CN104385534A - 一种塑封模具结构 - Google Patents

一种塑封模具结构 Download PDF

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CN104385534A
CN104385534A CN201410658319.3A CN201410658319A CN104385534A CN 104385534 A CN104385534 A CN 104385534A CN 201410658319 A CN201410658319 A CN 201410658319A CN 104385534 A CN104385534 A CN 104385534A
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plastic
bar
aluminum alloy
wire
mold
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CN104385534B (zh
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麦有海
张国光
陈逸晞
姚剑锋
杨全忠
江超
董安意
邱焕枢
王光明
曾志坚
李伟光
冯庆海
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FOSHAN BLUE ROCKET ELECTRONICS Co Ltd
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FOSHAN BLUE ROCKET ELECTRONICS Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336Coating a portion of the article, e.g. the edge of the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467Joining articles or parts of a single article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/2602Mould construction elements
    • B29C45/2606Guiding or centering means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles
    • B29C45/4005Ejector constructions; Ejector operating mechanisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • B29C2045/14122Positioning or centering articles in the mould using fixed mould wall projections for centering the insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467Joining articles or parts of a single article
    • B29C2045/1454Joining articles or parts of a single article injecting between inserts not being in contact with each other

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

一种塑封模具结构,包括上模具和下模具,所述下模具设置有多个塑封成型腔条和多个塑封料流道,每个所述塑封成型腔条的侧面底部设置有进胶口;所述塑封成型腔条包括下成型腔条、铝合金散热片定位模块和铜引线框架定位模块,所述铝合金散热片定位模块和所述铜引线框架定位模块设置有定位针;所述上模具在与所述下成型腔条的对应面固定设置有用于分离所述铝合金散热片和所述铜引线框架的顶针;所述下成型腔条的底部设置有用于顶出所述塑封体的活动顶针,所述下模具向下移动时,所述活动顶针向上顶出所述塑封体。本发明提出一种保证封装产品内部铜引线框架与铝合金散热片的间隙内填充层具有一致厚度的塑封模具结构,自行脱模生产效率高。

Description

一种塑封模具结构
技术领域
本发明涉及电子器件封装模具技术领域,尤其涉及一种塑封模具结构。
背景技术
随着电子产业的蓬勃发展,在半导体后工序封装中,使用环氧塑封料把两种金属材料堆叠同时进行封装,即一个铝合金散热片在另一个铜引线框架片的上方,要保证每只塑封的产品内部铜引线框架片与铝合金散热片之间的塑料绝缘层是一致的才能具备良好的散热、导热、绝缘效果。传统的封装模具设计封装出来的产品中往往会出现塑料绝缘层厚度不一致,从而导致产品可靠性出问题,特别是绝缘间隔的可靠性,而且塑封后的成品不可直接自动脱模,生产效率较低。
发明内容
本发明的目的在于提出一种保证封装产品内部铜引线框架与铝合金散热片的间隙内填充环氧树脂材料填充层具有一致厚度的塑封模具结构,自行脱模,生产效率高。
为达此目的,本发明采用以下技术方案:
一种塑封模具结构,包括上模具和下模具,需要封装的铝合金散热片和铜引线框架在所述上模具和所述下模具合模形成的腔条内通过注胶固化形成塑封体完成封装;
所述下模具设置有多个塑封成型腔条和多个塑封料流道,每个所述塑封成型腔条的侧面底部设置有进胶口,所述进胶口分别连接于所述塑封料流道;
所述塑封成型腔条包括下成型腔条、铝合金散热片定位模块和铜引线框架定位模块,所述铝合金散热片定位模块和所述铜引线框架定位模块设置有定位针,所述定位针用于定位所述铝合金散热片或所述铜引线框架;
所述上模具在与所述下成型腔条的对应面固定设置有用于分离所述铝合金散热片和所述铜引线框架的顶针;
所述下成型腔条的底部设置有用于顶出所述塑封体的活动顶针,所述下模具向下移动时,所述活动顶针向上活动顶出所述塑封体。
更优的,所述下模具还包括下引线条,所述下引线条的上表面设置有容纳所述铜引线框架的管脚的引线槽,所述上模具包括上引线条,所述上引线条相对于所述下引线条上的引线槽位置处有长条形凸起,合模时,所述上引线条压在所述下引线条之上时,所述凸起从所述引线槽的顶面及上侧面将所述引线槽密封。
更优的,所述塑封成型腔条、所述塑封料流道和所述下引线条一体成型。
更优的,所述引线槽的深度与所述管脚的厚度和所述凸起的高度之和相匹配。
更优的,相邻的所述塑封成型腔条的所述进胶口相连于同一塑封料流道。
更优的,所述顶针设置有两个。
更优的,所述下成型腔条与所述上模具的结合面为斜面。
更优的,所述活动顶针设置在所述下成型腔条的底部的中央。
更优的,所述定位针与所述塑封成型腔条一体成型。
更优的,所述上模具和所述下模具的材料为钢材。
本发明的有益效果:1、证封装产品内部铜引线框架与铝合金散热片的间隙内填充环氧树脂材料填充层具有一致厚度,产品具有良好的散热、导热、绝缘性能;2、塑封体自行脱模,生产效率高;3、一体化设置,结构简单合理,塑封产品质量更佳。
附图说明
图1是本发明的一个实施例的正面剖面示意图;
图2是本发明的一个实施例的侧面剖面示意图;
图3是本发明的一个实施例的上、下引线条正面的剖面示意图;
图4是本发明的一个实施例的封装成品的结构示意图;
其中:上模具1,下模具2,铝合金散热片3,铜引线框架4,塑封体5,定位针6,顶针11,上引线条12,凸起121,塑封成型腔条21,塑封料流道22,下引线条23,进胶口211,下成型腔条212,铝合金散热片定位模块213,铜引线框架定位模块214,活动顶针215,引线槽231。
具体实施方式
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
一种塑封模具结构,包括上模具1和下模具2,需要封装的铝合金散热片3和铜引线框架4在所述上模具1和所述下模具2合模形成的腔条内通过注胶固化形成塑封体5完成封装;
所述下模具2设置有多个塑封成型腔条21和多个塑封料流道22,每个所述塑封成型腔条21的侧面底部设置有进胶口211,所述进胶口211分别连接于所述塑封料流道22;
所述塑封成型腔条21包括下成型腔条212、铝合金散热片定位模块213和铜引线框架定位模块214,所述散热片定位模块213和所述铜引线框架定位模块214设置有定位针6,所述定位针6用于定位所述铝合金散热片3或所述铜引线框架4;
所述上模具1在与所述下成型腔条212的对应面固定设置有用于分离所述铝合金散热片3和所述铜引线框架4的顶针11;
所述下成型腔条212的底部设置有用于顶出所述塑封体5的活动顶针215,所述下模具2向下移动时,所述活动顶针215向上顶出所述塑封体5。
本发明塑封模具结构用于半导体封装工艺中,需要封装的铝合金散热片3和铜引线框架4在所述上模具1和所述下模具2合模形成的腔条内通过注胶固化形成塑封体5完成封装,在上模具1固定设置有顶针11,当下模具2与上模具1合模闭合时,顶针11会穿过铝合金散热片3上的避让孔接触到位于其下面的铜引线框架4,使铜引线框架4与铝合金散热片3分开并保持固定的距离,保证封装产品内部铜引线框架4与铝合金散热片3的间隙内的填充料层是一致的,半熔融状态的塑封料从进胶口211注入到成型模腔中,厚度均匀,能通过绝缘测试达到相应指标,绝缘强度满足产品质量要求,封装后的产品具备良好的散热、导热、绝缘效果。进胶口211设置在塑封成型腔条21的侧面底部,填充料先冲下模具2型腔底部开始填充,直至与铜引线框架4与铝合金散热片3之间的间隙,到整个塑封成型腔条2,整个注塑过程对形成很好的排气效果,内部不产生气孔,形成塑封料填充层,固化成型后,下模具2向下移动与上模具1分开,下模具2向下移动至一定距离时,下模具2的活动顶针215向上顶起,由设置在下模具2的活动顶针215将形成的塑封体5向上顶起,达到脱模的效果,提高每小时封装产品的产量,并降低生产成本。
更优的,所述下模具2还包括下引线条23,所述下引线条23的上表面设置有容纳所述铜引线框架4的管脚的引线槽231,所述上模具1包括上引线条12,所述上引线条12相对于所述下引线条23上的引线槽231位置处有长条形凸起121,合模时,所述上引线条12压在所述下引线条23之上时,所述凸起从所述引线槽231的顶面及上侧面将所述引线槽231密封。表面的凹凸装使上下引线条具有对插的结构,引线槽231的设置可以避免管脚压筋或塑封料残留多的缺陷。
更优的,所述塑封成型腔条21、所述塑封料流道22和所述下引线条一体成型。下模具2一体成型,减少了部件的组装,提高模具的合模时的密封性。
更优的,所述引线槽231的深度与所述管脚的厚度和所述凸起的高度之和相匹配。
更优的,相邻的所述塑封成型腔条21的所述进胶口211相连于同一塑封料流道22。相邻的进胶口211相连于同一塑封料流道22,合理的简化模具的内部结构,降低模具生产的难度。
更优的,所述顶针11设置有两个。铜引线框架4具有漏空结构,由两支顶针11相抵可以确保铜引线框架4与铝合金散热片3的相对面之间全部间隙的厚度一致。
更优的,所述下成型腔条212与所述上模具1的结合面为斜面。斜面的设置减少了铝合金散热片3与上模具1表面的溢料。
更优的,所述活动顶针215设置在所述下成型腔条212的底部的中央。设置在下成型腔条212的底部中央,更容易将塑封体5顶出。
更优的,所述定位针6与所述所述塑封成型腔条21一体成型。定位针6一体成型,减少部件的组装,同时避免零件使用久后会出现松动,确保铝合金散热片3和铜引线框架4放置的精度。
更优的,所述上模具1和所述下模具2的材料为钢材。钢材强度大、耐用、加工容易,是塑封模具结构的优选材料。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理,而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释,本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式,这些方式都将落入本发明的保护范围之内。

Claims (10)

1.一种塑封模具结构,包括上模具和下模具,需要封装的铝合金散热片和铜引线框架在所述上模具和所述下模具合模形成的腔条内通过注胶固化形成塑封体完成封装,其特征在于:
所述下模具设置有多个塑封成型腔条和多个塑封料流道,每个所述塑封成型腔条的侧面底部设置有进胶口,所述进胶口分别连接于所述塑封料流道;
所述塑封成型腔条包括下成型腔条、铝合金散热片定位模块和铜引线框架定位模块,所述铝合金散热片定位模块和所述铜引线框架定位模块设置有定位针,所述定位针用于定位所述铝合金散热片或所述铜引线框架;
所述上模具在与所述下成型腔条的对应面固定设置有用于分离所述铝合金散热片和所述铜引线框架的顶针;
所述下成型腔条的底部设置有用于顶出所述塑封体的活动顶针,所述下模具向下移动时,所述活动顶针向上活动顶出所述塑封体。
2.根据权利要求1所述的一种塑封模具结构,其特征在于:所述下模具还包括下引线条,所述下引线条的上表面设置有容纳所述铜引线框架的管脚的引线槽,所述上模具包括上引线条,所述上引线条相对于所述下引线条上的引线槽位置处有长条形凸起,合模时,所述上引线条压在所述下引线条之上时,所述凸起从所述引线槽的顶面及上侧面将所述引线槽密封。
3.根据权利要求2所述的一种塑封模具结构,其特征在于:所述塑封成型腔条、所述塑封料流道和所述下引线条一体成型。
4.根据权利要求2所述的一种塑封模具结构,其特征在于:所述引线槽的深度与所述管脚的厚度和所述凸起的高度之和相匹配。
5.根据权利要求1所述的一种塑封模具结构,其特征在于:相邻的所述塑封成型腔条的所述进胶口相连于同一塑封料流道。
6.根据权利要求1所述的一种塑封模具结构,其特征在于:所述顶针设置有两个。
7.根据权利要求1所述的一种塑封模具结构,其特征在于:所述下成型腔条与所述上模具的结合面为斜面。
8.根据权利要求1所述的一种塑封模具结构,其特征在于:所述活动顶针设置在所述下成型腔条的底部的中央。
9.根据权利要求1所述的一种塑封模具结构,其特征在于:所述定位针与所述塑封成型腔条一体成型。
10.根据权利要要求1所述的一种塑封模具结构,其特征在于:所述上模具和所述下模具的材料为钢材。
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