TW201327042A - 乾膜光阻用感光樹脂組成物 - Google Patents
乾膜光阻用感光樹脂組成物 Download PDFInfo
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- TW201327042A TW201327042A TW101145083A TW101145083A TW201327042A TW 201327042 A TW201327042 A TW 201327042A TW 101145083 A TW101145083 A TW 101145083A TW 101145083 A TW101145083 A TW 101145083A TW 201327042 A TW201327042 A TW 201327042A
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- photosensitive resin
- resin composition
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- dry film
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- 239000003999 initiator Substances 0.000 claims description 18
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
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- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
Abstract
本發明涉及一種包含在乾膜光阻的感光樹脂組成物,具體地,具有對顯影液的耐性而提高了細線密接度及解析度,且感光樹脂組成物進行光硬化而形成的硬化膜的剝離特性優異,並使用雷射直接曝光機時能夠用少量的曝光能量也能夠進行曝光,對於曝光步驟的速度影響整個生產速度的生產商或對於在PCB、引線框、PDP及其他顯示元件等生成影像,能夠將產能極大化。
Description
本發明涉及一種乾膜光阻用感光樹脂組成物。
感光樹脂組成物是以用於印刷電路板(Printed Circuit Board,PCB)或引線框(Lead Frame)的乾膜光阻(Dry Film Photoresist,DFR)或液狀光阻油墨(Liquid Photoresist Ink)等的形態使用。
目前,不僅在印刷電路板(PCB)或引線框製造,在電漿顯示板(PDP)的間隔壁(Rib barrier)或其他顯示器的ITO電極、匯流排地址(Bus Address)電極、黑矩陣(Black Matrix)等製造中也廣泛使用乾膜光阻(Dry Film Photoresist,DFR)。
在製造PCB、引線框等時,最重要的步驟之一為在晶圓的覆銅箔層壓板(Copper Clad Lamination Sheet,以下簡稱為CCLS)、銅箔(Copper Foil)上形成電路的步驟。在該步驟中所使用的顯影方式稱為光微影法(Photo Lithography),為了進行該光微影法而使用的原版影像板稱為原圖(Artwork,Lead Frame製造部分中通常使用的用語)或光罩(Photomask,半導體製造部分中通常使用的用語)。
另外,所述原圖分為光線透射的部分和不能透射的部分,利用此進行顯影。該顯影步驟稱為曝光步驟。
原圖的影像根據光線的透射與不透射轉射到CCLS或銅箔,此時,接收這種光線形成影像的物質為光阻(Photoresist,以下稱為PR)。從而,PR是在將原圖的影像轉射之前要積層或者塗覆到CCLS和銅箔上。
曝光步驟時,PCB、Lead Frame的生產商通常使用包含超高溫水銀燈發射的i線(365nm)的紫外線(ultra Violet,以下稱為UV)將PR進行曝光,從而使曝光部分進行聚合硬化。最近,通過雷射的直接描繪,即,不需要原圖的無光罩曝光顯示出急劇地擴散。作為無光罩曝光的光源多使用波長350-410nm的光,尤其是i線(365nm)或h線(405nm)。但是,相比於通常實施的超高溫水銀燈曝光,無光罩曝光的曝光時間長,從而需要縮短曝光時間之高感度的PR。
最近,就感光樹脂組成物而言,需要對超高溫水銀燈或雷射直接(Laser Direct)曝光的感應度較高、顯影步驟中對顯影液的耐性增加而能夠形成高密度的電路、縮短了硬化膜的剝離時間而能夠將產能極大化的感光樹脂組成物。
本發明的目的在於提供一種具有對顯影液的耐性而提高了細線密接度及解析度,且感光樹脂組成物進行光硬化而形成的硬化膜的剝離特性優異,並使用雷射直接曝光機時能夠用少量的曝光能量也能夠進行曝光的乾膜光阻用感光樹脂組成物。
根據本發明的一實施例,提供一種包含[A]光聚合引發劑、[B]鹼性顯影性黏合劑聚合物以及[C]分子內具有乙烯不飽和鍵的光聚合化合物的感光樹脂組成物,該[A]光聚合引發劑包含N-苯基甘胺酸,該[C]分子內具有乙烯不飽和鍵的光聚合化合物是由下列化學式1所表示的化合物,
式中,R1表示氫原子或甲基,R2是表示氫原子或碳原子為1-10的烷基,m和n各自獨立地表示1-30的整數,且2m+n30。
根據本發明的另一實施例,提供一種包含[A]光聚合引發劑0.5至20重量%、[B]鹼性顯影性黏合劑聚合物30至70重量%以及[C]光聚合化合物10至60重量%的感光樹脂組成物。
根據本發明另一實施例的感光樹脂組成物是使用雷射直接專用的曝光機進行曝光,曝光部分光硬化,通過顯影步驟而形成光阻圖案的感光樹脂組成物。
根據本發明的另一實施例,提供一種包含由上述化學式1所表示的化合物1-20重量%的感光樹脂組成物。
本發明涉及包含在乾膜光阻的感光樹脂組成物,具體地,具有對顯影液的耐性而提高了細線密接度及解析度,且感光樹脂組成物進行光硬化而形成的硬化膜的剝離特性優異,並使用雷射直接曝光機時能夠用少量的曝光能量也能夠進行曝光,對於曝光步驟的速度影響整個生產速度的生產商或對於在PCB、引線框、PDP及其他顯示元件等生成影像,能夠將產能極大化。
根據本發明的一實施例,提供一種包含[A]光聚合引發劑、[B]鹼性顯影性黏合劑聚合物以及[C]分子內具有乙烯不飽和鍵的光聚合化合物的感光樹脂組成物,該[A]光聚合引發劑包含N-苯基甘胺酸,該[C]分子內具有乙烯不飽和鍵的光聚合化合物是由下列化學式1所表示的化合物,
式中,R1表示氫原子或甲基,R2是表示氫原子或碳原子為1-10的烷基,m和n各自獨立地表示1-30的整數,且2m+n<30。
本發明的乾膜光阻用感光樹脂組成物具有對顯影液的耐性而提高了細線密接度及解析度,且感光樹脂組成物進行光硬化而形成的硬化膜的剝離特性優異,並使用雷射直接曝光機時能夠用少量的曝光能量也能夠進行曝光。
另外,根據本發明的感光樹脂組成物,較佳包含N-苯基甘胺酸。通過此提高感光樹脂組成物對雷射直接曝光的感應度,提高顯影步驟中對顯影液的耐性。
另外,根據本發明的感光樹脂組成物,較佳包含[C]分子內具有乙烯不飽和鍵的光聚合化合物是由上述化學式1所表示的化合物。通過此能夠進一步提高感光樹脂對雷射直接曝光的感應度,進一步提高顯影步驟中對顯影液的耐性,也縮短了感光樹脂組成物光硬化而形成的硬化膜的剝離時間。
本發明的感光樹脂組成物對光進行極端敏感的反應而可以使用更少的曝光能量也能發生充分的反應使得電路形成變得可能,[C]分子內具有乙烯不飽和鍵的光聚合化合物中包含上述化學式1所表示的化合物,從而提高了耐化學性,在形成光阻圖案之各個步驟的過程中能夠形成高解析度的電路,縮短了感光樹脂組成物光硬化而形成的硬化膜的剝離時間,形成影像時能夠將產能極大化。
以下進一步詳細說明本發明。
在乾膜光阻用感光樹脂組成物中包含的光聚合引發劑是通過UV及其他輻射使光聚合單體的連鎖反應開始的物質,在乾膜光阻的硬化中發揮重要的作用。
本發明中包含N-苯基甘胺酸作為光聚合引發劑。
N-苯基甘胺酸350-410nm極端敏感地反應而只用少量的光能也能夠引起充分的光反應,從而提高對雷射直接曝光的感應度,在顯影步驟中提高對顯影液的耐性而形成良好的電路。
產生上述作用之N-苯基甘胺酸的含量為組成物總量的0.05-2重量%,其含量小於0.05重量%,引發劑的反應性變弱而在少量的光能下(約30mJ/cm2以下)無法使用;超過2重量%,曝光後電路的剖面會形成嚴重的倒梯形,因此在蝕刻步驟後無法在電路中實現所需的電路寬度,嚴重時會誘發斷路(open)不良。
所述光聚合引發劑除了N-苯基甘胺酸以外,還可以進一步包含通常使用的光聚合引發劑。
所述通常使用的光聚合引發劑可以是2,2'-雙(2-氯苯基)-4,4'-5,5'-四苯雙咪唑、1-羥環己基苯酮、2,2-二甲氧基-1,2-二苯乙醇-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙-1-酮、2-苄基-2-二甲胺基-1-(4-嗎啉基苯基)丁-1-酮、2-羥基-2-甲基-1-苯基丙-1-酮、2,4,6-三甲基苯甲醯二苯基膦
氧化物、1-4-(2-羥基甲氧基)苯基-2-羥基-2-甲基丙-1-酮、2,4-二乙基噻唑酮、2-氯噻酮、2,4-二甲基噻唑酮、3,3-二甲基-4-甲氧基二苯甲酮、二苯甲酮、1-氯-4-丙氧噻唑酮、1-(4-異丙基苯基)2-羥基-2-甲基丙-1-酮、1-(4-十二烷基苯基)-羥基-2-甲基丙-1-酮、4-苯甲醯基-4’-甲基二甲硫、4-二甲胺基苯甲酸、甲基4-胺基苯甲酸二甲酯、乙基4-胺基苯甲酸二甲酯、丁基4-胺基苯甲酸二甲酯、2-乙基己基4-胺基苯甲酸甲酯、2-異戊基4-胺基苯甲酸甲酯、2,2-二乙氧基苯乙酮、苄基酮二甲基縮醛、苄基酮β-甲氧基二乙基縮醛、1-苯基-1,2-丙基二肟-o,o'-(2-羰基)乙氧基醚、鄰-苯甲醯苯甲酸甲酯、雙(4-二甲胺基苯基)酮、4,4’-雙(二乙胺基)二苯甲酮、4,4’-二氯二苯甲酮、苄基、安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香正丁醚、安息香異丁醚、安息香三級丁醚、對二甲胺基苯乙酮、對三級丁基三氯苯乙酮、對三級丁基二氯苯乙酮、噻噸酮、2-甲基噻噸酮、2-異丙基噻噸酮、二苯并環庚烯酮、α-α-二氯-對苯氧基苯乙酮、戊基4-胺基苯甲酸二甲酯、9-苯基吖啶、n-苯基甘胺酸、吖啶化合物、噻噸酮類化合物、蒽類化合物、香豆素類化合物、吡唑啉類化合物、六芳基-咪唑(hexaaryl-imidazole)的二聚物(dimer)等,但並不限於此。
所述光聚合引發劑的含量為感光樹脂組成物總量的0.5至20重量%。所述光聚合引發劑的含量在上述範圍內時能夠獲得充分的感應度。
本發明的鹼性顯影性黏合劑聚合物是(甲基)丙烯酸和(甲基)丙烯酸酯的共聚物。
具體地,是選自丙烯酸甲酯、甲基丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸甲酯、丙烯酸丁酯、甲基丙烯酸丁酯、丙烯酸、甲基丙烯酸、丙烯酸2-羥乙酯、甲基丙烯酸2-羥乙酯、丙烯酸2-羥丙酯、甲基丙烯酸2-羥丙酯、丙烯醯胺、甲基丙烯醯胺、苯乙烯及α-甲基苯乙烯合成的線性丙烯酸高分子中兩種以上單體通過共聚而得到的共聚丙烯酸高分子。
本發明的鹼性顯影性黏合劑聚合物考慮到乾膜光阻塗覆性、追踪性以及電路形成後光阻本身的機械强度,較佳平均分子量為30,000至150,000g/mol,玻璃轉移温度為20至150℃的高分子化合物,包含感光樹脂組合物的30至70重量%。
所述鹼性顯影性黏合劑聚合物的含量在上述範圍時,形成電路後能夠獲得強化細線密接力的效果。
本發明的分子內具有乙烯不飽和鍵的光聚合化合物為了具有對顯影液的耐性而提高細線密接力及解析度,並縮短將感光樹脂組成物光硬化而形成的硬化膜的剝離時間,包含下列化學式1所表示的化合物,
式中,R1表示氫原子或甲基,R2表示氫原子或碳原子數為1-10的烷基,m和n各自獨立地表示1-30的整數,且2m+n30。
改變顯示光反應性的不飽和雙鍵部的R1的結構,能夠置換氫原子或甲基,如果是氫原子時,光反應性增加,細線密接力變優異。
R2及m和n滿足以上條件時,具有對顯影液的耐性而提高細線密接力及解析度,並縮短將感光樹脂組成物光硬化而形成的硬化膜的剝離時間的優點。相反地,包含R2的碳原子數超過10的烷基或m+n的值超過30,會有顯影時間增加的問題。
在本發明中化學式1所表示的化合物包含感光樹脂組成物總量的1至20重量%,較佳1.5至15重量%。化學式1表示的化合物的含量不足1重量%時,其效果甚微;超過20重量%時,會發生在曝光後顯影步驟的顯影時間急劇上升的缺點。
本發明的光聚合化合物除了化學式1所表示的化合物之外,還可以包含末端至少有2個乙烯基的單體。
所述末端至少有2個乙烯基的單體可以是乙二醇二甲基丙烯酸酯(ethylene glycol dimethacrylate)、二乙二醇二甲基丙烯酸酯(diethylene
glycol dimethacrylate)、四乙二醇二甲基丙烯酸酯(tetraethylene glycol dimethacrylate)、丙二醇二甲基丙烯酸酯(propylene glycol dimethacrylate)、聚乙二醇二甲基丙烯酸酯(polypropylene glycol dimethacrylate)、丁二醇二甲基丙烯酸酯(butylene glycol dimethacrylate)、新戊二醇二甲基丙烯酸酯(neopentyl glycol dimethacrylate)1,6-己二醇二甲基丙烯酸酯(1,6-hexane glycol dimethacrylate)、三羥甲基丙烷三甲基丙烯酸酯(trimethyolpropanetrimethacrylate)、三羥基甲基丙烷三丙烯酸酯(trimethyolpropanetriacrylate)、丙三醇二甲基丙烯酸酯(glycerin dimethacrylate)、新戊四醇二甲基丙烯酸酯(pentaerythritoldimethacrylate)、新戊四醇三甲基丙烯酸醇(pentaerythritoltrimethacrylate)、二新戊四醇五甲基丙烯酸酯(dipentaeythritolpentamethacrylate)、2,2-雙(4-甲基丙烯醯氧基二乙氧基苯基)丙烷{2,2-bis(4-methacryloxydiethoxyphenyl)propane}、2,2-雙(4-甲基丙烯醯氧基聚乙氧基苯基)丙烷{(2,2-bis(4-methacryloxypolyethoxyphenyl)propane)}、2-羥基-3-甲基丙烯醯氧基丙基甲基丙烯酸酯{(2-hydroxy-3-methacryloyloxypropyl methacrylate)}、乙二醇二縮水甘油醚二甲基丙烯酸酯(ethylene glycol diglycidyl ether dimethacrylate)、二乙二醇二縮水甘油醚二甲基丙烯酸酯(diethylene glycol diglycidyl ether dimethacrylate)、鄰苯二甲酸二縮水甘油酯二甲基丙烯酸酯(phthalic acid diglycidyl ester dimethacrylate)、丙三醇聚縮水甘油醚聚甲基丙烯酸酯(glycerin polyglycidyl ether polymethacrylate)、含胺基甲酸酯的多官能(甲基)丙烯酸酯等。
所述光聚合化合物的含量為感光樹脂組成物總量的10至60重量%。
所述光聚合化合物的含量在上述範圍時,能夠獲得強化感光度和解析度、密接力的效果。
本發明的感光樹脂組成物根據需要還可以包含其他添加劑,其他添加劑可以使用作為塑化劑的鄰苯二甲酸酯形態的鄰苯二甲酸二丁酯、鄰苯二甲酸二庚酯、鄰苯二甲酸二辛酯、鄰苯二甲酸二烯丙酯;乙二醇酯形態的三乙二醇二乙酸酯、四乙二醇二乙酸酯;酸醯胺形態的對甲苯碸醯胺、苯碸醯胺、正丁基苯碸醯胺;磷酸三苯酯等。
本發明中,為了提高感光樹脂組成物的操作性還可以加入隱色燃料或著色物質。
隱色燃料可以使用三(4-二甲胺基-2-甲基苯基)甲烷、螢烷燃料。其中,使用隱色結晶紫時,對比更明顯而較佳。含隱色染料時,其含量較佳為感光樹脂組成物總量的0.1-10質量%。從對比表達的觀點看較佳0.1重量%以上,保存穩定性的觀點上看較佳10重量%以下。
著色物質可以是例如,甲苯磺酸的單水合物、品紅、酞菁綠、金胺、副品紅(Paramagenta)、結晶紫、甲基橙、耐爾藍2B、維多利亞藍、孔雀綠、鑽石、鹼性藍20。含有著色物質時,較佳其添加量為感光樹脂組成物的0.001-1重量%。在0.001重量%以上含量時,能夠提高操作性;在1重量%以下含量時,具有維持保存穩定性的效果。
除此之外的其他添加劑有熱聚合抑制劑、燃料、脫色劑(discoloring agent)、密接力促進劑等。
本發明中,上述組成的感光樹脂組成物可以用乾膜光阻用感光樹脂組成物製造,在如聚對苯二甲酸乙二醇酯之通常的基膜上通過通常的塗覆方法,塗覆10-400μm的感光樹脂層後乾燥。乾燥的感光樹脂層上利用聚乙烯等通常的保護膜進行層積。此外,將乾膜進行曝光、顯影進行物性的評價。所述曝光較佳使用包含UV、可視光線雷射燈的雷射直接曝光機。
以下對本發明較佳的實施例及比較例進行詳細說明。但是這些實施例只是本發明一較佳的實施例,本發明的範圍並不由這些實施例來限定。
乾膜光阻用感光樹脂組成物通過下表1的組成進行組合並評價。首先,將光聚合引發劑類溶於溶劑甲基乙基酮(MEK)和甲醇(MeOH)後,添加光聚合單體和鹼性顯影性黏合劑聚合物,利用機械攪拌機進行約1小時的混合之後,利用塗覆桿(bar)在30μm的PET膜上塗覆感光樹脂組成物。塗覆的感光樹脂組成物層利用熱風爐乾燥,此時溫度和時間分別是80℃、5分鐘。乾燥完成的膜利用保護膜(PE)在感光樹脂層上進行層積。
乾膜的反應性通過在CCL上,利用積層設備(Hakuto Mach610i),以層積輥壓力4kgf/cm2、速度2.0m/min進行層積之後,在乾膜表面設置Stuffer公司製的梯形板(Step Tablet)後,利用INPREX IP-3600H進行曝光,在
Na2CO3 1重量%水溶液、30℃、噴射壓力1.5kgf/cm2的條件下進行顯影。
乾膜的電路物性在給定的感應度下利用KOLON Test Artwork進行了評價,其結果在下表2中示出。
利用所述實施例及比較例中製造的乾膜光阻,測定了對銅板的曝光量、感光度、細線密接力、解析度、剝離度,並將結果在下表2中示出。
使用曝光裝置INPREX IP-3600H進行了曝光。
作為反應性之量度而使用的感應度係使用Stouffer Graphic Arts設備公司的21段梯形板以光阻為基準來測定。
在除去製造的感光乾膜光阻的PE膜後,利用加熱壓接輥在銅板上進行層積。在此,利用具有分為5μm單位的10-150μm的配線圖案的光罩進行曝光顯影後,測定了光阻的密接力。
密接力的配線圖案為Line/Space=x:400(單位:μm),讀取除了獨立細線中蛇行以外之直線的最小值。
利用具有Line/Space=10:10-150:150(單位:μm)的配線圖案的光罩進行曝光顯影後,測定了光阻的解析度。解析度是在曝光後顯影中形成的光阻圖案中,未曝光部分清除乾淨後之圖案的最小值。
剝離度通過如下方法測定。在除去製造的感光乾膜光阻的PE膜後,利用加熱壓接輥在銅板上進行層積,將感光樹脂組成物進行曝光顯影,製造50mm x 50mm大小的光硬化膜。然後,使用3%氫氧化鈉水溶液(溫度50℃)進行剝離。
剝離度通過光硬化膜從銅板上剝離的時間為剝離時間進行評價。此外,測定了剝離後的剝離試片的大小。
S:小(低於0.5cm)
M:中(0.5-2cm)
L:中(2-5cm)
如上述表2所示,使用根據本發明的感光樹脂組成物製造之乾膜光阻的細線密接力和解析度以及感光度與比較例1相比提升,剝離度與比較例2相比顯著減少。
本領域技術人員能夠進行本發明的單純的變形或變更,這些變形或變更都屬於本發明的範圍。
Claims (4)
- 一種感光樹脂組成物,包含:[A]光聚合引發劑;[B]鹼性顯影性黏合劑聚合物;以及[C]分子內具有乙烯不飽和鍵的光聚合化合物,其中,該[A]光聚合引發劑包含N-苯基甘胺酸,該[C]分子內具有乙烯不飽和鍵的光聚合化合物是由下列化學式1所表示的化合物,
- 根據申請專利範圍第1項所述的感光樹脂組成物,其中,該[A]光聚合引發劑的含量為0.5至20重量%、該[B]鹼性顯影性黏合劑聚合物的含量為30至70重量%以及該[C]光聚合化合物的含量為10至60重量%。
- 根據申請專利範圍第1項所述的感光樹脂組成物,其中,該感光樹脂組成物是使用雷射直接專用曝光機進行曝光,曝光部分光硬化,通過顯影步驟形成光阻圖案的感光樹脂組成物。
- 根據申請專利範圍第1項所述的感光樹脂組成物,其中,該感光樹脂組成物包含化學式1所表示的化合物1-20重量%。
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WO2016006264A1 (ja) * | 2014-07-10 | 2016-01-14 | 太陽インキ製造株式会社 | 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板 |
CN108255014B (zh) * | 2017-12-11 | 2019-07-02 | 珠海市能动科技光学产业有限公司 | 一种含有改性聚氨酯和光固化单体的干膜光阻剂 |
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JP4230227B2 (ja) * | 2003-01-07 | 2009-02-25 | 旭化成エレクトロニクス株式会社 | 光重合性樹脂組成物 |
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CN103176362A (zh) | 2013-06-26 |
KR20130073509A (ko) | 2013-07-03 |
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