CN104378907A - 电路板及其制作方法 - Google Patents
电路板及其制作方法 Download PDFInfo
- Publication number
- CN104378907A CN104378907A CN201310347836.4A CN201310347836A CN104378907A CN 104378907 A CN104378907 A CN 104378907A CN 201310347836 A CN201310347836 A CN 201310347836A CN 104378907 A CN104378907 A CN 104378907A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- mass percentage
- focus ratio
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
电路板 | 100 |
基板 | 110 |
基材层 | 111 |
胶层 | 112 |
导电层 | 113 |
导电金属层 | 1131 |
第一黑化层 | 1132 |
第二黑化层 | 1133 |
导电线路图形 | 114 |
电性连接垫 | 1141 |
保护层 | 115 |
开口 | 1151 |
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310347836.4A CN104378907B (zh) | 2013-08-12 | 2013-08-12 | 电路板及其制作方法 |
TW102136269A TWI536876B (zh) | 2013-08-12 | 2013-10-08 | 電路板及其製作方法 |
US14/458,236 US9820388B2 (en) | 2013-08-12 | 2014-08-12 | Printed circuit board and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310347836.4A CN104378907B (zh) | 2013-08-12 | 2013-08-12 | 电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104378907A true CN104378907A (zh) | 2015-02-25 |
CN104378907B CN104378907B (zh) | 2017-06-30 |
Family
ID=52447329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310347836.4A Active CN104378907B (zh) | 2013-08-12 | 2013-08-12 | 电路板及其制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9820388B2 (zh) |
CN (1) | CN104378907B (zh) |
TW (1) | TWI536876B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111243781A (zh) * | 2020-03-28 | 2020-06-05 | 山东嘉汇材料科技有限公司 | 一种银浆及其制备方法与应用 |
CN111627613A (zh) * | 2020-06-04 | 2020-09-04 | 武汉理工大学 | 基于酚氧树脂的银纳米线柔性透明导电薄膜的制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020050797A (ja) * | 2018-09-27 | 2020-04-02 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
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2013
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- 2013-10-08 TW TW102136269A patent/TWI536876B/zh active
-
2014
- 2014-08-12 US US14/458,236 patent/US9820388B2/en active Active
Patent Citations (11)
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CN1416969A (zh) * | 2001-10-30 | 2003-05-14 | 大日本油墨化学工业株式会社 | 水压复制方法 |
CN1781039A (zh) * | 2003-04-28 | 2006-05-31 | 伊斯曼柯达公司 | 使用多层传导通道的图案传导片 |
CN101014890A (zh) * | 2004-09-08 | 2007-08-08 | 东丽株式会社 | 光布线用树脂组合物和光电复合布线基板 |
CN1892427A (zh) * | 2005-07-06 | 2007-01-10 | 株式会社有泽制作所 | 光敏热固性树脂组合物、感光性覆盖层和柔性印刷线路板 |
CN101067668A (zh) * | 2006-05-02 | 2007-11-07 | 富士胶片株式会社 | 滤色器的制造方法、滤色器及显示装置 |
CN101490589A (zh) * | 2006-07-20 | 2009-07-22 | 日立化成工业株式会社 | 光电混载基板 |
CN2930196Y (zh) * | 2006-07-28 | 2007-08-01 | 佳总兴业股份有限公司 | 软硬复合印刷电路板结构 |
CN101393394A (zh) * | 2007-09-21 | 2009-03-25 | 太阳油墨制造株式会社 | 光固化性·热固化性树脂组合物及其固化物 |
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CN102812571A (zh) * | 2010-03-31 | 2012-12-05 | 端点工程有限公司 | 光学器件及其制造方法 |
CN102243544A (zh) * | 2010-05-12 | 2011-11-16 | 群康科技(深圳)有限公司 | 触控屏、触控屏的制造方法及触控显示装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111243781A (zh) * | 2020-03-28 | 2020-06-05 | 山东嘉汇材料科技有限公司 | 一种银浆及其制备方法与应用 |
CN111627613A (zh) * | 2020-06-04 | 2020-09-04 | 武汉理工大学 | 基于酚氧树脂的银纳米线柔性透明导电薄膜的制备方法 |
CN111627613B (zh) * | 2020-06-04 | 2021-12-17 | 武汉理工大学 | 基于酚氧树脂的银纳米线柔性透明导电薄膜的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US9820388B2 (en) | 2017-11-14 |
TWI536876B (zh) | 2016-06-01 |
TW201517706A (zh) | 2015-05-01 |
US20150040392A1 (en) | 2015-02-12 |
CN104378907B (zh) | 2017-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170307 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
CP03 | Change of name, title or address |