CN104419917A - Pcb板镀金中的孔金属化工艺 - Google Patents
Pcb板镀金中的孔金属化工艺 Download PDFInfo
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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Abstract
本发明公开了PCB板镀金中的孔金属化工艺,包括以下步骤:步骤一、采用胶体钯液对孔进行活化,其中,胶体钯液的配方为氯化钯0.5~0.7g/L、盐酸200~300ml/L、氯化亚锡35~45g/L及锡酸钠6~8g/L,活化时间为3~5min,活化温度为25℃;步骤二、将活化后的孔采用质量百分比浓度为5%的氢氧化钠溶液解胶;步骤三、进行化学镀铜,其中,化学镀铜液的配方为硫酸铜10~15g/L、氢氧化钠10~20g/L、甲醛8~12ml/L,温度为45℃~55℃,镀铜时间为40~50min。采用本发明对PCB板镀金工序中的孔进行金属化,工序简单,操作便捷,便于实现,并能保证镀铜层的厚度,进而保证镀铜后具有良好的导电性能。
Description
技术领域
本发明涉及印制电路板加工领域,具体是PCB板镀金中的孔金属化工艺。
背景技术
PCB板,即印制电路板,其是电子产品的基本零组件,其在电子设备中主要提供集成电路等各种电子元器件固定、装配的机械支撑,实现集成电路等各种电子元器件之间的布线和电气连接或电绝缘等功能。随着现代信息产业及电子工业的高速发展,印制电路板行业发展迅猛。印制电路板的铜电路表面易氧化,可焊性差,最可靠的方法是对印制电路板镀金,由于铜与金在界面的原子易相互渗透,金的硬度较低,一般的工艺是铜基体先镀上一层镍,再镀金,镍比铜硬度大,可以为镀金层提供一种较硬的基底,从而能提高了金镀层的耐磨性。另外,镍的标准电极电位比铜低,因此,镍镀层对于铜来说是属于阳极镀层,对铜基体起电化学保护作用。镍是一种可靠的阻挡层,可阻止基体铜向金镀层扩散,从而提高金的抗腐蚀性。
印制电路板镀金过程中会涉及到对印制电路板基板进行钻孔,并需对孔金属化使印制电路板基板两面铜层的线路连通,目前孔金属化一般都是在孔壁上设置铜层。由于印制电路板的基板不具有导电性,无法电镀铜 ,也不具备自催化活性,无法直接进行化学镀铜。为了使孔金属化,现有工序复杂,成本较高。
发明内容
本发明的目的在于克服现有技术的不足,提供了一种工序简便、便于实现、耗材少、成本低的PCB板镀金中的孔金属化工艺。
本发明的目的主要通过以下技术方案实现:PCB板镀金中的孔金属化工艺,包括以下步骤:
步骤一、采用胶体钯液对孔进行活化,其中,胶体钯液的配方为氯化钯0.5~0.7g/L、盐酸200~300ml/L、氯化亚锡35~45g/L及锡酸钠6~8g/L,活化时间为3~5min,活化温度为25℃;
步骤二、将活化后的孔采用质量百分比浓度为5%的氢氧化钠溶液解胶;
步骤三、进行化学镀铜,其中,化学镀铜液的配方为硫酸铜10~15g/L、氢氧化钠10~20g/L、甲醛8~12ml/L,温度为45℃~55℃,镀铜时间为40~50min。其中,解胶的目的是使印制电路板基板吸附的胶体钯的钯核完全暴露出来。
进一步的,所述步骤三完成后还包括以下步骤:采用硫酸盐进行电镀铜,其中,电镀液中硫酸铜90 g/L、浓硫酸200 g/L,温度为25℃,阴极电流密度为0.01~0.03A/cm2。
为了提高电镀铜过程的活性和加快电镀效率,所述电镀液中还包括聚二硫二丙烷磺酸钠0.02 g/L、四氢噻唑硫酮0.001 g/L、OP-21乳化剂0.3g/L及盐酸0.05g/L。
进一步的,所述阴极电流密度为0.02A/cm2。
进一步的,所述胶体钯液的配方为氯化钯0.6g/L、盐酸250ml/L、氯化亚锡40g/L及锡酸钠7g/L,活化时间为4min。
为了提高化学镀铜的活性和效率,所述化学镀铜液的配方还包括乙二胺四乙酸40 g/L、2,2-联吡啶0.01 g/L及亚铁氰化钾0.1 g/L。
进一步的,所述化学镀铜液的温度为50℃。
进一步的,所述化学镀铜液的配方中硫酸铜13g/L、氢氧化钠15g/L、甲醛10ml/L,温度为50℃,镀铜时间为45min。
与现有技术相比,本发明具有以下有益效果:(1)本发明采用胶体钯液对孔进行活化后进行解胶,然后化学镀铜,在印制电路板基板的孔上实现化学镀铜,进而实现孔金属化,工序简单,操作方便,便于实现。
(2)本发明在化学镀铜后再通过电镀铜,能增加镀铜层的厚度,增加了印制电路板中电路的可靠性。
具体实施方式
下面结合实施例对本发明做进一步的详细说明,但本发明的实施方式不限于此。
实施例
PCB板镀金中的孔金属化工艺,包括以下步骤:步骤一、采用胶体钯液对孔进行活化,其中,胶体钯液的配方为氯化钯0.5~0.7g/L、盐酸200~300ml/L、氯化亚锡35~45g/L及锡酸钠6~8g/L,活化时间为3~5min,活化温度为25℃;步骤二、将活化后的孔采用质量百分比浓度为5%的氢氧化钠溶液解胶;步骤三、进行化学镀铜,其中,化学镀铜液的配方为硫酸铜10~15g/L、氢氧化钠10~20g/L、甲醛8~12ml/L、乙二胺四乙酸40 g/L、2,2-联吡啶0.01 g/L及亚铁氰化钾0.1 g/L,温度为45℃~55℃,镀铜时间为40~50min。其中,本实施例中胶体钯液的配方中氯化钯优选为0.6g/L,盐酸优选为250ml/L,氯化亚锡优选为40g/L,锡酸钠优选为7g/L,活化时间优选为4min。本实施例中化学镀铜液的配方中硫酸铜优选为13g/L,氢氧化钠优选为15g/L,甲醛优选为10ml/L,温度优选为50℃,镀铜时间优选为45min,化学镀铜液的温度优选为50℃。
本实施例在化学镀铜完成后还包括以下步骤:采用硫酸盐进行电镀铜,其中,电镀液中硫酸铜90 g/L、浓硫酸200 g/L、聚二硫二丙烷磺酸钠0.02 g/L、四氢噻唑硫酮0.001 g/L、OP-21乳化剂0.3g/L及盐酸0.05g/L,温度为25℃,阴极电流密度为0.01~0.03A/cm2。其中,阴极电流密度优选为0.02A/cm2。
采用本实施例对孔进行金属化,能保证镀层的厚度,镀铜后导电性能好。
以上内容是结合具体的优选实施方式对本发明作的进一步详细说明,不能认定本发明的具体实施方式只局限于这些说明。对于本发明所属技术领域的普通技术人员来说,在不脱离本发明的技术方案下得出的其他实施方式,均应包含在本发明的保护范围内。
Claims (8)
1.PCB板镀金中的孔金属化工艺,其特征在于,包括以下步骤:
步骤一、采用胶体钯液对孔进行活化,其中,胶体钯液的配方为氯化钯0.5~0.7g/L、盐酸200~300ml/L、氯化亚锡35~45g/L及锡酸钠6~8g/L,活化时间为3~5min,活化温度为25℃;
步骤二、将活化后的孔采用质量百分比浓度为5%的氢氧化钠溶液解胶;
步骤三、进行化学镀铜,其中,化学镀铜液的配方为硫酸铜10~15g/L、氢氧化钠10~20g/L、甲醛8~12ml/L,温度为45℃~55℃,镀铜时间为40~50min。
2.根据权利要求1所述的PCB板镀金中的孔金属化工艺,其特征在于,所述步骤三完成后还包括以下步骤:采用硫酸盐进行电镀铜,其中,电镀液中硫酸铜90 g/L、浓硫酸200 g/L,温度为25℃,阴极电流密度为0.01~0.03A/cm2。
3.根据权利要求2所述的PCB板镀金中的孔金属化工艺,其特征在于,所述电镀液中还包括聚二硫二丙烷磺酸钠0.02 g/L、四氢噻唑硫酮0.001 g/L、OP-21乳化剂0.3g/L及盐酸0.05g/L。
4.根据权利要求2所述的PCB板镀金中的孔金属化工艺,其特征在于,所述阴极电流密度为0.02A/cm2。
5.根据权利要求1所述的PCB板镀金中的孔金属化工艺,其特征在于,所述胶体钯液的配方为氯化钯0.6g/L、盐酸250ml/L、氯化亚锡40g/L及锡酸钠7g/L,活化时间为4min。
6.根据权利要求1所述的PCB板镀金中的孔金属化工艺,其特征在于,所述化学镀铜液的配方还包括乙二胺四乙酸40 g/L、2,2-联吡啶0.01 g/L及亚铁氰化钾0.1 g/L。
7.根据权利要求1所述的PCB板镀金中的孔金属化工艺,其特征在于,所述化学镀铜液的温度为50℃。
8.根据权利要求1~7中任意一项所述的PCB板镀金中的孔金属化工艺,其特征在于,所述化学镀铜液的配方中硫酸铜13g/L、氢氧化钠15g/L、甲醛10ml/L,温度为50℃,镀铜时间为45min。
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105779977A (zh) * | 2016-02-15 | 2016-07-20 | 深圳市瑞世兴科技有限公司 | 镁合金镀镍用的钯活化液以及镁合金镀镍方法 |
CN107460456A (zh) * | 2017-07-31 | 2017-12-12 | 苏州天承化工有限公司 | 一种低钯化学镀铜活化剂及制备方法 |
CN109023316A (zh) * | 2018-07-31 | 2018-12-18 | 广东利尔化学有限公司 | 一种线路板活化液及其活化方法 |
CN111155152A (zh) * | 2019-12-26 | 2020-05-15 | 西安泰金工业电化学技术有限公司 | 一种用于pcb水平电镀工序中降低生产成本的方法 |
CN112626502A (zh) * | 2020-11-30 | 2021-04-09 | 南通麦特隆新材料科技有限公司 | 一种pcb板化学镀铜活化剂及其制备方法 |
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2013
- 2013-09-10 CN CN201310406900.1A patent/CN104419917A/zh active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105779977A (zh) * | 2016-02-15 | 2016-07-20 | 深圳市瑞世兴科技有限公司 | 镁合金镀镍用的钯活化液以及镁合金镀镍方法 |
CN107460456A (zh) * | 2017-07-31 | 2017-12-12 | 苏州天承化工有限公司 | 一种低钯化学镀铜活化剂及制备方法 |
CN109023316A (zh) * | 2018-07-31 | 2018-12-18 | 广东利尔化学有限公司 | 一种线路板活化液及其活化方法 |
CN111155152A (zh) * | 2019-12-26 | 2020-05-15 | 西安泰金工业电化学技术有限公司 | 一种用于pcb水平电镀工序中降低生产成本的方法 |
CN111155152B (zh) * | 2019-12-26 | 2022-11-01 | 西安泰金工业电化学技术有限公司 | 一种用于pcb水平电镀工序中降低生产成本的方法 |
CN112626502A (zh) * | 2020-11-30 | 2021-04-09 | 南通麦特隆新材料科技有限公司 | 一种pcb板化学镀铜活化剂及其制备方法 |
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