleaning roller 230 under the state contacted with the pattern plane M of mask plate 210 along x-axis rearward (arrow x ' direction) advance.
Now, under the state that mask cleaning roller 230 is had an effect in the elastic force of spring 257, rotate under the state contacted with the pattern plane M of mask plate 210 and advance.Thus, the dust that the pattern plane M of mask plate 210 exists can be made to be attached to mask cleaning roller 230 side, accordingly, dedusting can be carried out to the pattern plane M of mask plate 210.
So, mask cleaning roller 230 rotates and advances rearward under the state contacted with the pattern plane M of mask plate 210, near the final rear side end e1 arriving the pattern plane M of mask plate 210 (with reference to Fig. 6 (d)).So exposure objective table 240 declines (with reference to Fig. 7 (a)) from Fig. 6 (d) state.Mask cleaning roller 230 is now the position z2 identical with Fig. 4 (a) along the position (upper side summit P1 is circumferentially along the position of z-axis) of z-axis.In addition, exposure objective table 240 only decline ormal weight time, then together with the decline of this exposure objective table 240, carrying mechanism portion 100 entirety also only declines ormal weight.
And, mask cleaning roller 230 advances further rearward, arrives the position x1 (the 1st position x1) (with reference to Fig. 7 (b)) leaving predetermined distance from the rear side end 210a (the rear side end e1 of pattern plane M) of mask plate 210 along x-axis rearward.
The action that mask cleaning roller 230 advances to the 1st position x1 shown in Fig. 7 (b) from the 2nd position x4 shown in Fig. 5 (b) during substrate W is handled upside down in carry out.Therefore, the exposure actions of not carrying out exposing the script that such exposure device 10 carries out to respectively carrying long size flakes substrate W by ormal weight off and on impacts, and just can carry out dedusting to the pattern plane M of mask plate 210.
So, as shown in Fig. 7 (b), as mask cleaning roller 230 in-position x1 (the 1st position x1), exposure objective table 240 only rise ormal weight (with reference to Fig. 7 (c)).This is the action the same with Fig. 5 (c).Now, with the rising of exposure objective table 240, carrying mechanism portion 100 entirety also only rises ormal weight.As shown in Fig. 7 (c), when the light-sensitive surface (it is photosensitive region A2) Yu mask plate 210 that are in substrate W pattern plane M near to or in contact with state time, then expose in this condition.Thus, pattern transferring on the photosensitive region A2 of substrate W.
Now, due to also expose objective table 240 only rising ormal weight time, mask cleaning roller 230 arrives the position x1 (the 1st position x1) leaving predetermined distance from the rear side end 210a (the rear side end e1 of pattern plane M) of mask plate 210 along x-axis rearward, and therefore mask cleaning roller 230 can not abut with mask plate 210 and mask plate maintaining part 220.In addition, mask cleaning roller 230 does not also abut with other not shown component parts.Thus, expose objective table 240 to rise as Suo Shi Fig. 7 (c).
And after end exposure, exposure objective table 240 declines from the state of Fig. 7 (c).Now, also again start the carrying action of the interval of substrate W, substrate W is only handled upside down ormal weight.In addition, after end exposure, state when exposure objective table 240 declines from the state of Fig. 7 (c) becomes the state identical with Fig. 4 (a).Again repeatedly carry out following action from this state, namely carry out Fig. 4 (b) to Fig. 4 (d), Fig. 5 (a) return Fig. 4 (a) to Fig. 6 (d) and Fig. 7 (a) to Fig. 7 (c) action to Fig. 5 (c), Fig. 6 (a) successively.
So, in the exposure device 10 involved by embodiment, mask cleaning roller 230 using between the 1st position x1 and the 2nd position x4 as movable range when moving back and forth, carry out the action of the pattern plane M dedusting to mask plate 210 in this movable range of an edge.And, using mask cleaning roller 230 along in movable range to front side advance action as front forward motion, and using mask cleaning roller 230 along the action of advancing rearward in movable range as rear forward motion time, mask cleaning roller 230 carries out the action of the pattern plane M dedusting to mask plate 210 respectively in front forward motion and rear forward motion.In addition, in front forward motion and rear forward motion, the action that the pattern plane M of mask plate 210 carries out dedusting is carried out alternately between off and on respectively by the action of ormal weight carrying substrate W respectively.Therefore, mask dedusting action can effectively be carried out.
But, when the state (with reference to Fig. 4 (a)) being in the position left respectively along x-axis and z-axis relative to mask plate 210 from mask cleaning roller 230 becomes state (reference Fig. 4 (c)) that mask cleaning roller 230 contacts with the pattern plane M of mask plate 210, as shown in Fig. 4 (a) to Fig. 4 (c), mask cleaning roller 230 directly contacts with the pattern plane M of mask plate 210.
Therefore, there will not be mask cleaning roller 230 forwards thruster to press the situation of the rear side end 210a of mask plate 210, can prevent the position of mask plate 210 from offseting, and the breakages such as the bight in the rear side end 210a of mask plate 210 can be prevented.
In addition, although in Fig. 4 (c), the position x2 along x-axis when mask cleaning roller 230 contacts with pattern plane M is the position consistent with the rear side end 210a of mask plate 210 (the rear side end e1 of pattern plane M), but not necessarily the position consistent with the rear side end 210a of mask plate 210 (the rear side end e1 of pattern plane M), also can be mask plate 210 rear side end 210a near planar portions, namely the rear side end e1 of pattern plane M is neighbouring (such as, the actual rear side end forming figuratum pattern forming region in pattern plane M).Importantly, so long as not rear side end 210a or the position that makes bight in the rear side end 210a of mask plate 210 etc. damaged of forwards thruster pressure mask plate 210, and it is the position can carrying out dedusting to the pattern forming region in the pattern plane M of mask plate 210 effectively.
In addition, when mask cleaning roller 230 advances rearward from the 2nd position x4, also when the state (with reference to Fig. 6 (a)) being in from mask cleaning roller 230 position left respectively along x-axis and z-axis relative to mask plate 210 becomes state (reference Fig. 6 (c)) that mask cleaning roller 230 contacts with mask plate 210, as shown in Fig. 6 (a) to Fig. 6 (c), mask cleaning roller 230 directly contacts with the pattern plane M of mask plate 210.
Therefore, there will not be mask cleaning roller 230 to push the situation of the front side end 210b of mask plate 210 rearward, can prevent the position of mask plate 210 from offseting, and the breakages such as the bight in the front side end 210b of mask plate 210 can be prevented.
In addition, although in Fig. 6 (c), the position x3 along x-axis when mask cleaning roller 230 contacts with pattern plane M is the position consistent with the front side end 210b of mask plate 210 (the front side end e2 of pattern plane M), but now also need not to be the position consistent with the front side end 210b of mask plate 210 (the front side end e2 of pattern plane M), also can be mask plate 210 front side end 210b near planar portions, namely the front side end e2 of pattern plane M is neighbouring (such as, the actual front side end forming figuratum pattern forming region in pattern plane M).Importantly, so long as not the front side end 210b pushing mask plate 210 rearward or the position making bight in the front side end 210b of mask plate 210 etc. damaged, and it is the position can carrying out dedusting to the pattern forming region in the pattern plane M of mask plate 210 effectively.
As described above, the exposure device 10 involved by embodiment, the action carrying out dedusting by the pattern plane M of mask cleaning roller 230 pairs of mask plates 210 during substrate W is handled upside down in automatically carry out.In addition, not only just carried out the dedusting of the pattern plane M of mask plate 210 by mask cleaning roller 230, the dedusting of substrate W can also be carried out by substrate cleaning roller 140.In addition, substrate cleaning roller 140 couples of substrate W carry out dedusting action also during substrate W is handled upside down in automatically carry out.Therefore, the exposure actions of originally carrying out in the exposure device of volume to volume mode is not impacted, just can carry out the pattern plane M of mask plate 210 and the dedusting of substrate W.Thus, exposure actions speed originally can be kept.
In addition, in the exposure device 10 involved by embodiment, mask cleaning roller 230, in following structure, is contacted with the pattern plane M of mask plate 210 under the state giving regulation pushing force by the elastic force of spring 257.Therefore, mask cleaning roller 230 can be made to contact with pattern plane M with suitable pushing force, do not need the control etc. of pushing force when contacting accurately.In addition, the interval (interval along z-axis) of mask cleaning roller 230 and pattern plane M does not need to adjust accurately yet, can alleviate the adjustment operation at the interval (interval along z-axis) of mask cleaning roller 230 and pattern plane M.Thus, the exposure device 10 involved by embodiment, can simplify the whole mechanism for carrying out dedusting to the pattern plane M of mask plate 210.
In addition, the invention is not restricted to above-mentioned embodiment, various distortion can be implemented without departing from the scope of the subject in the invention.Such as, also shown distortion can be implemented as follows.
(1) in the above-described embodiment, although ball screw 253L, 253R are arranged on slide block 252L, 252R of the left and right sides, rotate under synchronous state by making both, thus mask cleaning roller 230 is moved back and forth along x-axis, but ball screw may also be only left and right any one.Such as, when the right side slide block 252R only in Fig. 2 (a) arranges ball screw 253R, then left slider 252L and right side slide block 252R advance interlock and advance along on guide rail 251L.As this structure, mask cleaning roller 230 also can be made to move back and forth along x-axis.
In addition, when driving slide block 252L, 252R of the left and right sides by 1 ball screw, then 1 ball screw also can be configured on the centre position of left slider 252L and right side slide block 252R along x-axis.Accordingly, slide block 252L, 252R of the left and right sides can be driven well by 1 ball screw balance.
(2) in the above-described embodiment, although mask dust removal unit driving mechanism portion 250 uses ball screw and makes the mechanism that mask cleaning roller 230 moves back and forth along x-axis, make mask cleaning roller can adopt mechanism miscellaneous along the mechanism that x-axis moves back and forth.In addition, although exposure objective table driving mechanism portion 260 uses ball screw and makes the mechanism that exposure objective table 240 is elevated, exposure objective table 240 is made can to adopt mechanism miscellaneous along the mechanism of z-axis lifting moving.
(3) in the above-described embodiment, being parts that the component having adhesion by mask cleaning roller 230 entirety is formed, but being not limited to this although the description of mask cleaning roller 230, also can be that only mask cleaning roller 230 surface has the parts of adhesion.Such as, both can be the form at the surface wrap of the cylinder formed by synthetic resin etc. with the component of adhesion, in addition, also can be the form being formed with adhesion layer on the surface of cylinder.Substrate cleaning roller 140 is also the same.
(4) in the above-described embodiment, although configure upward exemplified with the light-sensitive surface A of substrate W and the exposure device that configures down of the pattern plane M of mask plate 210, being not limited to this, also can be contrary configuration.That is, also can be that the light-sensitive surface A of substrate W configures and the exposure device that configures upward of the pattern plane M of mask plate 210 down.
(5) in the above-described embodiment, although when exposing exemplified with making the light-sensitive surface A of substrate W in exposure portion 200, situation about exposing is carried out under the state that slight void is set between the light-sensitive surface A and the pattern plane M of mask plate 210 of substrate W, but necessarily small space is not set between the light-sensitive surface A and the pattern plane M of mask plate 210 of substrate W, also can exposes under the state making the pattern plane M of the light-sensitive surface A of substrate W and mask plate 210 touch.
(6) in the above-described embodiment, although mask dust removal unit carries out the action of the pattern plane M dedusting to mask plate 210 respectively in front forward motion and rear forward motion, also can only front forward motion and rear forward motion any one in carry out dedusting.
(7) in the above-described embodiment, although exemplified with as mask dust removal unit, use the roller (mask cleaning roller 230) be made up of the component with adhesion, carried out the situation of dedusting by the dust of adhesion to existence on the pattern plane M of mask plate 210 of mask cleaning roller 230, but be not limited thereto.Such as, mask dust removal unit also can be the form utilizing vacuum attraction and carry out dedusting.So, exposure device when mask dust removal unit being utilized vacuum attraction to carry out dedusting as exposure device of the present invention variation and be described.
The variation of exposure device of the present invention is configured to, mask dust removal unit 230 has the suction port along the y-axis direction in the pattern plane M of mask plate 210, utilize the aspiration-type mask dust removal unit attracting the pattern plane M of mask plate 210 to be carried out to dedusting, aspiration-type mask dust removal unit to the action that the pattern plane M of mask plate 210 carries out dedusting be play attractive force under the state between the pattern plane M of mask plate 210 with void and along mask plate 210 pattern plane M and along the x-axis direction before so that carry out the form of action.
In addition, even if mask dust removal unit utilizes vacuum attraction and carries out dedusting, it also can be the formation identical with the exposure device illustrated in above-mentioned embodiment that the entirety of exposure device is formed.In addition, in the following description, will vacuum attraction be utilized to carry out the mask dust removal unit of dedusting as aspiration-type mask dust removal unit.
Then be described simply when this aspiration-type mask dust removal unit being such as applied to the exposure device shown in Fig. 1.Aspiration-type mask dust removal unit has elongated suction port on the Width (along the direction of y-axis in Fig. 1) of mask plate 210.This aspiration-type mask dust removal unit is the same with mask cleaning roller 230, can be arranged on mask cleaning roller support portion 254L, 254R.Now, the suction hole of aspiration-type mask dust removal unit upward, with can be relative with the pattern plane M of mask plate 210.
And, when carrying out dedusting, as long as carry out the action substantially same with Fig. 4 to Fig. 7.But, because aspiration-type mask dust removal unit and aspiration-type substrate dust removal unit carry out dedusting respectively relative to the pattern plane M of mask plate 210 under non-contacting state, therefore do not need aspiration-type mask dust removal unit is contacted with the pattern plane M of mask plate 210.Thus, if the initial position shown in Fig. 4 (a), the interval along z-axis of the suitable suction port of setting aspiration-type mask dust removal unit and the pattern plane M of mask plate 210, as long as then make aspiration-type mask cleaning roller move back and forth along x-axis along the position of z-axis under the state remained unchanged.
In addition, because aspiration-type mask dust removal unit carries out dedusting relative to the pattern plane M of mask plate 210 under non-contacting state, the structure contacted with the pattern plane M of mask plate 210 by the elastic force of spring 257 as mask cleaning roller 230 is not therefore needed.
By using this aspiration-type mask dust removal unit, also can be the same with above-mentioned embodiment, in during respectively pressing ormal weight carrying substrate W off and on, dedusting is carried out to the pattern plane M of mask plate 210.In addition, in substrate dust removal unit 140, also aspiration-type substrate dust removal unit can be used equally.
(8) in the above-described embodiment, although as shown in Figure 1, show mask dust removal unit control device 400 and expose the example that objective table control device 500 is incorporated in exposure device framework 300 inside, but also can be arranged on the outside of exposure device framework 300.
(9) in the above-described embodiment, although as shown in Figure 1, mask plate 210 is identical length L1 along length and the mask plate maintaining part 220 of x-axis along the length of x-axis, but not necessarily identical length, when in the rising with exposure objective table 240, mask cleaning roller 230 rises, as long as do not hinder the rising of mask cleaning roller 230, then mask plate maintaining part 220 also can be longer than mask plate 210 along the length of x-axis.
Claims (7)
1. an exposure device, be respectively be located at by ormal weight barrow in the process of the long size flakes substrate between delivery section and winder off and on, making the pattern plane of the light-sensitive surface of described substrate and mask plate facing, and make the exposure device that the light-sensitive surface of described substrate exposes, it is characterized in that
Make the x-axis of described substrate in the xy plane that formed by x-axis and y-axis be front side towards the side of described winder, when to make with this front side opposite side be rear side, then have:
Exposure objective table, is configured in and clips described substrate and on the position relative with described mask plate, can along the z-axis orthogonal with xy plane and described substrate one lifting;
Mask dust removal unit, moving back and forth and can be elevated along z-axis together with described exposure objective table along x-axis can be realized, and be arranged on described exposure objective table, described mask plate side is positioned at the state left from the light-sensitive surface of described substrate along z-axis, described rear side end to major general from described mask plate along x-axis leave rearward further predetermined distance the 1st position and from the described front side end of described mask plate along x-axis further forwards side leave predetermined distance the 2nd position between scope as movable range during described moving back and forth, advance while carry out the action of the pattern plane dedusting to described mask plate in this movable range of one edge,
Mask dust removal unit driving mechanism portion, for make described mask dust removal unit carry out described in move back and forth;
Mask dust removal unit control device, controls to move back and forth described in described mask dust removal unit by controlling described mask dust removal unit driving mechanism portion;
Exposure objective table driving mechanism portion, is elevated along z-axis for making described exposure objective table;
And exposure objective table control device, the lifting of described exposure objective table is controlled by controlling described exposure objective table driving mechanism portion,
Described mask dust removal unit is at least surperficial roll with adhesion,
The action that described mask dust removal unit carries out dedusting to the pattern plane of described mask plate carries out rotating the action of advancing under the state contacted with the pattern plane of described mask plate,
When described mask dust removal unit being contacted relative to described mask plate along the position that x-axis and z-axis are left respectively from described mask dust removal unit with the pattern plane of described mask plate,
Described mask dust removal unit control device controls described mask dust removal unit driving mechanism portion,
Described mask dust removal unit is arrived and the position relative near the end of x-axis in the pattern plane of described mask plate,
Described exposure objective table control device controls described exposure objective table driving mechanism portion,
When described mask dust removal unit arrives with relative near the end of x-axis position in the pattern plane of described mask plate, make described mask dust removal unit and contacting near the end of x-axis in the pattern plane of described mask plate,
When making the light-sensitive surface exposure of described substrate,
Described mask dust removal unit control device controls described mask dust removal unit driving mechanism portion, makes described mask dust removal unit be in the state arriving described 1st position or described 2nd position,
Described exposure objective table control device controls described exposure objective table driving mechanism portion, under the state that described mask dust removal unit arrives described 1st position or described 2nd position, described exposure objective table is made to move along z-axis and the light-sensitive surface of described substrate and the pattern plane of described mask plate are in contact or close state.
2. exposure device according to claim 1, is characterized in that,
Described mask dust removal unit during respectively carrying described substrate by ormal weight off and in carry out the action of the pattern plane dedusting to described mask plate.
3. exposure device according to claim 1 and 2, is characterized in that,
Using described mask dust removal unit along the action of advancing to described front side in described movable range as front forward motion, during using described mask dust removal unit along the action of advancing to described rear side in described movable range as rear forward motion,
Described mask dust removal unit carries out the action of the pattern plane dedusting to described mask plate respectively in described front forward motion and described rear forward motion,
The action in described front forward motion and described rear forward motion, dedusting being carried out to the pattern plane of described mask plate respectively during respectively carrying described substrate by ormal weight off and in carry out alternately.
4. exposure device as claimed in any of claims 1 to 3, is characterized in that,
Described mask dust removal unit is arranged on described exposure objective table, when being in the state contacted with the pattern plane of described mask plate, is acted on the power pushing described pattern plane by the elastic force of spring.
5. exposure device as claimed in any of claims 1 to 3, is characterized in that,
Described mask dust removal unit has the suction port along the y-axis direction in the pattern plane of described mask plate, is the aspiration-type mask dust removal unit of by attraction, the pattern plane of described mask plate being carried out to dedusting,
Described aspiration-type mask dust removal unit is play attractive force under the state between the pattern plane of described mask plate with void and along the pattern plane of described mask plate and the action of advancing along the x-axis direction to the action that the pattern plane of described mask plate carries out dedusting.
6. exposure device as claimed in any of claims 1 to 5, is characterized in that,
There is substrate dust removal unit, dedusting is carried out at least described light-sensitive surface of described substrate.
7. exposure device according to claim 6, is characterized in that,
Described substrate dust removal unit has the roll of adhesion at least surface, and it is set up with state contact with at least light-sensitive surface of described substrate, the carrying of adjoint described substrate when respectively carrying described substrate by ormal weight off and on and rotating.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-180743 | 2013-08-30 | ||
| JP2013180743A JP5631464B1 (en) | 2013-08-30 | 2013-08-30 | Exposure equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104423180A true CN104423180A (en) | 2015-03-18 |
| CN104423180B CN104423180B (en) | 2016-08-31 |
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| CN201410425472.1A Active CN104423180B (en) | 2013-08-30 | 2014-08-26 | Exposure device |
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| Country | Link |
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| JP (1) | JP5631464B1 (en) |
| KR (1) | KR101587731B1 (en) |
| CN (1) | CN104423180B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107024836A (en) * | 2016-02-02 | 2017-08-08 | 优志旺电机株式会社 | Roll-to-roll double-side exposal device |
| CN107734867A (en) * | 2017-09-06 | 2018-02-23 | 江门市泽天达科技有限公司 | A kind of exposure mechanism |
| CN108628106A (en) * | 2017-03-26 | 2018-10-09 | 株式会社阿迪泰克工程 | Exposure device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6729954B1 (en) * | 2019-10-18 | 2020-07-29 | 株式会社 ベアック | Exposure equipment |
| JP6832412B2 (en) * | 2019-11-25 | 2021-02-24 | 株式会社アドテックエンジニアリング | Roll-to-roll double-sided exposure device |
| JP6762640B1 (en) * | 2020-07-06 | 2020-09-30 | 株式会社 ベアック | Exposure device |
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| JP2002182372A (en) * | 2000-12-15 | 2002-06-26 | Nikon Corp | Projection alignment method and apparatus as well as method of manufacturing device |
| CN101470357A (en) * | 2007-12-27 | 2009-07-01 | 株式会社Orc制作所 | Exposure apparatus |
| WO2012150645A1 (en) * | 2011-05-02 | 2012-11-08 | 村田機械株式会社 | Orientation adjustment device, and orientation adjustment method |
| JP2013041997A (en) * | 2011-08-16 | 2013-02-28 | Fujitsu Semiconductor Ltd | Dust-proofing device for extreme ultraviolet exposure mask and exposure method |
| CN202649668U (en) * | 2012-06-19 | 2013-01-02 | 京东方科技集团股份有限公司 | Automatic mask cleaning system and exposure equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107024836A (en) * | 2016-02-02 | 2017-08-08 | 优志旺电机株式会社 | Roll-to-roll double-side exposal device |
| CN108628106A (en) * | 2017-03-26 | 2018-10-09 | 株式会社阿迪泰克工程 | Exposure device |
| CN108628106B (en) * | 2017-03-26 | 2021-12-21 | 株式会社阿迪泰克工程 | Exposure device |
| CN107734867A (en) * | 2017-09-06 | 2018-02-23 | 江门市泽天达科技有限公司 | A kind of exposure mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015049356A (en) | 2015-03-16 |
| JP5631464B1 (en) | 2014-11-26 |
| KR101587731B1 (en) | 2016-01-21 |
| KR20150026963A (en) | 2015-03-11 |
| CN104423180B (en) | 2016-08-31 |
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