CN104423166A - 感光性组合物与光刻胶 - Google Patents
感光性组合物与光刻胶 Download PDFInfo
- Publication number
- CN104423166A CN104423166A CN201310730591.3A CN201310730591A CN104423166A CN 104423166 A CN104423166 A CN 104423166A CN 201310730591 A CN201310730591 A CN 201310730591A CN 104423166 A CN104423166 A CN 104423166A
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- Prior art keywords
- bonding agent
- photosensitive composite
- ester
- photoreactive monomer
- solid content
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 22
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- 239000002131 composite material Substances 0.000 claims description 36
- 239000004310 lactic acid Substances 0.000 claims description 27
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明涉及一种感光性组合物与光刻胶。光刻胶由一感光性组合物经配制而形成。感光性组合物包括一粘合剂(binder agent)、一第一光反应单体(photomonomer)以及一光引发剂。粘合剂的化学结构具有表示如下的重复单元(repeating unit)I:其中R1为H或CH3,R2为C2~C4的烷基,n为2~40的整数,A为H或
Description
技术领域
本发明涉及感光性组合物及光刻胶(photoresist),特别是有关于由生质材料形成的感光性组合物及光刻胶。
背景技术
电子产业的光刻(lithography)工艺例如印刷电路板工艺会使用大量的光刻胶。一般的光刻胶,比方说负型光刻胶(negative type photoresist),主要全是由石油化学品例如丙烯酸酯(压克力,acrylate)系列原料所形成。当光刻胶在光刻程序例如显影、剥膜步骤等后,会成为无法回收使用的废弃物。这种废弃物每年有数千吨的产生量,且多是以掩埋或焚化等的方式处理。因此,光刻胶不但非常耗费石油材料,并且对自然环境有不良的影响。
发明内容
本发明涉及一种感光性组合物。感光性组合物与光刻胶主要是采用具有可生物分解性的生质材料形成,因此可再生使用,且不会对自然环境造成负荷。
根据本发明的一实施例,提出一种感光性组合物。感光性组合物包括一丙烯酸酯系粘合剂(acrylic binder agent)、一第一光反应单体(photomonomer)以及一光引发剂。第一光反应单体具有至少一乳酸寡聚物及2个以上的不饱和丙烯酸酯系官能基,以粘合剂的固含量为100重量份为基准,第一光反应单体约为25~95重量份。以粘合剂的固含量为100重量份为基准,光引发剂约为0.5~15重量份
根据本发明的另一实施例,提出一种感光性组合物。感光性组合物包括一粘合剂(binder agent)、一第一光反应单体以及一光引发剂。粘合剂的化学结构具有表示如下的重复单元(repeating unit)I:
其中R1为H或CH3,R2为C2~C4的烷基,n为2~40的整数,A为H或第一光反应单体(photomonomer)具有至少一乳酸寡聚物及2个以上的不饱和丙烯酸酯系官能基。以粘合剂的固含量为100重量份为基准,第一光反应单体约为25~95重量份。以粘合剂的固含量为100重量份为基准,光引发剂约为0.5~15重量份。
根据本发明的又一实施例,提出一种光刻胶。光刻胶由前述的感光性组合物经配制而形成。
具体实施方式
为了对本发明的上述及其它方面有更佳的了解,下文特举较佳实施例作详细说明如下:
根据本发明的实施例,感光性组合物包括一粘合剂(binder agent)、一第一光反应单体(photomonomer)及一光引发剂。
粘合剂是由一粘合组合物经聚合反应而成。实施例中,粘合剂例如是丙烯酸酯系粘合剂(acrylic binder agent)。举例来说,粘合组合物包括一乳酸寡聚物,粘合剂例如由带有不饱和丙烯酸酯系官能基的乳酸寡聚物经共聚合反应而制得。共聚合反应可以是经由加热进行的溶液聚合法。
第一光反应单体(photomonomer)具有至少一乳酸寡聚物及2个以上的不饱和丙烯酸酯系官能基,以粘合剂的固含量为100重量份为基准,第一光反应单体约为25~95重量份。
以粘合剂的固含量为100重量份为基准,光引发剂约为0.5~15重量份。
乳酸寡聚物主要以乳酸及丙烯酸酯系不饱合单体作为原料而制得,由于乳酸属于具有再生性质的生质材料,所制得的光刻胶就具有生物可分解性,故可重复使用。此外,于实施例中,乳酸寡聚物中含有不饱和丙烯酸酯系官能基,所以可以与其它不饱合单体进行自由基共聚合反应,得以合成具有高分子量的粘合剂。此外,乳酸寡聚物是容易量产且成本低。再者,乳酸寡聚物是一可分解的材料,对自然环境不会有不良的影响,不会对自然环境造成负荷。
于实施例中,黏合组合物的乳酸寡聚物可占粘合剂的固体成份达10~90重量百分比。
于实施例中,感光性组合物经配制后可形成一光刻胶,例如是负型光刻胶。于实施例中,光刻胶的耐酸性高、玻璃化转变温度(Tg)高、且是可生物分解的。
于一实施例中,共聚合反应后,粘合剂的化学结构具有表示如下的重复单元(repeating unit)I:
其中R1为H或CH3,R2为C2~C4的烷基,n为2~40的整数,A为H或
于另一实施例中,共聚合反应后,粘合剂的化学结构更可具有表示如下的重复单元II:
其中R1为H或CH3。
于再一实施例中,共聚合反应后,粘合剂的化学结构更可具有表示如下的重复单元III:
其中R1为H或CH3,R2为C1~C4的烷基,x和y为大于或等于1的整数。
于实施例中,黏合组合物更可包括其它反应单体,包括一含羧基的不饱和单体、一不含羧基的不饱和单体或一溶剂。
含羧基的不饱和化合物包括例如丙烯酸(acrylic acid)、甲基丙烯酸(methyl acrylic acid)、顺-丁烯二酸、反-丁烯二酸或衣康酸(itaconic acid)等等。于实施例中,含羧基的不饱和化合物可占粘合剂的固含量约5~45重量份。其中具有不饱和双键的衣康酸可经由发酵工艺得到,且为具有再生性质的生质材料。
不含羧基的不饱和单体包括丙烯酸酯系列单体如丙烯酸甲酯(methylacrylate)、甲基丙烯酸甲酯(methyl methacrylate)、丙烯酸乙酯、甲基丙烯酸乙酯、丙烯酸丙酯、甲基丙烯酸丙酯、丙烯酸异丙酯、甲基丙烯酸异丙酯、丙烯酸丁酯、甲基丙烯酸丁酯、丙烯酸异丁酯、甲基丙烯酸异丁酯、丙烯酸己酯、甲基丙烯酸己酯等;也可包含其它不饱和单体例如丙烯酰胺(acrylamide)、丙烯氰或苯乙烯等等。于一些实施例中,不含羧基的不饱和单体可占粘合剂的固含量约0.1~85重量份。然而本发明并不限于此。于其它实施例中,可不添加不含羧基的不饱和单体。
于一些实施例中,合成粘合剂时所使用含有羧基的单体,例如丙烯酸或甲基丙烯酸,可使感光性组合物符合碱水显影的需求,且可增加亲水性。不含羧基的不饱和单体可视情况调整使用的种类与量,以调变粘合剂的亲水性与玻璃化转变温度(Tg)。粘合剂的亲水性愈高,可提升感光性组合物整体组成对水的兼容性与显影性,但也会使附着力下降;Tg则会影响感光性组合物预烤后的粘性,太低会使感光层(或光刻胶)湿粘,不利影像转移(imagetransfer)工艺的操作。
于一些实施例中,粘合剂由溶液聚合法(solution polymerization)进行合成。适用的溶剂包括例如二氯甲烷(dichloromethane)、氯仿(chloroform)、四氯甲烷(tetrachloromethane)、丙酮(acetone)、丁酮(methyl ethyl ketone)、乙醇(ethyl alcohol)、丙醇(propyl alcohol)、异丙醇(isopropyl alcohol)、丁醇(butylalcohol)、二乙基酮(diethyl ketone)、丙二醇甲醚(propylglycol monomethylether)或丙二醇甲醚醋酸酯(propyleneglycol monomethyl ether acetate)等等。于实施例中,以粘合剂的固含量为100重量份为基准,溶剂可约为40~200重量份。溶剂使用量低于下限,则感光液粘度太高,不易涂布。由于反应温度需配合热聚合引发剂而设定,若反应温度高于所采用溶剂的沸点,则聚合反应要在加压条件下进行,否则溶剂在反应过程会有挥发的问题。常用的聚合温度范围约为50℃~130℃。有时考虑粘合剂的溶解性,可以搭配使用二种以上的溶剂进行聚合。
于实施例中,第一光反应单体的化学结构以化学式表示如下:
其中R1为H或CH3,n为2~40的整数,m为2~6的整数,B为多官能基主体(multi-functional moiety)。
于一实施例中,第一光反应单体的化学结构例如可以化学式表示如下:
其中n为2~40的整数。
含有乳酸寡聚物的光反应单体可由多醇化合物(polyols)与乳酸进行扩链(chain extension)反应后,再与丙烯酸或甲基丙烯酸反应至得。
本发明的感光性组合物除了包括含有乳酸寡聚物的第一光反应单体外,也可选择性地包括一不含乳酸寡聚物的第二光反应单体。于实施例中,以粘合剂的固含量为100重量份为基准,第一光反应单体和第二光反应单体的总量可约为25~95重量份。
添加不含乳酸寡聚物的第二光反应单体,可在合成感光性组合物的进行紫外线曝光时增加聚合反应速率,以提升感光度。适当的光反应单体的使用量可使感光性组合物不致太过僵硬,而不利于聚合反应的进行。若光反应单体的总量高于95重量份,会造成感光性组成表面湿粘。通常光反应单体其每一分子中含有的不饱和双键数目愈多,可使交联度愈高,较易抵抗蚀刻液或电镀液的侵蚀。
于一些实施例中,第二光反应单体包括五丙烯酸羟基双异戊五酯(dipentaerythritol pentaacrylate)、六丙烯酸双异戊六酯(dipentaerythritolhexaacrylate)、六丙烯酸芳氨基甲酸乙酯(aromatic urethane hexaacrylate)、三丙烯酸三甲酯丙烷(trimethylolpropane triacrylate)、乙氧化三丙烯酸三甲酯丙烷(ethoxylated trimethylolpropane triacrylate)、三甲基丙烯酸三甲酯丙烷(trimethylolpropane trimethacrylate)、乙氧化三甲基丙烯酸三甲酯丙烷(ethoxylated trimethylolpropane trimethacrylate)、三丙烯酸羟基异戊三酯(pentaerythritol triacrylate)、三甲基丙烯酸羟基异戊三酯(pentaerythritoltrimethacrylate)、四丙烯酸异戊四酯(pentaerythritol tetraacrylate)或四甲基丙烯酸异戊四酯(pentaerythritol tetramethacrylate)。
于一些实施例中,光引发剂包括2,2-二甲氧基-2-苯基苯乙酮(benzildimethyl ketal)、2,4-二乙基硫杂蒽酮(2,4-diethylthioxanthone)、异丙基硫杂蒽酮(isopropylthioxanthone)、2-甲基-1-[4-(甲基-硫代)苯]-2-吗啉基-1-丙酮(2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropanone-1)或二苯甲酮(benzophenone)。光引发剂宜选择吸光分解能力强者,可避免因氧气抑制而降低涂料表面交联度的问题。
于一些实施例中,感光性组合物可进一步包括一增感剂(sensitizer),与光引发剂配合以提升感光度。增感剂包括苯甲酸-2-二甲胺乙酯(2-dimethylaminoethyl benzoate)、对二甲胺苯甲酸乙酯(ethyl(p-dimethylamino)benzoate)或4,4'-双(二甲氨基)二苯酮(4,4’-bis(N,N-dimethylamino)benzophenone,Michler’s ketone)。以粘合剂的固含量为100重量份为基准,增感剂约为0.1~5重量份。然而本发明并不限于此。于其它实施例中,亦可不添加增感剂。
于其它实施例中,感光性组合物还可包括一可塑剂。可塑剂可为一低分子量高沸点的组成,藉由扩散进入并澎润树脂的微结构。可塑剂可软化感光性组合物促进光硬化反应的进行。可塑剂可包括磷酸盐(phosphate)例如磷酸三甲苯酯(tricresyl phosphate)、磷酸三苯酯(triphenyl phosphate)、磷酸三丁酯(tributyl phosphate)、三(2-乙基己基)磷酸酯(tris(2-ethylhexyl)phosphate);聚乙烯二醇(polyethylene glycol)、聚丙烯乙二醇(polypropylene glycol)、三甘醇(triethylene glycol)、三甘醇二乙酸酯(triethylene glycol diacetate)、三甘醇二丙酸酯(triethylene glycol dipropionate)、三甘醇双丙烯酸酯(triethylene glycoldiacrylate)、四甘醇(tetraethylene glycol)、四甘醇二乙酸酯(tetraethylene glycoldiacetate)、四甘醇双庚酯(tetraethylene glycol diheptanoate)、二乙基己二酸酯(diethyl adipate);苯二甲酸盐(phthalate)例如邻苯二甲酸二辛酯(dioctylphthalate)、双十一基酞酸酯(diundecyl phthalate)、联环己烷酞酸酯(dicyclohexyl phthalate)、二苯基酞酸酯(diphenyl phthalate)、丁基苄基酞酸酯(butyl benzyl phthalate)等等。
为使感光组合物达到适当性质,也可以依需求适当地添加消泡剂、平坦剂、色料、增滑剂(slipping agent)、附着促进剂(adhesion promoter)、触变剂(thixotropic agent)、增感剂(sensitizer)、填充料(filler)等等的添加剂。
为让本发明的上述目的、特征、和优点能更明显易懂,下文特举较佳实施例作详细说明如下。
(1).乳酸寡聚物的合成:
在三颈反应瓶中加入反应物:172.96g L-lactide和39.04g HEMA(2-Hydroxyethyl methacrylate)、触媒:0.30g辛酸锡(stannous2-ethylhexanoate)、以及安定剂:0.06g MEHQ(4-Methoxyphenol)。将反应器放入温度控制在100℃的油浴中并通入空气。以250rpm速度搅拌反应混合物反应12小时,即可得到乳酸寡聚物(PLA-HEMA macromonomer)。
(2).粘合剂I的合成(采用生质原料):
取一四颈反应瓶升高温度至90℃并使四颈反应瓶内充满氮气。将一澄清的混合溶液,包含190.52g乳酸寡聚物、47.83g甲基丙烯酸(Methacrylicacid)、18.21g甲基丙烯酸甲酯(methyl methacrylate)、316.0g丙二醇甲醚醋酸酯(propyleneglycol monomethyl ether acetate)和3.68g偶氮二异丁睛(N,N’-azobisisobutyronitrile),加入四颈反应瓶中,持续反应7小时,即可得到固含量45%,Tg=54.4℃的粘合剂I,其重量平均分子量为75,000。
合成完成的粘合剂I具有表示如下的重复单元:
(3).粘合剂II的合成(采用石化原料):
取一四颈反应瓶升高温度至90℃并使四颈反应瓶内充满氮气。将一澄清的混合溶液,包含137.31g甲基丙烯酸丁酯(Butyl methacrylate)、100.83g甲基丙烯酸(Methacrylic acid)、22.37g甲基丙烯酸甲酯(methyl methacrylate)、316.0g丙二醇甲醚醋酸酯(propyleneglycol monomethyl ether acetate)和1.51g偶氮二异丁睛(N,N’-azobisisobutyronitrile),加入四口反应瓶中,持续反应7小时,即可得到固含量45%,Tg=62.4℃的粘合剂II,其重量平均分子量为45,000。
合成完成的粘合剂II具有表示如下的重复单元:
(4).第一光反应单体的合成(具有乳酸寡聚物):
取一四颈反应瓶升高温度至130℃并使四颈反应瓶内充满氮气。将一澄清的混合溶液,包含27.65g甘油(Glycerol)、183.00g乳酸、68.43g丙烯酸(Acrylic acid)、1.10g对甲基苯磺酸(p-Toluene sulfonic acid)和庚烷(n-Heptane),加入四颈反应瓶中,持续回流(Reflux)反应16小时,再以真空蒸馏法,移除溶剂及副产物,即可得到215.0g含有乳酸寡聚物的光反应单体。
实施例1~4及比较例1的感光性组合物的成分如以下表1所示,以下各个成分的比例以重量份表示。
表1
将上列感光性组合物混合并搅拌均匀。然后以帘幕式涂布法将感光性组合物印刷于聚对苯二甲酸乙二醇酯(PET)基材上,并放入烘箱以100℃进行干燥2分钟。待感光性薄膜冷却后,使用压合机将其压粘在铜箔基板上。其中压合机的温度保持在100℃至120℃。然后,于PET基材上覆盖底片并以紫外线曝光机对感光性薄膜进行曝光。曝光能量为80mJ/cm2。接着以1.0%碳酸钠水溶液(Na2CO3(aq))进行显影,露出欲蚀刻的铜箔部分。然后,以氯化铜水溶液(CuCl2(aq))蚀刻基板,并以1%氢氧化钠水溶液(NaOH(aq))剥除光刻胶。
接着,对以如表1所示的实施例1~4与比较例1的组成所制成的光刻胶进行感光性、分辨率、附着性、残渣、剥膜时间及蚀刻抗性测试。
以下针对测试项目说明。感光性测试的结果以格数表示,曝光格数片(step tablet)上每一格的光密度(optical density,OD)不同,曝光时透光量每格不同,第一格光密度最低,透光量最多,光刻胶感光最足,每增一格,增加一定比例的光密度,以21格表为例,第一格光密度=0.05,每格光密度增加0.15,透光量减为原来的1/√2。分辨率测试的结果以光刻胶显影后干膜图案能清楚解析的最小线宽/线距表示。附着性测试的结果以光刻胶显影后干膜图案完整附着的最小线宽表示。残渣测试的结果以光刻胶显影后未感光硬化区域是否残留干膜残屑表示。抗蚀刻性的结果以光刻胶蚀刻后干膜图案是否仍然保持完整表示。
表2为实施例1~4与比较例1的光刻胶的测试结果。
表2
光刻胶 | 实施例1 | 实施例2 | 实施例3 | 实施例4 | 比较例1 |
感光性(格数) | 7 | 5 | 6 | 6 | 6 |
分辨率(μm) | 60 | 50 | 50 | 50 | 60 |
附着性(μm) | 60 | 60 | 60 | 50 | 60 |
残渣(Scum) | None | None | None | None | None |
剥膜时间(秒) | 35 | 31 | 29 | 32 | 31 |
蚀刻抗性 | OK | OK | OK | OK | OK |
从表2的结果可发现,本发明的实施例的光刻胶具有良好感光性、高耐显影性、高分辨率、高附着性、高耐蚀性与快速剥膜特性,上述特性都与不含生质材料的比较例的光刻胶相当。换句话说,以本发明实施例的感光性组合物制成的光刻胶,不但具有与传统以石化原料制成的光刻胶具有相同的良好特性,同时是可生物分解的,对自然环境不会有不良的影响。
综上所述,虽然本发明已以较佳实施例揭露如上,然其并非用以限定本发明。本发明所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,当可作各种的更动与润饰。因此,本发明的保护范围当视后附的申请专利范围所界定者为准。
Claims (11)
1.一种感光性组合物,包括:
一丙烯酸酯系粘合剂;
一第一光反应单体,具有至少一乳酸寡聚物及2个以上的不饱和丙烯酸酯系官能基,以所述粘合剂的固含量为100重量份为基准,所述第一光反应单体约为25~95重量份;以及
一光引发剂,以所述粘合剂的固含量为100重量份为基准,所述光引发剂约为0.5~15重量份。
2.一种感光性组合物,包括:
一粘合剂,所述粘合剂的化学结构具有表示如下的重复单元I:
其中R1为H或CH3,R2为C2~C4的烷基,n为2~40的整数,A为H或
一第一光反应单体,具有至少一乳酸寡聚物及2个以上的不饱和丙烯酸酯系官能基,以所述粘合剂的固含量为100重量份为基准,所述第一光反应单体约为25~95重量份;以及
一光引发剂,以所述粘合剂的固含量为100重量份为基准,所述光引发剂约为0.5~15重量份。
3.权利要求2所述的感光性组合物,其中所述第一光反应单体的化学结构以化学式表示如下:
其中R1为H或CH3,n为2~40的整数,m为2~6的整数,B为多官能基主体。
4.权利要求3所述的感光性组合物,其中所述第一光反应单体的化学结构以化学式表示如下:
其中n为2~40的整数。
5.权利要求2所述的感光性组合物,其中所述光引发剂包括2,2-二甲氧基-2-苯基苯乙酮、2,4-二乙基硫杂蒽酮、异丙基硫杂蒽酮、2-甲基-1-[4-(甲基-硫代)苯]-2-吗啉基-1-丙酮或二苯甲酮。
6.权利要求5所述的感光性组合物,还包括一增感剂,所述增感剂包括苯甲酸-2-二甲胺乙酯、对二甲胺苯甲酸乙酯或4,4'-双(二甲氨基)二苯酮,且以所述粘合剂的固含量为100重量份为基准,所述增感剂约为0.1~5重量份。
7.权利要求2所述的感光性组合物,其中所述粘合剂由一粘合组合物经聚合反应而形成,所述粘合组合物包括一乳酸寡聚物,所述粘合组合物的乳酸寡聚物占所述粘合剂的固含量约为10~90重量百分比。
8.权利要求2所述的感光性组合物,还包括一第二光反应单体,其中所述第二光反应单体包括五丙烯酸羟基双异戊五酯、六丙烯酸双异戊六酯、六丙烯酸芳氨基甲酸乙酯、三丙烯酸三甲酯丙烷、乙氧化三丙烯酸三甲酯丙烷、三甲基丙烯酸三甲酯丙烷、乙氧化三甲基丙烯酸三甲酯丙烷、三丙烯酸羟基异戊三酯、三甲基丙烯酸羟基异戊三酯、四丙烯酸异戊四酯或四甲基丙烯酸异戊四酯。
9.权利要求2所述的感光性组合物,其中所述粘合剂的化学结构还具有表示如下的重复单元II:
其中R1为H或CH3。
10.权利要求9所述的感光性组合物,其中所述粘合剂的化学结构还具有表示如下的重复单元III:
其中R1为H或CH3,R2为C1~C4的烷基。
11.一种光刻胶,其中所述光刻胶由权利要求1或2所述的感光性组合物配制而形成。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104991418A (zh) * | 2015-06-24 | 2015-10-21 | 常州强力电子新材料股份有限公司 | 一种用于uv-led光固化的增感剂及其制备方法和应用 |
CN107300830A (zh) * | 2016-04-15 | 2017-10-27 | 常州强力电子新材料股份有限公司 | 一种新型光固化组合物及其应用 |
Families Citing this family (2)
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US9758610B2 (en) * | 2015-12-18 | 2017-09-12 | Dow Global Technologies Llc | Acid-labile hyperbranched copolymer and associated photoresist composition and method of forming an electronic device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6313189B1 (en) * | 1996-11-13 | 2001-11-06 | Merck Patent Gesellschaft Mit Beschrankter Haftung | Biologically resorbable polymerization products made of binding agent systems which can be hardened by radiation |
CN1466706A (zh) * | 2000-09-11 | 2004-01-07 | 日立化成工业株式会社 | 抗蚀图、其制造方法及其应用 |
US20070214987A1 (en) * | 2006-03-14 | 2007-09-20 | Fujifilm Corporation | Lithographic printing plate precursor |
US20080004369A1 (en) * | 2004-11-17 | 2008-01-03 | Jukka Seppala | Crosslinkable Biopolymer |
US20090220753A1 (en) * | 2008-02-29 | 2009-09-03 | Fujifilm Corporation | Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate |
CN102388077A (zh) * | 2009-04-10 | 2012-03-21 | 太阳控股株式会社 | 光固化性树脂及光固化性树脂组合物 |
CN102486614A (zh) * | 2010-12-02 | 2012-06-06 | 财团法人工业技术研究院 | 感光性组合物与光致抗蚀剂 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4645503A (en) | 1985-08-27 | 1987-02-24 | Orthomatrix Inc. | Moldable bone-implant material |
JP2750461B2 (ja) * | 1989-11-10 | 1998-05-13 | ダイセル化学工業株式会社 | 光重合性組成物 |
DE4112464A1 (de) | 1991-04-17 | 1992-10-22 | Henkel Kgaa | Verbesserte retard-systeme fuer die zeitverzoegerte freigabe medizinischer und/oder biologischer wertstoffe aus einem depot-traegermaterial |
KR100578987B1 (ko) * | 2000-09-27 | 2006-05-12 | 히다치 가세고교 가부시끼가이샤 | 레지스트 패턴, 그 제조방법 및 그 이용 |
EP1209527A1 (en) | 2000-11-28 | 2002-05-29 | Shipley Company LLC | Photoresist composition |
US6743563B2 (en) | 2001-08-15 | 2004-06-01 | Shipley Company, L.L.C. | Photoresist compositions |
WO2007001043A1 (ja) | 2005-06-29 | 2007-01-04 | Hitachi Zosen Corporation | 乳酸の製造方法および乳酸製造装置 |
US7723461B1 (en) | 2005-12-22 | 2010-05-25 | Tetramer Technologies, Llc | Polymeric materials from renewable resources |
JP2011032301A (ja) | 2008-08-08 | 2011-02-17 | Nippon Bee Chemical Co Ltd | 乳酸系重合体およびその用途 |
-
2013
- 2013-08-23 TW TW102130229A patent/TWI503625B/zh active
- 2013-12-26 US US14/141,091 patent/US9170490B2/en active Active
- 2013-12-26 CN CN201310730591.3A patent/CN104423166B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6313189B1 (en) * | 1996-11-13 | 2001-11-06 | Merck Patent Gesellschaft Mit Beschrankter Haftung | Biologically resorbable polymerization products made of binding agent systems which can be hardened by radiation |
CN1466706A (zh) * | 2000-09-11 | 2004-01-07 | 日立化成工业株式会社 | 抗蚀图、其制造方法及其应用 |
US20080004369A1 (en) * | 2004-11-17 | 2008-01-03 | Jukka Seppala | Crosslinkable Biopolymer |
US20070214987A1 (en) * | 2006-03-14 | 2007-09-20 | Fujifilm Corporation | Lithographic printing plate precursor |
US20090220753A1 (en) * | 2008-02-29 | 2009-09-03 | Fujifilm Corporation | Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate |
CN102388077A (zh) * | 2009-04-10 | 2012-03-21 | 太阳控股株式会社 | 光固化性树脂及光固化性树脂组合物 |
CN102486614A (zh) * | 2010-12-02 | 2012-06-06 | 财团法人工业技术研究院 | 感光性组合物与光致抗蚀剂 |
Non-Patent Citations (1)
Title |
---|
GRIJPMA ET AL.: ""Methacrylate-functionalized oligomers based on lactide, E-caprolactone and trimethylene carbonate for application in stereo-lithography"", 《 MATERIALS RESEARCH INNOVATIONS》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104991418A (zh) * | 2015-06-24 | 2015-10-21 | 常州强力电子新材料股份有限公司 | 一种用于uv-led光固化的增感剂及其制备方法和应用 |
CN104991418B (zh) * | 2015-06-24 | 2019-09-24 | 常州强力电子新材料股份有限公司 | 一种用于uv-led光固化的增感剂及其制备方法和应用 |
CN107300830A (zh) * | 2016-04-15 | 2017-10-27 | 常州强力电子新材料股份有限公司 | 一种新型光固化组合物及其应用 |
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TWI503625B (zh) | 2015-10-11 |
US9170490B2 (en) | 2015-10-27 |
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